http://www.fujielectric.com/products/semiconductor/
2MBI100VA-120-50
IGBT Modules
IGBT MODULE (V series)
1200V / 100A / 2 in one package
Features
High speed switching
Voltage drive
Low Inductance module structure
Applications
Inverter for Motor Drive
AC and DC Servo Drive Amplier
Uninterruptible Power Supply
Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at TC =25°C unless otherwise specied)
Items Symbols Conditions Maximum ratings Units
Collector-Emitter voltage V
Gate-Emitter voltage V
Collector current
Collector power dissipation P
Junction temperature T
Operating junction temperature (under switching conditions)
Case temperature T
Storage temperature T
Isolation voltage
Screw torque
Note *1: All terminals should be connected together when isolation test will be done.
Note *2: Recommendable Value : 3.0-5.0 Nm (M5 or M 6)
Note *3: Recommendable Value : 2.5-3.5 Nm (M5)
between terminal and copper base (*1)
Mounting (*2) - 5.0
Terminals (*3) - 5.0
Electrical characteristics (at Tj= 25°C unless otherwise specied)
Items
Zero gate voltage collector current I
Gate-Emitter leakage current I
Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
Internal gate resistance R
Input capacitance C
Turn-on time
Turn-off time
Forward on voltage
Reverse recovery time t
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance (1device) R
Contact thermal resistance (1device) (*4) R
Note *4: This is the value which is dened mounting on the additional cooling n with thermal compound.
CES 1200 V
GES ±20 V
C Continuous T C=100°C 100
I
C pulse 1ms 200
I
C 100
-I
C pulse 1ms 200
-I
C 1 device 555 W
j 175
Tjop 150
C 125
stg -40 ~ 125
A
°C
Viso AC : 1min. 2500 VAC
N m
Symbols Conditions
CES V GE = 0V, V CE = 1200V - - 1.0 mA
GES V CE = 0V, VGE = ±20V - - 200 nA
GE (th) V CE = 20V, I C = 100mA 6.0 6.5 7.0 V
CE (sat)
V
(terminal)
CE (sat)
V
(chip)
G (int) - - 7.5 - Ω
ies V CE = 10V, VG E = 0V, f = 1MHz - 9.1 - nF
on
t
t
r - 200 -
r (i) - 50 -
t
off - 600 -
t
f - 40 -
t
F
V
(terminal)
F
V
(chip)
rr I F = 100A - 150 - nsec
V
GE = 15V
C = 100A
I
V
GE = 15V
C = 100A
I
VCC = 600V LS = 30nH
C = 100A
I
GE = ±15V
V
G = 1.6Ω
R
j = 150°C
T
V
GE = 0V
F = 100A
I
V
GE = 0V
F = 100A
I
T
j=25°C - 1.90 2.35
j=125°C - 2.20 -
T
j=150°C 2.25
T
T
j=25°C - 1.75 2.20
j=125°C - 2.05 -
T
j=150°C 2.10
T
T
j=25°C - 1.80 2.25
j=125°C - 1.95 -
T
j=150°C 1.90
T
T
j=25°C - 1.70 2.15
j=125°C - 1.85 -
T
j=150°C 1.80
T
Characteristics
min. typ. max.
- 600 -
Characteristics
min. typ. max.
th(j- c)
th(c-f) with Thermal Compound - 0.050 -
IGBT - - 0.27
FWD - - 0.48
Units
Units
°C/W
V
nsec
V
1
7906a
JULY 2015
2MBI100VA-120-50
Characteristics (Representative)
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 25°C / chip
250
V
200
GE=20V 15V 12V
150
100
Collector current: IC [A]
50
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector current vs. Collector-Emitter voltage (typ.)
GE= 15V / chip
V
250
Collector current vs. Collector-Emitter voltage (typ.)
T
j= 150°C / chip
250
GE= 20V
V
200
15V
12V
150
100
Collector current: IC [A]
50
10V
8V
0
0 1 2 3 4 5
Collector-Emitter voltage: VCE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
j= 25°C / chip
T
10
200
T
125°C150°C
j=25°C
150
100
Collector Current: IC [A]
50
0
0 1 2 3 4
Collector-Emitter Voltage: VCE [V]
Gate Capacitance vs. Collector-Emitter Voltage
GE= 0V, ƒ= 1MHz, T j= 25°C
V
100
ies
10
C
8
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: VGE [V]
Dynamic Gate Charge (typ.)
CC=600V, I C=100A, T j= 25°C
V
20
15
10
5
CE
V
I
C=200A
C=100A
I
C=50A
I
800
600
400
200
CE [V]
1
Gate Capacitance: Cies , Coes , Cres [nF]
Cres
Coes
0.1
0 10 20 30
Collector-Emitter voltage: VCE [V]
0
-5
-10
Gate-Emitter voltage: VGE [V]
VGE
-15
-20
0
-200
-400
Collector-Emitter voltage: V
-600
-800
-1.0 -0.5 0.0 0.5 1.0
Gate charge: Qg [μC]
2
2MBI100VA-120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Switching time: ton , tr , toff , tf [nsec]
Switching time vs. Collector current (typ.)
CC=600V, V GE=±15V, R G=1.6Ω, T j=125°C
V
10000
1000
100
10
0 100 200 300
Collector current: IC [A]
CC=600V, I C=100A, V GE=±15V, T j=125°C
V
10000
1000
100
ton
t
tr
tf
ton
toff
tr
Switching time vs. Collector current (typ.)
V
CC=600V, V GE=±15V, R G=1.6Ω, T j=150°C
10000
1000
off
ton
toff
tr
100
tf
Switching time: ton , tr , toff , tf [nsec]
10
0 100 200 300
Collector current: IC [A]
Switching loss vs. Collector current (typ.) Switching time vs. Gate resistance (typ.)
V
CC=600V, V GE=±15V, R G=1.6Ω, T j=125, 150°C
30
Tj =125oC
25
20
15
10
j=150
T
o
C
Eon
Eoff
Err
tf
Switching time: ton , tr , toff , tf [nsec]
10
1 10 100
Gate resistance: RG [Ω]
Switching loss vs. Gate resistance (typ.)
CC=600V, I C=100A, V GE=±15V, T j=125, 150°C
V
14
Tj =125oC
12
10
8
6
4
j=150
T
o
C
Eon
Eoff
Err
5
Switching loss: Eon , Eoff , Err [mJ/pulse]
0
0 50 100 150 200 250
Collector current: IC [A]
Reverse bias safe operating area (max.)
+V
GE=15V, -V GE=15V, R G=1.6Ω, T j=150°C
250
200
150
100
Collector current: IC [A]
50
2
Switching loss: Eon , Eoff , Err [mJ/pulse]
0
1 10 100
Gate resistance: RG [Ω]
0
0 400 800 1200 1600
Collector-Emitter voltage: VCE [V]
(Main terminals)
3