http://www.fujielectric.com/products/semiconductor/
2MBI150VA-120-50
IGBT Modules
IGBT MODULE (V series)
1200V / 150A / 2 in one package
Features
High speed switching
Voltage drive
Low Inductance module structure
Applications
Inverter for Motor Drive
AC and DC Servo Drive Amplier
Uninterruptible Power Supply
Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at TC =25°C unless otherwise specied)
Items Symbols Conditions Maximum ratings Units
Collector-Emitter voltage V
Gate-Emitter voltage V
Collector current
Collector power dissipation P
Junction temperature T
Operating junction temperature (under switching conditions)
Case temperature T
Storage temperature T
Isolation voltage
Screw torque
Note *1: All terminals should be c onnected together when isolation test will be done.
Note *2: Recommendable Value : 3.0 -5.0 Nm (M5 or M6)
Note *3: Recommendable Value : 2.5 -3.5 Nm (M5)
between terminal and copper base (*1)
Mounting (*2) - 5.0
Terminals (*3) - 5.0
Electrical characteristics (at Tj = 25°C unless otherwise specied)
Items
Zero gate voltage collector current I
Gate-Emitter leakage current I
Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
Internal gate resistance R
Input capacitance C
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time t
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance (1device) R
Contact thermal resistance (1device) (*4) R
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
CES 1200 V
GES ±20 V
C Continuous T C=100°C 150
I
C pulse 1ms 300
I
C 150
-I
C pulse 1ms 300
-I
C 1 device 785 W
j 175
Tjop 150
C 125
stg -40 ~ 125
A
°C
Viso AC : 1min. 2500 VAC
N m
Symbols Conditions
CES V GE = 0V, V CE = 1200V - - 1.0 mA
GES V CE = 0V, VGE = ±20V - - 200 nA
GE (th) V CE = 20V, I C = 150mA 6.0 6.5 7.0 V
CE (sat)
V
(terminal)
CE (sat)
V
(chip)
G (int) - - 5 - Ω
ies V CE = 10V, VG E = 0V, f = 1MHz - 12.6 - nF
on
t
t
r - 200 -
r (i) - 50 -
t
off - 600 -
t
f - 40 -
t
F
V
(terminal)
F
V
(chip)
rr I F = 150A - 150 - nsec
V
GE = 15V
C = 150A
I
V
GE = 15V
C = 150A
I
VCC = 600V LS = 30nH
C = 150A
I
GE = ±15V
V
G = 1.1Ω
R
j = 150°C
T
V
GE = 0V
F = 150A
I
V
GE = 0V
F = 150A
I
T
j=25°C - 2.05 2.50
j=125°C - 2.35 -
T
j=150°C 2.40
T
T
j=25°C - 1.75 2.20
j=125°C - 2.05 -
T
j=150°C 2.10
T
T
j=25°C - 1.85 2.30
j=125°C - 2,00 -
T
j=150°C 1.95
T
T
j=25°C - 1.70 2.15
j=125°C - 1.85 -
T
j=150°C 1.80
T
Characteristics
min. typ. max.
- 600 -
Characteristics
min. typ. max.
th(j- c)
th(c-f) with Thermal Compound - 0.050 -
IGBT - - 0.19
FWD - - 0.31
Units
Units
°C/W
V
nsec
V
1
7907a
JULY 2015
2MBI150VA-120-50
Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 25°C / chip
350
300
V
12V
GE=20V 15V
250
200
150
100
Collector current: IC [A]
50
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector current vs. Collector-Emitter voltage (typ.)
GE= 15V / chip
V
350
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 150°C / chip
350
300
V
15V
GE= 20V
12V
250
200
150
100
Collector current: IC [A]
50
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
j= 25°C / chip
T
10
300
T
125°C150°C
j=25°C
250
200
150
100
Collector Current: IC [A]
50
0
0 1 2 3 4
Collector-Emitter Voltage: VCE [V]
Gate Capacitance vs. Collector-Emitter Voltage
GE= 0V, ƒ= 1MHz, T j= 25°C
V
100
ies
10
C
8
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: VGE [V]
Dynamic Gate Charge (typ.)
CC=600V, I C=150A, T j= 25°C
V
20
15
10
5
V
CE
I
C=300A
C=150A
I
C=75A
I
800
600
400
200
CE [V]
1
Gate Capacitance: Cies , Coes , Cres [nF]
Cres
Coes
0.1
0 10 20 30
Collector-Emitter voltage: VCE [V]
0
-5
-10
Gate-Emitter voltage: VGE [V]
VGE
-15
-20
0
-200
-400
Collector-Emitter voltage: V
-600
-800
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
Gate charge: Qg [μC]
2
2MBI150VA-120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Switching time: ton , tr , toff , tf [nsec]
Switching time: ton , tr , toff , tf [nsec]
Switching time vs. Collector current (typ.)
CC=600V, V GE=±15V, R G=1.1Ω, T j=125°C
V
10000
1000
100
10
0 100 200 300 400
Collector current: IC [A]
CC=600V, I C=150A, V GE=±15V, T j=125°C
V
10000
1000
100
10
0.1 1 10 100
ton
toff
Switching time vs. Collector current (typ.)
V
CC=600V, V GE=±15V, R G=1.1Ω, T j=150°C
10000
ton
t
off
1000
tr
ton
toff
tr
100
tf
tf
Switching time: ton , tr , toff , tf [nsec]
10
0 100 200 300 400
Collector current: IC [A]
Switching loss vs. Collector current (typ.) Switching time vs. Gate resistance (typ.)
V
CC=600V, V GE=±15V, R G=1.1Ω, T j=125, 150°C
45
40
35
30
tr
25
20
15
10
tf
5
Switching loss: Eon , Eoff , Err [mJ/pulse]
0
0 100 200 300 400
Tj =125oC
o
j=150
T
C
Eon
Eoff
Err
Gate resistance: RG [Ω]
Switching loss vs. Gate resistance (typ.)
CC=600V, I C=150A, V GE=±15V, T j=125, 150°C
V
20
18
16
14
12
10
8
6
4
2
Switching loss: Eon , Eoff , Err [mJ/pulse]
0
0 1 10 100
Eon
Eoff
Err
Tj =125oC
j=150
T
Collector current: IC [A]
o
C
Reverse bias safe operating area (max.)
+V
350
300
250
200
150
100
50
0
0 400 800 1200 1600
Gate resistance: RG [Ω]
Collector current: IC [A]
GE=15V, -V GE=15V, R G=1.1Ω, T j=150°C
Collector-Emitter voltage: VCE [V]
(Main terminals)
3