Freescale USB Development Board
USB-KW40Z User's Guide
1About this guide
This manual describes the Freescale USB-KW40Z
development platform. The USB-KW40Z board is a small,
cost-effective evaluation and development board for
application prototypes and demonstration of the
MKW40Z160 SoC family of devices. This evaluation board
offers an easy-to-use mass-storage device mode flash
programmer, a virtual serial port, classic programming, and
run-control capabilities.
The MKW40Z160 SoC is an ultra low-power, highly
integrated single-chip device that enables Bluetooth Low
Energy (BLE) and/or IEEE® Std. 802.15.4/RF connectivity
for portable, extremely low-power embedded systems. The
MKW40Z160 SoC family integrates a radio transceiver
operating in the 2.36 GHz to 2.48 GHz range supporting a
range of FSK/GFSK and O-QPSK modulations, and ARM
Cortex®- M0+ MCU, 160 KB flash memory and 20 KB
SRAM, BLE Link Layer hardware, 802.15.4 packet
processor hardware, and peripherals optimized to meet the
requirements of the target applications.
This equipment is for use by developers for evaluation purposes only and must not be incorporated into
any other device or system. This device may not be sold to the general public. Integrators will be
responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
2.1.1Labeling
FCC labels are physically located on the back of the board.
2.1.2Operating conditions
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
•This device may not cause harmful interference.
•This device must accept any interference received, including interference that may cause undesired
operation.
2.1.3Exposure limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20 cm) from all persons.
2.1.4Antenna restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible
party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique
coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section.
The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of
a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier
current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or
15.221 of the IEEE Std. 802.15.4. This requirement does not apply to intentional radiators that must be
professionally installed, such as perimeter protection systems and some field disturbance sensors, or to
other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation
site. However, the installer is responsible for ensuring that the proper antenna is employed so that the limits
in this Part are not exceeded.
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Safety information
2.2Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to
the following two conditions:
1. This board may not cause interference, and
2. This board must accept any interference, including interference that may cause undesired operation
of the device.
2.2.126 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
2.3Electrostatic discharge considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
•Flexible fabric, solid fixed size, or disposable ESD wrist straps
•Static control workstations, static control monitors, and table or floor static control systems
•Static control packaging and transportation materials and environmental systems
2.4Disposal instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
freescale.com/productdisposal.
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USB-KW40Z overview and description
3USB-KW40Z overview and description
3.1Introduction
The USB-KW40Z development platform is an evaluation environment based on the Freescale
MKW40Z160 SoC device. The MKW40Z160 SoC integrates a radio transceiver operating in the 2.36 GHz
to 2.48 GHz range, supporting a range of FSK/GFSK and O-QPSK modulations, an ARM Cortex-M0+
MCU into a single package.
Freescale supplements the MKW40Z160 SOC with tools and software that include hardware evaluation
and development boards, software development IDE, applications, drivers, custom PHY usable with IEEE
Std. 802.15.4 compatible MAC, BLE Link Layer, and enables the Bluetooth Low Energy protocol to be
used in the MBAN frequency range for proprietary applications.
3.2Board features
3.2.1USB-KW40Z board
The USB-KW40Z development board contains the MKW40Z160 device it is one of the simplest reference
design utilizing the on chip USB block for power and communication. The USB-KW40Z is a small form
factor self-contained board for evaluation of wireless application and can be used as a packet sniffer. The
USB type-A connection is used with USB enabled hardware such as a computer.
Figure 1 shows the USB-KW40Z development platform.
