http://www.fujielectric.com/products/semiconductor/
2MBI600VD-060-50
IGBT Modules
IGBT MODULE (V series)
600V / 600A / 2 in one package
Features
High speed switching
Voltage drive
Low Inductance module structure
Applications
Inverter for Motor Drive
AC and DC Servo Drive Amplier
Uninterruptible Power Supply
Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at Tc=25°C unless other wise specied)
Items Symbols Conditions Maximum ratings Units
Collector-Emitter voltage V
Gate-Emitter voltage V
Collector current
Inverter
Collector power dissipation Pc 1 device 2940 W
Junction temperature Tj 175
Operating junction temperature (under switching conditions)
Case temperature T
Storage temperature Tstg -40 ~ +125
Isolation voltage
Screw torque
Note *1: All terminals should be connected together during the test.
Note *2: Recommendable Value : 3.0- 6.0 Nm (M5 or M6)
Note *3: Recommendable Value : 2.5- 5.0 Nm (M6)
between terminal and copper base (*1)
Mounting (*2)
Terminals (*3) 5.0
Electrical characteristics (at Tj= 25°C unless otherwise specied)
Items
Zero gate voltage collector current I
Gate-Emitter leakage current I
Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
Internal gate resistance R
Input capacitance Cies V
Turn-on time
Inverter
Turn-off time
Forward on voltage
Reverse recovery time trr I
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance (1device) Rth(j-c)
Contact thermal resistance (1device) (*4) Rth(c-f) with Thermal Compound - 0.0125 -
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
CES 600 V
GES ±20 V
Ic Continuous Tc=80°C 600
Ic pulse 1ms Tc=80°C 1200
-Ic 600
-Ic pulse 1ms 1200
Tjop 150
C 125
°C
Viso AC : 1min. 2500 VAC
-
Symbols Conditions
CES VGE = 0V, VCE = 600V - - 2.0 mA
GES
GE (th) VCE = 20V, IC = 600mA 6.2 6.7 7.2 V
CE (sat)
V
(terminal)
CE (sat)
V
(chip)
g(int) - - 1.5 - Ω
ton
tr - 0.40 tr (i) - 0.15 toff - 0.75 -
VCE = 0V, VGE = ±20V
Tj=25°C - 1.85 2.30
Tj=125°C - 2.15 -
GE = 15V
V
C = 600A
I
Tj=150°C - 2.35 Tj=25°C - 1.60 2.05
Tj=125°C - 1.90 Tj=150°C - 2.00 -
CE
= 10V, VGE = 0V, f = 1MHz - 38.9 - nF
V
CC = 300V, IC = 600A
GE = ±15V, RG = 2.2Ω
V
Tj = 150°C, Ls =30nH
min. typ. max.
6.0
Characteristics
N m
Units
- - 800 nA
- 0.75 -
tf - 0.07 -
F
V
(terminal)
F
V
(chip)
Tj=25°C
Tj=125°C
GE = 0V
V
F = 600A
I
Tj=150°C - 1.57 -
Tj=25°C
Tj=125°C
Tj=150°C - 1.47 -
F = 600A - 0.25 - µsec
- 1.70 2.25
- 1.60 -
- 1.60 1.85
- 1.50 -
Characteristics
min. typ. max.
Units
IGBT - - 0.051
FWD - - 0.088
°C/W
V
µsec
V
1
7728b
DECEMBER 2014
2MBI600VD-060-50
Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
1400
VGE=20V 15V
1200
1000
800
600
400
Collector current: Ic [A]
200
0
0 1 2 3 4 5
Collector-Emitter voltage: V
12V
10V
8V
CE [V]
Collector current vs. Collector-Emitter voltage (typ.)
GE= 15V / chip
V
1400
125°CTj=25°C 150°C
1200
1000
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 150°C / chip
1400
1200
1000
800
600
400
Collector current: Ic [A]
200
0
0 1 2 3 4 5
VGE= 20V 15V
Collector-Emitter voltage: V
12V
10V
8V
CE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
Tj= 25°C / chip
10
8
800
600
400
Collector Current: Ic [A]
200
0
0 1 2 3 4
Collector-Emitter Voltage: V
CE [V]
Gate Capacitance vs. Collector-Emitter Voltage
GE= 0V, ƒ= 1MHz, Tj= 25°C
V
100
Cies
10
***
Coes
Cres
Gate Capacitance: Cies, Coes, Cres [nF]
1
0 5 10 15 20 25 30
Collector-Emitter voltage: V
CE [V]
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: V
GE [V]
Dynamic Gate Charge (typ.)
Vcc=300V, Ic=600A, Tj= 25°C
20
15
10
GE [V]
5
0
-5
-10
-15
Gate-Emitter voltage: V
-20
-4 -3 -2 -1 0 1 2 3 4 5
VCE
VGE
Gate charge: Qg [µC]
Ic=1200A
Ic=600A
Ic=300A
400
300
200
100
0
-100
-200
-300
-400
Collector-Emitter voltage: VCE [V]
2
2MBI600VD-060-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Switching time vs. Collector current (typ.)
Vcc=300V, V
10000
1000
100
Switching time: ton, tr, toff, tf [nsec]
10
0 200 400 600 800 1000 1200 1400
Vcc=300V, Ic=600A, V
10000
1000
GE=±15V, RG=2.2Ω, Tj=125°C
toff ton
Collector current: Ic [A]
GE=±15V, Tj=125°C
toff
ton
tr
Switching time vs. Collector current (typ.)
Vcc=300V, V
10000
1000
tr
tf
100
Switching time: ton, tr, toff, tf [nsec]
10
0 200 400 600 800 1000 1200 1400
GE=±15V, RG=2.2Ω, Tj=150°C
toff ton
tr
tf
Collector current: Ic [A]
Switching loss vs. Collector current (typ.)Switching time vs. Gate resistance (typ.)
Vcc=300V, V
80
60
GE=±15V, RG=2.2Ω, Tj=125°C, 150°C
Tj=125oC
Tj=150
o
C
Eoff
100
Switching time: ton, tr, toff, tf [nsec]
10
1 10 100
Gate resistance: RG [Ω]
Switching loss vs. Gate resistance (typ.)
Vcc=300V, Ic=600A, V
180
160
140
120
100
80
60
40
20
Switching loss: Eon, Eoff, Err [mJ/pulse]
0
1 10 100
GE=±15V, Tj=125°C, 150°C
Tj=125oC
o
Tj=150
C
Gate resistance: RG [Ω]
Eon
Eoff
Err
tf
40
Eon
20
0
Switching loss: Eon, Eoff, Err [mJ/pulse]
Err
0 200 400 600 800 1000 1200 1400
Collector current: Ic [A]
Reverse bias safe operating area (max.)
+VGE=15V, -VGE=15V, RG=2.2Ω, Tj=150°C
1400
1200
1000
800
600
400
Collector current: Ic [A]
200
0
0 200 400 600 800
Collector-Emitter voltage: VCE [V]
(Main terminals)
3