Freescale Semiconductor i.MX27PDK User Manual

i.MX27 PDK 1.0 Hardware
User's Guide
Document Number: 924-76325
Rev. 1.0
11/2008
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About This Book .....................................................................................................v
Audience............................................................................................................................... v
Organization.......................................................................................................................... v
Conventions.......................................................................................................................... vi
Definitions, Acronyms, and Abbreviations.............................................................................vi
Chapter 1 Introduction ....................................................................................... 1-1
1.1 i.MX27 3-Stack Features....................................................................................... 1-2
1.2 i.MX27 3-Stack Components................................................................................. 1-3
1.3 System and User Requirements.............................................................................. 1-4
1.4 3-Stack System Operating Specifications................................................................ 1-4
Chapter 2 Configuration and Connections........................................................... 2-1
2.1 Debug Board Configuration................................................................................... 2-1
2.1.1 Debug Board Top Switches and Connectors........................................................... 2-1
2.1.2 Debug Board Bottom Connectors .......................................................................... 2-3
2.2 Personality Board Connectors................................................................................ 2-4
2.2.1 Personality Board Top Connectors......................................................................... 2-4
2.2.2 Personality Board Bottom Connectors.................................................................... 2-5
2.3 CPU Board Connector........................................................................................... 2-6
2.4 Setting the Debug Switches.................................................................................... 2-7
Chapter 3 Build the Platform .............................................................................. 3-1
3.1 Build a Development Platform: Assemble 3 Boards................................................ 3-2
3.1.1 Connect Personality Board to Debug Board........................................................... 3-2
3.1.2 Connect CPU Board to Debug Board..................................................................... 3-3
3.1.3 Connect Development Platform to PC; Run Preloaded Image................................. 3-4
3.2 Build a Demo Platform: Assemble 2 Boards........................................................... 3-5
3.2.1 Connect CPU Board to Personality Board.............................................................. 3-6
3.2.2 Connect Power Supply; Run Pre-loaded Demo....................................................... 3-7
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Chapter 4 Functional Operation.......................................................................... 4-1
4.1 Functional Block Diagrams.................................................................................... 4-1
4.2 3-Stack Memory Map............................................................................................ 4-3
4.3 CPLD on the Debug Board.................................................................................... 4-4
4.3.1 CPLD Features ...................................................................................................... 4-4
4.3.2 CPLD Memory Map.............................................................................................. 4-4
4.3 .3 Pro grammin g the CPLD ......................................................................................... 4-5
4.4 i.MX27 GPIO Grouping......................................................................................... 4-7
Chapter 5 Connectors and Signals....................................................................... 5-1
5.1 500 Pins Board to Board Co nnector....................................................................... 5-2
5.2 TV/Headphone Jack..............................................................................................5-16
5.3 LCD Connector ....................................................................................................5-18
5.4 Keypad .................................................................................................................5-20
5.5 Current Measurement Connector...........................................................................5-21
5.6 Battery Operation..................................................................................................5-21
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About This Book
This document explains how to connect and operate the i.MX27 3-Stack Platform System.
Audience
This document is intended for software, hardware, and system engineers who are planning to use the i.MX27 hardware and for anyone who wants to understand more about the i.MX27 hardware.
Organization
This document contains the following chapters. Chapter 1 Intr oduces the features and functionality of the 3-Stack board. Chapter 2 Provides configuration and setup information. Chapter 3 Explains how to assemble the boards. Chapter 4 Provides block diagrams and memory mapping. Chapter 5 Provides connector pin assignments and signal descriptions.
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Conventions
This docu ment us e s the following conventions :
Courier Is used to identify comman ds, explicit comman d p ar ame ter s, code
examples, expressions, data types, and directives.
Italic Is used for emphasis, to identify new terms, and for replaceable command
parameters.
Definitions, Acronyms, and Abbreviations
Th e followin g lis t defines the abb re viations used in th is document. APMS Atlas Power Management System
ATA Har d dr ive interface spec CD Compact Disk CM OS Comp leme ntary Meta l Oxide Se miconductor CPLD Custom Progr ammed Logic Devices CPU Central Processing Unit CSI Camera Sensor Imaging CSPI Serial Peripheral Interface DCE Data Communication s E quipment DDR Double Data Rate DIP Dual In-line Package DMA Direct Memory Access DTE Data Terminal Equipment DUART Dual Universal Asynchronous Receiver/Transmitter EEPROM Electrically Erasable Progr ammable Read Only Memory EPROM Erasable Programmable Read Only Memory FIR Infra Red GPIO General Purpose Input/Output GPO General Purpose Output I
2C Inter-Integrated Circuit
ICE In-Circuit Emulator I/O I nput/Output IrDA Infrared Data Association ISA Instr umentation, System, and Automation Society JTAG Joint Test Access Group LAN Local Area Network LCD Liquid Crystal Display LED Light Emitting Diode MB Mega byte MCU Microcontroller Unit MM C Multi- med ia Card MC P M ulti-ch ip p roduct
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MS Memory St ick NVRA M Non -volatile Ra n dom Access Memory OTG On t he Go PC Personal Computer PCMCIA Personal Computer Memory Card International Asso ciation PCB Printed Circuit Board PHY Physical interface POR Power on Reset PSRAM Pseudo Random Access Memo ry PWM Pulse Width Modulation QVGA Graphics Adapter RAM Random Access Memory SD SanDisk (Smart Media) SDRAM Synchronous Dynamic Random Access Memory SI System International (international syst em of units and measures) SIMM Single In-Line Memory Module SPST Single Pole Single Throw SSI2 Synchro nous Serial Interface TFT Th in Film Tr ansistor UART Universal Asynchrono us Receiver/Transmitter USB Univer sal Serial Bus
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Chapter 1 Introduction
The i.MX27 3-Stack Platform System helps you develop new solutions using the i.MX27 ARM9™ MCU and the MC13783 audio and power management chip.
