Freescale Semiconductor USB-KW019032 User Manual

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Freescale Semiconductor, Inc.
Document Number: USBKW019032UG
User’s Guide
USB-KW019032 Freescale USB Dongle Development Board
User’s Guide
Rev. 0, 10/2015
1 About this document
This user’s guide describes the hardware for the Freescale USB-KW019032 development platform. The USB-KW019032 board is the core evaluation and application development platform for the MKW01Z128 device, and can be used as a standalone evaluation solution or used to develop software and applications.
The MKW01Z128 transceiver is a highly-integrated, cost-effective, system-in-package (SiP), sub-GHz wireless node solution with an FSK, GFSK, MSK, or OOK modulation-capable transceiver, and a low-power ARM® Cortex®-M0+ CPU. The highly integrated RF transceiver operates over a wide frequency range including 315 MHz, 433 MHz, 470 MHz, 868 MHz, 915 MHz, 928 MHz, and 955 MHz in the license-free Industrial, Scientific, and Medical (ISM) frequency bands.
1.1 Audience
This guide is intended for system designers.
Contents
1. About this document . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1.Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1.FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2.Regulatory approval for Canada (IC RSS 210) . . . 3
2.3.Electrostatic discharge considerations . . . . . . . . . . 3
2.4.Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . 3
3. USB-KW019032 overview and description . . . . . . . . 4
3.1.Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2.Board features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3.Software and driver considerations . . . . . . . . . . . . 6
4. USB-KW019032 development board . . . . . . . . . . . . 7
4.1.USB-KW019032 board overview . . . . . . . . . . . . . 7
4.2.Functional description . . . . . . . . . . . . . . . . . . . . . . 9
4.3.Schematic, board layout, and bill of materials . . 15
5. PCB manufacturing specifications . . . . . . . . . . . . . . 23
5.1.Single PCB construction . . . . . . . . . . . . . . . . . . . 24
5.2.Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.3.Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.4.Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.5.Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.6.Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . 26
5.7.Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.8.Hole specification / tool table . . . . . . . . . . . . . . . 26
5.9.File description . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
© 2015 Freescale Semiconductor, Inc. All rights reserved.
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Safety information
2 Safety information
2.1 FCC guidelines
This equipment is to be used by developers for evaluation purposes only, and it must not be incorporated into any other device or system. This device is not to be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter), and obtaining a separate FCC authorization.
The FCC approval of this device only covers the original configuration of this device (as supplied). Any modifications to this product (including changes shown in this manual) violate the rules of the Federal Communications Commission and Industry Canada, and make operation of the product unlawful.
2.1.1 Labeling
The FCC labels are located on the back of the board.
2.1.2 Operating conditions
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
This device must not cause harmful interference
This device must accept any interference received, including interference that can cause undesired operation
2.1.3 Exposure limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least eight inches (20 cm) from people.
2.1.4 Antenna restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible party is used with the device. The use of a permanently attached antenna (or of an antenna that uses unique coupling to the intentional radiator) is considered sufficient to comply with the provisions of this sec tion. The manufacturer can design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of sections 15.211, 15.213, 15.217, 15.219, or
15.221 of the IEEE 802.15.4 standard. Further on, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter-protection systems and some field-disturbance sensors, or to other intentional radiators, which, in accordance with section 15.31(d), must be measured at the installation site. However, the installer is responsible for ensuring that a proper antenna is employed, so that the limits in this part are not exceeded.
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Safety information
2.2 Regulatory approval for Canada (IC RSS 210)
This equipment complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
1. This board must not cause interference
2. This board must accept any interference, including interference that can cause undesired operation of the device
2.2.1 26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
2.3 Electrostatic discharge considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on the early CMOS circuits, normal handling precautions must be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification, ESD stresses were performed for the Human Body Model (HBM), the Machine Model (MM), and the Charge Device Model (CDM).
The latch-up testing is in conformity with the JESD78 IC latch-up test. When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps, plus any (or all) of the following ESD dissipation methods:
Flexible fabric, solid fixed size, or disposable ESD wrist straps
Static control workstations, static control monitors, and table (or floor) static control systems
Static control packaging and transportation materials, and environmental systems
2.4 Disposal instructions
This product can be subject to special disposal requirements. For product disposal instructions, see
www.freescale.com/productdisposal.
