Fuji Electric 1MBI400V-120-50 Data Sheet

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http://www.fujielectric.com/products/semiconductor/
1MBI400V-120-50
IGBT Modules
IGBT MODULE (V series) 1200V / 400A / 1 in one package
Features
High speed switching Voltage drive Low Inductance module structure
Applications
Inverter for Motor Drive AC and DC Servo Drive Amplier Uninterruptible Power Supply Industrial machines, such as Welding machines
Maximum Ratings and Characteristics
Absolute Maximum Ratings (at Tc=25°C unless otherwise specied)
Items Symbols Conditions Maximum ratings Units Collector-Emitter voltage V Gate-Emitter voltage V
Collector current
Collector power dissipation Pc 1 device 2410 W Junction temperature Tj 175 Operating junction temperature
(under switching conditions) Case temperature Tc 125 Storage temperature Tstg -40~+125 Isolation voltage Between terminal and copper base (*1) V
Mounting (*2) M5 ro M6 6.0
Screw torque
Note *1: All terminals should be connected together during the test. Note *2: Rec ommendable Value : 3.0-6.0 Nm (M5, M6) Note *3: Recommendable Value : 1.1-2.0 Nm (M4) Recommendable Value : 2.5-5.0 Nm (M6)
Terminals (*3)
CES 1200 V GES ±20 V
Ic Continuous
Ic pulse 1ms 800
-Ic 400
-Ic pulse 1ms 800
Tjop 150
iso AC : 1min. 2500 VAC
M4 2.0 M6 5.0
Tc=100°C 400 Tc=25°C 480
A
°C
Nm
1
7777a
MARCH 2014
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1MBI400V-120-50
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Electrical characteristics (at Tj= 25°C unless otherwise specied)
Items Symbols Conditions
Zero gate voltage collector current I Gate-Emitter leakage current I Gate-Emitter threshold voltage V
Collector-Emitter saturation voltage
CES VGE = 0V, VCE = 1200V GES VCE = 0V, VGE = ±20V
GE (th) VCE = 20V, IC = 400mA
V
CE (sat)
(terminal)
V
CE (sat)
GE = 15V
V IC = 400A
(chip)
Tj=25°C Tj=125°C Tj=150°C Tj=25°C Tj=125°C Tj=150°C
Internal gate resistance Rg(int) - Input capacitance Cies V
GE
= 0V, VCE = 10V, f = 1MHz
ton
Turn-on time
Turn-off time
Forward on voltage
tr tr(i) toff tf V
F
(terminal)
V
F
(chip)
CC = 600V, IC = 400A
V VGE = ±15V, RG = 1.8Ω Tj=150°C, Ls=35nH
GE
= 0V
V IF = 400A
Tj=25°C Tj=125°C Tj=150°C Tj=25°C Tj=125°C Tj=150°C
Reverse recovery time trr I
F = 400A
Thermal resistance characteristics
Items Symbols Conditions
Thermal resistance (1device) Rth(j-c)
Contact thermal resistance (*4) Rth(c-f) with Thermal Compound - 0.0125 -
Note *4: This is the value which is dened mounting on the additional cooling n with thermal c ompound.
IGBT - - 0.062
Characteristics
min. typ. max.
- - 4.0
- - 400
6.0 6.5 7.0
- 1.95 2.40
- 2.25 -
2.30
- 1.75 2.15
- 2.05 -
2.10
- 1.9 -
- 36 -
- 0.60 -
- 0.20 -
- 0.08 -
- 1.00 -
- 0.14 -
- 1.85 2.30
- 2.00 -
1.95
- 1.70 2.15
- 1.85 -
1.80
- 0.20 -
Characteristics
min. typ. max.
IGBT Modules
Units
mA
nA
V
V
Ω
nF
µs
V
µs
Units
°C/WFWD - - 0.110
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1MBI400V-120-50
Characteristics (Representative)
IGBT Modules
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Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
1000
800
600
400
Collector current: Ic [A]
200
0
0 1 2 3 4 5
VGE=20V
Collector-Emitter voltage: V
15V 15V
12V
10V
8V
CE [V]
Collector current vs. Collector-Emitter voltage (typ.)
