Page 1
Continental Device India Limited
An ISO/TS 16949 and ISO 9001 Certified Company
ABSOLUTE MAXIMUM RATINGS
DESCRIPTION
SYMBOL
DESCRIPTION
SYMBOL
TEST CONDITION
MIN
TYP
MAX
UNITS
DESCRIPTION
SYMBOL
TEST CONDITION
MIN
TYP
MAX
UNITS
E
B
NPN SILICON PLANAR EPITAXIAL TRANSISTOR CD965
TO-92
Plastic Package
C
For Low Frequency Power Amplification
VALUE
Collector Emitter Voltage
Collector Base Voltage
Emitter Base Voltage
Collector Current
Collector Current Peak
Power Dissipation @ Ta=25ºC P
Junction Temperature
Storage Temperature Range
V
CEO
V
CBO
V
EBO
I
C
I
CP
C
T
j
T
stg
- 55 to +150
ABSOLUTE MAXIMUM RATINGS(Ta=25ºC unless specified otherwise)
Collector Emitter Voltage
Collector Base Voltage
Emitter Base Voltage
Collector Cut Off Current
Emitter Cut Off Current
DC Current Gain
V
V
V
I
I
CEO
CBO
EBO
CBO
EBO
h
FE
IC=1mA, IB=0
IC=100µA, IE=0
IE=10µA, IC=0
VCB=10V, IE=0
VEB=7V, IC=0
*IC=500mA, VCE=2V
IC=2A, VCE=2V
Collector Emitter Saturation Voltage
Base Emitter Saturation Voltage
V
CE (sat)
V
BE (sat)
IC=3A, IB=100mA
IC=1A, IB=25mA
20
40
7
5
8
0.75
150
UNITS
V
V
V
A
A
W
ºC
ºC
20 V
40 V
7 V
100 nA
100 nA
180 600
150
1.35 V
1.20 V
DYNAMIC CHARACTERISTICS
Output Capacitance
Transition Frequency
*hFE Classification
CD965Rev_3 080903E
Continental Device India Limited
C
ob
f
T
IE=0, VCB=20V, f=1MHz
IC=50mA, VCE=6V
150
50 pF
MHz
P : 180 - 270 Q : 230 - 380 R : 340 - 600
Data Sheet Page 1 of 4
Page 2
CD965
TO-92 Plastic Package
1
2
3
B
3. EMITTER
Packing Details
TO-92
Plastic Package
DIM
A
B
A
Dimens ion With 'L'
Uncontrolled
L
C
D
E
MIN.
4.32
4.45
3.18
0.41
0.35
MAX.
5.33
5.20
4.19
0.55
0.50
F 5 DEG
G
1
K
D
2
Beyond 'L'
3
H
K
L
1.14
1.20
12.70
1.982
1.40
1.40
—
2.082
E
Solderabilit y Ensured
D
A
A
SEC AA
All dimensions are in mm
1.03
1.20M
G
F
F
M
3 2 1
H
C
Mold
Parting
Line
PIN CONFIGURATION
1. BASE
2. COLLECTOR
The TO-92 Package, Tape and Ammo Pack Drawings are correct as on the date of issue/revision of this Data Sheet.
The currently valid dimensions and information, may please be confirmed from the TO-92 Drawing in the Packages and
Packing Section of the Product Catalogue.
PACKAGE
TO-92 Bulk
TO-92 T&A
Details
1K/polybag
2K/ammo box
STANDARD PACK INNER CARTON BOX
Net Weight/Qty
200 gm/1K pcs
645 gm/2K pcs
3" x 7.5" x 7.5"
12.5" x 8" x 1.8"
5K
2K
OUTER CARTON BOX
Qty
17" x 15" x 13.5"
17" x 15" x 13.5"
Qty Gr WtSize Size
80K
32K
23 kgs
12.5 kgs
CD965Rev_3 080903E
Continental Device India Limited
Data Sheet Page 2 of 4
Page 3
TO-92 Tape and Ammo Pack
Ammo Pack Style
Tape Mechanical Data
*
Maximum alignment deviation between
leads will not to be greater than 0.2mm.