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USB-KW019032 overview and description
3 USB-KW019032 overview and description
3.1 Introduction
The USB-KW019032 development platform is an evaluation environment based on the Freescale MKW01Z128 device. The MKW01Z128 device is a highly-integrated RF transceiver, and it operates over a wide frequency range, including 315 MHz, 433 MHz, 470 MHz, 868 MHz, 915 MHz, 928 MHz, and 955 MHz in the license-free Industrial, Scientific, and Medical (ISM) frequency bands. This configuration enables users to minimize external components.
The MKW01Z128 is targeted for the following low-power wireless applications:
Automated meter reading
Wireless sensor networks
Home and building automation
Wireless alarm and security systems
Industrial monitoring and control
Wireless MBUS Standard (EN13757-4:2005)
Freescale supplements the MKW01Z128 device with tools and software that include hardware evaluation and development boards, software development IDE and applications, drivers, custom PHY usable with Freescale IEEE 802.15.4 compatible MAC, SMAC, Thread
©
, and an available wireless MBUS solution.
3.2 Board features
3.2.1 USB-KW019032 board
The USB-KW019032 development board contains the MKW01Z128 device, and it is one of the simplest reference designs using the on-chip USB block for power and communication. The USB-KW019032 is a small-form-factor self-contained board for evaluation of wireless application, and it can be used as a packet sniffer. The USB type-A connection is used with USB-enabled hardware, such as a computer.
USB-KW019032 evaluation board operates in the 915 MHz and 868 MHz frequency bands with 32 MHz clock source. You can change the operation band to a different band, but optimize the RF matching network as per Section 4.3.1, “Bill of materials.”
Figure 1 shows the USB-KW019032 development platform.
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USB-KW019032 overview and description
Figure 1. USB-KW019032 development board
The USB-KW019032 development board includes the following features:
Based on the Freescale low-cost MKW01Z128 transceiver with an ARM Cortex-M0+CPU MCU, and a functional set of MCU peripherals in a 60-pin LGA package
Reference design area with small footprint and a low-cost RF node — Unbalanced input/output port — Flexible RF front end for operation in different bands — Programmable output power ranging from -18 dBm to +13 dBm in 1 dB steps — High sensitivity: down to -120 dBm at 1.2 kbps
Integrated chip antenna for RFIO port, and footprint U.FL connector for RFIO port
32 MHz reference oscillator depending on regional configuration
Reset switch drive to MKW01Z128 device
Reset switch drive to debug interface (OpenSDA)
Cortex 10-pin (0.05 inches) SWD debug port for target MCU
Cortex 10-pin (0.05 inches) JTAG port for OpenSDA updates
Integrated open-standard serial and debug interface (OpenSDA)
One blue LED indicator drive to MKW01Z128 MCU
One blue LED indicator drive to MK22FN512 MCU
One push-button switch drive to MKW01Z128 MCU
One push-button switch drive to MK22FN512 MCU
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USB-KW019032 overview and description
MCU MK22F
JT AG K22F Application
button – MK22F
Reset button – MK22F
32 MHz crystal
Application button – MKW01
Reset button – MKW01
MKW01
SWD KW01
Power-on / application LED
Chip antenna
Figure 2 shows the main board features and input/output headers for the Freescale USB-KW019032 board.
Figure 2. USB-KW019032 callouts
3.3 Software and driver considerations
The USB-KW019032 includes OpenSDAv2.1 (CMSIS-DAP), a serial and debug adapter circuit that includes an open-source bootloader, and debug interface software. It bridges serial and debug communications between a USB host and an embedded target processor. The hardware circuit is based on the Kinetis K22F family. You can find more information in the KW019032 Quick Start Card.
T o enter the bootloader mode and re-flash the CMSIS-DAP application, hold down the SW2 button while plugging the USB-KW019032 board to the PC.
For additional information about the sub-GHz Kinetis family platforms, refer to
freescale.com/USB-KW019032.
For ARM mbed™ drivers, refer to https://developer.mbed.org/handbook/Windows-serial-configuration.
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USB-KW019032 development board
4 USB-KW019032 development board
4.1 USB-KW019032 board overview
The USB-KW019032 is an evaluation board based on the Freescale Kinetis MKW01Z128 transceiver. It provides a platform to evaluate the MKW01Z128 device, and to develop software and applications. The core device is accompanied by a 32 MHz reference oscillator crystal, RF circuitry (including a chip antenna), and supporting circuitry.
The USB-KW019032 board is intended as the core PCB for MKW01Z128 device evaluation and application development, and it can be used as a simple standalone evaluation solution or as a packet sniffer. This development board covers the 868 MHz, 915 MHz, and 928 MHz bands.
