http://www.fujielectric.com/products/semiconductor/
2MBI75VA-120-50
IGBT Modules
IGBT MODULE (V series)
1200V / 75A / 2 in one package
Features
High speed switching
Voltage drive
Low Inductance module structure
Applications
Inverter for Motor Drive
AC and DC Servo Drive Amplier
Uninterruptible Power Supply
Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at TC =25°C unless otherwise specied)
Items Symbols Conditions Maximum ratings Units
Collector-Emitter voltage V
Gate-Emitter voltage V
Collector current
Collector power dissipation P
Junction temperature T
Operating junction temperature (under switching conditions)
Case temperature T
Storage temperature T
Isolation voltage
Screw torque
Note *1: All terminals should be connected together when isolation test will be done.
Note *2: Recommendable Value : 3.0-5.0 Nm (M5 or M6)
Note *3: Recommendable Value : 2.5 -3.5 Nm (M5)
between terminal and copper base (*1)
Mounting (*2) - 5.0
Terminals (*3) - 5.0
Electrical characteristics (at Tj = 25°C unless otherwise specied)
Items
Zero gate voltage collector current I
Gate-Emitter leakage current I
Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
Internal gate resistance R
Input capacitance C
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time t
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance (1device) R
Contact thermal resistance (1device) (*4) R
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
CES 1200 V
GES ±20 V
C Continuous T C=100°C 75
I
I
C pulse 1ms 150
C 75
-I
C pulse 1ms 150
-I
C 1 device 390 W
j 175
Tjop 150
C 125
stg -40 ~ 125
A
°C
Viso AC : 1min. 2500 VAC
N m
Symbols Conditions
CES V GE = 0V, V CE = 1200V - - 1.0 mA
GES V CE = 0V, VGE = ±20V - - 200 nA
GE (th) V CE = 20V, I C = 72mA 6.0 6.5 7.0 V
CE (sat)
V
(terminal)
CE (sat)
V
(chip)
G (int) - - 10 - Ω
ies V CE = 10V, VGE = 0V, f = 1MHz - 6.0 - nF
on
t
t
r - 200 -
r (i) - 50 -
t
off - 600 -
t
f - 40 -
t
F
V
(terminal)
F
V
(chip)
rr I F = 75A - 150 - nsec
V
GE = 15V
C = 75A
I
V
GE = 15V
C = 75A
I
VCC = 600V LS = 30nH
C = 75A
I
GE = ±15V
V
G = 2.2Ω
R
j = 150°C
T
V
GE = 0V
F = 75A
I
V
GE = 0V
F = 75A
I
T
j=25°C - 1.95 2.40
j=125°C - 2.30 -
T
j=150°C 2.35
T
T
j=25°C - 1.85 2.30
j=125°C - 2.20 -
T
j=150°C 2.25
T
T
j=25°C - 1.80 2.25
j=125°C - 1.95 -
T
j=150°C 1.90
T
T
j=25°C - 1.70 2.15
j=125°C - 1.85 -
T
j=150°C 1.80
T
Characteristics
min. typ. max.
- 600 -
Characteristics
min. typ. max.
th(j- c)
th(c-f) with Thermal Compound - 0.050 -
IGBT - - 0.38
FWD - - 0.58
Units
Units
°C/W
V
nsec
V
1
7905a
APRIL 2014
2MBI75VA-120-50
Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Collector current vs. Collector-Emitter voltage (typ.)
T
j
= 25°C / chip
160
V
GE=20V 15V
12V
140
120
100
80
10V
60
Collector current: IC [A]
40
20
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector current vs. Collector-Emitter voltage (typ.)
VGE= 15V / chip
160
140
120
j=25°C
125°C T
150°C
Collector current vs. Collector-Emitter voltage (typ.)
T
j
= 150°C / chip
160
140
V
GE= 20V 15V
12V
120
100
80
10V
60
Collector current: IC [A]
40
8V
20
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
j= 25°C / chip
T
10
8
100
80
60
Collector Current: IC [A]
40
20
0
0 1 2 3 4
Collector-Emitter Voltage: VCE [V]
Gate Capacitance vs. Collector-Emitter Voltage
GE= 0V, ƒ= 1MHz, T j= 25°C
V
100
10
1
Gate Capacitance: Cies , Coes , Cres [nF]
C
Cres
Coes
ies
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: VGE [V]
Dynamic Gate Charge (typ.)
VCC =600V, IC =75A, Tj = 25°C
20
15
10
5
0
-5
-10
Gate-Emitter voltage: VGE [V]
-15
V
VGE
CE
I
C=150A
C=75A
I
C=37.5A
I
800
600
400
200
0
-200
-400
-600
CE [V]
Collector-Emitter voltage: V
0.1
0 10 20 30
Collector-Emitter voltage: VCE [V]
-20
-800
-1.0 -0.5 0.0 0.5 1.0
Gate charge: Qg [μC]
2
2MBI75VA-120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Switching time: ton , tr , toff , tf [nsec]
Switching time vs. Collector current (typ.)
CC=600V, V GE=±15V, R G=2.2Ω, T j=125°C
V
10000
1000
100
10
0 100 200
Collector current: IC [A]
CC=600V, I C=75A, V GE=±15V, T j=125°C
V
10000
1000
ton
toff
tr
Switching time vs. Collector current (typ.)
V
CC=600V, V GE=±15V, R G=2.2Ω, T j=150°C
10000
ton
t
off
1000
tr
ton
toff
tr
100
tf
tf
Switching time: ton , tr , toff , tf [nsec]
10
0 100 200
Collector current: IC [A]
Switching loss vs. Collector current (typ.) Switching time vs. Gate resistance (typ.)
V
CC=600V, V GE=±15V, R G=2.2Ω, T j=125, 150°C
25
Tj =125oC
o
C
j=150
20
15
T
Eon
Eoff
10
100
tf
Switching time: ton , tr , toff , tf [nsec]
10
1 10 100
Gate resistance: RG [Ω]
Switching loss vs. Gate resistance (typ.)
CC=600V, I C=75A, V GE=±15V, T j=125, 150°C
V
12
Tj =125oC
o
j=150
C
10
T
Eon
5
Switching loss: Eon , Eoff , Err [mJ/pulse]
0
0 50 100 150 200
Collector current: IC [A]
Reverse bias safe operating area (max.)
+V
GE=15V, -V GE=15V, R G=2.2Ω, T j=150°C
160
140
Err
120
Err
Eoff
100
80
60
40
Collector current: IC [A]
20
8
6
4
2
Switching loss: Eon , Eoff , Err [mJ/pulse]
0
1 10 100
Gate resistance: RG [Ω]
0
0 400 800 1200 1600
Collector-Emitter voltage: VCE [V]
(Main terminals)
3