Freescale Semiconductor Energy Efficient Solutions Xtrinsic MMA8452Q Data Sheet: Technical Data

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MMA8452Q

16 PIN QFN

3 mm x 3 mm x 1 mm

CASE 2077-02

Top and Bottom View

Top View

Pin Connections

1 2

3 4 59

141516

876

VDD

VDDIO

BYP

DNC

SCL

GND

NC GND

INT1 GND

INT2

SA0

SDA

Freescale Semiconductor Document Number: MMA8452Q

Data Sheet: Technical Data Rev. 9, 07/2014

An Energy Efficient Solution by Freescale

Xtrinsic MMA8452Q 3-Axis,

12-bit/8-bit Digital Accelerometer

The MMA8452Q is a smart, low-power, three-axis, capacitive, micromachined accelerometer with 12 bits of resolution. This accelerometer is packed with embedded functions with flexible user programmable options, configurable to two interrupt pins. Embedded interrupt functions allow for overall power savings relieving the host processor from continuously polling data.

The MMA8452Q has user selectable full scales of ±2g/±4g/±8g with high-pass filter filtered data as well as non-filtered data available real-time. The device can be configured to generate inertial wakeup interrupt signals from any combination of the configurable embedded functions allowing the MMA8452Q to monitor events and remain in a low power mode during periods of inactivity. The MMA8452Q is available in a 3 mm x 3 mm x 1 mm QFN package.

Features

• 1.95V to 3.6V supply voltage

• 1.6V to 3.6V interface voltage

• ±2g/±4g/±8g dynamically selectable full-scale

• Output Data Rates (ODR) from 1.56 Hz to 800 Hz

• 99 μg/√Hz noise

• 12-bit and 8-bit digital output

•I

• Two progr ammable interrupt pins for six interrupt sources

• Three embedded channels of motion detection

Typical Applications

• E-Compass applications

• Static orientation detection (Portrait/Landscape, Up/Down, Left/Right, Back/

• Notebook, e-reader, and Laptop Tumble and Freefall Detection

• Real-time orientation detection (virtual reality and gaming 3D user position feedback)

• Real-time activity analysis (pedometer step counting, freefall drop detection for HDD, dead-reckoning GPS backup)

• Motion detection for portable product power saving (Auto-SLEEP and Auto-WAKE for cell phone, PDA, GPS, gaming)

• Shock and vibration monitoring (mechatronic compensation, shipping and warranty usage logging)

•

digital output interface

— Freefall or Motion Detection: 1 channel — Pulse Detection: 1 channel — Transient Detection: 1 channel

– Orientation (Portrait/Landscape) detection with set hysteresis – Automatic ODR change for Auto-WAKE and return to SLEEP – High-Pass Filter Data available real-time –Self-Test – RoHS compliant – Current Consumption: 6 μA to 165 μA

Front position identification)

User interface (menu scrolling by orientation change, pulse detection for button replacement

Part Number Temperature Range Package Description Shipping

MMA8452QT -40°C to +85°C QFN-16 Tray

MMA8452QR1 -40°C to +85°C QFN-16 Tape and Reel

ORDERING INFORMATION

)

1 Block Diagram and Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1 Mechanical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.3 I2C interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 Zero-g Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.3 Self-Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4 System Modes (SYSMOD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.1 Device Calibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.2 8-bit or 12-bit Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.3 Low-Power Modes vs. High-Resolution Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.4 Auto-WAKE/SLEEP Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.5 Freefall and Motion Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.6 Transient Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.7 Pulse Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.8 Orientation Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.9 Interrupt Register Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.10 Serial I

6 Register Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.1 Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.2 Portrait/ Landscape Embedded Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.3 Motion and Freefall Embedded Function Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.4 Transient (HPF) Acceleration Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.5 Single, Double and Directional Pulse-Detection Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

6.6 Auto-WAKE/SLEEP Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

6.7 Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

6.8 User Offset Correction Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

7 Printed Circuit Board Layout and Device Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

7.1 Printed Circuit Board Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

7.2 Overview of Soldering Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

7.3 Halogen Content. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

8 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

8.1 Product identification markings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

8.2 Tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

8.3 Package Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1 Block Diagram and Pin Description

12-bit

SDA SCL

I2C

Embedded

DSP

Functions

C to V

Internal

OSC

Clock

GEN

ADC

Converter

VDDIO

VSS

X-axis

Transducer

Y-axis

Transducer

Z-axis

Transducer

Freefall

and Motion

Detection

Transient Detection

(i.e., fast motion,

transient)

Orientation with

Set Hysteresis

and Z-lockout

Shake Detection

through

Motion

Threshold

Auto-WAKE/Auto-SLEEP Configurable with debounce counter and multiple motion interrupts for control

Auto-WAKE/SLEEP

ACTIVE Mode

SLEEP

VDD

INT1 INT2

ACTIVE Mode

WAKE

Single, Double and Directional

Tap Detection

MODE Options

Low Power Low Noise + Low Power High Resolution Normal

MODE Options

Low Power Low Noise + Low Power High Resolution Normal

DIRECTION OF THE

DETECTABLE ACCELERATIONS

(BOTTOM VIEW)

(TOP VIEW)

Earth Gravity

Figure 1. Block Diagram

Figure 2. Direction of the Detectable Accelerations

Sensors Freescale Semiconductor, Inc. 3

MMA8452Q

Figure 3 shows the device configuration in the six different orientation modes. These orientations are defined as the following:

Top View

Earth Gravity

Pin 1

Xout @ 0g

Yout @ -1g

Zout @ 0g

Xout @ 1g Yout @ 0g Zout @ 0g

Xout @ 0g Yout @ 1g Zout @ 0g

Xout @ -1g

Yout @ 0g Zout @ 0g

Side View

FRONT

Xout @ 0g Yout @ 0g Zout @ 1g

BACK

Xout @ 0g Yout @ 0g

Zout @ -1g

0.1μF

1.6V-3.6V VDDIO

VDDIO

4.7kΩ 4.7kΩ

GND

VDDIO

SCL

INT2

INT1

GND

SDA

SA0

VDD

BYP

MMA8452Q

1415

4.7μF

INT1

INT2

SA0

0.1μF

1.95V - 3.6V VDD

SCL

SDA

DNC

PU = Portrait Up, LR = Landscape Right, PD = Portrait Down, LL = Landscape Left, BACK and FRONT side views. There are several registers to configure the orientation detection and are described in detail in the register setting section.

Figure 3. Landscape/Portrait Orientation

Figure 4. Application Diagram

MMA8452Q

4 Freescale Semiconductor, Inc.

Sensors

Table 1. Pin Descriptions

Pin # Pin Name Description

1 VDDIO Internal Power Supply (1.62V - 3.6V) 2 BYP Bypass capacitor (0.1 μF) 3 DNC Do not connect to anything, leave pin isolated and floating.

4SCL 5 GND Connect to Ground 6SDA

7SA0 8 NC Internally not connected

9 INT2 Inertial Interrupt 2, output pin 10 GND Connect to Ground 11 INT1 Inertial Interrupt 1, output pin 12 GND Connect to Ground 13 NC Internally not connected 14 VDD Power Supply (1.95 V to 3.6 V) 15 NC Internally not connected 16 NC Internally not connected (can be GND or VDD)

C Serial Clock, open drain

C Serial Data

C Least Significant Bit of the Device I2C Address, I2C 7-bit address = 0x1C (SA0=0), 0x1D (SA0=1).

The device power is supplied through VDD line. Power supply decoupling capacitors (100 nF ceramic plus 4.7 µF bulk, or a

single 4.7 µF ceramic) should be placed as near as possible to the pins 1 and 14 of the device.

The control signals SCL, SDA, and SA0 are not tolerant of voltages more than VDDIO + 0.3V . If VDDIO is removed, the control

signals SCL, SDA, and SA0 will clamp any logic signals with their internal ESD protection diodes.

The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) are user programmable through the I

interface. The SDA and SCL I2C connections are open drain and therefore require a pullup resistor as shown in the application diagram in Figure 4.

1.1 Soldering Information

The QFN package is compliant with the RoHS standard. Please refer to AN4077.

MMA8452Q

Sensors Freescale Semiconductor, Inc. 5

2 Mechanical and Electrical Specifications

2.1 Mechanical Characteristics

Table 2. Mechanical Characteristics @ VDD = 2.5V, VDDIO = 1.8V, T = 25°C unless ot herwise noted.

Parameter Test Conditions Symbol Min Typ Max Unit

FS[1:0] set to 00

2g Mode

Measurement Range

Sensitivity

Sensitivity Accuracy

Sensitivity Change vs. Temperature

Zero-g Level Offset Accuracy Zero-g Level Offset Accuracy Post Board Mount

Zero-g Level Change vs. Temperature -40°C to 85°C TCOff ±0.15 mg/°C Self-Test Output Change

X Y Z

ODR Accuracy

2 MHz Clock ±2 Output Data Bandwidth BW ODR/3 ODR/2 Hz Output Noise Normal Mode ODR = 400 Hz Noise 126 µg/√Hz

Output Noise Low-Noise Mode Operating Temperature Range Top -40 +85 °C

(1)

(2)

(3)

(4)

(5)

(1)

FS[1:0] set to 01

4g Mode

FS[1:0] set to 10

8g Mode

FS[1:0] set to 00

2g Mode

FS[1:0] set to 01

4g Mode

FS[1:0] set to 10

8g Mode

FS[1:0] set to 00

2g Mode

FS[1:0] set to 01

4g Mode

FS[1:0] set to 10

8g Mode

FS[1:0] 2g, 4g, 8g TyOff ±17 mg FS[1:0] 2g, 4g, 8g TyOffPBM ±20 mg

FS[1:0] set to 0

4g Mode

Normal Mode ODR = 400 Hz Noise 99 µg/√Hz

Soa ±2.64 %

TCSo ±0.008 %/°C

Vst

±2

±4

±8

1024

512

256

+44 +61

+392

counts/g

LSB

1. Dynamic Range is limited to 4g when the Low-Noise bit in Register 0x2A, bit 2 is set.

2. Sensitivity remains in spec as stated, but changing Oversampling mode to Low Power causes 3% sensitivity shift. This behavior is also seen when changing from 800 Hz to any other data rate in the Normal, Low Noise + Low Power or High Resolution mode.

3. Before board mount.

4. Post Board Mount Offset Specifications are based on an 8 Layer PCB, relative to 25°C.

5. Self-Test is one direction only.

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6 Freescale Semiconductor, Inc.

2.2 Electrical Characteristics

Table 3. Electrical Characteristics @ VDD = 2.5V, VDDIO = 1.8V, T = 25°C unless otherwise noted.

Parameter Test Conditions Symbol Min Typ Max Unit

Supply Voltage VDD

(1)

Interface Supply Voltage VDDIO

ODR = 1.56 Hz ODR = 6.25 Hz ODR = 12.5 Hz 6

Low-Power Mode

ODR = 50 Hz 14

ODR = 100 Hz 24

ODR = 200 Hz 44 ODR = 400 Hz 85

ODR = 800 Hz 165 ODR = 1.56 Hz ODR = 6.25 Hz ODR = 12.5 Hz 24

Normal Mode

ODR = 50 Hz 24

ODR = 100 Hz 44

ODR = 200 Hz 85

ODR = 400 Hz 165

ODR = 800 Hz 165

Current during Boot Sequence, 0.5 mSec max duration using recommended Bypass Cap

VDD = 2.5V Idd Boot

Value of Capacitor on BYP Pin -40°C 85°C Cap

STANDBY Mode Current @ 25°C

VDD = 2.5V, VDDIO = 1.8V

STANDBY Mode

Stby 1.8 5 μA

Digital High Level Input Voltage

SCL, SDA, SA0 VIH 0.7*VDDIO

Digital Low-Level Input Voltage

SCL, SDA, SA0 VIL 0.3*VDDIO

High Level Output Voltage

INT1, INT2 I

= 500 μA VOH 0.9*VDDIO

Low-Level Output Voltage

INT1, INT2 I

= 500 μA VOL 0.1*VDDIO

Low-Level Output Voltage

SDA I

= 500 μA VOLS 0.1*VDDIO

Power on Ramp Time 0.001 1000 ms

Time from VDDIO on and

Boot time

VDD > VDD min until I

C is ready

Tbt 350 500 µs

for operation, Cbyp = 100 nF

Turn-on time

(2)

Time to obtain valid data from

STANDBY mode to ACTIVE mode. Time to obtain valid data from valid

voltage applied.

Ton1

Ton2 2/ODR + 2 ms

Operating Temperature Range Top -40 +85 °C

1.95 2.5 3.6 V

(1)

1.62 1.8 3.6 V 6 6

24 24

75 100 470 nF

2/ODR + 1 ms

1mA

μA

1. There is no requirement for power supply sequencing. The VDDIO input voltage can be higher than the VDD input voltage.

2. Note the first sample is typically not very precise. Depending on ODR/MODS setting, a minimum of three samples is recommended for full precision.

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Sensors Freescale Semiconductor, Inc. 7

2.3 I2C interface characteristics

VIL = 0.3V

VIH = 0.7V

Table 4. I

C slave timing values

SCL clock frequency f Bus-free time between STOP and START condition t (Repeated) START hold time t Repeated START setup time t STOP condition setup time t SDA data hold time t SDA setup time t SCL clock low time t SCL clock high time t SDA and SCL rise time t SDA and SCL fall time t SDA valid time

(4)

SDA valid acknowledge time Pulse width of spikes on SDA and SCL that must be suppressed by

internal input filter

(1)

Parameter Symbol

(5)

SCL

BUF

HD;STA

SU;STA

SU;STO

HD;DAT

SU;DAT

LOW

HIGH

VD;DAT

VD;ACK

C Fast Mode

Min Max

0 400 kHz

1.3 μs

0.6 μs

0.05 0.9

(2)

100 ns

1.3 μs

0.6 μs 20 + 0.1 C 20 + 0.1 C

(3)

300 ns 300 ns

(2)

0.9

(2)

0.9

050ns

Capacitive load for each bus line Cb 400 pF

Unit

μs

μs μs

1.All values referred to V

2.This device does not stretch the LOW period (t

(0.3VDD) and V

IH(min)

3.Cb = total capacitance of one bus line in pF.

