Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D186
BC559
PNP general purpose transistor
Product specification
Supersedes data of 1999 May 28
2004 Nov 05
Page 2
Philips Semiconductors Product specification
PNP general purpose transistor BC559
FEATURES
• Low current (max. 100 mA)
• Low voltage (max. 30 V).
PINNING
PIN DESCRIPTION
1 emitter
2 base
APPLICATIONS
3 collector
• General purpose switching and amplification.
DESCRIPTION
PNP transistor in a TO-92 (SOT54) plastic package.
NPN complement: BC549.
handbook, halfpage
1
2
3
2
MAM281
Fig.1 Simplified outline (TO-92; SOT54)
and symbol.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
BC559C SC-43A plastic single-ended leaded (through hole) package; 3 leads SOT54
3
1
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
V
I
I
I
P
T
T
T
CBO
CEO
EBO
C
CM
BM
tot
stg
j
amb
collector-base voltage open emitter −−30 V
collector-emitter voltage open base −−30 V
emitter-base voltage open collector −−5V
collector current (DC) −−100 mA
peak collector current −−200 mA
peak base current −−200 mA
total power dissipation T
≤ 25 °C − 500 mW
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
ambient temperature −65 +150 °C
2004 Nov 05 2
Page 3
Philips Semiconductors Product specification
PNP general purpose transistor BC559
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
T
=25°C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
I
EBO
h
FE
V
CEsat
V
BEsat
V
BE
C
c
f
T
F noise figure; BC559C VCE= −5 V; IC= −200 µA; RS=2kΩ;
thermal resistance from junction to ambient note 1 250 K/W
collector-base cut-off current VCB= −30 V; IE=0 A −−1 −15 nA
VCB= −30 V; IE= 0 A; Tj= 150 °C −−−4 µA
emitter-base cut-off current VEB= −5 V; IC=0 A −−−100 nA
DC current gain; BC559C VCE= −5 V; IC= −2 mA; see Fig.2 420 − 800
collector-emitter saturation
voltage
IC= −10 mA; IB= −0.5 mA −−60 −300 mV
IC= −100 mA; IB= −5mA −−180 −650 mV
base-emitter saturation voltage IC= −10 mA; IB= −0.5 mA; note 1 −−750 − mV
IC= −100 mA; IB= −5 mA; note 1 −−930 − mV
base-emitter voltage VCE= −5 V; IC= −2 mA; note 2 −600 −650 −750 mV
VCE= −5 V; IC= −10 mA; note 2 −−−820 mV
collector capacitance VCB= −10 V; IE=ie= 0 A; f = 1 MHz − 4 − pF
transition frequency VCB= −5 V; IE= −10 mA; f = 100 MHz 100 −−MHz
−−4dB
f = 30 Hz to 15.7 kHz
VCE= −5 V; IC= −200 µA; RS=2kΩ;
−−4dB
f = 1 kHz; B = 200 Hz
Notes
1. V
decreases by about −1.7 mV/K with increasing temperature.
BEsat
2. VBE decreases by about −2 mV/K with increasing temperature.
2004 Nov 05 3
Page 4
Philips Semiconductors Product specification
PNP general purpose transistor BC559
600
handbook, full pagewidth
h
FE
500
400
300
200
100
0
−2
−10
BC559C.
−10
MBH728
VCE = −5 V
−1
−1
−10 −10
−10
2
IC (mA)
3
Fig.2 DC current gain; typical values.
2004 Nov 05 4
Page 5
Philips Semiconductors Product specification
PNP general purpose transistor BC559
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads SOT54
c
E
d
A L
1
D
2
3
b
1
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
5.2
mm
5.0
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54 TO-92 SC-43A
b
0.48
0.40
b
c
D
d
1
0.66
0.45
0.38
4.8
4.4
0.55
IEC JEDEC JEITA
E
1.7
4.2
1.4
3.6
REFERENCES
2.54
e
e
1
1.27
L
14.5
12.7
L
1
(1)
L
1
max.
2.5
EUROPEAN
PROJECTION
b
e
1
e
ISSUE DATE
97-02-28
04-06-28
2004 Nov 05 5
Page 6
Philips Semiconductors Product specification
PNP general purpose transistor BC559
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For datasheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or atanyother conditions above thosegivenin the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty that suchapplicationswillbe
suitable for the specified use without further testing or
modification.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto result in personal injury.Philips
Semiconductorscustomersusing or selling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the productis infull production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no license or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2004 Nov 05 6
Page 7
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R75/05/pp7 Date of release: 2004 Nov 05 Document order number: 9397 750 13572
SCA76
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