Fuji Electric 2MBI150VH-170-50 Data Sheet

Page 1
http://www.fujielectric.com/products/semiconductor/
2MBI150VH-170-50
IGBT Modules
IGBT MODULE (V series) 1700V / 150A / 2 in one package
Features
High speed switching Voltage drive Low Inductance module structure
Applications
Inverter for Motor Drive AC and DC Servo Drive Amplier Uninterruptible Power Supply Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at TC=25°C unless otherwise specied)
Items Symbols Conditions Maximum ratings Units Collector-Emitter voltage V Gate-Emitter voltage V
Collector current
Collector power dissipation P Junction temperature T Operating junction temperature (under switching conditions) Case temperature T Storage temperature T Isolation voltage
Screw torque
Note *1: All terminals should be connected together during the test. Note *2 : Recommendable Value : 3.0- 6.0 N·m (M5 or M6) Note *3 : Recommendable Value : 2.5-5.0 N·m (M5)
between terminal and copper base (*1) Mounting (*2) - 6.0 Terminals (*3) - 5.0
Electrical characteristics (at Tj= 25°C unless otherwise specied)
Items
Zero gate voltage collector current I Gate-Emitter leakage current I Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
Internal gate resistance R Input capacitance C
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time t
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance(1device) R
Contact thermal resistance (1device) (*4) R
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
CES 1700 V GES ±20 V
C Continuous
I
C pulse 1ms 300
I
C 150
-I
C pulse 1ms 300
-I
C 1 device 1110 W j 175
C=100°C 150
T
C=25°C 250
T
Tjop 150
C 125 stg -40 ~ 125
Viso AC : 1min. 4000 VAC
Symbols Conditions
CES VGE = 0V, VCE = 1700V - - 2.0 mA GES VCE = 0V, VGE = ±20V - - 400 nA
GE (th) VCE = 20V, IC = 150mA 6.0 6.5 7.0 V
CE (sat)
V (terminal)
CE (sat)
V
GE = 15V
V
C = 150A
I
(chip)
G (int) - - 5.0 - Ω ies VCE = 10V, VG E = 0V, f = 1MHz - 16 - nF
on
t t
r - 350 - r (i) - 60 -
t
off - 1050 -
t
f - 140 -
t
F
V (terminal)
F
V
VCC = 900V, IC = 150A
GE = ±15V, Rg_on=Rg_off= 4.8Ω
V
j=150°C, LS = 30nH
T
GE = 0V
V
F = 150A
I
(chip)
rr IF = 150A - 220 - nsec
th(j- c)
th(c-f) with Thermal Compound - 0.0250 -
IGBT - - 0.135 FWD - - 0.200
T T T T T T
T T T T T T
Package No. : M276
A
°C
N m
Characteristics
min. typ. max.
j=25°C - 2.20 2.65 j=125°C - 2.60 - j=150°C - 2.65 - j=25°C - 2.00 2.45 j=125°C - 2.40 - j=150°C - 2.45 -
- 950 -
j=25°C - 1.95 2.40 j=125°C - 2.20 - j=150°C - 2.20 - j=25°C - 1.80 1.95 j=125°C - 2.05 - j=150°C - 2.05 -
Characteristics
min. typ. max.
Units
V
nsec
V
Units
°C/W
1
7938b
MARCH 2016
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2MBI150VH-170-50
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Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 25°C / chip
400
300
VGE=20V
15V
12V
200
10V
100
Collector current: Ic [A]
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: V
CE [V]
Collector current vs. Collector-Emitter voltage (typ.)
GE= 15V / chip
V
400
Collector current vs. Collector-Emitter voltage (typ.)
j= 150°C / chip
T
400
VGE= 20V
300
200
100
Collector current: Ic [A]
15V
12V
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: V
CE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
j= 25°C / chip
T
8
T
300
j=25°C
125°C
150°C
200
100
Collector Current: Ic [A]
0
0 1 2 3 4 5
Collector-Emitter Voltage: V
CE [V]
Gate Capacitance vs. Collector-Emitter Voltage
V
GE= 0V, ƒ= 1MHz, Tj= 25°C
100
Cies
10
***
1
Gate Capacitance: Cies, Coes, Cres [nF]
0.1 0 10 20 30
Collector-Emitter voltage: V
Cres
Coes
CE [V]
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: V
GE [V]
Dynamic Gate Charge (typ.)
Vcc=900V, Ic=150A, T
20
15
10
5
0
-5
-10
Gate-Emitter voltage: VGE [V] ,,
-15
-20
-2 -1 0 1 2
VCE
VGE
Gate charge: Qg [μC]
j= 25°C
Ic=300A Ic=150A Ic=75A
1200
900
600
300
0
-300
-600
-900
-1200
[V],,
Collector-Emitter voltage: VCE
2
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2MBI150VH-170-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Switching time vs. Collector current (typ.)
Vcc=900V, VGE=±15V, Rg_on=Rg_off=4.8Ω, Tj=125°C
10000
1000
100
Switching time: ton, tr, toff, tf [nsec]
10
Vcc=900V, Ic=150A, V
10000
1000
toff
ton
tr
tf
0 100 200 300 400
Collector current: Ic [A]
GE=±15V, Tj=125°C
toff
ton
tr
Switching time vs. Collector current (typ.)
Vcc=900V, VGE=±15V, Rg_on=Rg_off=4.8Ω, Tj=150°C
10000
toff
1000
ton
100
Switching time: ton, tr, toff, tf [nsec]
10
tr
tf
0 100 200 300 400
Collector current: Ic [A]
Switching loss vs. Collector current (typ.)Switching time vs. Gate resistance (typ.)
Vcc=900V, V
GE=±15V, Rg_on=Rg_off=4.8Ω, Tj=125, 150°C
160
o
C
140
120
Tj=125 T
j=150
o
C
100
80
Eon
Eoff
100
tf
60
40
20
Switching time: ton, tr, toff, tf [nsec]
10
1 10 100
Gate resistance: Rg_on, Rg_off []
0
Switching loss: Eon, Eoff, Err [mJ/pulse]
0 100 200 300 400
Collector current: Ic [A]
Switching loss vs. Gate resistance (typ.) Reverse bias safe operating area (max.)
Vcc=900V, Ic=150A, VGE=±15V, Tj=125, 150°C
250
200
150
100
50
Tj=125 T
j=150
o
C
o
C
Eon
Eoff
Err
+VGE=15V, -VGE=15V, Rg_off=4.8Ω, Tj=150°C
400
300
200
100
Collector current: Ic [A]
Err
Switching loss: Eon, Eoff, Err [mJ/pulse]
0
1 10 100
Gate resistance: Rg_on, Rg_off []
0
0 500 1000 1500 2000
Collector-Emitter voltage: V
CE [V]
(Main terminals)
3
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2MBI150VH-170-50
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IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Forward Current vs. Forward Voltage (typ.)
chip
400
j=25°C
300
200
100
Forward current: IF [A]
150°C
0
0 1 2 3
Forward on voltage: V
T
F [V]
Reverse Recovery Characteristics (typ.)
Vcc=900V, V
1000
GE=±15V, Rg_on=4.8Ω, Tj=150°C
125°C
Reverse Recovery Characteristics (typ.)
Vcc=900V, V
1000
rr [nsec] ,,,
100
Reverse recovery current: Irr [A] ,,
Reverse recovery time: t
10
GE=±15V, Rg_on=4.8Ω, Tj=125°C
Irr
trr
0 100 200 300 400
Forward current: I
F [A]
Transient Thermal Resistance (max.)
1
FWD
rr [nsec] ,,,
100
Reverse recovery current: Irr [A] ,,
Reverse recovery time: t
10
0 100 200 300 400
Forward current: I
FWD safe operating area (max.)
T
j=150°C
350
300
250
200
150
Pmax=300W
trr
Irr
F [A]
0.1
4
Zth
0.01
n
τ
[sec] 0.0023 0.0301 0.0598 0.0708
n
r
IGBT 0.01448 0.03671 0.05186 0.03194
Thermal resistanse: Rth(j-c) [°C/W] ***
0.001
n
[°C/W] FW D 0.02145 0.05439 0.07684 0.04732
0.001 0.01 0.1 1
Pulse Width : Pw [sec]
=
Σ
n
=1
1 2 3 4
IGBT
 