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Figure 1. USB-KW40Z development board
USB-KW40Z overview and description
The USB-KW40Z development board includes the following features:
•Based on the Freescale ultra low-power MKW40Z160 SoC BLE device
•Fully compliant IEEE Std. 802.15.4, 2006, transceiver supporting 250 kbit/s O-QPSK data in
5.0 MHz channels and full spread-spectrum encode and decode
•Fully compliant Bluetooth v4.1 Low Energy (BLE)
•Full IEEE 802.15.4 compliant wireless node with KSDK enable software
•Reference design area with small footprint, low-cost RF node
— Differential input/output port used with external balun for single port operation
— Low external component count
— Programmable output power from –20 dBm to +5 dBm at the MMCX connector, no harmonic
trap using bypass mode of operation
— Receiver sensitivity: –102 dBm, typical (@1% PER for 20 byte payload packet), for 802.15.4
at the MMCX connector
— Receiver sensitivity: -91 dBm for BLE applications at the MMCX connector
•Integrated PCB inverted meander type antenna and MMCX (Micro-Miniature Coaxial) RF port
•Bypass operation mode
•32 MHz reference oscillator
•32 kHz reference oscillator
•2.4 GHz frequency operation (ISM and MBAN)
•Reset switch drive to MKW40Z160.
•Reset switch drive to debug interface (OpenSDA)
•Cortex 10-pin (0.05 inch) SWD debug port for target MCU
•Cortex 10-pin (0.05 inch) JTAG port for OpenSDA updates
•Integrated open-standard serial and debug interface (OpenSDA)
•2 Blue LED indicators primary drive thought MKW40Z160 MCU, also connected to MK22FN512
•1 Push button switch drive to MKW40Z160 MCU, also connected to MK22FN512
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USB-KW40Z overview and description
Figure 2 shows the main board features and I/O headers for the Freescale USB-KW40Z board.
Figure 2. USB-KW40Z component placement
3.3Serial and debug adapter
The USB-KW40Z development board can be enabled with OpenSDA v2.1, a serial and debug adapter
circuit that includes an open-source hardware design, an open-source bootloader, and debug interface
software. It bridges serial and debug communications between a USB host and an embedded target
processor. The hardware circuit is based on a Freescale Kinetis K22F family microcontroller (MCU).
OpenSDAv2.1 enables the CMSIS-DAP bootloader, an open-source mass storage device (MSD)
bootloader, and the CMSIS-DAP Interface firmware (also known as the mbed interface), that provides a
MSD flash programming interface, a virtual serial port interface, and a CMSIS-DAP debug protocol
interface. For more information on the OpenSDAv2.1 software, see mbed.org and
https://github.com/mbedmicro/CMSIS-DAP.
NOTE
Driver considerations, you must install a windows driver that can be
downloaded from the following link:
USB-KW40Z comes pre-programed with a sniffer application. In order to enable this board with
OpenSDA feature and as a development board, refer to the following:
freescale.com/USB-KW40Z/startnow
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USB-KW40Z development board
4USB-KW40Z development board
4.1USB-KW40Z board overview
The USB-KW40Z board is an evaluation board based on the Freescale MKW40Z160 SoC. The
USB-KW40Z provides a platform to evaluate the MKW40Z160 SoC device and to develop software and
applications. The core device is accompanied by a the 32 MHz reference oscillator crystal, RF circuitry
including antenna, and supporting circuitry.
The USB-KW40Z board is intended as the core PCB for MKW40Z160 device evaluation and application
development, and can be used as a simple standalone valuation solution or as packet sniffer.
4.1.1PCB features
The USB-KW40Z board provides the following features:
•USB small form factor
•4-Layer metal, 0.062 inch thick FR4 board
•LGA footprint and power supply bypass mode
•Printed Meander Antenna and footprint for installing a (user supplied) MMCX connector
•32 MHz reference oscillator crystal
•32 kHz crystal provided for optional timing oscillator
•Secondary (MK22FN512) device to use as voltage regulator and MCU processor for BLE sniffer.
4.1.2Form factor
Figure 3 shows the USB-KW40Z development board layout and footprint.
Figure 3. USB-KW40Z top side (component side) footprint
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USB-KW40Z development board
Figure 4 shows a footprint of the USB-KW40Z with the location of the headers.
Figure 4. USB-KW40Z I/O headers location
4.1.3Board level specifications
Table 1. USB-KW40Z specifications
ParameterMinTypMaxUnitsNotes/Conditions
General
Size (PCB: X, Y)——18.5 x 61.4
0.73 x 2.42mminches
Layer build (PCB)—1.57
0.062
Dielectric material (PCB)————FR4
Power
Current consumption———mAVaries with operational mode, Refer to
Tem per atur e
Operating temperature (see note)-40+25+70°COperating temperature is limited to +70 °C
Storage temperature-30+25+70°C
RF
802.15.4 Frequency range2405—2480MHz All 16 channels in the 2450 MHz band
BLE Frequency range2400—2483MHz All 40 channels in the 2450 MHz band
ISM and MBAN Frequency range2360—2483MHz
RF Receiver
—mm
inches
4-Layer
datasheet.