The 3-Stack platform comprises the CPU Engine board, Personality board, and Debug board. The system suppo r ts application software development, target bo ar d debugging, and optional circuit cards. The CPU board can be run in stand-alone mode for code development. An LCD display panel is supplied with the 3-Stack system.
Figure 1-1 shows the major components of the 3-Stack system.
Figure 1-1 Major Components of the 3-Stack System
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1.1 i.MX27 3-Stack Features
The 3-Stack system can be used in two ways: the development mode requires a three-board as sembly; the d emons tratio n mode r eq uires only a two-board assembly (without th e Debug board).
The system includes the following features
.
Near form-factor demonstration modules and working platforms.
Solid reference schematics that closely resemble final products to aid customers’ designs.
Three-board system, which includes: CPU board with i.MX27 ARM9 MCU, MC13783 chip Personality boar d with peripheral components and interface connectors Debug board with two RS-232 interfaces, 10/100 Base-T Ethernet connector, and
current measure connectors.
Utilizes reliable high-density connector to interface between boards.
Fig ure 1- 2 illu str ates the three-board assembly (left) fo r dev elop ment and th e tw o-boar d a ssembly (right) for demonstration.
Figure 1-2 Board Assemblies
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1.2 i.MX27 3-Stack Components
The 3-Stack board set includes the following co mponents:
+5.0 VDC, 2.4 A universal power supply
+4.2 V 2400mAh battery power supply and battery charging function
2.8- inch th in film transistor liq uid crystal display ( TF TL CD ) pan el w ith touc h panel an d
LED backlight
2.4-inch Quarter Video Graphics Arr ay (QVGA) smart display panel connector
Image sensor camera connector
Con figurable inte llige nt man ag ement of sys tem p ower through pow er man ag ement ch ip
MC13783
Two selectable syst em clock sources, 32.768KHz and 26MHz
256 MB of NAND Flash Memory
128 MB of 32-bit DDR SDRAM memory
RealView- I CE® debug support`
Pushbutton reset (o n CPU) o r reset control from MC13783
Ster eo micr ophone jack, headphone and video jack, ster eo and mono (ear piece) speaker
t ermina ls
One connector to outboard GPS module
FM receiver
TV decoder that supports 8-bit color, and NTSC and PAL formats
SD card co nnecto r s, with card sense functionality
Onboard keypad and keypad co nnecto r
Onboard Wi-Fi CERTIFIED™ IEEE 802.11™ b/g standards and Bluetooth(r) Core
Specification Version 2.0 + EDR (enhanced data rate) co mbination module
One USB high- speed host transceiver, with standard USB host connector
ATA5-compliant co nt rolle r wit h one 44-position du al ro w, 2mm h eade r for small fo rm-
factor disk driver s, and one 40-pin ZIF connector for Toshiba HDD
Onboard accelerometer with sensit ivity in three separat e axes (X, Y, and Z)
Two RS- 232 interfaces with DB-9 connectors: one is driven by UART channel internal to
the i.MX27 and supports DCE with optional full modem controls; the other is DTE with o ptiona l full mod em con trols
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1.3 System and User Requirements
You will n ee d a n IBM® PC or comp atible computer that in clu de s:
Windows 98™, ME™, 2000™, XP™, or NT ™ (version 4.0) operating system
One +5VDC, 2.4A power supply with a female (inside posit ive) power co nnecto r
(included)
CAUTION
Never supply more than +5.5 V power to the i.MX27 3-Stack. Doing so can dama ge b oar d c omponents.
1.4 3-Stack System Operating Specifications
Table 1-1 identifies the clock, environmental conditions, and dimensions of the i. MX27 3-S tack system.
Table 1-1 Specifications
Characteristic Specifications
Clock Selectable 32.768KHz or 26 MHz
Temperature: Operating Storage
Relative Humidity 0 to 90% (noncondensing)
Power Requirements 4.5V to 5.5 V DC @1.5A
Dimensions
-10 °C to + 50 °C
-40 °C to +85 °C
CPU Engine board: 38.989mm x 69.012mm Personality board: 71.428mm x 129.462mm Debug board: 71.400mm x 174.900mm
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Chapter 2 Configuration and Connections
This section contains configuration information, connection descriptions, and other operational information that may be useful during the development process.
