Fuji Electric 2MBI100VA-120-50 Data Sheet

http://www.fujielectric.com/products/semiconductor/
2MBI100VA-120-50
IGBT Modules
IGBT MODULE (V series) 1200V / 100A / 2 in one package
High speed switching Voltage drive Low Inductance module structure
Applications
Inverter for Motor Drive AC and DC Servo Drive Amplier Uninterruptible Power Supply Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at TC=25°C unless otherwise specied)
Items Symbols Conditions Maximum ratings Units Collector-Emitter voltage V Gate-Emitter voltage V
Collector current
Collector power dissipation P Junction temperature T Operating junction temperature (under switching conditions) Case temperature T Storage temperature T Isolation voltage
Screw torque
Note *1: All terminals should be connected together when isolation test will be done. Note *2: Recommendable Value : 3.0-5.0 Nm (M5 or M 6) Note *3: Recommendable Value : 2.5-3.5 Nm (M5)
between terminal and copper base (*1) Mounting (*2) - 5.0 Terminals (*3) - 5.0
Electrical characteristics (at Tj= 25°C unless otherwise specied)
Items
Zero gate voltage collector current I Gate-Emitter leakage current I Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
Internal gate resistance R Input capacitance C
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time t
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance (1device) R
Contact thermal resistance (1device) (*4) R
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
CES 1200 V GES ±20 V
C Continuous TC=100°C 100
I
C pulse 1ms 200
I
C 100
-I
C pulse 1ms 200
-I
C 1 device 555 W j 175
Tjop 150
C 125 stg -40 ~ 125
A
°C
Viso AC : 1min. 2500 VAC
N m
Symbols Conditions
CES VGE = 0V, VCE = 1200V - - 1.0 mA GES VCE = 0V, VGE = ±20V - - 200 nA
GE (th) VCE = 20V, IC = 100mA 6.0 6.5 7.0 V
CE (sat)
V (terminal)
CE (sat)
V (chip)
G (int) - - 7.5 - Ω ies VCE = 10V, VG E = 0V, f = 1MHz - 9.1 - nF
on
t t
r - 200 - r (i) - 50 -
t
off - 600 -
t
f - 40 -
t
F
V (terminal)
F
V (chip)
rr IF = 100A - 150 - nsec
V
GE = 15V
C = 100A
I
V
GE = 15V
C = 100A
I
VCC = 600V LS = 30nH
C = 100A
I
GE = ±15V
V
G = 1.6Ω
R
j = 150°C
T
V
GE = 0V
F = 100A
I
V
GE = 0V
F = 100A
I
T
j=25°C - 1.90 2.35 j=125°C - 2.20 -
T
j=150°C 2.25
T T
j=25°C - 1.75 2.20 j=125°C - 2.05 -
T
j=150°C 2.10
T
T
j=25°C - 1.80 2.25 j=125°C - 1.95 -
T
j=150°C 1.90
T T
j=25°C - 1.70 2.15 j=125°C - 1.85 -
T
j=150°C 1.80
T
Characteristics
min. typ. max.
- 600 -
Characteristics
min. typ. max.
th(j- c)
th(c-f) with Thermal Compound - 0.050 -
IGBT - - 0.27 FWD - - 0.48
Units
Units
°C/W
V
nsec
V
1
7906a
JULY 2015
2MBI100VA-120-50
3
Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 25°C / chip
250
V
200
GE=20V 15V 12V
150
100
Collector current: IC [A]
50
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector current vs. Collector-Emitter voltage (typ.)
GE= 15V / chip
V
250
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 150°C / chip
250
GE= 20V
V
200
15V
12V
150
100
Collector current: IC [A]
50
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
j= 25°C / chip
T
10
200
T
125°C150°C
j=25°C
150
100
Collector Current: IC [A]
50
0
0 1 2 3 4
Collector-Emitter Voltage: VCE [V]
Gate Capacitance vs. Collector-Emitter Voltage
GE= 0V, ƒ= 1MHz, Tj= 25°C
V
100
ies
10
C
8
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: VGE [V]
Dynamic Gate Charge (typ.)
CC=600V, IC=100A, Tj= 25°C
V
20
15
10
5
CE
V
I
C=200A C=100A
I
C=50A
I
800
600
400
200
CE [V]
1
Gate Capacitance: Cies, Coes, Cres [nF]
Cres
Coes
0.1 0 10 20 30
Collector-Emitter voltage: VCE [V]
0
-5
-10
Gate-Emitter voltage: VGE [V]
VGE
-15
-20
0
-200
-400 Collector-Emitter voltage: V
-600
-800
-1.0 -0.5 0.0 0.5 1.0 Gate charge: Qg [μC]
2
2MBI100VA-120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Switching time: ton, tr, toff, tf [nsec]
Switching time vs. Collector current (typ.)
CC=600V, VGE=±15V, RG=1.6Ω, Tj=125°C
V
10000
1000
100
10
0 100 200 300
Collector current: IC [A]
CC=600V, IC=100A, VGE=±15V, Tj=125°C
V
10000
1000
100
ton t
tr
tf
ton toff
tr
Switching time vs. Collector current (typ.)
V
CC=600V, VGE=±15V, RG=1.6Ω, Tj=150°C
10000
1000
off
ton toff
tr
100
tf
Switching time: ton, tr, toff, tf [nsec]
10
0 100 200 300
Collector current: IC [A]
Switching loss vs. Collector current (typ.)Switching time vs. Gate resistance (typ.)
V
CC=600V, VGE=±15V, RG=1.6Ω, Tj=125, 150°C
30
Tj=125oC
25
20
15
10
j=150
T
o
C
Eon
Eoff
Err
tf
Switching time: ton, tr, toff, tf [nsec]
10
1 10 100
Gate resistance: RG [Ω]
Switching loss vs. Gate resistance (typ.)
CC=600V, IC=100A, VGE=±15V, Tj=125, 150°C
V
14
Tj=125oC
12
10
8
6
4
j=150
T
o
C
Eon
Eoff
Err
5
Switching loss: Eon, Eoff, Err [mJ/pulse]
0
0 50 100 150 200 250
Collector current: IC [A]
Reverse bias safe operating area (max.)
+V
GE=15V, -VGE=15V, RG=1.6Ω, Tj=150°C
250
200
150
100
Collector current: IC [A]
50
2
Switching loss: Eon, Eoff, Err [mJ/pulse]
0
1 10 100
Gate resistance: RG [Ω]
0
0 400 800 1200 1600
Collector-Emitter voltage: VCE [V]
(Main terminals)
3
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