GE= 15V / chip
V
1000
800
125°CTj=25°C 150°C
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 150°C / chip
1000
VGE= 20V
800
600
400
Collector current: Ic [A]
200
0
0 1 2 3 4 5
Collector-Emitter voltage: V
12V
10V
8V
CE [V]
Collector-Emitter voltage vs. Gate-Emitter voltage
Tj= 25°C / chip
10
8
600
400
Collector Current: Ic [A]
200
0
0 1 2 3 4
Collector-Emitter Voltage: V
CE [V]
6
4
2
Collector-Emitter Voltage: VCE [V]
0
5 10 15 20 25
Gate-Emitter Voltage: V
Gate Capacitance vs. Collector-Emitter Voltage Dynamic Gate Charge (typ.)
V
100
VGE= 0V, ƒ= 1MHz, Tj= 25°C
Cies
10
***
Cres
Coes
Gate Capacitance: Cies, Coes, Cres [nF]
1
0 10 20 30
Collector-Emitter voltage: V
CE [V]
20
15
10
5
0
-5
-10
Gate-Emitter voltage: VGE [V]
-15
-20
-4 -2 0 2 4
cc=600V, Ic=400A, Tj= 25°C
V
CE
VGE
Gate charge: Qg [µC]
GE [V]
Ic=800A Ic=400A Ic=200A
800
600
400
200
0
-200
-400
-600
-800
Collector-Emitter voltage: VCE [V]
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1MBI400V-120-50
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IGBT Modules
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Switching time vs. Collector current (typ.)
Vcc=600V, V
10000
1000
100
Switching time: ton, tr, toff, tf [nsec]
10
0 200 400 600 800 1000
GE=±15V, Rg=1.8Ω, Tj=125°C
Collector current: Ic [A]
Switching time vs. Gate resistance (typ.)
Vcc=600V, Ic=400A, V
10000
1000
GE=±15V, Tj=125°C
toff
ton tr
toff ton
tr
tf
Switching time vs. Collector current (typ.)
Vcc=600V, V
10000
1000
100
Switching time: ton, tr, toff, tf [nsec]
10
0 200 400 600 800 1000
GE=±15V, Rg=1.8Ω, Tj=150°C
Collector current: Ic [A]
Switching loss vs. Collector current (typ.)
Vcc=600V, V
100
80
60
GE=±15V, RG=1.8Ω, Tj=125°C, 150°C
Tj=125oC
o
C
Tj=150
toff ton
tr tf
Eoff
Eon
100
Switching time: ton, tr, toff, tf [nsec]
10
1 10 100
Switching loss vs. Gate resistance (typ.)
Vcc=600V, Ic=400A, V
150
100
50
Switching loss: Eon, Eoff, Err [mJ/pulse]
0
1 10 100
Gate resistance: R
GE=±15V, Tj=125°C, 150°C
o
Tj=125
C
o
C
Tj=150
Gate resistance: R
tf
G [Ω]
G [Ω]
Eon
Eoff
Err
40
20
0
Switching loss: Eon, Eoff, Err [mJ/pulse]
0 200 400 600 800 1000
Collector current: Ic [A]
Reverse bias safe operating area (max.)
GE=±15V, Rg=1.8 , Tj=150°C
V
1000
800
600
400
Collector current: Ic [A]
200
0
0 400 800 1200 1600
Collector-Emitter voltage: VCE [V]
(Main terminals)
Err
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1MBI400V-120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
Forward Current vs. Forward Voltage (typ.)
chip
1000
800
Tj=25°C
600
400
Forward current: IF [A]
200
150°C
125°C
0
0 1 2 3
Forward on voltage: V
F [V]
Reverse Recovery Characteristics (typ.)
Vcc=600V, VGE=±15V, RG=1.8Ω, Tj=150°C
10000
Reverse recovery current: Irr [A]
10000
1000
100
Reverse recovery time: trr [nsec]
10
***
Reverse Recovery Characteristics (typ.)
Vcc=600V, V
0 200 400 600 800 1000
GE=±15V, RG=1.8Ω, Tj=125°C
Irr
trr
Forward current: I
F [A]
Transient Thermal Resistance (max.)