4.1.1 PCB features
The USB-KW019032 board has the following features:
USB small form factor
Four-layer, metal, 0.062 inch thick FR4 board
LGA footprint and power supply bypass
Chip antenna for RFIO port, and footprint for installing a (user-supplied) U.FL connector on the RFIO port
32 MHz reference oscillator crystal
4.1.2 Form factor
Figure 3 shows the USB-KW019032 board’s connector and header locations.
Figure 3. USB-KW019032 board top-side (component-side) footprint
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Figure 4 shows a footprint of the USB-KW019032 with the location of headers.
Figure 4. USB-KW019032 board’s connector and header locations
4.1.3 Board level specifications
Table 1. USB-KW019032 board specifications
Parameter Min T yp Max Units Notes/conditions
General
Size (PCB: X, Y) 18.5 × 61.4
0.73 × 2.42mminches
Layer build (PCB) 1.57
0.062
Dielectric material (PCB) FR4
Current consumption mA Varies with operational mode, Refer to the
Operating temperature (see note) -40 +25 +70 °C Operating temperature is limited to +70 °C
Storage temperature -30 + 25 +70 °C
FSK sensitivity -105
to
-120
OOK sensitivity -112 dBm
Adjacent channel rejection
(offset = ±25 kHz or 50 kHz)
nd
order Intercept point +75 dBm
2
rd
3
order Intercept point +20 dBm
—-42 dB
—mm
inches
Power
datasheet.
Temperature
due to switches. The basic circuit is capable to handle maximum temperature of +85 °C.
RF receiver
—dBm
Four-layer
RSSI dynamic range -115 0
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RF transmitter
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USB-KW019032 development board
Table 1. USB-KW019032 board specifications (continued)
Parameter Min T yp Max Units Notes/conditions
RF power output (RFIO pin) -18 +13 dBm Programmable in 1 dB steps.
Adjacent channel power (25 kHz
offset)
FCC Product is approved according to the FCC
CE (ETSI) Product is approved according to the EN
CE (EMC) Product is approved according to the EN
UL Product is approved according to the IEC
RoHS Product complies with the EU Directive
WEEE Product complies with the EU Directive
—— -37 dBm
Regulatory approval
part 15 standard.
300 328 V1.7.1 (2006-10) standard.
301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards.
Safety
60950-1 and EN 60950-1, first-edition standards.
Environment
th
2002/95/EC of 27
2002/95/EC of 27
January 2003.
th
January 2003.
Frequency range 290 340 MHz Programmable , using a 32 MHz clock.
424 510 MHz 862 1020 MHz
4.2 Functional description
The USB-KW019032 board is built around the Freescale MKW01Z128 device in a 60-pin LGA package. The device features a highly-integrated, cost-effective sub-GHz radio frequency transceiver, and a Kinetis family ultra-low-power, mixed-signal ARM Cortex-M0+ MCU in a single package. This board is intended as a simple evaluation platform, and as a building block for application development. The four -layer board provides the MKW01Z128 device with its required RF circuitry and a 32 MHz reference oscillator crystal. You can use the layout for this base-level functionality as a reference layout for your target board.
Figure 5 shows a simple block diagram.
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USB type A
Power LED
Xtal
Reset SW button
32 MHz Xtal
Reset button
Power Management
MCU K22F
SPI / UART / I2C
MKW01
Chip Antenna
RST_TGTMKW01
Push­button
Application LED
Push­button
Application LED
JTAG
SWD
Figure 5. USB-KW019032 block diagram
4.2.1 RF performance and considerations
The MKW01Z128 transceiver is a single-chip integrated circuit ideally suited for today's high-performance ISM-band RF applications. It is intended to be used as a high-performance, low-cost FSK and OOK RF transceiver for robust, frequency-agile, half-duplex bi-directional RF links. The MKW01Z128 device is intended for applications over a wide frequency range, including the 868 MHz European ISM band, and the 902—928 MHz North American ISM bands. Output power ranges from -18 dBm to +13 dBm (on the RF_IO port).
The USB-KW019032 uses a flexible RF path topology that makes it suitable for working in different frequency bands by replacing minimum number of components, while providing good RF performance. The tables in Section 4.3.1, “Bill of materials” show different BOMs according to different frequency bands of operation.
Figure 6 shows a typical topology of the RF circuitry. The footprint enables installing the U.FL connector
J49 for measurement purposes. When using J49, C58 must be installed and C50 removed.
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Figure 6. USB-KW019032 RF circuitry
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4.2.2 Clocks
The USB-KW019032 board provides one clock (a 32 MHz reference oscillator). Figure 7 shows the 32 MHz external crystal Y1. This mounted crystal meets the MKW01Z128 transceiver requirements.
