R e v i s e d R e c o r d s
Date
Apr.-21 -’06
Aug.-09 -’06 Revision
Classi-
fication
Enactment
Ind. Content
Revised Reliability test
a
results (P9/14)
Applied
date
Issued
date
Drawn Checked Checked Approved
K. Yamada T.MiyasakaM.W atanabe
K.Muramatsu
S. Ogawa
K. Yamada
T.Miyasaka
MS5F6562
2
a
14
H04-004-06b
1. Outline Drawing ( Unit : mm )
2MBI400U2B-060-50
(RoHS compliant product)
2. Equivalent circuit
MS5F6562
3
a
14
H04-004-03a
3.Absolute Maximum Ratings ( at Tc= 25℃ unless otherwise specified )
It ems Symbols Conditions
VCESCollector-Emitter voltage
Gate-Emitter voltage
Collector current
Collector Power Dissipation
Junction temperature
Storage temperature
Isolation
voltage
Screw Torque
(*1) All terminals should be connected together when isolation test will be done.
(*2) Recommendable Value : Mounting 2.5~3.5 Nm (M5)
Terminals 2.5~3.5 Nm (M5)
VGES
Ic
Icp
-Ic 400
-Ic pluse
Pc
Tj
Tstg
Viso
Mounting *2
Terminals *2
Continuous
1ms
AC : 1min.
Ma ximum
Ratings
650
±20 V
400
800
800
1250
150
-40~ +125
2500between terminal and copper base *1
3.5
3.5
Unit s
V
A
W1 device
℃
VAC
N・m
4. Electrical characteristics ( at Tj= 25℃ unless otherwise specified)
Items Symbols
Zero gate voltage
Collector current
Gate-Emitter
leakage current
Gate-Emitter
threshold voltage
Collector-Emitter
saturation voltage
Input capacitance -
Turn-off time
Forward on voltage
Reverse recovery time
Lead resistance, terminal-chip *3 mΩR lead -
(*3)Biggest internal terminal resistance among arm.
ICES
IGES
VGE(th)
VCE(sat)
(terminal)
VCE(sat)
(chip)
Cies VCE=10V,VGE=0V,f=1MHz
ton
trTurn-on time
tr (i)
toff
tf
VF
(terminal)
VF
(chip)
trr
VGE = 0V
VCE = 600V
VCE = 0V
VGE=±20V
VCE = 20V
Ic = 400mA
VGE=15V
Ic = 400A
Vcc = 300V
Ic = 400A
VGE=±15V
Rg = 6.8 Ω
VGE=0V
IF = 400A
Conditions
6.2
Tj= 25℃
Tj=125℃
Tj= 25℃
Tj=125℃
Tj= 25℃
Tj=125℃
Tj= 25℃ Tj=125℃
Char a cter istics
max.typ.min.
-
-
- 2.25 2.55
- 2.50
- 1.85 -
-
- 0.40
- 0.22
- 0.16
- 0.48
-
- 2.00
-
-
-
-
-
6.7
2.10 -
29.0 - nF
0.07
2.05 -
1.60 -
1.65
0.97 -
2.0 mA
400
7.7 V
-
1.20
0.60
- μs
1.20
0.45
2.35
-
Units
nA
V
V
μsIF = 400A - 0.35
MS5F6562
4
a
14
H04-004-03a
5. Thermal resistance characteristics
Place of manufactur ing (code)
Items Symbols Conditions
Thermal resistance(1device) Rth(j-c)
Contact Thermal resistance
(1device) *4
Rth(c-f) with Thermal Compound -
(*4) This is the value which is defined mounting on the additional cooling fin with thermal compound.
IGBT
FWD
Char a cter istics
min. t yp. ma x.
-
- - 0.16
- 0.10
0.025 -
6. Indication on module
Logo of pr oduction
2MBI400U2B-060-50
400A 600V
Lot.No.
7.Applicable category
This specification is applied to IGBT Module named 2MBI400U2B-060-50 .
Units
℃/W
8.Storage and transportation notes
The module should be stored at a standard temperature of 5 to 35℃ and humidity of 45 to 75% .
・
Store modules in a place with few temperature changes in order to avoid condensation on the module surface.
・
Avoid exposure to corrosive gases and dust.
・
Avoid excessive external force on the module.
・
Store modules with unprocessed terminals.
・
Do not drop or otherwise shock the modules when transporting.
・
9. Definitions of switching time
90%
~
~
0V
V
L
RG
VGE
VCE
Ic
GE
V
CE
Vcc
Ic
0V
0A
t
rr
I
rr
Ic
~
90%
10%
10% 10%
t
r(i)
t
r
t
on
~
V
CE
~
~
t
off
0V
90%
t
f
10. Packing and Labeling
Display on the packing box
- Logo of production
- Type name
- Lot No
- Products quantity in a packing box
MS5F6562
5
a
14
H04-004-03a