Fuji Electric 2MBI150VH-170-50 Data Sheet

http://www.fujielectric.com/products/semiconductor/
2MBI150VH-170-50
IGBT Modules
IGBT MODULE (V series) 1700V / 150A / 2 in one package
Features
High speed switching Voltage drive Low Inductance module structure
Applications
Inverter for Motor Drive AC and DC Servo Drive Amplier Uninterruptible Power Supply Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at TC=25°C unless otherwise specied)
Items Symbols Conditions Maximum ratings Units Collector-Emitter voltage V Gate-Emitter voltage V
Collector current
Collector power dissipation P Junction temperature T Operating junction temperature (under switching conditions) Case temperature T Storage temperature T Isolation voltage
Screw torque
Note *1: All terminals should be connected together during the test. Note *2 : Recommendable Value : 3.0- 6.0 N·m (M5 or M6) Note *3 : Recommendable Value : 2.5-5.0 N·m (M5)
between terminal and copper base (*1) Mounting (*2) - 6.0 Terminals (*3) - 5.0
Electrical characteristics (at Tj= 25°C unless otherwise specied)
Items
Zero gate voltage collector current I Gate-Emitter leakage current I Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
Internal gate resistance R Input capacitance C
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time t
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance(1device) R
Contact thermal resistance (1device) (*4) R
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
CES 1700 V GES ±20 V
C Continuous
I
C pulse 1ms 300
I
C 150
-I
C pulse 1ms 300
-I
C 1 device 1110 W j 175
C=100°C 150
T
C=25°C 250
T
Tjop 150
C 125 stg -40 ~ 125
Viso AC : 1min. 4000 VAC
Symbols Conditions
CES VGE = 0V, VCE = 1700V - - 2.0 mA GES VCE = 0V, VGE = ±20V - - 400 nA
GE (th) VCE = 20V, IC = 150mA 6.0 6.5 7.0 V
CE (sat)
V (terminal)
CE (sat)
V
GE = 15V
V
C = 150A
I
(chip)
G (int) - - 5.0 - Ω ies VCE = 10V, VG E = 0V, f = 1MHz - 16 - nF
on
t t
r - 350 - r (i) - 60 -
t
off - 1050 -
t
f - 140 -
t
F
V (terminal)
F
V
VCC = 900V, IC = 150A
GE = ±15V, Rg_on=Rg_off= 4.8Ω
V
j=150°C, LS = 30nH
T
GE = 0V
V
F = 150A
I
(chip)
rr IF = 150A - 220 - nsec
th(j- c)
th(c-f) with Thermal Compound - 0.0250 -
IGBT - - 0.135 FWD - - 0.200
T T T T T T
T T T T T T
Package No. : M276
A
°C
N m
Characteristics
min. typ. max.
j=25°C - 2.20 2.65 j=125°C - 2.60 - j=150°C - 2.65 - j=25°C - 2.00 2.45 j=125°C - 2.40 - j=150°C - 2.45 -
- 950 -
j=25°C - 1.95 2.40 j=125°C - 2.20 - j=150°C - 2.20 - j=25°C - 1.80 1.95 j=125°C - 2.05 - j=150°C - 2.05 -
Characteristics
min. typ. max.
Units
V
nsec
V
Units
°C/W
1
7938b
MARCH 2016
2MBI150VH-170-50
3
Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 25°C / chip
400
300
VGE=20V
15V
12V
200
10V
100
Collector current: Ic [A]
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: V
CE [V]
Collector current vs. Collector-Emitter voltage (typ.)
GE= 15V / chip
V
400
Collector current vs. Collector-Emitter voltage (typ.)
j= 150°C / chip
T
400
VGE= 20V
300
200
100
Collector current: Ic [A]
15V
12V
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: V
CE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
j= 25°C / chip
T
8
T
300
j=25°C
125°C
150°C
200
100
Collector Current: Ic [A]
0
0 1 2 3 4 5
Collector-Emitter Voltage: V
CE [V]
Gate Capacitance vs. Collector-Emitter Voltage
V
GE= 0V, ƒ= 1MHz, Tj= 25°C
100
Cies
10
***
1
Gate Capacitance: Cies, Coes, Cres [nF]
0.1 0 10 20 30
Collector-Emitter voltage: V
Cres
Coes
CE [V]
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: V
GE [V]
Dynamic Gate Charge (typ.)
Vcc=900V, Ic=150A, T
20
15
10
5
0
-5
-10
Gate-Emitter voltage: VGE [V] ,,
-15
-20
-2 -1 0 1 2
VCE
VGE
Gate charge: Qg [μC]
j= 25°C
Ic=300A Ic=150A Ic=75A
1200
900
600
300
0
-300
-600
-900
-1200
[V],,
Collector-Emitter voltage: VCE
2
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