— Capacitors C22 and C21 provide the bulk of the crystal load capacitance. At 25 °C, it must have
the frequency accurate to ±10 ppm (or less) to enable temperature variation.
— Signal DIO5/CLKOUT can be used to supply an external clock to the MCU die.
Figure 7. USB-KW019032 32 MHz reference oscillator circuit
4.2.3 Power management
There is a single way to power the USB-KW019032 board. It is made via the type-A USB connector J5 to supply 5 V (VUSB) directly to the secondary MCU (MK22FN512), which includes an internal LDO and a 3.3 V output to enable the MKW01Z128 device. The USB-KW019032 power management circuit is shown in Figure 8.
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Figure 8. USB-KW019032 power management circuit
The green LED marked as D4 functions as a power indicator. For current measurements, you can isolate the MKW01Z128 device through the SH19 cut-trace , and this will disable the VCC path (including LEDs).
4.2.4 USB-KW019032 board peripheral functions
The board includes two different MCUs, one dedicated to RF acquisition (MKW01Z128), and the second one used as OpenSDA debugger and coprocessor (MK22FN512).
4.2.4.1 MKW01Z128 device peripheral functions
The USB-KW019032 development board includes two push-buttons; one for general-purpose peripheral functions to assist with implementing targeted applications, and the other dedicated to the MKW01Z128 hardware reset.
The board also includes two LEDs; one for general purposes, and the other functioning as a power-on indicator. Figure 9 shows the push-buttons and LEDs for MKW01Z128 transceiver.
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Figure 9. USB-KW019032 MKW01Z128 push-buttons and LEDs
4.2.4.2 MK22FN512/Open SDA interface
The USB-KW019032 board includes OpenSDA circuitry based on the MK22FN512 device, which includes everything that is necessary for enabling, communication, and debugging. The board provides power output for all the peripherals, including the MKW01Z128 device. Figure 10 shows the OpenSDA circuitry based on the MK22FN512 MCU, and all the necessary connections to interface with the MKW01Z128.
Figure 10. USB-KW019032 OpenSDA circuitry
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4.2.4.2.1 OpenSDA interface clock
The USB-KW019032 provides 8 MHz reference oscilator as the clock source for the OpenSDA MK22FN512 MCU. Figure 11 shows the external 8 MHz crystal X1. This mounted crystal meets the MK22FN512 requirements. It also provides C23 and C24 to bulk the crystal load capacitance.
Figure 11. USB-KW019032 board's 8 MHz clock source for MK22FN512
4.2.4.2.2 MK22FN512 peripheral functions
The USB-KW019032 OpenSDA interface circuit also includes two switch buttons; one for general-purpose peripheral functions to assist in implementing targeted applications, and the other for the MK22FN512 MCU hardware reset.
The USB-KW019032 also includes one general-purpose LED for the OpenSDA interface circuitry.
Figure 12 shows the push-buttons and LEDs for MK22FN512.
Figure 12. USB-KW019032 board’s push-buttons and LEDs for MK22FN512
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4.3 Schematic, board layout, and bill of materials
USB-KW019032 development board
Figure 13. USB-KW019032 schematic rev. A – MK22FN USB and OpenSDA
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Figure 14. USB-KW019032 schematic rev. A – MK01Z
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Figure 15. USB-KW019032 board component location (top view)
Figure 16. USB-KW019032 board test points
Figure 17. USB-KW019032 board layout (top view)
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Figure 18. USB-KW01 90 3 2 boa r d la yo u t (bo tto m vi ew )
4.3.1 Bill of materials
The following tables list the bill of materials. Table 2 details the parts common for all frequency bands,
Table 3 details the parts for the 915 MHz and 868 MHz frequency bands (default), Table 4 details the parts
for the 433 MHz frequency band, and Table 5 details the parts for the 315 MHz frequency band.
NOTE
The ANT1 component is designed to be used with 900 MHz and 800 MHz frequencies, and the values for the components L3, C17, and C20 are calculated for those frequencies and this particular chip antenna; in case another antenna is required, those values must be readjusted according to the new antenna and manufacturer recommendations.
