Fuji Electric 2MBI300U2B-060 Data Sheet

2MBI300U2B-060
IGBT Module U-Series
Features
· High speed switching
· Voltage drive
· Low inductance module structure
Applications
· AC and DC Servo drive amplifier
· Uninterruptible power supply
600V / 300A 2 in one-package
2. Equivalent circuit
Equivalent Circuit Schematic
· Industrial machines, such as Welding machines
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25°C unless otherwise specified)
Item Symbol
Collector-Emitter voltage VCES Gate-Emitter voltage VGES Collector current IC
ICp
-IC
-IC pulse Collector Power Dissipation PC Junction temperature Tj Storage temperature Tstg Isolation voltage between terminal and copper base *1 Viso Screw Torque Mounting *2 Terminals *2
*1 : All terminals should be connected together when isolation test will be done. *2 : Recommendable value : Mounting 2.5 to 3.5N·m(M5), Terminal 2.5 to 3.5 N·m(M5)
Conditions
Continuous
1ms
1 device
AC:1min.
Rating
600 ±20 300 600 300
600 1000 +150
-40 to +125 2500
3.5
3.5
Electrical characteristics (at Tj=25°C unless otherwise specified)
Item
Symbols Conditions Characteristics Unit
Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage
Input capacitance Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time Lead resistance, terminal-chip*3
*3:Biggest internal terminal resistance among arm.
ICES IGES VGE(th) VCE(sat) (terminal) VCE(sat) (chip) Cies ton tr tr(i) toff tf VF (terminal) VF (chip) trr R lead
VGE=0V, VCE=600V VCE=0V, VGE=±20V VCE=20V, IC=300mA VGE=15V, IC=300A
VCE=10V, VGE=0V, f=1MHz VCC=300V IC=300A VGE=±15V RG= 9.1 Ω
VGE=0V IF=300A
IF=300A
Tj=25°C Tj=125°C Tj=25°C Tj=125°C
Tj=25°C Tj=125°C Tj=25°C Tj=125°C
Min. Typ. Max.
2.0 – 400
6.2 6.7 7.7 – 2.10 2.45 – 2.35 – – 1.80 – – 2.05 – –23 – – 0.40 1.20 – 0.22 0.60 – 0.16 – – 0.48 1.20 – 0.07 0.45 – 1.90 2.30 – 1.95 – – 1.60 – – 1.65 – – 0.35 – 0.97
Thermal resistance characteristics
Items Symbols Conditions Characteristics Unit
Min. Typ. Max.
Thermal resistance
Contact Thermal resistance *4 : This is the value which is defined mounting on the additional cooling fin with thermal compound.
Rth(j-c) Rth(j-c) Rth(c-f)*4
IGBT FWD With thermal compound
0.125 – 0.23 – 0.025
Unit
V V A
W °C
VAC N·m
mA nA V V
nF μs
V
μs mΩ
°C/W °C/W °C/W
2MBI300U2B-060
Characteristics (Representative)
IGBT Module
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
750
VGE=20V15V
600
12V
450
300
Collector current : Ic [A]
150
0
012345
Collector-Emitter voltage : VCE [V]
Collector current vs. Collector-Emitter voltage (typ.)
VGE=15V / chip Tj=25°C / chip
750
Tj=125°CTj=25°C
600
10V
8V
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 125°C / chip
750
600
450
300
Collector current : Ic [A]
150
0
012345
Collector-Emitter voltage : VCE [V]
VGE=20V15V
12V
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
10
8
10V
8V
450
300
Collector current : Ic [A]
150
0
01234
Collector-Emitter voltage : VCE [V]
Capacitance vs. Collector-Emitter voltage (typ.) Dynamic Gate charge (typ.)
100.0
Cies
10.0
Cres
Coes
1.0
6
4
2
Collector - Emitter voltage : VCE [ V ]
0
5 10152025
Gate - Emitter voltage : VGE [ V ]
Ic=600A Ic=300A Ic=150A
Vcc=300V, Ic=300A, Tj= 25°C
VGE
Capacitance : Cies, Coes, Cres [ nF ]
0.1 0102030
Collector-Emitter voltage : VCE [V]
Gate - Emitter voltage : VGE [ 5V/div ]
Collector-Emitter voltage : VCE [ 100V/div ]
0 500 1000 1500
VCE
Gate charge : Qg [ nC ]
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