Fuji Electric 6MBI300U4-170 SPECIFICATION

SPECIFICATION

Device Name :

Type Name :

Spec. No. :

IGBT MODULE

6MBI300U4-170

MS5F 6307

July 15 ’05

July 15 ’05

S.Miyashita

T.Miyasaka

K.Yamada

Y.Seki

MS5F6307

a

1

14

H04-004-07b

R e v i s e d R e c o r d s

Date

July.-15 -’05 K. Yamada

Classi-

fication

Enactment

Ind. Content

Applied

date

Issued

Drawn Checked Checked Approved

T.Miyasaka

date

Revised characteristic s

Oct.-25-’05

Revision

a

VCE(sat) (P4/14)

O.Ikawa

K.YamadaS.Miyashita

Y.S eki

T.Miyasaka

MS5F6307

2

a

14

H04-004-06b

1. Outline Drawing ( Unit : mm )

6MBI300U4-170

2. Equivalent circuit

⑪　　　　　　　　　　　　　⑨　　　　　　　　　　　　⑦
⑫　　　　　　　　　　　　　⑩　　　　　　　　　　　　⑧

　　　　　②　　　　　　　　　　　　 ④　　　　　　　　 　　　⑥

　　　　　①　　　　　　　　 　　 ③　　　 　　 　　　 　　⑤

[Inverter]

MS5F6307

[Thermister]

[Thermistor]

3

a

14

H04-004-03a

3.Absolute Maximum Ratings ( at Tc= 25°C unless otherwise specified ）

Items Symbols Conditi ons

VCESCollector-Emitter voltage V

Gate-Emitter voltage

Ic

Collector current

Collector Power Dissipation

Junction temperature

Storage temperature

Isolation
voltage

Screw
Torque

(*1) All terminals should be connected together when isolation test will be done.
(*2) Two thermistor terminals should be connected together, each other terminals should be connected together

and shorted to base plate when isolation test will be done.

(*3) Recommendable Value : Mounting 2.5~3.5 Nm (M5 or M6)

(*4) Recommendable Value : Terminals 3.5~4.5 Nm (M6)

between terminal and copper base (*1)

between thermistor and others (*2)

Mounting (*3)

Terminals (*4)

Icp

-Ic

-Ic pulse

Pc

Tj

Tstg

Viso

-

Continuous

1ms

1ms

1 device

AC : 1min.

Tc=25°C

Tc=80°C

Tc=25°C

Tc=80°C

Maxim um

Rati ngs

1700

±20 VVGES

450

300

900

600

300

600

1385

150

-40 ~ +125

3400 VAC

3.5

4.5

Units

A

W

°C

N m

4. Electrical characterist ics ( at Tj= 25°C unless ot her wi se specifi ed)

Items

Zero gate voltage
Collector current

Gate-Emitter
leakage current

Gate-Emitter
threshold voltage

Collector-Emitter
saturation voltage

Input capacitance

Inverter

Turn-on time

Turn-off time

Forward on voltage

Reverse recovery time

Lead resistance,
terminal-chip(*5)

Resistance R

Thermistor

B value B

(*5) Biggest internal terminal resistance among arm.

Symbo ls

ICES

IGES

VGE(th)

VCE(sat)

(terminal)

VCE(sat)

(chip)

Cies VCE=10V,VGE=0V,f=1MHz

ton

tr

tr (i)

toff

tf

VF

(terminal)

VF

(chip)

trr

Con ditions

VGE = 0V

VCE = 1700V

VCE = 0V

VGE=±20V

VCE = 20V

Ic = 300mA

VGE=15V

Ic = 300A

Vcc = 900V

Ic = 300A

VGE=±15V

Rg = 1.5 Ω

VGE=0V

IF = 300A

T=25oC

T=100oC

T=25/50oC

Tj= 25°C

Tj=125°C

Tj= 25°C

Tj=125°C

Tj= 25°C

Tj=125°C

Tj= 25°C -

Tj=125°C

MS5F6307

Characteristics

min.

-

- -

4.5

- 2.70 2.85

- 3.10

- 2.25 2.40

-

-

-

- 0.05

- 0.55

-

-

-

-

-

- 1.00

- 5000 -

465 495 520

3305 3375 3450 K

-

6.5

a

2.65 --

0.62

0.39

0.09 0.30

2.10 2.45

1.80 2.15

2.00

0.18 0.6

max.typ.

3.0 mA

600

8.5 V

aa

1.20

0.60

1.50

Uni ts

-

- nF28

-

-2.30

-

-

mΩR lead

4

14

nA

V

μs

V

μsIF = 300A

Ω

a

H04-004-03a

5. Thermal resi stance characteristics

Store modules in a place with few temperature changes in order to avoid condensation on the module surface.

Items Symbo ls Con ditions

Thermal resistance(1device) Rth(j-c)

Contact Thermal resistance
(1device) (*6)

(*6) This is the value which is defined mounting on the additional cooling fin with thermal compound.

6.Recommend way of m odule m ount ing to Heat sink Clam ping

(1) Initial : 1/3 specified torque, sequence (1)→(2)→(3)→(4)→(5)→(6)→(7)→(8)
(2) Final ：Full specified torque (3.5 Nm),sequence(4)→(3)→(2)→(1)→(8)→(7)→(6)→(5)

Rth(c-f) with Thermal Compound

IGBT

FWD

Characteristics

min. typ. max.

-

- - 0.15

-

- 0.09

0.0167 -

Uni ts

°C/W

(7) (3) (1) (5)

7. Indi cation on module

Lo go of product ion

Lo t.No. Place of manufacturing (code)

Mounting holes

Heat sink

(8)(4)(2)(6)

Module

6MBI300U4-170

300A 1700V

8.Appl icable category

This specification is applied to IGBT Module named 6MBI300U4-170 .

9.Sto rage and t ransportation notes

The module should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75% .

・

・

Avoid exposure to corrosive gases and dust.

・

Avoid excessive external force on the module.

・

Store modules with unprocessed terminals.

・

Do not drop or otherwise shock the modules when transporting.

・

MS5F6307

5

14

H04-004-03a

a