Table 2. Bill of materials (parts common for all frequency bands) (Sheet 1 of 4)
Item Qty Reference Value Description Mfg. name Mfg. part number
1 1 C13 6.8 pF CAP CER 6.8PF 50V
0.5PF C0G 0402
21C7 DNP 10 pF CAP CER 10PF 50V
5% C0G 0402
3 2 C21, C22 11 pF CAP CER 11PF 50V
1% C0G 0402
4 2 C23, C24 DNP 22 pF CAP CER 22PF 50V
5% C0G 0402
5 2 C37, C38 DNP 47 pF CAP CER 47PF 50V
5% C0G 0402
6 2 C50, C58 100 pF CAP CER 100PF 50V
5% C0G 0402
7 1 C16 220 pF CAP CER 220PF 50V
5% C0G 0402
8 2 C60, C61 1000 pF CAP CER 1000PF 50V
5% C0G 0402
MURATA GRM1555C1H6R8DZ01J
AVX 04025A100JAT2A
KEMET CBR04C110F5GAC
AVX 04025A220JAT2A
MURATA GRM1555C1H470JA01D
KEMET C0402C101J5GAC
KEMET C0402C221J5GAC
MURATA GRM1555C1H102JA01D
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Table 2. Bill of materials (parts common for all frequency bands) (Sheet 2 of 4)
Item Qty Reference Value Description Mfg. name Mfg. part number
91C51 DNP 1000 pF CAP CER 1000PF 50V
5% C0G 0402
10 1 C43 0.01 F CAP CER 0.01UF 50V
10% X7R 0402
11 11 C14, C19,
C25, C28,
0.1 F CAP CER 0.1UF 16V 10% X7R 0402
C36, C39, C42, C44, C66, C68, C69
12 1 C67 DNP 0.1 F CAP CER 0.1UF 16V
10% X7R 0402
13 4 C31, C33,
C34, C49
1.0 F CAP CER 1.0UF 10V 10% X5R 0402
14 1 C32 2.2 F CAP CER 2.2UF 10V
10% X7R 0603
15 1 C27 10 F CAP CER 10UF 10V
10% X5R 0805
16 1 D4 GREEN LED GRN SGL 20MA
0603
17 2 D8, D12 BLUE LED BLUE SGL 20MA
SMT 0805
MURATA GRM1555C1H102JA01D
KEMET C0402C103K5RAC
KEMET C0402C104K4RAC
KEMET C0402C104K4RAC
YAGEO AMERICA CC0402KRX5R6BB105
TAIYO YUDEN LMK107B7225KA-T
MURATA GRM21BR71A106KE51L
OSRAM LG L29K-G2J1-24-Z
LITE ON LTST-C171TBKT
18 1 D18 MSS1P3L DIODE SCH 1A 20V
MICROSMP SMT
19 1 J5 USB_TYPE_A CON 1X4
USB_TYPE_A_MALE RA SMT — 178H AU
20 2 J13, J14 HDR 2X5 CONN,HEAD,2X5,ST
R,50/50 CON-2RH-10-50
21 1 J49 DNP U.FL CON, U.FL, VERT
1.25MM, 50OHM MALE PIN 6GHZ
22 2 L6, L7 330 IND FER BEAD
330OHM@100MHZ
2.5A — SMT
23 1 L11 33 nH IND —
0.033UH@100MHZ 200MA 5% 0402
24 4 R1 1, R12, R14,
R15
0 RES MF ZERO OHM
1/16W 5% 0402
25 1 R17 DNP 0 RES MF ZERO OHM
1/16W 5% 0402
VISHAY
MSS1P3L-M3/89A
INTERTECHNOLOGY MOLEX 480371000
SAMTEC FTS-105-01-F-D
HIROSE U.FL-R-SMT-1
TDK MPZ2012S331A
MURATA LQG15HS33NJ02D
VISHAY
CRCW04020000Z0ED
INTERTECHNOLOGY VISHAY
CRCW04020000Z0ED
INTERTECHNOLOGY
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Table 2. Bill of materials (parts common for all frequency bands) (Sheet 3 of 4)
Item Qty Reference Value Description Mfg. name Mfg. part number
26 2 R50, R51 33 RES MF 33.0 OHM
1/16W 1% 0402
27 1 R85 100 RES MF 100 OHM
1/16W 5% 0402
28 3 R10, R30, R31 220 RES MF 220 OHM
1/16W 5% 0402
29 6 R88, R89,
R90, R91,
1.0 K RES MF 1.0K 1/16W 1% 0402
R92, R93
30 2 R53, R54 4.7 K RES MF 4.7K 1/16W
5% 0402
31 1 R5 DNP 4.7 K RES MF 4.7K 1/16W
5% 0402
32 2 R25, R26 10.0 K RES MF 10.0K 1/16W
1% AEC-Q200 0402
33 1 R105 10.0 K RES MF 10.0K 1/16W
1% AEC-Q200 0402