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
Saturation (maximum input level)—+0—dBm Refer to datasheet
Sensitivity for 1% packet error rate
(PER) (+25 °C) 802.15.4
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— -102—dBm Refer to datasheet
USB-KW40Z development board
Table 1. USB-KW40Z specifications (continued)
ParameterMinTypMaxUnitsNotes/Conditions
Sensitivity for 1% packet error rate
(PER) (+25 °C) BLE
RF Transmitter
RF Power Output -20—+5 dBm Programmable in steps.
2nd harmonic—≤50≤40 dBm —
3rd harmonic—≤50≤40 dBm —
Regulatory Approval
FCC————Product is approved according to the FCC
CE (ETSI)————Product is approved according to the EN
CE (EMC)————Product is approved according to the EN
Safety
UL————Product is approved according to the IEC
Environment
—-94— dBRefer to datasheet
At the MMCX connector with no trap.
part 15 standard
300 328 V1.7.1 (2006-10) standard
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
60950-1 and EN 60950-1, First Edition
standards
1
RoHS————Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE————Product complies with the EU Directive
2002/95/EC of 27 January 2003
1]
Trap will add 1 to 2 dB of loss.
4.2Functional description
The USB-KW40Z is built around the Freescale MKW40Z160 SoC in a 48-pin LGA package. The
USB-KW40Z features a IEEE Std. 802.15.4 and BLE 2.4 GHz radio frequency transceiver and a Kinetis
family ultra low-power, mixed-signal ARM Cortex-M0+ microcontroller in a single package. This board
is intended as a simple evaluation platform and as a building block for application development. The
four-layer board provides the MKW40Z160 with its required RF circuitry and a 32 MHz reference
oscillator crystal. The layout for this base level functionality can be used as a reference layout for your
target board. Figure 5 shows a simple block diagram.
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USB-KW40Z development board
Figure 5. USB-KW40Z block diagram
4.2.1RF performance and considerations
The USB-KW40Z board’s integrated transceiver includes a 1 mW nominal output power PA with internal
voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation,
and full spread-spectrum encoding and decoding. Key specifications for the MKW40Z160 SoC are:
•Nominal output power is set to 0 dBm
•Programmable output power from -20 dBm to +5 dBm at the MMCX, no harmonic trap
•Typical sensitivity is -102 dBm (@1% PER for 25 °C) at the MMCX (802.15.4)
•Typical sensitivity is -91 dBm (@1% PER for 25 °C) at the MMCX (BLE)
•Frequency range is 2360 to 2480 MHz
•Differential bidirectional RF I/O port with integrated transmit/receive switch
•Meander printed metal antenna for a small footprint, low cost design
•Uses a minimum number of RF marching components and external 50:100 balun
An external 50 (bal): 100 (unbal) balun connects a single-ended 50 ohm port to the differential RF port of
the MKW40Z160 SoC’s transceiver. The layout has provision for out-of-band signal suppression
(components L3 and C20) if required. Figure 6 shows the typical topology for the RF circuitry. The RF
connector J4 has been included in the design for measurement purposes and is used as a DNP.
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USB-KW40Z development board
Figure 6. USB-KW40Z RF circuitry
4.2.2Clocks
The USB-KW40Z provides two clock sources to the MKW40Z160:
•32 MHz Reference Oscillator - Figure 7 shows the external 32 MHz external crystal Y1. This
mounted crystal must meet the specifications outlined in the AN3251 application note. The IEEE
Std. 802.15.4 requires that the frequency be accurate to less than ±40 ppm.
— Capacitors C4 and C5 provide the bulk of the crystal load capacitance. At 25 °C, it is desired
to have the frequency accurate to ±10 ppm or less to allow for temperature variation.