4.t

5.t

= time for data signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).

VD;DAT

= time for Acknowledgement signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).

VD;ACK

(0.7VDD) levels.

IL(max)

) of the SCL signal.

LOW

Figure 5. I2C slave timing diagram

MMA8452Q

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8 Freescale Semiconductor, Inc.

2.4 Absolute Maximum Ratings

This device is sensitive to mechanical shock. Improper handling can cause permanent damage of the part or cause the part to otherwise fail.

This device is sensitive to ESD, improper handling can cause permanent damage to the part.

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. Exposure to

maximum rating conditions for extended periods may affect device reliability.

Table 5. Maximum Ratings

Rating Symbol Value Unit

Maximum Acceleration (all axes, 100 μs) g Supply Voltage VDD -0.3 to + 3.6 V Input voltage on any control pin (SA0, SCL, SDA) Vin -0.3 to VDDIO + 0.3 V Drop Test D Operating Temperature Range T Storage Temperature Range T

max

drop

STG

Table 6. ESD and Latchup Protection Characteristics

Rating Symbol Value Unit

Human Body Model HBM ±2000 V Machine Model MM ±200 V Charge Device Model CDM ±500 V Latchup Current at T = 85°C

— ±100 mA

5,000 g

1.8 m

-40 to +85 °C

-40 to +125 °C

3 Terminology

3.1 Sensitivity

The sensitivity is represented in counts/g. In 2g mode the sensitivity is 1024 counts/g. In 4g mode the sensitivity is

512 counts/g and in 8g mode the sensitivity is 256 counts/g.

3.2 Zero-g Offset

Zero-g Offset (TyOff) describes th e deviation of an actual output signal from the ideal output signal if the sensor is stationary. A sensor stationary on a horizontal surface will measure 0g in X-axis and 0g in Y-axis whereas the Z-axis will measure 1g. The output is ideally in the middle of the dynamic range of the sensor (content of OUT Registers 0x00, data expressed as 2's complement number). A deviation from ideal value in this case is called Zero-g offset. Offset is to some ex tent a result of stress on the MEMS sensor and therefore the offset can slightly change aft er mo un ting the sensor onto a printed circuit board or exposin g it to extensive mechanical stress.

3.3 Self-Test

Self-Test checks the transducer functionality without external mechanical stimulus. When Self-Test is activated, an electrostatic actuation force is applied to the sensor, simulating a small acceleration. In this case, the sensor outputs will exhibit a change in their DC levels which are related to the selected full scale through the device sensitivity . When Self-Test is activated, the device output level is given by the algebraic sum of th e signals produced by the acceleration acting on the se nsor and by the electrostatic test-force.

Sensors Freescale Semiconductor, Inc. 9

MMA8452Q

4 System Modes (SYSMOD)

OFF

WAKESTANDBY

OFF

ACTIVE

SYSMOD = 00

SYSMOD = 10

SYSMOD = 01

Auto SLEEP/WAKE

Condition

VDD > 1.8 V

VDD < 1.8 V

CTRL_REG1

Active bit = 1

CTRL_REG1

Active bit = 0

CTRL_REG1

Active bit = 0

Figure 6. MMA8451Q Mode Transition Diagram

Table 7. Mode of Operation Description

Mode

OFF

STANDBY

ACTIVE

(WAKE/SLEEP)

Powered Down

I2C communication is possible

C Bus State

VDDIO Can be > VDD

VDD Function Description

<1.8V

>1.8V

• The device is powered off.

• All analog and digital blocks are shutdown.

C bus inhibited.

•I

• Only digital blocks are enabled. Analog subsystem is disabled.

• Internal clocks disabled.

• Registers accessible for Read/Write.

• Device is configured in STANDBY mode.

• All blocks are enabled (digital, analog).

All register contents are preserved when transitioning from ACTIVE to STANDBY mode. Some registers are reset when transitioning from STANDBY to ACTIVE. These are all noted in the device memory map register table. The SLEEP and WAKE modes are ACTIVE modes. For more information on how to use the SLEEP and WAKE modes and how to transition between these modes, please refer to the functionality section of this document.

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5 Functionality

The MMA8452Q is a low-power , digital output 3-axis linear accelerometer wit h a I2C interface and embedded logic used to detect events and notify an external microprocessor over interrupt lines. The functionality includes the following:

• 8-bit or 12-bit data which includes High-Pass Filtered data

• 4 different oversampling options for compromising between resolution and current consumption based on application requirements

• Additional Low-Noise mode that functions independently of the Oversampling modes for higher resolution

• L ow Power and Auto-WAKE/SLEEP modes for conservation of current consumption

• Single-/Double-pulse with directional information 1 channel

• Motion detection with directional information or Freefall 1 channel

• Transient detection based on a high-pass filter and settable threshold for detecting the change in acceleration above a threshold with directional information 1 channel

• Portrait/Landscape detection with trip points fixed at 30° and 60° for smooth transitions between orientations.

All functionality is available in 2g, 4g or 8g dynamic ra nges. There are many configuration settings for enabling all the different

functions. Separate application notes have been provided to help configure the device for each embedd ed functionality.

Table 8. Features of the MMA845xQ devices

Feature List MMA8451 MMA8452 MMA8453

Digital Resolution (Bits) Digital Sensitivity (Counts/g) Data-Ready Interrupt Single-Pulse Interrupt Double-Pulse Interrupt Directional-Pulse Interrupt Auto-WAKE Auto-SLEEP Freefall Interrupt 32 Level FIFO High-Pass Filter Low-Pass Filter Orientation Detection Portrait/Landscape = 30°, Landscape to Portrait = 60°,

and Fixed 45° Threshold Programmable Orientation Detection Motion Interrupt with Direction Transient Detection with High-Pass Filter Low Power Mode

14 12 10

4096 1024 256

Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No Yes Yes Yes Yes Yes Yes

Yes Yes Yes

Yes No No Yes Yes Yes Yes Yes Yes Yes Yes Yes

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5.1 Device Calibration

The device interface is factory calibrated for sensitivity and Zero-g offset for each axi s . The trim values are stored in Non Volatile Memory (NVM). On power-up, the trim parameters are read from NVM and applied to the circuitry. In normal use, further calibration in the end application is not necessary. However, the MMA8452Q allows the user to adjust the Zero-g offset for each axis after power-up, changing the default offs et values. The user offset adjustments are stored in 6 volatile registers. For more information on device calibration, refer to Freescale application note, AN4069.

5.2 8-bit or 12-bit Data

The measured acceleration data is stored in the OUT_X_MSB, OUT_X_LSB, OUT_Y_MSB, OUT_Y_LSB, OUT_Z_MSB, and OUT_Z_LSB registers as 2’s complement 12-bit numbers. The most significant 8-bits of each axis are stored in OUT_X (Y, Z)_MSB, so applications needing only 8-bit results can use these 3 registers and ignore OUT_X,Y, Z_LSB. To do this, the F_READ bit in CTRL_REG1 must be set. When the F_READ bit is cleared, the fast read mode is disabled.

When the full-scale is set to 2g, the measurement range is -2g to +1.999g, and each count corresponds to 1g/1024 (1 mg) at 12-bits resolution. When the full-scale is set to 8g, the measu rement range is -8g to +7.996g, and each count corresponds to 1g/256 (3.9 mg) at 12-bits resolu tion. The resolutio n is reduced by a factor of 16 if only the 8-bit result s are used. For more information on the data manipulation between data formats and modes, refer to Freescale application note, AN4076. There is a device driver available that can be used with the Sensor Toolbox demo board (LFSTBEB8451, 2, 3Q).

5.3 Low-Power Modes vs. High-Resolution Modes

The MMA8452Q can be optimized for lower power modes or for higher resolution of the output data. High resolution is achieved by setting the LNOISE bit in Register 0x2A. This improves the resolution but be aware that the dynamic range is limited to 4g when this bit is set. This will affect all internal functions and reduce noise. Another method for improving the resolution of the data is by oversampling. One of the oversampling schemes of the data can activated when MODS = 10 in Register 0x2B which will improve the resolution of the output data only. The highest resolution is achieved at 1.56 Hz.

There is a trade-off between low power and high resolution. Low Power can be achieved when the oversampling rate is reduced. The lowest power is achieved when MODS = 11 or when the sample rate is set to 1.56 Hz. For more information on how to configure the MMA8452Q in Low-Power mode or High-Resolution mode and to realize the benefits application note, AN4075.

, refer to Freescale

5.4 Auto-WAKE/SLEEP Mode

The MMA8452Q can be configured to transition between sample rates (with their respective current consumption) based on four of the interrupt functions of the device. The advantage of using the Auto-WAKE/SLEEP is that the system can automatically transition to a higher sample rate (higher current consumption) when needed but spends the majority of the time in the SLEEP mode (lower current) when the device does not require higher sampling rates. Auto-WAKE refers to the device being triggered by one of the interrupt functions to transition to a higher sample rate. This may also interrupt the processor to transition from a SLEEP mode to a higher power mode.

SLEEP mode occurs after the accelerometer has not detected an interrupt for longer than the user definable time-out period. The device will transition to the specified lower sample rate. It may also alert the processor to go into a lower power mode to save on current during this period of inactivity.

The Interrupts that can WAKE the device from SLEEP are the following: P ul s e Detection, Orientation Detection, Motion/Freefall, and Transient Detection. Refer to AN4074, for more detailed information for configuring the Auto-WAKE/SLEEP.

5.5 Freefall and Motion Detection

MMA8452Q has flexible interrupt architecture for detecting either a Freefall or a Motion. Freefall can be enabled where the set threshold must be less than the configured threshold, or motion can be enabled where the set threshold must be greater than the threshold. The motion configuration has the option of enabling or disabling a high-pass filter to eliminate tilt data (static offset). The freefall does not use the high-pass filter. For details on the Freefall and Motion detection with specific application examples and recommended configuration settings, refer to Freescale application note, AN4070.

5.5.1 Freefall Detection

The detection of “Freefall” involves the monitoring of the X, Y, and Z axes for the condition where the acceleration magnitude is below a user specified threshold for a user definable amou nt of time. Norma lly, the usable th re sho ld ran ges are be tw een ±100 mg and ±500 mg.

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5.5.2 Motion Detection

Motion is often used to simply alert the main processor that the device is currently in use. When the acceleration exceeds a set threshold the motion interrupt is asserted. A motion can be a fast moving shake or a slow moving tilt. This will depend on the threshold and timing values configured for the ev en t. The motion detection function can analyze static acceleration changes or faster jolts. For example, to detect that an object is spinning, all three axes would be enabled with a threshold detection of > 2g. This condition would need to occur for a minimum of 100 ms to ensure that the event wasn't just noise. The timing value is set by a configurable debounce counter. The debounce counter acts like a filter to determine whether the condition exists for configurable set of time (i.e., 100 ms or longer). There is also directional data available in the source register to detect the direction of the motion. This is useful for applications such as directional shake or flick, which assists with the algorithm for various gesture detections.

5.6 Transient Detection

The MMA8452Q has a built-in high-pass filter. Acceleration data goes through the high-pass filter, eliminating the offset (DC) and low frequencies. The high-pass filter cutoff frequency can be set by the user to four different frequen ci es w hi c h a re dependent on the Output Dat a Rate (ODR). A higher cutoff frequency ensures the D C dat a or slower moving da ta will be filtered out, allowing only the higher frequencies to pass. The embedded Transient Detection function uses the high-pass filtered data allowing the user to set the threshold and debounce counter. The Transient detection feature can be used in the same manner as the motion detection by bypassing the high-pass filter. There is an option in the configuration register to do this. This adds more flexibility to cover various customer use cases.

Many applications use the accelerometer’s static acceleration readings (i.e., tilt) which measure the change in acceleration due to gravity only. These functions benefit from acceleration dat a being filt ered with a low -p ass filter w here high-freque ncy data is considered noise. However, there are many functions where the accelerometer must analyze dynamic acceleration. Functions such as tap, flick, shake and step counting are based on the analysis of the change in the acceleration. It is simpler to interpret these functions dependent on dynamic acceleration data when the static component has been removed. The Transient Detection function can be routed to either interrupt pin through bit 5 in CTRL_REG5 register (0x2E). Registers 0x1D – 0x20 are the dedicated Transient Detection configuration registers. The source register contains directional data to determine the direction of the acceleration, either positive or negative. For details on the benefits of the embedded Transient Detection function along with specific application examples and recommended configuration settings, please refer to Freescale application note, AN4071.

5.7 Pulse Detection

The MMA8452Q has embedded single/double and directional pulse detection. This function has various customizing timers for setting the pulse time width and the latency time between pulses. There are programmable thresholds for all three axes. The pulse detection can be configured to run through the high-pass filter and also through a low-pass filter, which provides more customizing and tunable pulse-detection schemes. The status register provides updates on the axes where the event was detected and the direction of the tap. For more information on how to configure the device for pulse detection, please refer to Freescale application note, AN4072.