A tape trailer, having at least three feed
CD965
TO-92
Plastic Package
T
h
h
A
H3
H2
H1
Ho
L
F1
t1
t
P
A1
F2
F
P2
Po
(p)
h1 h1
C1
C2
Do
W2
All dimensions are in mm
ITEM
BODY WIDTH
SYMBOL
A1
BODY HEIGHT A 4.8
BODY THICKNESS T 3.9
PITCH OF COMPONENT P
1
*
FEED HOLE PITCH Po
2
*
FEED HOLE CENTRE TO
COMPONENT CENTRE
P2
DISTANCE BETWEEN OUTER
LEADS F
3
*
COMPONENT ALIGNMENT SIDE VIEW
4
*
COMPONENT ALIGNMENT FRONT VIEW
h
h1
TAPE WIDTH W
HOLD-DOWN TAPE WIDTH Wo
HOLE POSITION W1
HOLD-DOWN TAPE POSITION W2
LEAD WIRE CLINCH HEIGHT Ho
COMPONENT HEIGHT H1
LENGTH OF SNIPPED LEADS L
FEED HOLE DIAMETER Do
5
*
TOTAL TAPE THICKNESS t
LEAD - TO - LEAD DISTANCE F1, F2
STAND OFF
H2
CLINCH HEIGHT H3 3.0
LEAD PARALLELISM
| C1 - C2 |
PULL - OUT FORCE (p)
SPECIFICATION
MIN.
NOM.
4.0 4.8
12.7
12.7
6.35
5.08
18
0.5
16
2.54
0.45
6N
Label
Wo
W1
MAX.
5.2
4.2
1.0
0
0 1.3
6
9
23.25
11.0
4
1.2
1.45
0.22
Adhesive Tape on Top Side
Flat side
W
4
3
(
1
.
7
"
)
TOL .
NOTES
1.
± 1.0
2.
± 0.3
± 0.4
3.
+ 0.6
- 0.2
4.
± 0.5
± 0.2
5.
+ 0.7
- 0.5
± 0.2
6.
± 0.5
± 0.2
+ 0.4
- 0.1
REMARKS
1
*
2
*
3
*
4
*
5
D
E
E
F
Carrier
Strip
186
(7.3")
)
"
3
1
(
2
3
3
Flat Side of Transistor and
Adhesive Tape Visible
2000 pcs./Ammo Pack
Maximum non-cumulative variation
between tape feed holes shall not
exceed 1 mm in 20 pitches.
Holddown tape will not exceed beyond
the edge(s) of carrier tape and there
shall be no exposure of adhesive.
There will be no more than three (3)
consecutive missing components in a
tape.
holes are provided after the last
component in a tape.
Splices should not interfere with the
sprocket feed holes.
Cumulative pitch error 1.0 mm/20 pitch
To be measured at bottom of clinch
At top of body
At top of body
t1 0.3 – 0.6 mm
CD965Rev_3 080903E
Continental Device India Limited
Data Sheet Page 3 of 4
Page 4
Notes
CD965
TO-92
suited
for
individual
or
Plastic Package
Disclaimer
The product information and the selection guides facilitate selection of the CDIL's Discrete Semiconductor Device(s) best
for application in your product(s) as per your requirement. It is recommended that you completely review our Data Sheet(s) so as
to confirm that the Device(s) meet functionality parameters for your application. The information furnished in the Data Sheet and
on the CDIL Web Site/CD are believed to be accurate and reliable. CDIL however, does not assume responsibility
inaccuracies or incomplete information. Furthermore, CDIL does not assume liability whatsoever, arising out of the application or
use of any CDIL product; neither does it convey any license under its patent rights nor rights of others. These products are not
designed for use in life saving/support appliances or systems. CDIL customers selling these products (either as
Discrete Semiconductor Devices or incorporated in their end products), in any life saving/support appliances or systems
applications do so at their own risk and CDIL will not be responsible for any damages resulting from such sale(s).
CDIL strives for continuous improvement and reserves the right to change the specifications of its products without prior notice.
CDIL is a registered Trademark of
Continental Device India Limited
C-120 Naraina Industrial Area, New Delhi 110 028, India.
Telephone + 91-11-2579 6150, 5141 1112 Fax + 91-11-2579 5290, 5141 1119
email@cdil.com www.cdilsemi.com
CD965Rev_3 080903E
Continental Device India Limited
Data Sheet Page 4 of 4
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