1
1000
0.1
Irr
trr
100
Reverse recovery current: Irr [A]
Reverse recovery time: trr [nsec]
10
0 200 400 600 800 1000
Forward current: I
F [A]
0.01
Thermal resistanse: Rth(j-c) [°C/W]
0.001
ô [sec] 0.0023 0.0301 0.0598 0.0708
Rth IGBT 0.00665 0.01686 0.02382 0.01467
[°C/W] FWD 0.01180 0.02991 0.04226 0.02603
0.001 0.01 0.1 1
Pulse Width : Pw [sec]
FWD
IGBT
FWD safe operating area (max.)
Tj=150°C
1000
800
600
400
Pmax=400kW
200
Reverse recovery current: Irr [A]
0
0 500 1000 1500
Collector-Emitter voltage: VCE [V]
(Main terminals)
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1MBI400V-120-50
7
Outline Drawings(Unit:mm)
IGBT Modules
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Equivalent Circuit
Weight: 370g (typ.)
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1MBI400V-120-50
IGBT Modules
http://www.fujielectric.com/products/semiconductor/
WARNING
1. This Catalog contains the product specications, characteristics, data, materials, and structures as of March 2014. The contents are subject to change without notice for specication changes or other reasons. When using a product listed in this Catalog, be sur to obtain the latest specications.
2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade sec ret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric C o., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property r ights which may arise from the use of the applications descr ibed herein.
3. Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safet y measures to prevent the equipment from causing a physic al injury, re, or other problem if any of the products become fault y. It is recommended to make your design failsafe, ame retardant, and free of malfunction.
4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements.
• Computers • OA equipment • Communications equipment (terminal devices) • Measurement equipment
• Machine tools • Audiovisual equipment • Electr ical home appliances • Personal equipment • Industrial robots etc.
5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obt ain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incor porated in the equipment becomes faulty.
• Transportation equipment (mounted on c ars and ships) • Trunk communications equipment
• Trafc-signal control equipment • Gas leakage detectors with an auto-shut-off feature
• Emergency equipment for responding to disasters and anti-burglar y devices • Safety devices
• Medical equipment
6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation).
• Space equipment • Aeronautic equipment • Nuclear control equipment
• Submarine repeater equipment
7. Copyright ©1996 -2014 by Fuji Electric Co., Ltd. All rights reser ved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd.
8. If you have any question about any portion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injur y caused by any use of the products not in accordance with instructions set forth herein.
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Technical Information
Please refer to URLs below for futher information about products, application manuals and technical documents.
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IGBT Modules
FUJI ELECTRIC Power Semiconductor WEB site
日本 Global 中国 Europe North America
www.fujielectric.co.jp/products/semiconductor/
www.fujielectric.com/products/semiconductor/
www.fujielectric.com.cn/products/semiconductor/
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www.americas.fujielectric.com/components/semiconductors/
Information
日本
1
半導体総合カタログ
2
製品情報
3
アプリケーションマニュアル
4
技術資料
5
マウンティングインストラクション
6
IGBT 損失シミュレーションソフト
7
AT-NPC 3-Level 損失シュミレーションソフト
8
富士電機技報
9
製品のお問い合わせ
10
改廃のお知らせ
Global
1
Semiconductors General Catalog
2
Product Information
3
Application Manuals
4
Technical Documents
5
Mounting Instructions
6
IGBT Loss Simulation Software
7
AT-NPC 3-Level Loss Simulation Software www.fujielectric.com/products/semiconductor/model/igbt/simulation_3level/
8
Fuji Electric Journal
9
Contact
10
Revised and discontinued product information www.fujielectric.com/products/semiconductor/discontinued/
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www.fujielectric.com/products/semiconductor/journal/ www.fujielectric.com/products/semiconductor/contact/
中国
1
半导体综合目录
2
产品信息
3
应用手册
4
技术资料
5
安装说明书
6
IGBT 损耗模拟软件
7
AT-NPC 3-Level 损耗模拟软件
8
富士电机技报
9
产品咨询
10
产品更改和停产信息
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2015-10
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