5.8 Orientation Detection

The MMA8452Q has an orientation detection algorithm with the ability to detect all 6 orientations. The transition from portrait to landscape is fixed with a 45° threshold angle and a ±14° hysteresis angle. This allows the for a smooth transition from portrait to landscape at approximately 30° and then from landscape to portrait at approximately 60°.

The angle at which the dev ice no longer detect s the o rient ation change is r eferred to as the “Z-Lockout angle”. The device operates down to 29° from the flat position. All angles are accurate to ±2°.

For further information on the orientation detection function refer to Freescale application note, AN4068.

Figure 8 shows the definitions of the trip angles going from Landscape to Portrait (A) and then also from Portrait to

Landscape (B).

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Figure 7. Landscape/Portrait Orientation

Top View

Earth Gravity

Pin 1

Xout @ 0g

Yout @ -1g

Zout @ 0g

Xout @ 1g Yout @ 0g Zout @ 0g

Xout @ 0g Yout @ 1g Zout @ 0g

Xout @ -1g

Yout @ 0g Zout @ 0g

Side View

FRONT

Xout @ 0g Yout @ 0g

Zout @ 1g

BACK

Xout @ 0g Yout @ 0g

Zout @ -1g

Portrait

Landscape to Portrait

90°

Trip Angle = 60°

0° Landscape

Portrait

Portrait to Landscape

90°

Trip Angle = 30°

0° Landscape

(A) (B)

Upright

NORMAL

90°

Z-LOCK = 29°

0° Flat

DETECTION REGION

LOCKOUT REGION

Figure 8. Illustration of Landscape to Portrait Transition (A) and Portrait to Landscape Transition (B)

Figure 9 illustrates the Z-angle lockout region. When lifting the device upright from the flat position it will be active for

orientation detection as low as 29° from flat. .

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Figure 9. Illustration of Z-Tilt Angle Lockout Transition

Sensors

5.9 Interrupt Register Configurations

INTERRUPT

CONTROLLER

Data Ready

Motion/Freefall

Pulse

Orientation

Transient

Auto-SLEEP

INT ENABLE INT CFG

INT1

INT2

There are six configurable interrupts in the MMA8452Q: Data Ready, Motion/Freefall, Pulse, Orientation, Transient, and AutoSLEEP events. These six interrupt sources can be routed to one of two interrupt pins. The interrupt source must be enabled and configured. If the event flag is asserted because the event condition is detected, the corresponding interrupt pin, INT1 or INT2, will assert.

Figure 10. System Interrupt Generation Block Diagram

5.10 Serial I2C Interface

Acceleration data may be accessed through an I2C interface thus making the device particularly suit abl e for direct interfaci ng with a microcontroller. The MMA8452Q features an interrupt signal which indicates when a new set of measured acceleration data is available thus simplifying data synchronization in the digital system that uses the device. The MMA8452Q may also be configured to generate other interrupt signals accordingly to the programmable embedded functions of the device for Motion, Freefall, Transient, Orient a tion, and Pulse.

The registers embedded inside the MMA8452Q are accessed through the I interface, VDDIO line must be tied high (i.e., to the interface supply voltage). If VDD is not present and VDDIO is present, the MMA8452Q is in off mode and communications on the I2C interface are ignored. The I2C interface may be used for communications between other I

C devices and the MMA8452Q does not affect the I2C bus.

Table 9. Serial Interface Pin Description

Pin Name Pin Description

SCL I SDA I SA0 I

There are two signals associated with the I

C Serial Clock

C Serial Data

C least significant bit of the device address

C bus; the Serial Clock Line (SCL) and the Serial Data line (SDA). The latter is a bidirectional line used for sending and receiving the data to/from the interface. External pullup resistor s connected to VDDIO are expected for SDA and SCL. When the bus is free both the lines are high. The I and Normal mode (100 kHz) I

C standards (Table 5).

C serial interface (Table 9). To en able the I2C

C interface is compliant with fast mode (400 kHz),

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5.10.1 I2C Operation

The transaction on the bus is started through a start condition (START) signal. ST AR T condition is defined as a HIGH to LOW transition on the data line while the SCL line is held HIGH. After ST AR T has been transmitted by the Master , the bus is considered busy. The next byte of data transmitted after START contains the slave address in the first 7 bits, and the eighth bit tells whether the Master is receiving data from the slave or transmitting data to the slave. When an address is sent, each device in the system compares the first seven bits after a start condition with its address. If they match, the device considers itself addressed by the Master. The 9th clock pul se, following the slave address byte (and each subsequent byte) is the acknowledge (ACK). Th e transmitter must release the SDA line during the ACK period . The receiver must then pull the data line low so that it remains stable low during the high period of the acknowledge clock period.

A LOW to HIGH transition on the SDA line while the SCL line is high is defined as a stop condition (STOP). A data transfer is always terminated by a STOP. A Master may also issue a repeated START during a data transfer. The MMA8452Q expects repeated STARTs to be used to randomly read from specific registers.

The MMA8452Q's standard slave address is a choice between the two sequential addresses 0011100 and 0011101. The selection is made by the high- and low-lo gic level of the SA0 (pin 7) input respectively. The slave addresses are factory programmed and alternate addresses are available at customer request. The format is shown in Table 10.

Single Byte Read

The MMA8452Q has an internal ADC that can sample, convert and return sensor data on request. The transmission of an 8-bit command begins on the falling edge of SCL. After the eight clock cycles are used to send the command, note that the data returned is sent with the MSB first once the data is received. Figure 1 1 shows the timing diagram for the accelerometer 8- bit I2C read operation. The Master (or MCU) transmits a start condition (ST) to the MMA8452Q, slave address ($1D), with the R/W bit set to “0” for a write, and the MMA8452Q sends an acknowledgement. Then the Master (or MCU) transmits the address of the register to read and the MMA8452Q sends an acknowledgement. The Master (or MCU) transmits a repeated start condition (SR) and then addresses the MMA8452Q ($1D ) with th e R/W bi t set t o “1” for a read from the previously selected register . The Slave then acknowledges and transmits the data from the requested register . The Master does not acknowledge (NAK) the transmitted data, but transmits a stop condition to end the data transfer.

Multiple Byte Read

When performing a multi-byte read or “b urst read”, the MMA8452Q automatically increments the received register address commands after a read command is received. Therefore, after following the steps of a single byte read, multiple bytes of data can be read from sequential registers after each MMA8452Q acknowledgment (AK) is received until a no acknowledge (NAK) occurs from the Master followed by a stop condition (SP) signaling an end of transmission.

Single Byte Write

To st art a write co mmand, the Master t ransmits a st art cond ition (ST) to the MMA8452Q, slave address ($1D) with the R/W bit set to “0” for a write, the MMA8452Q sends an acknowledgement. Then the Master (MCU) transmits the address of the register to write to, and the MMA8452Q sends an acknowledgement. Then the Master (or MCU) transmits the 8-bit data to write to the designated register and the MMA8452Q sends an ackn o w led g ement that it has received the data. Since this transmi ssi o n is complete, the Master transmits a stop condition (SP) to the data transfer. The data sent to the MMA8452Q is now stored in the appropriate register.

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Multiple Byte Wri t e

The MMA8452Q automatically increments the received register address commands after a write command is received. Therefore, after following the steps of a single byte write, multiple bytes of data can be written to sequential registers after each MMA8452Q acknowledgment (ACK) is received.

Table 10. I

< Single Byte Read >

Master

C Device Address Sequence

Command

[7:2]

Device Address

[1]

SA0

[7:1]

Device Address

R/W

8-bit Final Value

Read 001110 0 0x1C 1 0x39 Write 001110 0 0x1C 0 0x38 Read 001110 1 0x1D 1 0x3B Write 001110 1 0x1D 0 0x3A

ST Device Address[6:0] W Register Address[7:0] SR Device Address[6:0] R NAK SP

[7:0]

Slave

< Multiple Byte Read >

Master

Slave

Master

Slave

ST Device Address[6:0] W Register Address[7:0] SR Device Address[6:0] R AK

Data[7:0] Data[7:0] Data[7:0]

< Single Byte Write >

Master

Slave

ST Device Addr ess[6:0] W Register Address[7:0] Data[7:0] SP

< Multiple Byte Write >

Master

ST Device Address[6:0] W Register Address[7:0] Data[7:0] Data[7:0] SP

AK AK AK Data[7:0]

AK AK NAK SP

AK AK AK

Slave

Legend

ST: Start Condition SP: Stop Condition NAK: No Acknowledge W: Write = 0 SR: Repeated Start Condition AK: Acknowledge R: Read = 1

AK AK AK AK

Figure 11. I2C Timing Diagram

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6 Register Descriptions

Table 11. Register Address Map

Name Type

(1)(2)

STATUS

OUT_X_MSB

OUT_X_LSB

OUT_Y_MSB

OUT_Y_LSB OUT_Z_MSB OUT_Z_LSB

(1)(2)

R 0x00 0x01 00000000 0x00 Real time status R 0x01 0x02 0x03 Output — [7:0] are 8 MSBs of 12-b it sample. R 0x02 0x03 0x00 Output — [7:4] are 4 LSBs of 12-bit sample. R 0x03 0x04 0x05 Output — [7:0] are 8 MSBs of 12-b it sample. R 0x04 0x05 0x00 Output — [7:4] are 4 LSBs of 12-bit sample. R 0x05 0x06 0x00 Output — [7:0] are 8 MSBs of 12-b it sample. R 0x06 0x00 Output — [7:4] are 4 LSBs of 12-bit sample.

Auto-Increment Address

F_READ=0 F_READ=1

Default

Reserved R 0x07 — — — Reserved. Read return 0x00. Reserved R 0x08 — — — Reserved. Read return 0x00.

SYSMOD R 0x0B 0x0C 00000000 0x00 Current System Mode

INT_SOURCE

(1)(2)

R 0x0C 0x0D 00000000 0x00 Interrupt status

WHO_AM_I R 0x0D 0x0E 00101010 0x2A Device ID (0x2A)

(3)(4)

XYZ_DATA_CFG

HP_FILTER_CUTOFF

PL_STATUS

PL_CFG

PL_COUNT

PL_BF_ZCOMP

P_L_THS_REG

FF_MT_CFG

FF_MT_SRC

FF_MT_THS

FF_MT_COUNT

(1)(2)

(3)(4)

(1)(2)

(3)(4)

Reserved R

R/W 0x0E 0x0F 00000000 0x00

(3)(4)

R/W 0x0F 0x10 00000000 0x00

R 0x10 0x11 00000000 0x00

R/W 0x11 0x12 10000000 0x80 Landscape/Portrait configuration.

R 0x12 0x13 00000000 0x00

R 0x13 0x14 01000100 0x44 Back-Front, Z-Lock Trip threshold

R 0x14 0x15 10000100 0x84

R/W 0x15 0x16 00000000 0x00

R 0x16 0x17 00000000 0x00

R/W 0x17 0x18 00000000 0x00 Freefall/Motion threshold register R/W 0x18 0x19 00000000 0x00 Freefall/Motion debounce counter

0x19 -

0x1C

— — — Reserved. Read return 0x00.

TRANSIENT_CFG R/W 0x1D 0x1E 00000000 0x00

TRANSIENT_SRC TRANSIENT_THS

TRANSIENT_COUNT

PULSE_CFG

PULSE_SRC PULSE_THSX PULSE_THSY PULSE_THSZ PULSE_TMLT PULSE_LTCY

(3)(4)

(1)(2)

(3)(4)

(1)(2)

(3)(4)

R 0x1E 0x1F 00000000 0x00 Transient event status register

R/W 0x1F 0x20 00000000 0x00 Transient event threshold

(3)(4)

R/W 0x20 0x21 00000000 0x00 Transient debounce counter R/W 0x21 0x22 00000000 0x00 ELE, Double_XYZ or Single_XYZ

R 0x22 0x23 00000000 0x00 EA, Double_XYZ or Single_XYZ R/W 0x23 0x24 00000000 0x00 X pulse threshold R/W 0x24 0x25 00000000 0x00 Y pulse threshold R/W 0x25 0x26 00000000 0x00 Z pulse threshold R/W 0x26 0x27 00000000 0x00 Time limit for pulse R/W 0x27 0x28 00000000 0x00 Latency time for 2nd pulse

Hex

Value

HPF Data Out and Dynamic

Cutoff frequency is set to 16 Hz @

Landscape/Portrait orientation

Landscape/Portrait debounce

Portrait to Landscape Trip Angle is

Freefall/Motion functional block

Freefall/Motion event source

Transient functional block

Comment

Range Settings

800 Hz

status

counter

29°

configuration

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Table 11. Register Address Map

(3)(4)

R/W 0x28 0x29 00000000 0x00 Window time for 2nd pulse R/W 0x29 0x2A 00000000 0x00 Counter setting for Auto-SLEEP R/W 0x2A 0x2B 00000000 0x00 Data Rate, ACTIVE Mode

R/W 0x2B 0x2C 00000000 0x00

R/W 0x2C 0x2D 00000000 0x00 Wake from Sleep, IPOL, PP_OD R/W 0x2D 0x2E 00000000 0x00 Interrupt enable register R/W 0x2E 0x2F 00000000 0x00 Interrupt pin (INT1/INT2) map R/W 0x2F 0x30 00000000 0x00 X-axis offset adjust R/W 0x30 0x31 00000000 0x00 Y-axis offset adjust R/W 0x31 0x0D 00000000 0x00 Z-axis offset adjust

C burst read mode. Therefore the internal storage of the auto-increment address is cleared whenever a

Sleep Enable, OS Modes,

RST, ST

PULSE_WIND

ASLP_COUNT

CTRL_REG1

CTRL_REG2

CTRL_REG3 CTRL_REG4 CTRL_REG5

OFF_X OFF_Y OFF_Z

Reserved (do not modify) 0x40 – 7F — — — Reserved. Read return 0x00.