r 1–e
n
 
t
-
τ
n
 
100
50
Reverse recovery current: Irr [A] ,,
0
0 500 1000 1500 2000
Collector-Emitter voltage: V
(Main terminals)
CE [V]
4
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2MBI150VH-170-50
1. Outline Drawing ( Unit : mm
)
Outline Drawings, mm
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Equivalent Circuit Schematic
2. Equivalent Circuit
Weight: 370g (typ.)
C1
G1
E1
C2E1
G2
E2
E2
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2MBI150VH-170-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
WARNING
1. This Catalog contains the product specications, characteristics, data, materials, and structures as of March 2016. The contents are subject to c hange without notice for specication changes or other reasons. When using a product listed in this Catalog, be sur to obtain the latest specications.
2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warrant y, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein.
3. Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injur y, re, or other problem if any of the products become faulty. It is recommended to make your design failsafe, ame retardant, and free of malfunction.
4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements.
• Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment
• Machine tools • Audiovisual equipment • Electrical home appliances • Personal equipment • Industr ial robots etc.
5. If you need to use a product in this Cat alog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty.
• Transportation equipment (mounted on cars and ships) • Trunk communications equipment
• Trafc-signal control equipment • Gas leakage detectors with an auto-shut-off feature
• Emergency equipment for responding to disasters and anti- burglary devices • Safety devices
• Medical equipment
6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation).
• Space equipment • Aeronautic equipment • Nuclear control equipment
• Submarine repeater equipment
7. Copyr ight ©1996-2016 by Fuji Electric Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd.
8. If you have any question about any portion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein.
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