34 1 R556 DNP 10.0 K RES MF 10.0K 1/16W
1% AEC-Q200 0402
35 2 R113, R114 15 K RES MF 15.0K 1/16W
1% 0402
VISHAY
CRCW040233R0FKED
INTERTECHNOLOGY VISHAY
CRCW0402100RJNED
INTERTECHNOLOGY VISHAY
CRCW0402220RJNED
INTERTECHNOLOGY YAGEO AMERICA RC0402FR-071KL
YAGEO AMERICA RC0402JR-134K7L
YAGEO AMERICA RC0402JR-134K7L
VISHAY
CRCW040210K0FKED
INTERTECHNOLOGY VISHAY
CRCW040210K0FKED
INTERTECHNOLOGY VISHAY
CRCW040210K0FKED
INTERTECHNOLOGY BOURNS CR0402-FX-1502GLF
36 1 R106 27 K RES MF 27K 1/16W
5% 0402
37 1 R112 DNP 27 K RES MF 27K 1/16W
5% 0402
38 1 SH19 DNP 0 CUT TRACE
RESISTOR
39 6 SH40, SH41,
SH44, SH45,
0 CUT TRACE
RESISTOR
SH46, SH47
DNP
40 4 SW1, SW2,
SW5, SW6
41 7 TP2, TP4,
TP9, TP10, TP46, TP48,
TL1015AF160QG SW SPST-NO 0.05A,
12V, SMT
TPAD_040 TEST POINT PAD
40MIL DIA SMT, NO PART TO ORDER
TP104
VISHAY
CRCW040227K0JNED
INTERTECHNOLOGY VISHAY
CRCW040227K0JNED
INTERTECHNOLOGY NOTACOMPONENT NOTACOMPONENT
NOTACOMPONENT NOTACOMPONENT
E-SWITCH TL1015AF160QG
NOTACOMPONENT NOTACOMPONENT
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Table 2. Bill of materials (parts common for all frequency bands) (Sheet 4 of 4)
Item Qty Reference Value Description Mfg. name Mfg. part number
42 29 TP8, TP17,
TP21, TP23, TP30, TP32,
TPAD_030 TEST POINT PAD
30MIL DIA SMT, NO PART TO ORDER
TP35, TP36, TP37, TP42, TP43, TP47, TP49, TP51, TP52, TP53, TP102, TP105, TP107, TP108, TP113, TP1 14, TP116, TP1 17, TP508, TP509, TP510, TP511, TP512
43 1 TP507 DNP TESTLOOP_BLACKTEST POINT PC
MUL TI PURPOSE BLK TH
44 3 TVS1, TVS2,
TVS3 DNP
0402ESDA-MLP DIODE TVS BIDIR —
30V 0402
45 1 U1 MKW01Z128 IC MCU ARM 48MHZ
128KB FLASH 16KB RAM 1.8-3.6V LGA60
46 2 U4, U6 74LVC2G126GM IC BUF DUAL TS
1.2-3.6V XQFN8
NOTACOMPONENT NOTACOMPONENT
KEYSTONE
5011
ELECTRONICS
COOPER
0402ESDA-MLP1
BUSSMANN FREESCALE
MKW01Z128CHN
SEMICONDUCTOR
NXP 74LVC2G126GM
47 1 U5 K22FN512VMP12
_BGA_64P
IC MCU ARM 120MHZ 512KB FLASH 16KB
FREESCALE SEMICONDUCTOR
MK22FN512VMP12
RAM 1.71-3.6V BGA64
48 1 Y1 32 MHz XTAL 32MHZ 9PF —
NDK EXS00A-CS02368
SMT 3.2X2.5MM
49 1 Y2 8.0 0 MHz XTAL 8.00MHZ RSN
MURATA CSTCE8M00G55-R0
CERAMIC -- SMT
Table 3. Bill of materials (USB-KW01 900 MHz / 800 MHz frequency bands)
Item Qty Reference Value Description Mfg. name Mfg. part number
1 1 ANT1 7488910092 ANTENNA CER CHIP DUAL
BAND 868-960MHZ
2 1 C15 2.0 pF CAP CER 2PF 50V 0.25PF
C0G 0402
3 2 C17, C20 3.3 pF CAP CER 3.3PF 25V 0.1PF
— 0402
4 1 C4 5.6 pF CAP CER 5.6PF 50V
±0.25PF C0G CC0402
WURTH 7488910092
MURATA GRM1555C1H2R0CA01B
AVX 04023J3R3BBSTR
MURATA GJM1555C1H5R6CB01D
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USB-KW019032 development board
Table 3. Bill of materials (USB-KW01 900 MHz / 800 MHz frequency bands) (continued)
Item Qty Reference Value Description Mfg. name Mfg. part number
5 1 C9 7.5 pF CAP CER 7.5PF 50V
±0.5PF C0G 0402
6 2 C11, C46
DNP
7 2 L2, L5 0.0068 H IND — 0.0068UH@100MHZ