1. Register contents are reset when transition from STANDBY to ACTIVE mode occurs.

2. This register data is only valid in ACTIVE mode.

3. Register contents are preserved when transition from ACTIVE to STANDBY mode occurs.

4. Modification of this register’s contents can only occur when device is STANDBY mode except CTRL_REG1 ACTIVE bit and CTRL_REG2 RST bit.

Note:Auto-increment addresses which are not a simple increment are highlighted in bold. The auto-increment addressing is only enabled when

device registers are read using I STOP condition is detected.

6.1 Data Registers

The following are the data registers for the MMA8452Q. For more information on data manipulation of the MMA8452Q, refer

to application note, AN4076.

0x00: STATUS Data Status Register (Read Only)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

ZYXOW ZOW YOW XOW ZYXDR ZDR YDR XDR

Table 12. STATUS Description

X, Y, Z-axis Data Overwrite. Default value: 0

ZYXOW

ZOW

YOW

XOW

ZYXDR

ZDR

YDR

XDR

0: No data overwrite has occurred 1: Previous X, Y, or Z data was overwritten by new X, Y, or Z data before it was read Z-axis Data Overwrite. Default value: 0 0: No data overwrite has occurred 1: Previous Z-axis data was overwritten by new Z-axis data before it was read Y-axis Data Overwrite. Default value: 0 0: No data overwrite has occurred 1: Previous Y-axis data was overwritten by new Y-axis data before it was read X-axis Data Overwrite. Default value: 0 0: No data overwrite has occurred 1: Previous X-axis data was overwritten by new X-axis data before it was read X, Y, Z-axis new Data Ready. Default value: 0 0: No new set of data ready 1: A new set of data is ready Z-axis new Data Available. Default value: 0 0: No new Z-axis data is ready 1: A new Z-axis data is ready Y-axis new Data Available. Default value: 0 0: No new Y-axis data ready 1: A new Y-axis data is ready X-axis new Data Available. Default value: 0 0: No new X-axis data ready 1: A new X-axis data is ready

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ZYXOW is set whenever a new acceleration data is produced before completing the retrieval of the previous set. This event occurs when the content of at least one accele ration data register (i.e., OU T_X, OUT _Y, OUT_Z) has bee n overwr itte n. ZYX OW is cleared when the high-bytes of the acceleration data (OUT_X_MSB, OUT_Y_MSB, OUT_Z_MSB) of all the active channels are read.

ZOW is set whenever a new acceleration sample related to the Z-axis is generated before the retrieval of the previous sample. When this occurs the previous sample is overwritten. ZOW is cleared anytime OUT_Z_MSB register is read.

YOW is set whenever a new acceleration sample related to the Y-axis is generated before the retrieval of the previous sample. When this occurs the previous sample is overwritten. YOW is cleared anytime OUT_Y_MSB register is read.

XOW is set whenever a new acceleration sample related to the X-axis is generated before the retrieval of the previous sample. When this occurs the previous sample is overwritten. XOW is cleared anytime OUT_X_MSB register is read.

ZYXDR signals that a new sample for any of the enabled channels is available. ZYXDR is cleared when the high-bytes of the acceleration data (OUT_X_MSB, OUT_Y_MSB, OUT_Z_MSB) of all the enabled channels are read.

ZDR is set whenever a new acceleration sample related to the Z-axis is generated. ZDR is cleared anytime OUT_Z_MSB register is read.

YDR is set whenever a new acceleration sample related to the Y -axis is generated. YDR is cleared anytime OUT_Y_MSB register is read.

XDR is set whenever a new acceleration sample related to the X-axis is generated. XDR is cleared anytime OUT_X_MSB register is read.

Data Registers: 0x01: OUT_X_MSB, 0x02: OUT_X_LSB, 0x03: OUT_Y_MSB, 0x04: OUT_Y_LSB, 0x05: OUT_Z_MSB, 0x06: OUT_Z_LSB

These registers contain the X-axis, Y-axis, and Z-axis 12-bit output sample data expressed as 2's complement numbers. The

sample data output registers store the current sample data.

0x01: OUT_X_MSB: X_MSB Register (Read Only)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

XD11 XD10 XD9 XD8 XD7 XD6 XD5 XD4

0x02: OUT_X_LSB: X_LSB Registe r (Read Only)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

XD3XD2XD1XD00000

0x03: OUT_Y_MSB: Y_MSB Register (Read Only)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

YD11 YD10 YD9 YD8 YD7 YD6 YD5 YD4

0x04: OUT_Y_LSB: Y_LSB Register (Read Only)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

YD3YD2XD1XD00000

0x05: OUT_Z_MSB: Z_MSB Register (Read Only)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

ZD11 ZD10 ZD9 ZD8 ZD7 ZD6 ZD5 ZD4

0x06: OUT_Z_LSB: Z_LSB Re gister (Read Only)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

ZD3ZD2ZD1ZD0 0 0 0 0

OUT_X_MSB, OUT_X_LSB, OUT_Y_MSB, OUT_Y_LSB, OUT_Z_MSB, and OUT_Z_LSB are stored in the autoincrementing address range of 0x01 to 0x06 to reduce reading the status followed by 12-bit axis data to 7 bytes. If the F_READ bit is set (0x2A bit 1), auto-increment will skip over LSB registers. This will shorten the data acquisition from 7 bytes to 4 bytes. The LSB registers can only be read immediately following the read access of the corresponding MSB register. A random read access to the LSB registers is not possible. Reading the MSB register and then the LSB register in sequence ensures that both bytes (LSB and MSB) belong to the same data sample, even if a new data sample arrives between reading the MSB and the LSB byte.

0x0B: SYSMOD System Mode Register

The system mode register indicates the current device operating mode. Applications using the Auto-SLEEP/WAKE mechanism should use this register to synchronize the application with the device operating mode transitions.

0x0B: SYSMOD: System Mode Register (Read Only)

Bit

0 0 0 0 0 0 SYSMOD1 SYSMOD0

Bit

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Table 13. SYSMOD Description

System Mode. Default value: 00.

SYSMOD[1:0]

00: STANDBY mode 01: WAKE mode 10: SLEEP mode

0x0C: INT_SOURCE System Interrupt Status Register

In the interrupt source register the status of the various embedded features can be determined. The bits that are set (logic ‘1’) indicate which function has asserted an interrupt and conversely the bits that are cleared (logic ‘0’) indicate which function has not asserted or has deasserted an interrupt. The bits are set by a low to high tr ansition and are cleared by reading the appropriate interrupt source register . The SRC_DRDY bit is cleared by reading the X, Y and Z data. It is not cleared by simply reading the Status Register (0x00).

0x0C: INT_SOURCE: System Interrupt Status Register (Read Only)

Bit

SRC_ASLP 0 SRC_TRANS SRC_LNDPRT SRC_PULSE SRC_FF_MT 0 SRC_DRDY

Bit

Table 14.

INT_SOURCE Description

Auto-SLEEP/WAKE interrupt status bit. Default value: 0. Logic ‘1’ indicates that an interrupt event that can cause a WAKE to SLEEP or SLEEP to WAKE system mode transition has occurred. Logic ‘0’ indicates that no WAKE to SLEEP or SLEEP to WAKE system mode transition interrupt event has occurred.

SRC_ASLP

SRC_TRANS

SRC_LNDPRT

SRC_PULSE

SRC_FF_MT

SRC_DRDY

WAKE to SLEEP transition occurs when no interrupt occurs for a time period that exceeds the user specified limit (ASLP_COUNT). This causes the system to transition to a user specified low ODR setting. SLEEP to WAKE transition occurs when the user specified interrupt event has woken the system; thus causing the system to transition to a user specified high ODR setting. Reading the SYSMOD register clears the SRC_ASLP bit. Transient interrupt status bit. Default value: 0. Logic ‘1’ indicates that an acceleration transient value greater than user specified indicates that no transient event has occurred. This bit is asserted whenever “EA” bit in the TRANS_SRC is asserted and cleared by reading the TRANS_SRC register. Landscape/Portrait Orientation interrupt status bit. Default value: 0. Logic ‘1’ indicates that an interrupt was generated due to a change in the device orientation status. Logic ‘0’ indicates that no change in orientation status was detected. This bit is asserted whenever “NEWLP” bit in the PL_STATUS is asserted and the This bit is cleared by reading the PL_STATUS register. Pulse interrupt status bit. Default value: 0. Logic ‘1’ indicates that an interrupt was generated due to single and/or double pulse event. Logic ‘0’ indicates that no pulse event was detected. This bit is asserted whenever “EA” bit in the PULSE_SRC is asserted and the interrupt has been enabled. This bit is cleared by reading the PULSE_SRC register. Freefall/Motion interrupt status bit. Default value: 0. Logic ‘1’ indicates that the Freefall/Motion function interrupt is active. Logic ‘0’ indicates that no Freefall or Motion event was detected. This bit is asserted whenever “EA” bit in the FF_MT_SRC register is asserted and the FF_MT interrupt has been enabled. This bit is cleared by reading the FF_MT_SRC register. Data Ready Interrupt bit status. Default value: 0. Logic ‘1’ indicates that the X, Y, Z data ready interrupt is active indicating the presence of new data and/or data overrun. Otherwise if it is a logic ‘0’ the X, Y, Z interrupt is not active. This bit is asserted when the ZYXOW and/or ZYXDR is set and the interrupt has been enabled. This bit is cleared by reading the X, Y, and Z data.

threshold has

the interrupt

interrupt has

occurred. Logic ‘0’

has been enabled. This bit is

been enabled.

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0x0D: WHO_AM_I Device ID Register

The device identification register identifies the part. The default value is 0x2A. This value is factory programmed. Consult the factory for custom alternate values.

0x0D: WHO_AM_I Device ID Register (Read Only)

Bit

00101 0 1 0

Bit

0x0E: XYZ_DATA_CFG Register

The XYZ_DATA_CFG register sets the dynamic range and sets the high-pass filter for the output data. When the HPF_OUT bit is set. The data registers 0x01 - 0x06 will contain high-pass filtered data when this bit is set.

0x0E: XYZ_DATA_CFG (Read/Write)

Bit

000HPF_OUT0 0 FS1FS0

Bit

Table 15. XYZ Data Configuration Descriptions

HPF_OUT

FS[1:0]

Enable High-Pass output data 1 = output data high-pass filtered. Default value: 0 Output buffer data format full scale. Default value: 00 (2g).

The default full scale value range is 2g and the high-pass filter is disabled.

Table 16. Full Scale Range

FS1 FS0 Full Scale Range

00 2 01 4 10 8 11 Reserved

0x0F: HP_FILTER_CUTOFF High-Pass Filter Register

This register sets th e high -pass filter cutoff frequency for removal of the offset and slower changing acceleration data. The output of this filter is indicated by the data registers (0x01-0x06) when bit 4 (H PF_OUT) of Reg ister 0x0E is set. The filter cutoff options change based on the data rate selected as shown in Table 18. For details of implementation on the high-pass filter, refer to Freescale application note, AN4071.

0x0F: HP_FILTER_CUTOFF: High-Pass Filter Register (Read/Write)

Bit

0 0 Pulse_HPF_BYP Pulse_LPF_EN 0 0 SEL1 SEL0

Bit

Table 17. High-Pass Filter Cutoff Register Descriptions

Bypass High-Pass Filter for Pulse Processing Function.

Pulse_HPF_BYP

Pulse_LPF_EN

SEL[1:0]

0: HPF enabled for Pulse Processing, 1: HPF Bypassed for Pulse Processing Default value: 0. Enable Low-Pass Filter for Pulse Processing Function. 0: LPF disabled for Pulse Processing, 1: LPF Enabled for Pulse Processing Default value: 0. HPF Cutoff frequency selection. Default value: 00 (see

Table 18).

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Table 18. High-Pass Filter Cutoff Options

Oversampling Mode = Normal

SEL1 SEL0 800 Hz 400 Hz 200 Hz 100 Hz 50 Hz 12.5 Hz 6.25 Hz 1.56 Hz

0 0 16 Hz 16 Hz 8 Hz 4 Hz 2 Hz 2 Hz 2 Hz 2 Hz 0 1 8 Hz 8 Hz 4 Hz 2 Hz 1 Hz 1 Hz 1 Hz 1 Hz 1 0 4 Hz 4 Hz 2 Hz 1 Hz 0.5 Hz 0.5 Hz 0.5 Hz 0.5 Hz 1 1 2 Hz 2 Hz 1 Hz 0.5 Hz 0.25 Hz 0.25 Hz 0.25 Hz 0.25 Hz

Oversampling Mode = Low Noise Low Power

0 0 16 Hz 16 Hz 8 Hz 4 Hz 2 Hz 0.5 Hz 0.5 Hz 0.5 Hz 0 1 8 Hz 8 Hz 4 Hz 2 Hz 1 Hz 0.25 Hz 0.25 Hz 0.25 Hz 1 0 4 Hz 4 Hz 2 Hz 1 Hz 0.5 Hz 0.125 Hz 0.125 Hz 0.125 Hz 1 1 2 Hz 2 Hz 1 Hz 0.5 Hz 0.25 Hz 0.063 Hz 0.063 Hz 0.063 Hz

Oversampling Mode = High Resolution

0 0 16 Hz 16 Hz 16 Hz 16 Hz 16 Hz 16 Hz 16 Hz 16 Hz 0 1 8Hz 8Hz 8Hz 8Hz 8Hz 8Hz 8Hz 8Hz 1 0 4Hz 4Hz 4Hz 4Hz 4Hz 4Hz 4Hz 4Hz 1 1 2 Hz 2 Hz 2 Hz 2 Hz 2 Hz 2 Hz 2 Hz 2 Hz

Oversampling Mode = Low Power

0 0 16 Hz 8 Hz 4 Hz 2 Hz 1 Hz 0.25 Hz 0.25 Hz 0.25 Hz 0 1 8 Hz 4 Hz 2 Hz 1 Hz 0.5 Hz 0.125 Hz 0.125 Hz 0.125 Hz 1 0 4 Hz 2 Hz 1 Hz 0.5 Hz 0.25 Hz 0.063 Hz 0.063 Hz 0.063 Hz 1 1 2 Hz 1 Hz 0.5 Hz 0.25 Hz 0.125 Hz 0.031 Hz 0.031 Hz 0.031 Hz

6.2 Portrait/ Landscape Embedded Function Registers

For more details on the meaning of the different user configurable settings and for example code refer to Freescale application note, AN4068.