•Optional 32.768 kHz Crystal Oscillator: Provision is also made for a secondary 32.768 kHz crystal
Y2 (see Figure 8). This oscillator can be used for a low power accurate time base.
— The module comes provided with this Y2 crystal and its load capacitors C6 and C7.
— Load capacitors C6 and C7 provide the entire crystal load capacitance; there is no onboard trim
There is one way to power on the USB-KW40Z board, a J5 type-A connector to supply 5 V(V_USB)
directly to the secondary MCU, that includes an internal regulator, 3.3 V output to enable theMKW40Z160
device. The USB-KW40Z power management circuit is shown in Figure 9.
Figure 9. USB-KW40Z power management circuit
Additionally, a green LED marked as D1 is available as a power indicator. For current measurements, users
can isolate the MKW40Z160
device, through SH13 cut-trace, this will disable the VCC path (including
LED).
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USB-KW40Z development board
4.2.4USB-KW40Z peripheral functions
The board includes two different MCUs, one dedicated to RF (MKW40Z160) acquisition and the second
features an OpenSDA debugger and processor for BLE sniffer application (MK22FN512).
4.2.4.1MKW40Z160peripheral functions
The USB-KW40Z development board includes two push buttons: one for a general purpose peripheral
function to assist in implementing targeted applications and the other dedicated to MKW40Z160 hardware
reset.
The board also include three LEDs, two for general purposes and the other as a Power-On indicator.
Figure 10 shows the push buttons and LEDs for MKW40Z160.
The application LEDs (D2 and D3) are connected not only with MKW40Z, they also share this connection
with the MK22FN512 MCU. You can isolate LEDs to remove or cut the trace over SH5 and SH6.
Figure 10. USB-KW40Z MKW40Z160 push button & LED
4.2.4.2MK22FN512/Open SDA Interface
•The USB-KW40Z includes an OpenSDA circuitry based on the MK22FN512, that includes all the
necessary components to enable communication and debugging, it also provides power output to
all MKW40Z160
MCU, and all the necessary connections to interface with MKW40Z160
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
peripherals. Figure 11 shows the OpenSDA circuitry based on the MK22FN512
.
Freescale Semiconductor, Inc13
USB-KW40Z development board
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Figure 11. USB-KW40Z OpenSDA circuitry
USB-KW40Z development board
4.2.4.2.1OpenSDA interface clock
The USB-KW40Z provides one clock source for the OpenSDA MK22FN512 MCU.
•8 MHz Reference Oscillator - Figure 12 shows the external 8 MHz external crystal X1. This
mounted crystal must meet MK22FN512 specifications. It also provides C44 and C45 to the bulk
of the crystal load capacitance.
Figure 12. USB-KW40Z MK22FN512 8 MHz clock source
4.2.4.2.2MK22FN512 peripheral functions
The USB-KW40Z OpenSDA interface circuit also includes one switch button, to assist in MK22FN512
MCU hardware reset. Figure 13 shows the push button for MK22FN512
Figure 13. USB-KW40Z MK22FN512 push button & LED
Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
50MIL DRILL SIZE 65MIL
SOLDERMASK TH, NO PART TO
ORDER
AEC-Q200 RC0402
0402
0402
NO PART TO ORDER
NO PART TO ORDER
NO PART TO ORDER
TEST POINT WHITE 40 MIL DRILL
180 MIL TH 109L
LOW ENERGY MAPLGA64
RAM 1.71-3.6V 120MHZ MAPBGA 64
DHVQFN14
SMT
COMPLIANT
NO PART TO ORDER NO PART TO ORDER
VISHAY
INTERTECHNOLOGY
INTERTECHNOLOGY
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INTERTECHNOLOGY
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INTERTECHNOLOGY
INTERTECHNOLOGY
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LAYOUT ELEMENT
ONLY
NOTACOMPONENTNOTACOMPONENT
NOTACOMPONENTNOTACOMPONENT
COMPONENTS
CORPORATION
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TP-105-01-09
MKW40Z160VHT4
MK22FN512VMP12
74LVC125ABQ,115
FC-135 32.7680KA-A3
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PCB manufacturing specifications
NOTES
•USB-KW40Z includes neither J4 (the MMCX connector) nor the
external antenna.