8 1 L3 10 nH IND — 0.010UH@100MHZ
9 1 L9 0.0047 H IND — 0.0047UH@100MHZ
10 pF CAP CER 10PF 50V 5%
C0G 0402
300MA 5% 0402
300MA 5% 0402
300MA ±0.3NF 0402
MURATA GRM1555C1H7R5DA01D
AVX 04025A100JA T2A
MURATA LQG15HS6N8J02D
MURATA LQG15HS10NJ02D
MURATA LQG15HS4N7S02D
Table 4. Bill of materials (USB-KW01 400 MHz frequency bands)
Item Qty Reference Value Description Mfg. name Mfg. part number
1 1 C4 8.2 pF CAP CER 8.2PF 50V 0.5PF
C0G 0402
2 2 C9, C15 15 pF CAP CER 15PF 50V 1%
C0G 0402
3 1 C11 2.4 pF CAP TF 2.4PF 50V 0.25PF
— 0402
AVX 04025A8R2CAT2A
VENKEL COMPANY
MURATA GJM1555C1H2R4BB01
C0402C0G500-150FNE
4 1 L5 12 nH IND — 0.012UH@100MHZ
300MA 5% 0402
5 1 L2 10 nH IND — 0.010UH@100MHZ
300MA 5% 0402
61L9 0 RES MF ZERO OHM 1/10W
0402
71C46 DNP 10 pF CAP CER 10PF 50V 5%
C0G 0402
MURATA LQW15AN12NJ00D
MURATA LQW15AN10NJ00D
PANASONIC ERJ-2GE0R00X
AVX 04025A100JAT2A
Table 5. Bill of materials (USB-KW01 300 MHz frequency bands)
Item Qty Reference Value Description Mfg. name Mfg. part number
1 1 C4 12 pF CAP CER 12PF 50V 5%
C0G 0402
2 1 C9 15 pF CAP CER 15PF 50V 5%
C0G 0402
3 2 C11, C46 DNP 10 pF CAP CER 10PF 50V 5%
C0G 0402
MURATA GRM1555C1H120JZ01D
VENKEL COMPANY
AVX 04025A100JAT2A
C0402C0G250-150JNP
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PCB manufacturing specifications
Table 5. Bill of materials (USB-KW01 300 MHz frequency bands) (con tinued)
Item Qty Reference Value Description Mfg. name Mfg. part number
4 1 C15 22 pF CAP CER 22pF 50V 5%
C0G AEC-Q200 0402
5 1 L5 22 nH IND — 22NH@100MHZ
310MA 2% 0402
6 1 L2 18 nH IND AIR 18NH@100MHZ
370MA 3% 0402
7 1 L9 4.7 nH IND — 4.7NH@100MHZ
300MA ±0.3nH 0402
NOTE
USB-KW019032 does not include the J49 (U.FL connector), nor the external antenna.
For external measurements and/or external antenna usage, the J49 must be installed and soldered in place.
A 50 U.FL connector is required; it is recommended to use the part with number U.FL-R-SMT-1 from Hirose.
When selecting an external antenna to connect to the U.FL connector, choose an antenna designed for the desired frequency band. Operation with an external antenna may require re-certification of your product.
MURATA GCM1555C1H220JA16
MURATA LQW15AN22NG00D
MURATA LQW15AN18NH00D
MURATA LQG15HN4N7S02D
5 PCB manufacturing specifications
This section provides the specifications used to manufacture the USB-KW019032 development Printed Circuit Board (PCB) described in this guide.
The USB-KW019032 development platform PCBs must comply with the following:
The PCB must comply with Perfag 1D / 3C (www.perfag.dk/en/)
The PCB manufacturer’s logo is required
The PCB production week and year codes are required — The manufacturer’s logo and week / year codes must be stamped on the back of the PCB solder
mask
— The PCB manufacturer cannot print text on the PCB (either in copper or in silkscreen) without
written permission from Freescale Semiconductor, Inc.