0x10: PL_STATUS Portrait/Landscape Status Register

This status register can be read to get updated information on any change in orientation by reading Bit 7, or on the specifics of the orientation by rea d ing th e ot her bits. For further understanding of Portrait Up, Portrait Down, Landscape Left, La n dsca pe Right, Back and Front orientations please refer to Figure 3. The interrupt is cleared when reading the PL_STATUS register.

0x10: PL_STATUS Register (Read Only)

Bit

NEWLP LO 0 0 0 LAPO[1] LAPO[0] BAFRO

Table 19. PL_STATUS Register Description

NEWLP

LAPO[1:0]

1. The default power up state is BAFRO = 0, LAPO = 0, and LO = 0.

(1)

BAFRO

Bit

Landscape/Portrait status change flag. Default value: 0. 0: No change, 1: BAFRO and/or LAPO and/or Z-Tilt lockout value has changed Z-Tilt Angle Lockout. Default value: 0. 0: Lockout condition has not been detected. 1: Z-Tilt lockout trip angle has been exceeded. Lockout has been detected. Landscape/Portrait orientation. Default value: 00 00: Portrait Up: Equipment standing vertically in the normal orientation 01: Portrait Down: Equipment standing vertically in the inverted orientation 10: Landscape Right: Equipment is in landscape mode to the right 11: Landscape Left: Equipment is in landscape mode to the left. Back or Front orientation. Default value: 0 0: Front: Equipment is in the front facing orientation. 1: Back: Equipment is in the back facing orientation.

Bit

NEWLP is set to 1 after the first orientation detection after a STANDBY to A CTIVE transition, and whenever a change in LO, BAFRO, or LAPO occurs. NEWLP bit is cleared anytime PL_STA TUS register is read.

The Orientation mechanism state change is limited to a maximum 1.25g. LAPO BAFRO and LO continue to change when NEWLP is set. The current position is locked if the absolute value of the acceleration experienced on any of the three axes is greater than 1.25g.

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0x11: Portrait/Landscape Configuration Register

This register enables the Portrait/Landscape function and sets the behavior of the debounce counter.

0x11: PL_CFG Register (Read/Write)

Bit

DBCNTM PL_EN 0 0 0 0 0 0

Bit

Table 20. PL_CFG Description

Debounce counter mode selection. Default value: 1

DBCNTM

PL_EN

0: Decrements debounce whenever condition of interest is no longer valid. 1: Clears counter whenever condition of interest is no longer valid. Portrait/Landscape Detection Enable. Default value: 0 0: Portrait/Landscape Detection is Disabled. 1: Portrait/Landscape Detection is Enabled.

0x12: Portrait/Landscape Debounce Counter

This register sets the debounce count for the orientation state transition. The minimum debounce latency is determined by the data rate set by the product of the selected system ODR and PL_COUNT registers. Any transition from WAKE to SLEEP or vice versa resets the internal Landscape/Portrait debounce counter. Note: The debounce counter weighting (time step) changes based on the ODR and the Oversampling mode. Table 22 explains the time step value for all sample rates and all Oversampling modes.

0x12: PL_COUNT Register (Read/Write)

Bit

DBNCE[7] DBNCE[6] DBNCE[5] DBNCE[4] DBNCE[3] DBNCE[2] DBNCE[1] DBNCE[0]

Bit

Table 21.

DBCNE[7:0]

PL_COUNT Description

Debounce Count value. Default value: 0000_0000.

Table 22. PL_COUNT Relationship with the ODR

ODR (Hz)

800 0.319 0.319 0.319 0.319 1.25 1.25 1.25 1.25 400 0.638 0.638 0.638 0.638 2.5 2.5 2.5 2.5 200 1.28 1.28 0.638 1.28 5 5 2.5 5 100 2.55 2.55 0.638 2.55 10 10 2.5 10

50 5.1 5.1 0.638 5.1 20 20 2.5 20

12.5 5.1 20.4 0.638 20.4 20 80 2.5 80

6.25 5.1 20.4 0.638 40.8 20 80 2.5 160

1.56 5.1 20.4 0.638 40.8 20 80 2.5 160

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

0x13: PL_BF_ZCOMP Back/Front and Z Compensation Register

The Z-Lo ck angle compensation is set to 29°. The Back to Front trip angle is set to ±75°.

0x13: PL_BF_ZCOMP Register (Read Only)

Bit

BKFR[1] BKFR[0] 0 0 0 ZLOCK[2] ZLOCK[1] ZLOCK[0]

Bit

Bit 4 Bit

Bit

Table 23. PL_BF_ZCOMP Description

BKFR[1:0]

ZLOCK[2:0]

Back Front Trip Angle Fixed Threshold = 01 which is Z-Lock Angle Fixed Threshold = 100 which is 29°.

≥ ±75°.

Bit

Note: All angles are accurate to ±2°.

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0x14: P_L_THS_REG Portrait/Landscape Threshold and Hysteresis Register

This register represents the Portrait to Landscape trip threshold.

0x14: P_L_THS_REG Register (Read Only)

Bit

P_L_THS[4] P_L_THS[3] P_L_THS[2] P_L_THS[1] P_L_THS[0] HYS[2] HYS[1] HYS[0]

Bit

Table 24. P_L_THS_REG Description

P_L_THS[7:3]

HYS[2:0]

Portrait/Landscape Fixed Threshold angle = 1_0000 (45°). This is a fixed angle added to the threshold angle for a smoother transition from Portrait to Landscape and Landscape to Portrait. This angle is fixed at ±14°, which is 100.

Table 25. Trip Angles with Hysteresis for 45° Angle

Hysteresis

4 ±14 59° 31°

Hysteresis

± Angle Range

Landscape to Portrait

Trip Angle

Portrait to Landscape

Trip Angle

6.3 Motion and Freefall Embedded Function Registers

The freefall/motion function can be configured in either freefall or motion detection mode via the OAE configuration bit (0x15 bit 6). The freefall/motion detection block can be disabled by setting all three bits ZEFE, YEFE, and XEFE to zero.

Depending on the register bits ELE (0x15 bit 7) and OAE (0x15 bit 6), each of the freefall and motion detection block can operate in four different modes:

Mode 1: Freefall Detection with ELE = 0, OAE = 0

In this mode, the EA bit (0x16 bit 7) indicates a freefall event after the debounce counter is complete. The ZEFE, YEFE, and XEFE control bits determine which axes are considered for the freefall detection. Once the EA bit is set, and DBCNTM = 0, the EA bit can get cleared only after the delay specified by FF_MT_COUNT. This is because the counter is in decrement mode. If DBCNTM = 1, the EA bit is cleared as soon as the freefall condition disappears, and will not be set again before the delay specified by FF_MT_COUNT has passed. Reading the FF_MT_SRC register does not clear the EA bit. The event flags (0x16) ZHE, ZHP, YHE, YHP, XHE, and XHP reflect the motion detection status (i.e. high-g event) without any debouncing, provided that the corresponding bits ZEFE, YEFE, and/or XEFE are set.

Mode 2: Freefall Detection with ELE = 1, OAE = 0

In this mode, the EA event bit indicates a freefall event after the debounce counter. Once the debounce counter reaches the time value for the set threshold, the EA bit is set, and remains set until the FF_MT_SRC register is read. When the FF_MT_SRC register is read, the EA bit and the debounce counter are cleared and a new event can only be generated after the delay specified by FF_MT_CNT. The ZEFE, YEFE, and XEFE control bits determine which axes are considered for the freefall detection. While EA = 0, the event flags ZHE, ZHP, YHE, YHP, XHE, and XHP reflect the motion detection status (i.e., high-g event) without any debouncing, provided that the corresponding bits ZEFE, YEFE, and/or XEFE are set. The event flags ZHE, ZHP , YHE, YHP, XHE, and XHP are latched when the EA event bit is set. The event flags ZHE, ZHP, YHE, YHP, XHE, and XHP will start changing only after the FF_MT_SRC register has been read.

Mode 3: Motion Detection with ELE = 0, OAE = 1

In this mode, the EA bit indicates a motion event after the debounce counter time is reached. The ZEFE, YEFE, and XEFE control bits determine which axes are taken into consideration for motion detection. Once the EA bit is set, and DBCNTM = 0, the EA bit can get cleared only after the delay specified by FF_MT_COUNT . If DBCNTM = 1, the EA bit is cleared as soon as the motion high-g condition disappears. The event flags ZHE, ZHP, YHE, YHP, XHE, and XHP reflect the motion detection status (i.e., high-g event) without any debouncing, provided that the corresponding bits ZEFE, YEFE, and/or XEFE are set. Reading the FF_MT_SRC does not clear any flags, nor is the debounce counter reset.

Mode 4: Motion Detection with ELE = 1, OAE = 1

In this mode, the EA bit indicates a motion event after debouncing. The ZEFE, YEFE, and XEFE control bits determine which axes are taken into consideration for motion detection. Once the debounce counter reaches the threshold, the EA bit is set, and remains set until the FF_MT_SRC register is read. When the FF_MT_SRC register is read, all register bits are cleared and the debounce counter are cleared and a new event can only be generated after the delay specified by FF_MT_CNT. While the bit EA is zero, the event flags ZHE, ZHP, YHE, YHP, XHE, and XHP reflect the motion detection status (i.e., high-g event) without any debouncing, provided that the corresponding bits ZEFE, YEFE, and/or XEFE are set. When the EA bit is set, these bits keep their current value until the FF_MT_SRC register is read.

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0x15: FF_MT_CFG Freefall/Motion Configuration Register

+8g

High-g + Threshold (Motion)

Low-g Threshold (Freefall)

High-g - Threshold (Motion)

-8g

X, Y, Z High-g Region

X, Y, Z Low-g Region

Negative

Positive

Acceleration

This is the Freefall/Motion configuration register for setting up the conditions of the freefall or motion function.

0x15: FF_MT_CFG Register (Read/Write)

Bit

ELE OAE ZEFE YEFE XEFE 0 0 0

Bit

Table 26. FF_MT_CFG Description

Event Latch Enable: Event flags are latched into FF_MT_SRC register. Reading of the FF_MT_SRC register clears the event

ELE

OAE

ZEFE

YEFE

XEFE

flag EA and all FF_MT_SRC bits. Default value: 0. 0: Event flag latch disabled; 1: event flag latch enabled Motion detect / Freefall detect flag selection. Default value: 0. (Freefall Flag) 0: Freefall Flag (Logical AND combination) 1: Motion Flag (Logical OR combination) Event flag enable on Z Default value: 0. 0: event detection disabled; 1: raise event flag on measured acceleration value beyond preset threshold Event flag enable on Y event. Default value: 0. 0: Event detection disabled; 1: raise event flag on measured acceleration value beyond preset threshold Event flag enable on X event. Default value: 0. 0: event detection disabled; 1: raise event flag on measured acceleration value beyond preset threshold

OAE bit allows the selection between Motion (logical OR combination) and Freefall (logical AND combination) detection. ELE denotes whether the enabled event flag will to be latched in the FF_MT_SRC register or the event flag status in the

FF_MT_SRC will indicate the real-time status of the event. If ELE bit is set to a logic ‘1’, then the event flags are frozen when the EA bit gets set, and are cleared by readin g th e FF_MT_SRC source register. ZHFE, YEFE, XEFE enable the detection of a motion or freefall event when the measured acceleration data on X, Y, Z channel is beyond the threshold set in FF_MT_THS register. If the ELE bit is set to logic ‘1’ in the FF_MT_CFG register new event flags are blocked from updating the FF_MT_SRC register. FF_MT_THS is the threshold register used to detect freefall motion events. The unsigned 7-bit FF_MT_THS threshold register holds the threshold for the freefall detection where the magnitude of the X and Y and Z acceleration values is lower or equal than the threshold value. Conversely, the FF_MT_THS also holds the threshold for the motion detection where the magnitude of the X or Y or Z acceleration value is higher than the threshold value.

Figure 12. FF_MT_CFG High- and Low-g Level

0x16: FF_MT_SRC Freefall/Motion Source Register

0x16: FF_MT_SRC Freefall and Motion Source Register (Read Only)

Bit

EA 0 ZHE ZHP YHE YHP XHE XHP

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Bit

Sensors

Table 27. Freefall/Motion Source Descripti on

Event Active Flag. Default value: 0.