•For external measurements and/or external antenna usage, J4 should be
installed and soldered in place.
•A 50 ohm MMCX connector is required; recommended part number
MM8030-2600B from Murata.
•When selecting an external antenna to connect to the MMCX connector,
choose an antenna designed for the desired frequency band. Operation
with an external antenna may require a separate certification of your
product.
5PCB manufacturing specifications
This section provides the specifications used to manufacture the USB-KW40Z development printed circuit
board (PCB) described in this guide.
The USB-KW40Z development platform PCBs must comply with the following:
•The PCB must comply with Perfag1D/3C (www.perfag.dk/en/)
•The PCB manufacturer’s logo is required
•The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
— The level is 94V-0 ((http://ulstandards.ul.com/standard/?id=94)
— The UL information must be stamped on the back of the PCB solder mask
NOTE
•A complete set of design files for the MKW40Z160 development boards
is available at the Freescale website (www.freescale.com/KW40Z)
under “Software and Tools.” These reference designs should be used as
a starting point for a custom application.
•The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
5.1Single PCB construction
This section describes individual PCB construction details.
•The USB-KW40Z PCBs are four-layer, multi-layer designs
•The PCBs contain no blind, buried, or micro vias
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PCB manufacturing specifications
•PCB data:
— USB-KW40Z size: Approximately 18.5x 61.4 mm (0.73 x 2.42 inches)
— USB-KW40Z final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder mask)
Table 3 defines some of the layers of the completed PCB. The artwork identification refers to the name of
the layer in commonly used terms.
Table 3. USB-KW40Z layer by layer overview
LayerArtwork Identification File Name
1Silkscreen Top PSS.art
2Top Layer MetalL1_PS.art
3Ground LayerL2_GND.art
4Signal LayerL3_INT_1.art
5Bottom Layer MetalL4_SS.art
6Silkscreen BottomSSS.art
IMPORTANT: The USB-KW40Z development board contains high frequency 2.4 GHz RF circuitry. As
a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical
parameters. Therefore, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper
thicknesses and spacing must not be changed; follow the stackup information provided with the reference
design (see Figure 19) information provided with the reference design.
The panel size can be negotiated depending on production volume.
5.3Materials
The PCB composite materials must meet the following requirements:
•Laminate—the base material (laminate) must be FR4. If the laminate material is changed, the RF
electrical characteristics may change and degrade RF performance.
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PCB manufacturing specifications
•Copper foil
— Top and bottom copper layers must be 1 oz. copper
— Interior layers must be 1 oz. copper
•Plating—All pad plating must be Hot Air Levelling (HAL)
5.4Solder mask
The solder mask must meet the following requirements:
•Solder mask type: Liquid Film Electra EMP110 or equivalent
•Solder mask thickness: 10–30 µm
5.5Silk screen
The silk screen must meet the following requirements:
•Silk screen color: White
•Silk screen must be applied after application of solder mask if solder mask is required
•The silk screen ink must not extend into any plated-thru-holes
•The silk screen must be clipped back to the line of resistance
5.6Electrical PCB testing
•All PCBs must be 100 percent tested for opens and shorts
•Impedance measurement - An impedance measurement report is not mandatory
5.7Packaging
Packaging for the PCBs must meet the following requirements:
•Finished PCBs must remain in panel
•Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability
5.8Hole specification/tool table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28441.pdf file.
5.9File description
Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.
Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
•FAB-28441.pdf—USB- Board fabrication drawing
•GRB-28441.zip—USB- Metal layers, solder mask, solder paste and silk screen
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Revision history
•SPF-28441.pdf—USB- Schematic
Design files are in Allegro format with OrCAD schematic capture.
6Revision history
Rev.
number
010/2015Initial release
DateSubstantive change(s)
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liability, including without limitation consequential or incidental damages.
“Ty
pical” parameters that may be provided in Freescale data sheets and/or specifications can
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operating parameters, including “typicals,” must be validated for each customer application
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Freescale, the Freescale logo and Kinetis are trademarks of Freescale Seminconductor, Inc.
Reg. U.S. Pat. & Tm. Off All other products or service names are the property of their
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