Data sheet acquired from Harris Semiconductor
SCHS041D − Revised October 2003
The CD4043B and CD4044B types are supplied
in 16-lead hermetic dual-in-line ceramic
packages (F3A suffix), 16-lead dual-in-line
plastic packages (E suffix), 16-lead
small-outline packages (D, DR, DT, DW, DWR,
and NSR suffixes),
and 16-lead thin shrink
small-outline packages (PW and PWR
suffixes).
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
PACKAGING INFORMATION
Orderable Device Status
CD4043BD ACTIVE SOIC D 16 40 Green (RoHS &
CD4043BDE4 ACTIVE SOIC D 16 40 Green (RoHS &
CD4043BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
CD4043BDR ACTIVE SOIC D 16 2500 Green (RoHS &
CD4043BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
CD4043BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
CD4043BDT ACTIVE SOIC D 16 250 Green (RoHS &
CD4043BDTE4 ACTIVE SOIC D 16 250 Green (RoHS &
CD4043BDTG4 ACTIVE SOIC D 16 250 Green (RoHS &
CD4043BDW ACTIVE SOIC DW 16 40 Green (RoHS &
CD4043BDWE4 ACTIVE SOIC DW 16 40 Green (RoHS &
CD4043BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
CD4043BDWR ACTIVE SOIC DW 16 2000 Green (RoHS &
CD4043BDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS &
CD4043BDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
CD4043BE ACTIVE PDIP N 16 25 Pb-Free
CD4043BEE4 ACTIVE PDIP N 16 25 Pb-Free
CD4043BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4043BF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4043BM OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4043BNSR ACTIVE SO NS 16 2000 Green (RoHS &
CD4043BNSRE4 ACTIVE SO NS 16 2000 Green(RoHS&
CD4043BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
CD4043BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
CD4043BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CD4043BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
CD4044BD ACTIVE SOIC D 16 40 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
(3)
no Sb/Br)
CD4044BDE4 ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDR ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDT ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDTE4 ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDTG4 ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDW ACTIVE SOIC DW 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDWE4 ACTIVE SOIC DW 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BE ACTIVE PDIP N 16 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4044BEE4 ACTIVE PDIP N 16 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4044BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4044BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4044BF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4044BM OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4044BNSR ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4044BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
CD4043BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4043BDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
CD4043BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4043BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4044BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4044BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4044BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4043BDR SOIC D 16 2500 333.2 345.9 28.6
CD4043BDWR SOIC DW 16 2000 346.0 346.0 33.0
CD4043BNSR SO NS 16 2000 346.0 346.0 33.0
CD4043BPWR TSSOP PW 16 2000 346.0 346.0 29.0
CD4044BDR SOIC D 16 2500 333.2 345.9 28.6
CD4044BNSR SO NS 16 2000 346.0 346.0 33.0
CD4044BPWR TSSOP PW 16 2000 346.0 346.0 29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
(1)
CD4043BD ACTIVE SOIC D 16 40 Green (RoHS
CD4043BDR ACTIVE SOIC D 16 2500 Green (RoHS
CD4043BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
CD4043BDT ACTIVE SOIC D 16 250 Green (RoHS
CD4043BDW ACTIVE SOIC DW 16 40 Green (RoHS
CD4043BDWR ACTIVE SOIC DW 16 2000 Green (RoHS
CD4043BE ACTIVE PDIP N 16 25 Green (RoHS
CD4043BEE4 ACTIVE PDIP N 16 25 Green (RoHS
CD4043BF3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4043BF3A
CD4043BNSR ACTIVE SO NS 16 2000 Green (RoHS
CD4043BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS
CD4043BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
CD4044BD ACTIVE SOIC D 16 40 Green (RoHS
CD4044BDR ACTIVE SOIC D 16 2500 Green (RoHS
CD4044BDT ACTIVE SOIC D 16 250 Green (RoHS
CD4044BDW ACTIVE SOIC DW 16 40 Green (RoHS
CD4044BE ACTIVE PDIP N 16 25 Green (RoHS
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043BM
