Page 1
1. Outline Drawing ( Unit : mm )
6MBI50U4A-120
2. Equivalent circuit
222555,,,222666
222777,,,222888
shows theoretical dimension.
( ) shows reference dimension.
111555,,,111 666
111
222
333
444
555
666
UUU VVV WWW
222333,,,222 444
777
888
999
111000
111111
111222
111999,,,222000222111,,,222222
111333,,,111 444
MS5F6015
111777 111888
a
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Gate-Emitter
Gate-Emitter
)
C
3. Absolute Maximum Ratings ( at Tc= 25oC unless otherwise specified
)
o
o
C
Maximum
Ratings
1200
±20
75
50
150
100
50
100
275
+150
-40 to +125
3.5
Units
V
V
A
W
o
C
N m
Items
Collector-Emitter voltage
Gate-Emitter voltage
Collector current
Symbols Conditions
VCES
VGES
Ic Continuous
Icp 1ms
Tc=25oC
Tc=80
Tc=80oC
-Ic
-Ic pulse 1ms
Collector Power Dissipation 1 device
Junction temperature
Storage temperature
Isolation
voltage
between terminal and copper base (*1)
between thermistor and others (*2)
Screw
Torque
Pc
Tj
Tstg
Viso AC : 1min. 2500 VAC
-Mounting (*3)
(*1) All terminals should be connected together when isolation test will be done.
(*2) Two thermistor terminals should be connected together, each other terminals should be connected together
and shorted to base plate when isolation test will be done.
(*3) Recommendable Value : 2.5 to 3.5 Nm (M5)
4. Electrical characteristics ( at Tj= 25oC unless otherwise specified
Items ConditionsSymbols
Zero gate voltage
collector current
leakage current
threshold voltage
ICES - - 1.0
IGES
VGE(th)
VCE(sat)
Collector-Emitter
saturation voltage
(terminal)
VCE(sat)
(chip)
Input capacitance
Cies VCE=10V,VGE=0V,f=1MHz -
ton Vcc=600V - 0.32 1.20
Turn-on time
Inverter
tr Ic=50A - 0.10
tr(i) VGE=±15V - 0.03 -
Turn-off time
toff RG=22Ω -
tf - 0.07 0.30
VF
Forward on voltage
(terminal)
VF
(chip)
Reverse recovery time
Lead resistance,
terminal-chip (*4)
Resistance
B value B
Thermistor
trr
R lead 4.10 - mΩ
R
(*4) Biggest internal terminal resistance among arm.
VCE=1200V
VGE=0V
VCE=0V
VGE=±20V
VCE=20V
Ic=50mA
Ic=50A
VGE=15V
Tj=25oC
Tj=125oC
4.5
Tj=25oC
Tj=125oC
IF=50A
VGE=0V
Tj=25oC
Tj=125oC
Tj=25oC
Tj=125oC
IF=50A -
T=25oC
T=100oC
T=25/50oC
465 495 520
3305
Characteristics
typ.
max.
- - 200
6.5 8.5
- 2.15 2.30
-
2.35
-
- 1.90 2.05
-
2.10 6 - nF
0.60
0.41 1.00
-
1.90 2.20
a
- 2.00 -
- 1.65 1.80
-
1.75 -
- 0.35
-
-
5000
-
3375 3450 K
Units
mA
nA
V
V
us
V
us
Ω
a
MS5F6015
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)
5. Thermal resistance characteristics
Items Symbols Conditions Units
Thermal resistance(1device)
Contact Thermal resistance
(1 device) (*5)
Rth(j-c)
Rth(c-f) with Thermal Compound
IGBT FWD - -
(*5) This is the value which is defined mounting on the additional cooling fin with thermal compound.
Characteristics
min. typ. max.
-
-
0.05
6. Indication on module
Logo of production
6MBI50U4A-120
50A 1200V
Lot.No. Place of manufacturing (code
7. Applicable category
This specification is applied to IGBT-Module named 6MBI50U4A-120.
0.45
0.73
-
o
C/W
8. Storage and transportation notes
•
Store modules in a place with few temperature changes in order to avoid condensation on the
•
o
C and humidity of 45 to 75% .
module surface.
Avoid exposure to corrosive gases and dust.
•
Avoid excessive external force on the module.
•
Store modules with unprocessed terminals.
•
Do not drop or otherwise shock the modules when transporting.
•
9. Definitions of switching time
～
～
0V
V
L
Vcc
R
G
V
GE
V
CE
Ic
GE
V
CE
Ic
0V
0A
t
r r
I
r r
Ic
～
90%
10%
10% 10%
t
r( i )
t
r
t
o n
～
V
CE
～
～
90%
0V
90%
t
f
t
o f f
10. Packing and Labeling
- Products quantity in a packing box
MS5F6015
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11. Reliabi li ty test results
High temp. 125
( 0 : 1 )
-5
Reliability Test Items
Test
cate-
Test items Test methods and conditions
gories
1 Terminal Strength Pull force : 20N
(Pull test) Test time : 10±1 sec.
2 Mounting Strength Screw torque : 2.5 ~ 3.5 N･m (M5)
Test time : 10±1 sec.
3 Vibration Range of frequency : 10 ~ 500Hz
Sweeping time : 15 min.
Acceleration :
100m/s
Sweeping direction : Each X,Y,Z axis
Test time : 6 hr. (2hr./direction)
4 Shock Maximum acceleration :
5000m/s
Pulse width : 1.0msec.
Direction : Each X,Y,Z axis
Test time : 3 times/direction
Mechanical TestsEnvironment Tests
5 Solderabitlity Solder temp. : 235±5
Immersion time : 5±0.5sec.
Test time : 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
6 Resistance to Solder temp. : 260±5
Soldering Heat Immersion time : 10±1sec.
Test time : 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
1 High Temperature Storage temp. : 125±5 ℃
Storage Test duration : 1000hr.
2 Low Temperature Storage temp. : -40±5 ℃
Storage Test duration : 1000hr.
3 Temperature Storage temp. : 85±2 ℃
Humidity Relative humidity : 85±5%
Storage Test duration : 1000hr.
4 Unsaturated Test temp. : 120±2 ℃
Pressurized Vapor Test humidity : 85±5%
Test duration : 96hr.
5 Temperature
Cycle Test temp. : Low temp. -40±5
2
℃
℃
Reference
norms
EIAJ ED-4701
(Aug.- 2001 edit ion)
Test Method 401
Method
Test Method 402
method
Test Method 403
Reference 1
Condition code B
2
Test Method 404
Condition code B
Test Method 303
Condition code A
Test Method 302
Condition code A
Test Method 201
Test Method 202
Test Method 103
Test code C
Test Method 103
Test code E
Test Method 105
Number
sample
of
Acceptance
number
5 ( 0 : 1 )
Ⅰ
5 ( 0 : 1 )
Ⅱ
5 ( 0 : 1 )
5 ( 0 : 1 )
( 0 : 1 )
5
( 0 : 1 )
5
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
5 ( 0 : 1 )
℃
6 Thermal Shock
±5 ℃
RT 5 ~ 35
℃
Dwell time : High ~ RT ~ Low ~ RT
1hr. 0.5hr. 1hr. 0.5hr.
Number of cycles : 100 cycles
+0
Test temp. :
High temp. 100
+5
Low temp. 0 -0℃
Used liquid : Water with ice and boiling water
Dipping time : 5 min. par each temp.
Transfer time : 10 sec.
Number of cycles : 10 cycles
MS5F6015
℃
Test Method 307
Ⅰ
method
Condition code A
5
a
6
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H04-004-03a
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