ZHE

ZHP

YHE

YHP

XHE

XHP

0: No event flag has been asserted; 1: one or more event flag has been asserted. See the description of the OAE bit to determine the effect of the 3-axis event flags on the EA bit. Z Motion Flag. Default value: 0. 0: No Z Motion event detected, 1: Z Motion has been detected This bit reads always zero if the ZEFE control bit is set to zero Z Motion Polarity Flag. Default value: 0. 0: Z event was Positive g, 1: Z event was Negative g This bit read always zero if the ZEFE control bit is set to zero Y Motion Flag. Default value: 0. 0: No Y Motion event detected, 1: Y Motion has been detected This bit read always zero if the YEFE control bit is set to zero Y Motion Polarity Flag. Default value: 0 0: Y event detected was Positive g, 1: Y event was Negative g This bit reads always zero if the YEFE control bit is set to zero X Motion Flag. Default value: 0 0: No X Motion event detected, 1: X Motion has been detected This bit reads always zero if the XEFE control bit is set to zero X Motion Polarity Flag. Default value: 0 0: X event was Positive g, 1: X event was Negative g This bit reads always zero if the XEFE control bit is set to zero

This register keeps track of the acceleration event which is triggering (or has triggered, in case of ELE bit in FF_MT_CFG register being set to 1) the event flag. In particular EA is set to a logic ‘1’ when the logical combination of acceleration events flags specified in FF_MT_CFG register is true. This bit is used in combination with the values in INT_EN_FF_MT and INT_CFG_FF_MT register bits to generate the freefall/motion interrupts.

An X,Y, or Z motion is true when the acceleration value of the X or Y or Z channel is higher than the preset threshold value defined in the FF_MT_THS register.

Conversely an X, Y, and Z low event is true when the acceleration value of the X and Y and Z channel is lower than or equal to the preset threshold value defined in the FF_MT_THS register.

0x17: FF_MT_THS Freefall and Motion Th re sh old Register

0x17: FF_MT_THS Register (Read/Write)

Bit

DBCNTM THS6 THS5 THS4 THS3 THS2 THS1 THS0

Bit

Table 28.

FF_MT_THS Description

DBCNTM

THS[6:0]

Debounce counter mode selection. Default value: 0. 0: increments or decrements debounce, 1: increments or clears counter. Freefall /Motion Threshold: Default value: 000_0000.

The threshold resolution is 0.063g/LSB and the threshold register has a range of 0 to 127 counts. The maximum range is to 8g. Note that even when the full scale value is set to 2g or 4g the motion detects up to 8g. If the Low-Noise bit is set in Register 0x2A then the maximum threshold will be limited to 4g regardless of the full scale range.

DBCNTM bit configures the way in which the debounce counter is reset when the inertial event of interest is momentarily not true.

When DBCNTM bit is a logic ‘1’, the debounce counter is cleared to 0 whenever the inertial event of interest is no longer true as shown in Figure 13, (b). While the DBCNTM bit is set to logic ‘0’ the debounce counter is decremented by 1 whenever the inertial event of interest is no longer true (Figure 13, (c)) until the debounce counter reaches 0 or the inertial event of interest becomes active.

Decrementing the debounce counter acts as a median enabling the system to filter out irregular spurious events which might impede the detection of inertial events.

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0x18: FF_MT_COUNT Debounce Register

This register sets the number of debounce sample counts for the event trigger.

0x18: FF_MT_COUNT_Register (Read/Write)

Bit

D7 D6 D5 D4 D3 D2 D1 D0

Bit

Table 29. FF_MT_COUNT Description

D[7:0]

Count value. Default value: 0000_0000

This register sets the minimum number of debounce sample counts of continuously matching the detection condition user selected for the freefall, motion event.

When the internal debounce counter reaches the FF_MT_COUNT value a Freefall/Motion event flag is set. The debounce counter will never increase beyond the FF_MT_COUNT value. Time step used for the debounce sample count depends on the ODR chosen and the Oversampling mode as shown in Table 30.

Table 30. FF_MT_COUNT Relationship with the ODR

ODR (Hz)

800 0.319 0.319 0.319 0.319 1.25 1.25 1.25 1.25 400 0.638 0.638 0.638 0.638 2.5 2.5 2.5 2.5 200 1.28 1.28 0.638 1.28 5 5 2.5 5 100 2.55 2.55 0.638 2.55 10 10 2.5 10

50 5.1 5.1 0.638 5.1 20 20 2.5 20

12.5 5.1 20.4 0.638 20.4 20 80 2.5 80

6.25 5.1 20.4 0.638 40.8 20 80 2.5 160

1.56 5.1 20.4 0.638 40.8 20 80 2.5 160

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

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High-g Event on

Count Threshold

FFEA

all 3-axis

(Motion Detect)

Counter

Value

High-g Event on

Count Threshold

Debounce

(a)

all 3-axis

(Motion Detect)

Counter

Value

High-g Event on

Count Threshold

Debounce

all 3-axis

(Motion Detect)

Counter

Value

DBCNTM = 1

(b)

DBCNTM = 0

(c)

Figure 13. DBCNTM Bit Function

Sensors Freescale Semiconductor, Inc. 29

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6.4 Transient (HPF) Acceleration Detection

For more information on the uses of the transient function please review Freescale application note, AN4071. This function is similar to the motion detection except that high-pass filtered data is compared. There is an option to disable the high-pass filter through the function. In this case the behavior is the same as the motion detection. This allows for the device to have 2 motion detection functions.

0x1D: Transient_CFG Register

The transient detection mechanism can be configured to raise an interrupt when the magni tude of the high-pass filtered acceleration threshold is exceeded. The TRANSIENT_CFG register is used to enable the transient interrupt generation mechanism for the 3 axes (X, Y, Z) of acceleration. There is also an option to bypass the high-pass filter. When the high-pass filter is bypassed, the function behaves similar to the motion detection.

0x1D: TRANSIENT_CFG Register (Read/Write)

Bit

0 0 0 ELE ZTEFE YTEFE XTEFE HPF_BYP

Table 31. TRANSIENT_CFG Description

Transient event flags are latched into the TRANSIENT_SRC register. Reading of the TRANSIENT_SRC register clears the event

ELE

ZTEFE

YTEFE

XTEFE

HPF_BYP

flag. Default value: 0. 0: Event flag latch disabled; 1: Event flag latch enabled Event flag enable on Z transient acceleration greater than transient threshold event. Default value: 0. 0: Event detection disabled; 1: Raise event flag on measured acceleration delta value greater than transient threshold. Event flag enable on Y transient acceleration greater than transient threshold event. Default value: 0. 0: Event detection disabled; 1: Raise event flag on measured acceleration delta value greater than transient threshold. Event flag enable on X transient acceleration greater than transient threshold event. Default value: 0. 0: Event detection disabled; 1: Raise event flag on measured acceleration delta value greater than transient threshold. Bypass High-Pass filter Default value: 0. 0: Data to transient acceleration detection block is through HPF 1: Data to transient acceleration detection block is NOT through HPF (similar to motion detection function)

Bit

0x1E: TRANSIENT_SRC Register

The Transient Source register provides the status of the enabled axes and the polarity (directional) information. When this register is read it clears the interrupt for the transient detection. When new events arrive while EA = 1, additional *TRANSE bits may get set, and the corresponding *_Trans_Pol flag become updated. However, no *TRANSE bit may get cleared before the TRANSIENT_SRC register is read.

0x1E: TRANSIENT_SRC Register (Read Only)

Bit

0 EA ZTRANSE Z_Trans_Pol YTRANSE Y_Trans_Pol XTRANSE X_Trans_Pol

Bit

Table 32. TRANSIENT_SRC Description

ZTRANSE

Z_Trans_Pol

YTRANSE

Y_Trans_Pol

XTRANSE

X_Trans_Pol

Event Active Flag. Default value: 0. 0: no event flag has been asserted; 1: one or more event flag has been asserted. Z transient event. Default value: 0. 0: no interrupt, 1: Z Transient acceleration greater than the value of TRANSIENT_THS event has occurred Polarity of Z Transient Event that triggered interrupt. Default value: 0. 0: Z event was Positive g, 1: Z event was Negative g Y transient event. Default value: 0. 0: no interrupt, 1: Y Transient acceleration greater than the value of TRANSIENT_THS event has occurred Polarity of Y Transient Event that triggered interrupt. Default value: 0. 0: Y event was Positive g, 1: Y event was Negative g X transient event. Default value: 0. 0: no interrupt, 1: X Transient acceleration greater than the value of TRANSIENT_THS event has occurred Polarity of X Transient Event that triggered interrupt. Default value: 0. 0: X event was Positive g, 1: X event was Negative g

When the EA bit gets set while ELE = 1, all other status bits get frozen at their current state. By reading the TRANSIENT_SRC register, all bits get cleared.

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0x1F: TRANSIENT_THS Register

The Transient Threshold register sets the threshold limit for the detection of the transient acceleration. The value in the TRANSIENT_THS register corresponds to a g value which is compared against the values of High-Pass Filtered Data. If the HighPass Filtered acceleration value exceeds the threshold limit, an event flag is raised and the interrupt is generated if enabled.

0x1F: TRANSIENT_THS Register (Read/Write)

Bit

DBCNTM THS6 THS5 THS4 THS3 THS2 THS1 THS0

Bit

Table 33. TRANSIENT_THS Description

DBCNTM

THS[6:0]

Debounce counter mode selection. Default value: 0. 0: increments or decrements debounce; 1: increments or clears counter. Transient Threshold: Default value: 000_0000.

The threshold THS[6:0] is a 7-bit unsigned number, 0.063g/LSB. The maximum threshold is 8g. Even if the part is set to full scale at 2g or 4g this function will still operate up to 8g. If the Low-Noise bit is set in Register 0x2A, the maximum threshold to be reached is 4g. Note: If configuring the transient detection threshold for less than 1g, the high-pass filter will need some settling time. The settling time will vary depending on selected ODR, high-pass frequency cutoff and threshold. For more information, please refer to Freescale application note, AN4071.

0x20: TRANSIENT_COUNT

The TRANSIENT_COUNT sets the minimum number of debounce counts continuously matching the cond ition where the unsigned value of high-pass filtered data is greater than the user specified value of TRANSIENT_THS.

0x20: TRANSIENT_COUNT Register (Read/Write)

Bit

D7 D6 D5 D4 D3 D2 D1 D0

Bit

Table 34. TRANSIENT_COUNT Description

D[7:0]

Count value. Default

value: 0000_0000

The time step for the transient detection debounce counter is set by the value of the system ODR and the Oversampling mode.

Table 35. TRANSIENT_COUNT Relationship with the ODR

ODR (Hz)

800 0.319 0.319 0.319 0.319 1.25 1.25 1.25 1.25 400 0.638 0.638 0.638 0.638 2.5 2.5 2.5 2.5 200 1.28 1.28 0.638 1.28 5 5 2.5 5 100 2.55 2.55 0.638 2.55 10 10 2.5 10

50 5.1 5.1 0.638 5.1 20 20 2.5 20

12.5 5.1 20.4 0.638 20.4 20 80 2.5 80

6.25 5.1 20.4 0.638 40.8 20 80 2.5 160

1.56 5.1 20.4 0.638 40.8 20 80 2.5 160

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

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6.5 Single, Double and Directional Pulse-Detection Registers

For more details of how to configure the pulse detection and sample code, please refer to Freescale application note, AN4072. The pulse-detection registers are referred to as “Pulse”.

0x21: PULSE_CFG Pulse Configuration Regi ster

This register configures the event flag for the pulse detection for enabling/disabling the detection of a single and dou ble pulse on each of the axes.

0x21: PULSE_CFG Regist er (Read/Write)

Bit

DPA ELE ZDPEFE ZSPEFE YDPEFE YSPEFE XDPEFE XSPEFE

Table 36. PULSE_CFG Description

Double Pulse Abort. Default value: 0.

DPA

ELE

ZDPEFE

ZSPEFE

YDPEFE

YSPEFE

XDPEFE

XSPEFE

0: Double Pulse detection is not aborted if the start of a pulse is detected during the time period specified by the PULSE_LTCY register. 1: Setting the DPA bit momentarily suspends the double pulse detection if the start of a pulse is detected during the time period specified by the PULSE_LTCY register and the pulse ends before the end of the time period specified by the PULSE_LTCY register. Pulse event flags are latched into the PULSE_SRC register. Reading of the PULSE_SRC register clears the event flag. Default value: 0. 0: Event flag latch disabled; 1: Event flag latch enabled Event flag enable on double pulse event on Z-axis. Default value: 0. 0: Event detection disabled; 1: Event detection enabled Event flag enable on single pulse event on Z-axis. Default value: 0. 0: Event detection disabled; 1: Event detection enabled Event flag enable on double pulse event on Y-axis. Default value: 0. 0: Event detection disabled; 1: Event detection enabled Event flag enable on single pulse event on Y-axis. Default value: 0. 0: Event detection disabled; 1: Event detection enabled Event flag enable on double pulse event on X-axis. Default value: 0. 0: Event detection disabled; 1: Event detection enabled Event flag enable on single pulse event on X-axis. Default value: 0. 0: Event detection disabled; 1: Event detection enabled

Bit

0x22: PULSE_SRC Pulse Source Register

This register indicates a double or single pulse event has occurred and also which direction. The corresponding axis and event must be enabled in Register 0x21 for the event to be seen in the source register.