The required Underwriter’s Laboratory (UL) flammability rating: — The level is 94V-0 — The UL information must be stamped on the back of the PCB solder mask
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PCB manufacturing specifications
NOTE
The complete set of design files for the USB-KW019032 development platform is available at www.freescale.com/KW01, under “Software and Tools.” These reference designs can be used as a starting point for developing custom applications.
The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual (document ZHDCRM) is also available at www.freescale.com/KW01 for additional design guidance.
See Hardware Design Considerations for MC12311 and MKW01x Sub-GHz Devices (document AN4958) for additional design guidance.
5.1 Single PCB construction
This section describes individual PCB construction details.
The USB-KW019032 PCBs are four-layer designs
The PCBs contain no blind, buried, or micro vias
The PCB data are as follows: — The size of USB-KW019032 is approximately 18.5 × 61.4 mm (0.73 × 2.42 inches) — The final thickness of USB-KW019032 (Cu/Cu) is 1.57 mm (0.62 inches) ±10% (excluding
solder mask)
Table 6 defines the layers of the PCB. The artwork identification refers to the name of the layer in
commonly used terms.
Table 6. USB-KW019032 layer by layer overview
Layer Artwork identification File name
1 Silkscreen top PSS.art 2 Top layer metal L1_PS.art 3 Ground layer L2_GND.art 4 Signal layer L3_INT_1.art 5 Bottom layer metal L4_SS.art 6 Silkscreen bottom SSS.art
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PCB manufacturing specifications
CAUTION
The USB-KW019032 development board contains high-frequency sub-GHz RF circuitry. The RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. The board stackup geometry is critical. Dielectric and copper thicknesses and spacing must not be changed; follow the stackup information provided with the reference design (see Figure 19). The current board thickness is 64 mils. For a 1 dB improvement, change the thickness to 32 mils (change the intermediate dialectic on inner layer B-Target to 8 mils). The board may become fragile.
Figure 19. USB-KW019032 PCB stackup cross-section (four layers)
Solder mask is required
Silk screen is required
5.2 Panelization
The panel size can be adjusted according to production volume.
5.3 Materials
The PCB composite materials must meet the following requirements:
Laminate: the base material (laminate) must be FR4. If the laminate material is changed, the RF electrical characteristics change, and degrade the RF performance.
Copper foil — The top and bottom copper layers must be 1 oz. copper — Interior layers must be 1 oz. copper
Plating: the whole pad plating must be made by Hot Air Leveling (HAL)
5.4 Solder mask
The solder mask must meet the following requirements:
Solder mask type must be Liquid Film Electra EMP110 or equivalent
Solder mask thickness must be 10 – 30 µm
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Revision history
5.5 Silk screen
The silk screen must meet the following requirements:
Silk screen color must be white
Silk screen must be applied after the application of solder mask (if solder mask is required)
The silk screen ink must not extend into the plated-thru holes
The silk screen must be clipped back to the line of resistance
5.6 Electrical PCB testing
All PCBs must be 100% tested for opens and shorts
Impedance measurement report is not mandatory
5.7 Packaging
The packaging of the PCBs must meet the following requirements:
Finished PCBs must remain in panel
Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials, as these materials can degrade solderability
5.8 Hole specification / tool table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28746.pdf file.
5.9 File description
The files included with the download are Design, Gerber, and PDF files. Gerber files are in RS-274x format. Not all files included with the Gerber files are for PCB manufacturing purposes.
The included PDF files are:
FAB-28746.pdf – Board fabrication drawing
®
GRB-28746.zip – Freescale Freedom
board metal layers, solder mask, solder paste, and silk
screen
SPF-28746.pdf – Freedom board schematic
Design files are in Cadence® Allegro® format with OrCAD® schematic capture.
6 Revision history
Revision
number
Date Substantive change(s)
0 10/2015 Initial release
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How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document.
Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” paramete rs that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the right s of ot hers. Freescale sells products pursuant to standard terms and condit ions of sa le, which ca n be f ound at t he fol lowing address: freescale.com/SalesTermsandConditions.
Freescale, the Freescale logo, and Kinetis are trademarks of Freescale Semiconductor, Inc. , Reg. U.S. Pat. & Tm. Of f. mbed is a trademar k of ARM Limited in EU and/or elsewhere. All other product or service names are the property of their respective owners.
ARM, the ARM powered logo, and Cortex are the registered trademarks of ARM Limited in EU and/or elsewhere. Cadence, Allegro, and OrCAD are the registered trademarks of Cadence Design Systems, Inc. All Rights Reserved.
© 2015 Freescale Semiconductor, Inc.
Document Number: USBKW019032UG
Rev. 0
10/2015
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