Fuji Electric 6MBI300U4-120 SPECIFICATION

SPECIFICATION

Device Name :

Type Name :

Spec. No. :

IGBT MODULE

6MBI300U4-120

MS5F 6022

Jan. 20 ’05

Jan. 20 ’05

S.Miyashita

T.Miyasaka

K.Yamada

Y.Seki

MS5F6022

a

1

14

H04-004-07b

R e v i s e d R e c o r d s

Date

Jan.-20 -’05

Oct.-25-’05

Classi-

fication

Enactment

Revision

Ind. Content

Revised characteristic s

a

VCE(sat),VF(P4/14)

Applied

date

Issued

date

Drawn Checked Checked Approved

T.Miyasaka

O.Ikawa

K. Yamada

K.YamadaS.Miyashita

Y.Seki

T.Miyasaka

MS5F6022

2

a

14

H04-004-06b

1. Outline Drawing ( Unit : mm )

6MBI300U4-120

2. Equivalent circuit

⑪　　　　　　　　　　　　　⑨　　　　　　　　　　　　⑦
⑫　　　　　　　　　　　　　⑩　　　　　　　　　　　　⑧

　　　　　②　　　　　　　　　　　　 ④　　　　　　　　 　　　⑥

　　　　　①　　　　　　　　 　　 ③　　　 　　 　　　 　　⑤

[Inverter]

MS5F6022

[Thermister]

[Thermistor]

3

a

14

H04-004-03a

Storage temperature

Screw

Tj=125

o

C

VCE(sat)

3. Absolute Maximu m Rating s ( at Tc= 25

o

C un less otherwise sp eci fied )

Maxim um

Tc=80

o

C

Tc=25

o

C

Tc=80

o

C

Tj=125

o

C

VCE(sat)

Tj=25

o

C

4. Electrical characteristics ( at Tj = 25

o

C un less otherwise sp eci fied )

Tj=25

o

C

Tc=25

o

C

Isolation

typ.

max.

Characteri st ics

min.

VF

Tj=25

o

C

Tj=125

o

C

VF

Tj=125

o

C

Tj=25

o

C

Items

T=25/50

o

C

T=100

o

C

T=25

o

C

Zero gate voltage

Gate-Emitter

Gate-Emitter

Lead resistance,

Collector-Emitter voltage
Gate-Emitter voltage

Symbols Conditi ons

VCES 1200
VGES

Ic Continuous

Collector current

Icp 1ms

-Ic

-Ic pulse 1ms
Collector Power Dissipation 1 device
Junction temperature

Pc
Tj
Tstg

voltage

Torque

between terminal and copper base (*1)
between thermistor and others (*2)
Mounting (*3)
Terminals (*4)

Viso AC : 1min. 2500 VAC

-

Rati ngs

±20
450
300
900
600
300

600
1385
+150

-40 to +125

3.5

4.5

Units

V
V

A

W

o

C

N m

(*1) All terminals should be connected together when isolation test will be done.
(*2) Two thermistor terminals should be connected together, each other terminals should be connected together
and shorted to base plate when isolation test will be done.
(*3) Recommendable Value : 2.5 to 3.5 Nm (M5)
(*4) Recommendable Value : 3.5 to 4.5 Nm (M6)

Items Conditi onsSymbols

VCE=1200V
VGE=0V
VCE=0V
VGE=±20V
VCE=20V
Ic=300mA

collector current

leakage current

threshold voltage

ICES - - 3.0

IGES

VGE(th)

Ic=300A

Collector-Emitter

(terminal)

VGE=15V

saturation voltage

(chip)

Input capacitance

Cies

VCE=10V,VGE=0V,f=1MHz -

ton Vcc=600V - 0.32 1.20

Turn-on time

Inverter

tr Ic=300A - 0.10
tr(i) VGE=±15V - 0.03 -

Turn-off time

toff RG=2.0Ω ­tf - 0.07 0.30

IF=300A

Forward on voltage

(terminal)

VGE=0V

(chip)

Reverse recovery time

terminal-chip (*5)

Resistance

B value B

Thermistor

trr

R lead 1.00

R

IF=300A -

(*5) Biggest internal terminal resistance among arm.

- - 600

4.5

- 2.30 2.45

-

6.5 8.5

a

2.50

aa

- 1.90 2.05

-

2.10 ­34 - nF

0.60

0.41 1.00

a

- 2.00 2.15

a

- 2.10 -

a

- 1.65 1.80

-

1.75 -

- 0.35

-

-

5000

465 495 520

3305

3375 3450 K

Units

mA

nA

V

­V

us

V

us

- mΩ

-

Ω

MS5F6022

4

a

14

H04-004-03a

6.Recommend way of m odule m ount ing to Heat sink Clam ping

(1) Initial : 1/3 specified torque, sequence (1)

(2)→(3)→(4)→(5)→(6)→(7)→(8)

(2) Final

Full specified torque (3.5 Nm),sequence(4)

(3)→(2)→(1)→(8)→(7)→(6)→(5)

Lo go of product ion

Lo t.No.

Place of manufacturing (code)

9. Storage and transportation notes

The module should be stored at a standard temperature of 5 to 35

o

C and humidity of 45 to 75% .

8. Appl icable category

300A 1200V

Contact Thermal resistance

5. Thermal resi stance characteristics

Items Symbols Conditi ons Units

min.

typ.

max.

Characteri st ics

7. Indi cation on module

Thermal resistance(1device)

(1 device) (*6)
(*6) This is the value which is defined mounting on the additional cooling fin with thermal compound.

：

Rth(j-c)

Rth(c-f) with Thermal Compound

IGBT -

→

→

- 0.09

- -

-

0.0167

0.15FWD

o

C/W

-

(7) (3) (1) (5)

Mounting ho les

Heat sink

(8)(4)(2)(6)

Module

6MBI300U4-120

This specification is applied to IGBT-Module named 6MBI300U4-120.

•

Store modules in a place with few temperature changes in order to avoid condensation on the

•

module surface.

Avoid exposure to corrosive gases and dust.

•

Avoid excessive external force on the module.

•

Store modules with unprocessed terminals.

•

Do not drop or otherwise shock the modules when transporting.

•

MS5F6022

5

14

H04-004-03a

a