0x22: PULSE_SRC Register (Read Only)

Bit

EA AxZ AxY AxX DPE PolZ PolY PolX

Bit

Table 37. PULSE_SRC Description

AxZ

AxY

AxX

DPE

PolZ

PolY

PolX

Event Active Flag. Default value: 0. (0: No interrupt has been generated; 1: One or more interrupt events have been generated) Z-axis event. Default value: 0. (0: No interrupt; 1: Z-axis event has occurred) Y-axis event. Default value: 0. (0: No interrupt; 1: Y-axis event has occurred) X-axis event. Default value: 0. (0: No interrupt; 1: X-axis event has occurred) Double pulse on first event. Default value: 0. (0: Single Pulse Event triggered interrupt; 1: Double Pulse event triggered interrupt) Pulse polarity of Z-axis Event. Default value: 0. (0: Pulse Event that triggered interrupt was Positive; 1: Pulse Event that triggered interrupt was negative) Pulse polarity of Y-axis Event. Default value: 0. (0: Pulse Event that triggered interrupt was Positive; 1: Pulse Event that triggered interrupt was negative) Pulse polarity of X-axis Event. Default value: 0. (0: Pulse Event that triggered interrupt was Positive; 1: Pulse Event that triggered interrupt was negative)

When the EA bit gets set while ELE = 1, all status bits (AxZ, AxY, AxZ, DPE, and PolX, PolY, PolZ) are frozen. Reading the PULSE_SRC register clears all bits. Reading the source register will clear the interrupt.

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0x23 - 0x25: PULSE_THSX, Y, Z Pulse Threshold for X, Y & Z Registers

The pulse threshold can be set separately for the X, Y and Z axes. The PULSE_THSX, PULSE_THSY and PULSE_THSZ registers define the threshold which is used by the system to start the pulse detection procedure.

0x23: PULSE_THSX Register (Read/Writ e)

Bit

0 THSX6 THSX5 THSX4 THSX3 THSX2 THSX1 THSX0

Bit

Table 38. PULSE_THSX Description

THSX[6:0]

0x24: PULSE_THSY Register (Read/Write )

Bit

0 THSY6 THSY5 THSY4 THSY3 THSY2 THSY1 THSY0

Pulse Threshold on X-axis. Default value: 000_0000.

Bit

Table 39. PULSE_THSY Description

THSY[6:0]

0x25: PULSE_THSZ Register (Read/Write)

Bit

0 THSZ6 THSZ5 THSZ4 THSZ3 THSZ2 THSZ1 THSZ0

Pulse Threshold on Y-axis. Default value: 000_0000.

Bit

Table 40. PULSE_THSZ Description

THSZ[6:0]

Pulse Threshold on Z-axis. Default value: 000_0000.

Bit

The threshold values range from 1 to 127 with steps of 0.63g/LSB at a fixed 8g acceleration range, thus the minimum resolution is always fixed at 0.063g/LSB. If the Low-Noise bit in Register 0x2A is set then the maximum threshold will be 4g. The PULSE_THSX, PULSE_THSY and PULSE_THSZ registers define the threshold which is used by the system to start the pulse detection procedure. The threshold value is expressed over 7-bits as an unsigned number.

0x26: PULSE_TMLT Pulse Time Window 1 Register

0x26: PULSE_TMLT Register (Read/Write)

Bit

TMLT7

Bit

TMLT6

Bit

TMLT5

Bit

TMLT4

Bit

TMLT3

Bit

TMLT2

Bit

TMLT1

Bit

TMLT0

Table 41. PULSE_TMLT Description

TMLT[7:0]

Pulse Time Limit. Default value: 0000_0000.

The bits TMLT7 through TML T 0 define the maximum time interval that can elapse between the start of the acceleration on the selected axis exceeding the specified threshold and the end when the acceleration on the selected axis must go below the specified threshold to be considered a valid pulse.

The minimum time step for the pulse time limit is defined in Table 42 and Table 43. Maximum time for a given ODR and Oversampling mode is the time step pulse multiplied by 255. The time steps available are dependent on the Oversampling mode and whether the Pulse Low-Pass Filter option is enabled or not. The Pulse Low-Pass Filter is set in Register 0x0F.

Table 42. Time Step for PULSE Time Limit (Reg 0x0F) Pulse_LPF_EN = 1

ODR (Hz)

800 0.319 0.319 0.319 0.319 1.25 1.25 1.25 1.25 400 0.638 0.638 0.638 0.638 2.5 2.5 2.5 2.5 200 1.28 1.28 0.638 1.28 5 5 2.5 5 100 2.55 2.55 0.638 2.55 10 10 2.5 10

50 5.1 5.1 0.638 5.1 20 20 2.5 20

12.5 5.1 20.4 0.638 20.4 20 80 2.5 80

6.25 5.1 20.4 0.638 40.8 20 80 2.5 160

1.56 5.1 20.4 0.638 40.8 20 80 2.5 160

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

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Table 43. Time Step for PULSE Time Limit (Reg 0x0F) Pulse_LPF_EN = 0

ODR (Hz)

800 0.159 0.159 0.159 0.159 0.625 0.625 0.625 0.625 400 0.159 0.159 0.159 0.319 0.625 0.625 0.625 1.25 200 0.319 0.319 0.159 0.638 1.25 1.25 0.625 2.5 100 0.638 0.638 0.159 1.28 2.5 2.5 0.625 5

50 1.28 1.28 0.159 2.55 5 5 0.625 10

12.5 1.28 5.1 0.159 10.2 5 20 0.625 40

6.25 1.28 5.1 0.159 10.2 5 20 0.625 40

1.56 1.28 5.1 0.159 10.2 5 20 0.625 40

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

0x27: PULSE_LTCY Pulse Latency Timer Register

0x27: PULSE_LTCY Register (Read/Write)

Bit

LTCY7 LTCY6 LTCY5 LTCY4 LTCY3 LTCY2 LTCY1 LTCY0

Bit

Table 44. PULSE_LTCY Description

LTCY[7:0]

Latency Time Limit. Default value: 0000_0000

The bits LTCY7 through L TCY0 define the time interval that starts after the first pulse detection. During this time interval, all pulses are ignored. Note: This timer must be set for single pulse and for double pulse.

The minimum time step for the pulse latency is defined in Table 45 and Table 46. The maximum time is the time step at the ODR and Oversampling mode multiplied by 255. The timing also changes when the Pulse LPF is enable d or disabled.

Table 45. Time Step for PULSE Latency @ ODR and Power Mode (Reg 0x0F) Pulse_LPF_EN = 1

ODR (Hz)

800 0.638 0.638 0.638 0.638 2.5 2.5 2.5 2.5

4001.2761.2761.2761.2765555 200 2.56 2.56 1.276 2.56 10 10 5 10 100 5.1 5.1 1.276 5.1 20 20 5 20

50 10.2 10.2 1.276 10.2 40 40 5 40

12.5 10.2 40.8 1.276 40.8 40 160 5 160

6.25 10.2 40.8 1.276 81.6 40 160 5 320

1.56 10.2 40.8 1.276 81.6 40 160 5 320

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

Table 46. Time Step for PULSE Latency @ ODR and Power Mode (Reg 0x0F) Pulse_LPF_EN = 0

ODR (Hz)

800 0.318 0.318 0.318 0.318 1.25 1.25 1.25 1.25 400 0.318 0.318 0.318 0.638 1.25 1.25 1.25 2.5 200 0.638 0.638 0.318 1.276 2.5 2.5 1.25 5 100 1.276 1.276 0.318 2.56 5 5 1.25 10

50 2.56 2.56 0.318 5.1 10 10 1.25 20

12.5 2.56 10.2 0.318 20.4 10 40 1.25 80

6.25 2.56 10.2 0.318 20.4 10 40 1.25 80

1.56 2.56 10.2 0.318 20.4 10 40 1.25 80

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

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0x28: PULSE_WIND Register (Read/ Write)

0x28: PULSE_WIND Second Pulse Time Window Register

Bit

WIND7 WIND6 WIND5 WIND4 WIND3 WIND2 WIND1 WIND0

Bit

Table 47. PULSE_WIND Description

WIND[7:0]

Second Pulse Time Window. Default value: 0000_0000.

The bits WIND7 through WIND0 define the maximum interval of time that can elapse after the end of the latency interval in which the start of the second pulse event must be detected provided the device has been configured for double pulse detection. The detected second pulse width must be shorter than the time limit constraints specified by the PULSE_TMLT register, but the end of the double pulse need not finish within the time specified by the PULSE_WIND register.

The minimum time step for the pulse window is defined in T able48 and Table49. The maximum time is the time step at the ODR, Oversampling mode and LPF Filter Option multiplied by 255.

Table 48. Time Step for PULSE Detection Window @ ODR and Power Mode (Reg 0x0F) Pulse_LPF_EN = 1

ODR (Hz)

800 0.638 0.638 0.638 0.638 2.5 2.5 2.5 2.5 400 1.276 1.276 1.276 1.276 5 5 5 5 200 2.56 2.56 1.276 2.56 10 10 5 10 100 5.1 5.1 1.276 5.1 20 20 5 20

50 10.2 10.2 1.276 10.2 40 40 5 40

12.5 10.2 40.8 1.276 40.8 40 160 5 160

6.25 10.2 40.8 1.276 81.6 40 160 5 320

1.56 10.2 40.8 1.276 81.6 40 160 5 320

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

Table 49. Time Step for PULSE Detection Window @ ODR and Power Mode (Reg 0x0F) Pulse_LPF_EN = 0

ODR (Hz)

800 0.318 0.318 0.318 0.318 1.25 1.25 1.25 1.25 400 0.318 0.318 0.318 0.638 1.25 1.25 1.25 2.5 200 0.638 0.638 0.318 1.276 2.5 2.5 1.25 5 100 1.276 1.276 0.318 2.56 5 5 1.25 10

50 2.56 2.56 0.318 5.1 10 10 1.25 20

12.5 2.56 10.2 0.318 20.4 10 40 1.25 80

6.25 2.56 10.2 0.318 20.4 10 40 1.25 80

1.56 2.56 10.2 0.318 20.4 10 40 1.25 80

Normal LPLN HighRes LP Normal LPLN HighRes LP

Max Time Range (s) Time Step (ms)

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6.6 Auto-WAKE/SLEEP Detection

The ASLP_COUNT register sets the minimum time period of inactivity required to change current ODR value from the value specified in the DR[2:0] register to ASLP_RATE register value, provided the SLPE bit is set to a logic ‘1’ in the CTRL_REG2 register. See Table 52 for functional blocks that may be monitored for inactivity in order to trigger the “return to SLEEP” event.

0x29: ASLP_COUNT Register (Read/Write)

Bit

D7 D6 D5 D4 D3 D2 D1 D0

Table 50. ASLP_COUNT Description

D[7:0]

D7-D0 defines the minimum duration time to change current ODR value from DR to ASLP_RATE. Time step and maximum value depend on the ODR chosen as shown in Table 51.

Bit

Duration value. Default value: 0000_0000.

Bit

Table 51. ASLP_COUNT Relationship with ODR

Output Data Rate

(ODR)

800 Hz 0 to 81s 1.25 ms 320 ms 400 Hz 0 to 81s 2.5 ms 320 ms 200 Hz 0 to 81s 5 ms 320 ms 100 Hz 0 to 81s 10 ms 320 ms

50 Hz 0 to 81s 20 ms 320 ms

12.5 Hz 0 to 81s 80 ms 320 ms

6.25 Hz 0 to 81s 160 ms 320 ms

1.56 Hz 0 to 162s 640 ms 640 ms

Duration ODR Time Step ASLP_COUNT Step

Bit

Table 52. SLEEP/WAKE Mode Gates and Triggers

Interrupt Source

SRC_TRANS Yes Yes

SRC_LNDPRT Yes Yes

SRC_PULSE Yes Yes

SRC_FF_MT Yes Yes

SRC_ASLP No* No*

SRC_DRDY No No

Event restarts timer and delays Return to SLEEP

Event will WAKE from SLEEP

In order to wake the device, the desired function or functions must be enabled in CTRL_REG4 and set to WAK E to SLEEP in CTRL_REG3. All enabled functions will still function in SLEEP mode at the SLEEP ODR. Only the functions that have been selected for WAKE from SLEEP will WAKE the device.

MMA8452Q has four functions that can be used to keep the sensor from falling aslee p; Transient, Orientation, Pulse, and Motion/FF. One or more of these functions can be enabled. In order to WAKE the device, four functions are provided; Transient, Orientation, Pu l se, and the Motion/Freefall. The Auto-WAKE/SLEEP interrupt does not affect the WAKE/SLEEP, nor does the data ready interrupt. See Register 0x2C for the WAKE from SLEEP bits.

If the Auto-SLEEP bit is disabled, then the device can only toggle between STANDBY and WAKE mode. If Auto-SLEEP interrupt is enabled, transitioning from ACTIVE mode to Auto-SLEEP mode and vice versa generates an interrupt.

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6.7 Control Registers

Note: Except for STANDBY mode selection, the device must be in STANDBY mode to change any of the fields within

CTRL_REG1 (0X2A).

0x2A: CTRL_REG1 System Control 1 Register

0x2A: CTRL_REG1 Register (Read/Write)

Bit

ASLP_RATE1 ASLP_RATE0 DR2 DR1 DR0 LNOISE F_READ ACTIVE

Table 53. CTRL_REG1 Description

ASLP_RATE[1:0]

DR[2:0]

LNOISE

F_READ

ACTIVE

Bit

Configures the Auto-WAKE sample frequency when the device is in SLEEP Mode. Default value: 00. See Table 54 for more information. Data rate selection. Default value: 000. See Table 55 for more information. Reduced noise reduced Maximum range mode. Default value: 0. (0: Normal mode; 1: Reduced Noise mode) Fast Read mode: Data format limited to single Byte Default value: 0. (0: Normal mode 1: Fast Read Mode) Full Scale selection. Default value: 00. (0: STANDBY mode; 1: ACTIVE mode)

Bit

Table 54. SLEEP Mode Rate Description

ASLP_RATE1 ASLP_RATE0 Frequency (Hz)

0050 0 1 12.5 1 0 6.25 1 1 1.56

Bit

It is important to note that when the device is Auto-SLEEP mode, the system ODR and the data rate for all the system functional blocks are overridden by the data rate set by the ASLP_RATE field.