2.1 Debug Board Configuration
Th e D ebug bo ard pro vides an easy, familia r inter face for pr ogramming and debugging the i.MX development systems and reference platforms.
This section describes the switches and connectors o n t he t op of the Debug board, and the connector to t he CPU Engine bo ar d on the bott om of the Debug board. The Debug board is a small card that you can insert o r remov e fr om th e p latfor m. The ab ility to remov e the debug bo ard is a major ad van tage to marketing a nd sa les tea ms who want to d emonst rate and sh owcase a varie ty of pro ducts an d id ea s in a streamlined, nea r form factor way, without t he added software development bulk.
2.1.1 Debug Board Top Switches and Connectors
Figure 2-1 ident ifies the switches and connectors located o n top of the Debug board. Table 2-1 describes the switches and connectors.
.
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Figure 2-1 Debug Board, Top View
Table 2-1 Debug Board, Top Components
Component Description
S1 Power button, connected to the ON1B input of the MC13783 through the 500 pin connector.
The line is pulled up, and pushing it grounds the line. If MC13783 is in Off, User Off or Memory Hold Mode, the board can be powered on by pushing the button
S2 Reset button, which resets the Debug board
S3 System reset switch, connected to the RESETB to MX27. The line is pulled up, and pushing it
grounds the line.
S4 Power on switch, which powers up the Debug board when set to 1.
J1 10/100 Base T Ethernet RJ45 Connector
J2 5.0V DC power connector
J3 Current measure connector; measures the current at various points of CPU Engine and
Personality board from the connector
F1 Re-settable fuse; re-settable over-current protection
D1 – D8 LEDs for CPLD debug
D9 LED for debug board 3.3V power; the LED will be bright when debug 3.3V is power on
D11 LED for DC power supply; the LED will be bright when 5.0V DC power is supplied
P1 WEIM Address measure connector; can support CodeTest Interface Probe
P2 WEIM Data measure connector; can support CodeTest Interface Probe
BT1, BT2 Test buttons for CPLD
CN1 i.MX27 JTAG connector
CN2 Debug board CPLD JTAG connector
CN3 Personality board CPLD JTAG connector (Reserved)
CN74 500 pins connector to Personality board
CON4 UART (DCE) DB9 female connector
SW4
SW5 – SW10
Enable switch; the switch designation settings follow.
ON Serial port UART (DTE) CON3 is selected SW4-1 UART Port Select
OFF Serial port UART (DCE) CON4 is selected
ON Enable NorFlash on Debug board SW4-2 NorFlash Enable
OFF Disable Norflash on Debug board
SW4-8 Power Enable
Boot mode setting switches; SW5 to SW10 settings determine where the processor begins program execution; the valid combinations of the switch settings follow.
ON Power supply to three boards
OFF Power supply to Debug board only
Boot mode device SW5 Boot4
SW6
UART/USB Bootloader X 0 0 0 0 0
8-bit NAND Flash (2KB page) Ext
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X 0 0 0 1 0
Boot3
SW7
Boot2
SW8
Boot1
SW9
Boot0 SW10
2.1.2 Debug Board Bottom Connectors
Fig ure 2- 2 illu str ates the bottom vie w of the Debug b oar d, wh ere J4 identifies t he 500-pin connector t o the CPU Engine boar d.
Figure 2-2 Debug Board Bottom View
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2.2 Personality Board Connectors
This section describes the switches and connectors o n t he t op of the Personality board, and the connecto r s on the bottom of the Personality board.
2.2.1 Personality Board Top Connectors
Figure 2-3 ident ifies the connectors on the top of the Personalit y Board.
Figure 2-3 Personality Board Connectors, Top View
Table 2-2 Personality Board Connectors, Top View
Component
Identifier
E1 Wi-Fi antenna
E2 Bluetooth antenna
F1 Resettable over current-protection fuse
J10 Mini USB OTG High speed connector, for USB OTG connection
Description
J14 Epson VGA LCD connector
J15 Giantplus QVGA Smart display connector
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Component
Identifier
Mini USBOTG High speed connector, for USB HOST connection. NOTE: J18 mini USBOTG
J18
J19 Audio and Video connector
CN13 GPS module connector
CN14 2.0M pixel CMOS sensor connector
CN16 Debug port for Wi-Fi and Bluetooth module
CN70 40 pin ZIF connector for Toshiba HDD
S7 – S17 Onboard keypad
High speed connector, for USB HOST connection.
Note: This connector is not used with the i.MX27 PDK; it is used only with the i.MX31 PDK.
Description
2.2.2 Personality Board Bottom Connectors
Fig ure 2-4 illustra tes the b ottom v iew of th e Personality b oar d. T able 2-3 describe s the connectors.
Figure 2-4 Personality Board, Bottom View
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