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2SK2639-01
FAP-IIS Series
N-channel MOS-FET
450V 0,65Ω 10A 100W
>Features > Outline Drawing
-High Speed Switching
-Low On-Resistance
-No Secondary Breakdown
-Low Driving Power
-High Voltage
GS = ± 30V Guarantee
-V
-Repetitive Avalanche Rated
>Applications
-Switching Regulators
-UPS
-DC-DC converters
-General Purpose Power Amplifier
>Maximum Ratings and Characteristics > Equivalent Circuit
-Absolute Maximum Ratings (TC=25°C), unless otherwise specified
Item Symbol Rating Unit
Drain-Source-Voltage V
Continous Drain Current I
Pulsed Drain Current I
Gate-Source-Voltage V
Repetitive or Non-Repetitive (Tch ≤ 150°C)
Avalanche Energy E
Max. Power Dissipation P
Operating and Storage Temperature Range T
T
DS
D
D(puls)
GS
I
AR
AS
D
ch
stg
-55 ~ +150 °C
450 V
10 A
40 A
±35 V
10 A
255 mJ
100 W
150 °C
Electrical Characteristics (T
-
=25°C), unless otherwise specified
C
Item Symbol Test conditions Min. Typ. Max. Unit
Drain-Source Breakdown-Voltage V
Gate Threshhold Voltage V
Zero Gate Voltage Drain Current I
Gate Source Leakage Current I
Drain Source On-State Resistance R
Forward Transconductance g
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Turn-On-Time t
Turn-Off-Time t
(ton=t
on
d(on)+tr
off (ton=td(off)+tf
)
)
Avalanche Capability I
Diode Forward On-Voltage V
Reverse Recovery Time t
Reverse Recovery Charge Q
(BR)DSS ID
GS(th) ID
DSS VDS
GSS VGS
DS(on) ID
fs ID
iss VDS
oss VGS
rss
t
d(on)
t
r ID
t
d(off)
t
f
AV
SD IF
rr IF=IDR
rr
=1mA VGS=0V
=1mA V
=450V Tch=25°C
V
=0V Tch=125°C
GS
=±35V VDS=0V
=5A VGS=10V
=5A VDS=25V
VCC=300V
RGS=10 Ω
L = 100µH
=2x IDR VGS=0V Tch=25°C
-dIF/dt=100A/µs Tch=25°C
DS=VGS
=25V
=0V
f=1MHz 80 120 pF
=10A
VGS=10V
=25°C
T
ch
VGS=0V
450 V
3,5 4,0 4,5 V
10 500 µA
0,2 1,0 mA
10 100 nA
0,58 0,65
3 6 S
950 1450 pF
180 270 pF
25 40 ns
70 110 ns
70 110 ns
50 80 ns
10 A
1,1 1,65 V
400 ns
5,0 µC
Ω
- Thermal Characteristics
Item Symbol Test conditions Min. Typ. Max. Unit
Thermal Resistance R
R
th(ch-a)
th(ch-c)
channel to air 35 °C/W
channel to case 1,25 °C/W
Collmer Semiconductor - P.O. Box 702708 - Dallas TX - 75370 - 972.233.1589 - 972.233.0481 Fax - www.collmer.com - 11/98
N-channel MOS-FET
Typical Output Characteristics
Drain-Source On-State Resistance vs. T
Typical Transfer Characteristics
Typical Drain-Source On-State-Resistance vs. I
Typical Forward Transconductance vs. I
Gate Threshold Voltage vs. T
Typical Capacitances vs. V
Typical Gate Charge Characteristic
Forward Characteristics of Reverse Diode
Avalanche Energy Derating
This specification is subject to change without notice!
450V 0,65Ω 10A 100W
> Characteristics
ID=f(VDS); 80µs pulse test; TC=25°C
R
= f(Tch); ID=5A; VGS=10V
DS(on)
ch
ID=f(VGS); 80µs pulse test; VDS=25V; Tch=25°C
↑
↑
[A]
D
I
]
Ω
[
DS(ON)
R
1
VDS [V]
R
=f(ID); 80µs pulse test; TC=25°C
DS(on)
4
ID [A]
C=f(VDS); VGS=0V; f=1MHz
↑
]
Ω
[
DS(ON)
R
D
gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C
2
Tch [°C]
D
↑
[S]
fs
g
DS
5
ID [A]
VGS=f(Qg); ID=10A; Tc=25°C
↑
[A]
D
I
3
VGS [V]
V
=f(Tch); ID=1mA; VDS=V
GS(th)
ch
GS
↑
[V]
GS(th)
V
IF=f(VSD); 80µs pulse test; VGS=0V
6
Tch [°C]
↑
C [F]
7
VDS [V]
Eas=f(starting Tch); VCC=45V; IAV=10A ID=f(VDS): D=0,01, Tc=25°C
↑
[V]
DS
V
↑ 10 ↑ 12
[A]
D
I
Eas [mJ]
Starting Tch [°C]
VDS [V]
8
Qg [nC]
↑
[K/W]
th(ch-c)
Z
↑ ↑
[V]
GS
V
[A]
F
I
VSD [V]
Transient Thermal impedance
Z
=f(t) parameter:D=t/T
thch
t [s]
9