R e v i s e d R e c o r d s
Date
May-24-’07
Classi-
fication
Enactment
Ind. Content
Applied
date
Issued
date
Drawn Checked Checked Approved
S.Miyashita K.Yamada T.Miyasaka
MS5F6857
2
15
H04-004-06b
1. Outline Drawin g ( Unit : mm )
2MBI300U4J-120-50
(RoHS compliant product)
2. Equi valen t circuit
GND
GND
Cu-Base
Cu-Base
[Inverter] [Thermistor]
[Inverter] [Thermistor]
+
G2.1
G2.1
G1.1
G1.1
+
G 1.2
G 1.2
EX 1.2
EX 1.2
G 2.2
G 2.2
EX 2.2
EX 2.2
-
-
CX 1
CX 1
G 1.3
G 1.3
G 2.3
G 2.3
Note : GND terminal current rating DC 1A max.
MS5F6857
T1
T1
T2
T2
3
15
H04-004-03a
Contact Thermal resistance
5. Thermal resi stance characteristi cs
Items
4. Electrical characteristi cs ( at Tj= 25
C un l ess otherw ise sp ecified )
3. Absol u te Maximum Rati ngs ( at Tc= 25
C un l ess otherw ise sp ecified )
Collector-Emitter voltage
Gate-Emitter voltage
Symbols
VCES 1200
VGES
Ic Continuous
Collector current
Icp 1ms
-Ic
-Ic pulse
Collector Power Dissipation 1 device
Junction temperature
Pc
Tj
Tstg
voltage
Screw
Torque
between terminal and copper base (*1)
between thermistor and others (*2)
Mounting (*3)
Terminals (*4)
PC-Board (*5)
Viso AC : 1min. 2500 VAC
-
1ms
Condi tion s
Ratings
450
300
900
600
300
600
1385
+150
-40 to +125
3.5
4.5
0.6
Units
V
V±20
A
W
o
C
N m
(*1) All terminals should be connected together when isolation test will be done.
(*2) Two thermistor terminals should be connected together, each other terminals should be connected together
and shorted to base plate when isolation test will be done.
(*3) Recommendable Value : Mounting 2.5 to 3.5 Nm (M5)
(*4) Recommendable Value : Terminals 3.5 to 4.5 Nm (M6)
(*5) Recommendable Value : PC-Board 0.4 to 0.6 Nm (M2.5)
Items Conditio nsSymbols
VCE=1200V
VGE=0V
VCE=0V
VGE=±20V
VCE=20V
Ic=300mA
collector current
Gate-Emitter
leakage current
Gate-Emitter
threshold voltage
ICES - - 3.0
IGES
VGE(th)
Ic=300A
Collector-Emitter
(terminal)
VGE=15V
saturation voltage
(chip)
Input capacitance
Cies
VCE=10V,VGE=0V,f=1MHz -
ton Vcc=600V - 0.32 1.20
Turn-on time
Inverter
tr Ic=300A - 0.10
tr(i) VGE=±15V - 0.03
Turn-off time
toff RG=2.0Ω tf - 0.07 0.30
IF=300A
Forward on voltage
(terminal)
VGE=0V
(chip)
Reverse recovery time
terminal-chip (*6)
Resistance
B value
Thermistor
trr
IF=300A -
R lead 1.00 - mΩ
R
B
(*6) Biggest internal terminal resistance among arm.
- - 600
4.5 6.5 8.5
- 2.30
-
2.50 -
2.45
- 1.90 2.05
-
2.10
34
0.60
0.41 1.00
-
2.00 2.15
- 2.10 -
- 1.65 1.80
-
1.75 -
- 0.35
-
-
5000
465 495 520
3305
3375 3450 K
Units
mA
nA
V
V
-
- nF
-
us
V
us
-
Ω
Items Symbols Conditio ns
Thermal resistance(1device) Rth(j-c)
(1 device) (*7)
(*7) This is the value which is defined mounting on the additional cooling fin with thermal compound.
IGBT FWD - - 0.15
Rth(c-f) with Thermal Compound -
MS5F6857
- 0.09
0.0167 -
Units
o
C/W
4
15
H04-004-03a
6.Indication on module
7.Recommend way of mounti n g on Heat si nk
(1) Initial : 1/3 specified torque, sequence (1)
Full specified torque (3.5 Nm),sequence(4)
8.Recommend way of PCB mounting on the Module
(1) Initial : 1/3 specified torque, sequence (1)
Full specified torque (0.6 Nm),sequence(1)
Display on the module label
- Logo of production
- Type name : 2MBI300U4J-120-50
- IC, VCES rating 300A 1200V
- Lot No. (5 digits)
- Place of manufacturing (code)
- Bar code
:
→
→
(3)
(2)
(1)
(4)
→
:
(4)
(3)
(2)
(1)
(5)
→
PCB (Printed Circuit Board)
M2.4 - M2.6 self tapping screw or M2.5 metrical screw is recommended.
The screw length to be PCB thickness +8mm or less.
Recommended tightening torque is 0.4 to 0.6 N m.
Note: FR4 is suitable as PCB material.
Nickel with a gold flash(Ni+Au) is recomm ended as surface metallization for spring landing pads.
Tin(Sn) can also be used.
This specification is applied to IGBT-Module named 2MBI300U4J-120-50.
MS5F6857
5
15
H04-004-03a