NIPDAU N / A for Pkg Type -55 to 125 CD4043BE
NIPDAU N / A for Pkg Type -55 to 125 CD4043BE
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043B
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4043B
NIPDAU Level-1-260C-UNLIM -55 to 125 CM043B
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4044BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4044BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4044BM
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4044BM
NIPDAU N / A for Pkg Type -55 to 125 CD4044BE
6-Feb-2020
Samples
(4/5)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
CD4044BEE4 ACTIVE PDIP N 16 25 Green (RoHS
CD4044BF ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4044BF
CD4044BF3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4044BF3A
CD4044BNSR ACTIVE SO NS 16 2000 Green (RoHS
CD4044BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
NIPDAU N / A for Pkg Type -55 to 125 CD4044BE
NIPDAU Level-1-260C-UNLIM -55 to 125 CD4044B
NIPDAU Level-1-260C-UNLIM -55 to 125 CM044B
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
6-Feb-2020
Samples
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4043B, CD4043B-MIL, CD4044B, CD4044B-MIL :
Catalog: CD4043B, CD4044B
•
Military: CD4043B-MIL, CD4044B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
6-Feb-2020
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Aug-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
CD4043BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4043BDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
CD4043BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4043BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4044BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4044BNSR SO NS 16 2000 330.0 16.4 8.45 10.55 2.5 12.0 16.2 Q1
CD4044BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Aug-2019
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4043BDR SOIC D 16 2500 333.2 345.9 28.6
CD4043BDWR SOIC DW 16 2000 350.0 350.0 43.0
CD4043BNSR SO NS 16 2000 367.0 367.0 38.0
CD4043BPWR TSSOP PW 16 2000 367.0 367.0 35.0
CD4044BDR SOIC D 16 2500 333.2 345.9 28.6
CD4044BNSR SO NS 16 2000 367.0 367.0 38.0
CD4044BPWR TSSOP PW 16 2000 367.0 367.0 35.0
Pack Materials-Page 2
PACKAGE OUTLINE
A
5.1
4.9
NOTE 3
SCALE 2.500
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
SEATING
6.6
TYP
6.2
PIN 1 INDEX AREA
1
8
B
4.5
4.3
NOTE 4
16
9
14X 0.65
2X
4.55
0.30
16X
0.19
0.1 C A B
C
1.2 MAX
PLANE
0.1 C
(0.15) TYP
SEE DETAIL A
GAGE PLANE
0.25
0.75
-80
0.50
A 20
DETAIL A
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
0.15
0.05
www.ti.com
EXAMPLE BOARD LAYOUT
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(R0.05) TYP
16
SYMM
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
METAL
15.000
SOLDER MASK DETAILS
METAL UNDER
SOLDER MASK
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SOLDER MASK
OPENING
EXPOSED METAL
4220204/A 02/2017
www.ti.com
EXAMPLE STENCIL DESIGN
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
16X (0.45)
14X (0.65)
1
8
16X (1.5)
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
(R0.05) TYP
16
SYMM
9
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
GENERIC PACKAGE VIEW
SOIC - 2.65 mm max heightDW 16
7.5 x 10.3, 1.27 mm pitch
This image is a representation of the package family, actual package may vary.
SMALL OUTLINE INTEGRATED CIRCUIT
Refer to the product data sheet for package details.
www.ti.com
4224780/A
PACKAGE OUTLINE
A
10.5
10.1
NOTE 3
SCALE 1.500
10.63
TYP
9.97
PIN 1 ID
AREA
1
8
B
7.6
7.4
NOTE 4
16
9
14X 1.27
2X
8.89
0.51
16X
0.31
0.25 C A B
SOIC - 2.65 mm max heightDW0016A
SOIC
C
SEATING PLANE
0.1 C
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
GAGE PLANE
0 - 8
0.25
1.27
0.40
(1.4)
DETAIL A
TYPICAL
4220721/A 07/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
5. Reference JEDEC registration MS-013.
0.3
0.1
www.ti.com
EXAMPLE BOARD LAYOUT
SOIC - 2.65 mm max heightDW0016A
SOIC
16X (2)
16X (0.6)
14X (1.27)
R0.05 TYP
SYMM
1
8
(9.3)
SEE
DETAILS
16
SYMM
9
LAND PATTERN EXAMPLE
SCALE:7X
METAL
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
OPENING
SOLDER MASK
OPENING
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
4220721/A 07/2016
www.ti.com
EXAMPLE STENCIL DESIGN
SOIC - 2.65 mm max heightDW0016A
SOIC
16X (2)
16X (0.6)
14X (1.27)
R0.05 TYP
SYMM
1
8
(9.3)
16
SYMM
9
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SCALE:7X
4220721/A 07/2016
www.ti.com
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