DR[2:0] bits select the Output Data Rate (ODR) for acceleration samples. The default value is 000 for a data rate of 800 Hz.

Table 55. System Output Data Rate Selection

DR2 DR1 DR0 ODR Period

0 0 0 800 Hz 1.25 ms 0 0 1 400 Hz 2.5 ms 0 1 0 200 Hz 5 ms 0 1 1 100 Hz 10 ms 1 0 0 50 Hz 20 ms 1 0 1 12.5 Hz 80 ms 1 1 0 6.25 Hz 160 ms 1 1 1 1.56 Hz 640 ms

ACTIVE bit selects between STANDBY mode and ACTIVE mode. The default value is 0 for STANDBY mode.

Table 56. Full Scale Selection

Active Mode

0STANDBY 1ACTIVE

LNOISE bit selects between normal full dynamic range mode and a high sensitivity, Low Noise mode. In Low Noise mode, the maximum signal that can be measured is ±4g. Note: Any thresholds set above 4g will not be reached. F_READ bit selects between Normal and Fast Read mode. When selected, the auto-increment counter will skip over the LSB data bytes.

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0x2B: CTRL_REG2 System Control 2 Register

0x2B: CTRL_REG2 Register (Read/Write)

Bit

ST RST 0 SMODS1 SMODS0 SLPE MODS1 MODS0

Bit

Table 57. CTRL_REG2 Description

RST

SMODS[1:0]

SLPE

MODS[1:0]

Self-Test Enable. Default value: 0. 0: Self-Test disabled; 1: Self-Test enabled Software Reset. Default value: 0. 0: Device reset disabled; 1: Device reset enabled. SLEEP mode power scheme selection. Default value: 00. See Table 58 and Table 59 Auto-SLEEP enable. Default value: 0. 0: Auto-SLEEP is not enabled; 1: Auto-SLEEP is enabled. ACTIVE mode power scheme selection. Default value: 00. See Table 58 and Table 59

ST bit activates the self-test function. When ST is set, X, Y, and Z outputs will shift. RST bit is used to activate the software reset. The reset mechanism can be enabled in STANDBY and ACTIVE mode.

When the reset bit is enabled, all registers are rest and are loaded with default values. Writing ‘1’ to the RST bit immediately resets the device, no matter whether it is in ACTIVE/WAKE, ACTIVE/SLEEP, or STANDBY mode.

C communication system is reset to avoid accidental corrupted data access.

The I

At the end of the boot process the RST bit is deasserted to 0. Reading this bit will return a value of zero.

The (S)MODS[1:0] bits select which Oversampling mode is to be used shown in Table 58. The Oversampling modes are available in both WAKE Mode MOD[1:0] and also in the SLEEP Mode SMOD[1:0].

Table 58. MODS Oversampling Modes

(S)MODS1 (S)MODS0 Power Mode

00 Normal 0 1 Low Noise Low Power 1 0 High Resolution 1 1 Low Power

Table 59. MODS Oversampling Modes Current Consumption and Averaging Value s at each ODR

Mode Normal (00) Low Noise Low Power (01) High Resolution (10) Low Power (11)

ODR Current

1.56 Hz 24 128 8 32 165 1024 6 16

6.25 Hz 24 32 8 8 165 256 6 4

12.5 Hz 24 16 8 4 165 128 6 2 50 Hz 24 4 24 4 165 32 14 2

100 Hz 44 4 44 4 165 16 24 2 200 Hz 85 4 85 4 165 8 44 2 400 Hz 165 4 165 4 165 4 85 2 800 Hz 165 2 165 2 165 2 165 2

μA OS Ratio Current μA OS Ratio Current μA OS Ratio Current μAOS Ratio

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0x2C: CTRL_REG3 Interrupt Control Register

0x2C: CTRL_REG3 Register (Read/Write)

Bit

0 WAKE_TRANS WAKE_LNDPRT WAKE_PULSE WAKE_FF_MT 0 IPOL PP_OD

Bit

Table 60. CTRL_REG3 Description

WAKE_TRANS

WAKE_LNDPRT

WAKE_PULSE

WAKE_FF_MT

IPOL

PP_OD

0: Transient function is bypassed in SLEEP mode. Default value: 0. 1: Transient function interrupt can wake up system 0: Orientation function is bypassed in SLEEP mode. Default value: 0. 1: Orientation function interrupt can wake up system 0: Pulse function is bypassed in SLEEP mode. Default value: 0. 1: Pulse function interrupt can wake up system 0: Freefall/Motion function is bypassed in SLEEP mode. Default value: 0. 1: Freefall/Motion function interrupt can wake up Interrupt polarity ACTIVE high, or ACTIVE low. Default value: 0. 0: ACTIVE low; 1: ACTIVE high Push-Pull/Open Drain selection on interrupt pad. Default value: 0. 0: Push-Pull; 1: Open Drain

IPOL bit selects the polarity of the interrupt signal. When IPOL is ‘0’ (default value) any interrupt event will signaled with a logical 0. PP_OD bit configures the interrupt pin to Push-Pull or in Open Drain mode. The default value is 0 which corresponds to PushPull mode. The Open Drain configuration can be used for connecting multiple interrupt signals on the same interrupt line.

0x2D: CTRL_REG4 Register (Read/Write)

Bit

INT_EN_ASLP 0 INT_EN_TRANS INT_EN_LNDPRT INT_EN_PULSE INT_EN_FF_MT 0 INT_EN_DRDY

Bit

Table 61.

Interrupt Enable Register Description

Interrupt Enable

INT_EN_ASLP

INT_EN_TRANS

INT_EN_LNDPRT

INT_EN_PULSE

INT_EN_FF_MT

INT_EN_DRDY

Interrupt Enable. Default value: 0. 0: Auto-SLEEP/WAKE interrupt disabled; 1: Auto-SLEEP/WAKE interrupt enabled. Interrupt Enable. Default value: 0. 0: Transient interrupt disabled; 1: Transient interrupt enabled. Interrupt Enable. Default value: 0. 0: Orientation (Landscape/Portrait) interrupt disabled. 1: Orientation (Landscape/Portrait) interrupt enabled. Interrupt Enable. Default value: 0. 0: Pulse Detection interrupt disabled; 1: Pulse Detection interrupt enabled Interrupt Enable. Default value: 0. 0: Freefall/Motion interrupt disabled; 1: Freefall/Motion interrupt enabled Interrupt Enable. Default value: 0. 0: Data Ready interrupt disabled; 1: Data Ready interrupt enabled

Description

The corresponding functional block interrupt enable bit allows the functional block to route its event detection flags to the

system’s interrupt controller. The interrupt controller routes the enabled functional block interrupt to the INT1 or INT2 pin.

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0x2E: CTRL_REG5 Register (Read/Write)

0x2E: CTRL_REG5 Interrupt Configuration Register

Bit

INT_CFG_ASLP 0 INT_CFG_TRANS INT_CFG_LNDPRT INT_CFG_PULSE INT_CFG_FF _MT 0 INT_CFG_DRDY

Bit

Table 62.

Interrupt Configuration Register Desc ription

Interrupt Configuration Description

INT_CFG_ASLP

INT_CFG_TRANS

INT_CFG_LNDPRT

INT_CFG_PULSE

INT_CFG_FF_MT

INT_CFG_DRDY

INT1/INT2 Configuration. Default value: 0. 0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin INT1/INT2 Configuration. Default value: 0. 0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin INT1/INT2 Configuration. Default value: 0. 0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin INT1/INT2 Configuration. Default value: 0. 0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin INT1/INT2 Configuration. Default value: 0. 0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin INT1/INT2 Configuration. Default value: 0. 0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin

The system’s interrupt controller shown in Figure 10 uses the corresponding bit field in the CTRL_REG 5 register to determine the routing table for the INT1 and INT2 interrupt pins. If the bit value is logic ‘0’, the functional block’s interrupt is routed to INT2, and if the bit value is logic ‘1’, then the interrupt is routed to INT1. One or more functions can assert an interrupt pin; therefore a host application responding to an interrupt should read the INT_SOURCE (0x0C) register to determine the appropriate sources of the interrupt.

6.8 User Offset Correction Registers

For more information on how to calibrate the 0g offset, refer to application note AN4069. The 2’s complement offset correction registers values are used to realign th e Ze ro -g position of the X, Y, and Z-axis after device board mount. The resolution of the offset registers is 2 mg per LSB. The 2’s complement 8-bit value would result in an offset compensation range ±256 mg.

0x2F: OFF_X Offset Correction X Register

0x2F: OFF_X Register (Read/Write)

Bit

D7 D6 D5 D4 D3 D2 D1 D0

Bit

Table 63. OFF_X Description

D[7:0]

X-axis offset value. Default value: 0000_0000.

0x30: OFF_Y Offset Correction Y Register

0x30: OFF_Y Register (Read/Write)

Bit

D7 D6 D5 D4 D3 D2 D1 D0

Bit

Table 64. OFF_Y Description

D[7:0]

Y-axis offset value. Default value: 0000_0000.

0x31: OFF_Z Offset Correction Z Register

0x31: OFF_Z Register (Read/Write)

Bit

D7 D6 D5 D4 D3 D2 D1 D0

Bit

Table 65. OFF_Z Description

D[7:0]

Z-axis offset value. Default value: 0000_0000.

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Table 66. MMA8452Q Register Map

Reg Name Definition Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

00 STATUS Data Status R ZYXOW ZOW YOW XOW ZYXDR ZDR YDR XDR

01 OUT_X_MSB 12-bit X Data R XD11 XD10 XD9 XD8 XD7 XD6 XD5 XD4

02 OUT_X_LSB 12-bit X Data R XD3 XD2 XD1 XD0 0 0 0 0

03 OUT_Y_MSB 12-bit Y Data R YD11 YD10 YD9 YD8 YD7 YD6 YD5 YD4

04 OUT_Y_LSB 12-bit Y Data R YD3 YD2 YD1 YD0 0 0 0 0

05 OUT_Z_MSB 12-bit Z Data R ZD11 ZD10 ZD9 ZD8 ZD7 ZD6 ZD5 ZD4

06 OUT_Z_LSB 12-bit Z Data R ZD3 ZD2 ZD1 ZD0 0 0 0 0

0B SYSMOD System Mode R 0 0 0 0 0 0 SYSMOD1 SYSMOD0

0C INT_SOURCE Interrupt Status R SRC_ASLP 0 SRC_TRANS SRC_LNDPRT SRC_PULSE SRC_FF_MT 0 SRC_DRDY

0D WHO_AM_I ID Register R 0 0 1 0 1 0 1 0

0E XYZ_DATA_CFG Data Config R/W 0 0 0 HPF_OUT 0 0 FS1 FS0

0F HP_FILTER_CUTOFF HP Filter Setting R/W 0 0 Pulse_HPF_BYP Pulse_LPF_EN 0 0 SEL1 SEL0

10 PL_STATUS PL Status R NEWLP LO 0 0 0 LAPO[1] LAPO[0] BAFRO

11 PL_CFG PL Configuration R/W DBCNTM PL_EN 0 0 0 0 0 0

12 PL_COUNT PL DEBOUNCE R/W DBNCE[7] DBNCE[6] DBNCE[5] DBNCE[4] DBNCE[3] DBNCE[2] DBNCE[1] DBNCE[0]

13 PL_BF_ZCOMP

14 P_L_THS_REG PL THRESHOLD R P_L_THS[4] P_L_THS[3] P_L_THS[2] P_L_THS[1] P_L_THS[0] HYS[2] HYS[1] HYS[0]

15 FF_MT_CFG

16 FF_MT_SRC

17 FF_MT_THS

18 FF_MT_COUNT

1D TRANSIENT_CFG Transient Config R/W 0 0 0 ELE ZTEFE YTEFE XTEFE HPF_BYP

1E TRANSIENT_SRC Transient Source R 0 EA ZTRANSE Z_Trans_Pol YTRANSE Y_Trans_Pol XTRANSE X_Trans_Pol

PL Back/Front Z Comp

Freefall/Motion Config

R/W

Freefall/Motion Source

Freefall/Motion

Threshold

R/W

Freefall/Motion

Debounce

R/W

BKFR[1] BKFR[0] 0 0 0 ZLOCK[2] ZLOCK[1] ZLOCK[0]

ELE OAE ZEFE YEFE XEFE 0 0 0

EA 0 ZHE ZHP YHE YHP XHE XHP

DBCNTM THS6 THS5 THS4 THS3 THS2 THS1 THS0

D7 D6 D5 D4 D3 D2 D1 D0

1F TRANSIENT_THS Transient Threshold R/W DBCNTM THS6 THS5 THS4 THS3 THS2 THS1 THS0

20 TRANSIENT_COUNT

21 PULSE_CFG Pulse Config R/W DPA ELE ZDPEFE ZSPEFE YDPEFE YSPEFE XDPEFE XSPEFE

22 PULSE_SRC Pulse Source R EA AxZ AxY AxX DPE Pol_Z Pol_Y Pol_X

23 PULSE_THSX Pulse X Threshold R/W 0 THSX6 THSX5 THSX4 THSX3 THSX2 THSX1 THSX0

24 PULSE_THSY Pulse Y Threshold R/W 0 THSY6 THSY5 THSY4 THSY3 THSY2 THSY1 THSY0

25 PULSE_THSZ Pulse Z Threshold R/W 0 THSZ6 THSZ5 THSZ4 THSZ3 THSZ2 THSZ1 THSZ0

26 PULSE_TMLT Pulse First Timer R/W TMLT7 TMLT6 TMLT5 TMLT4 TMLT3 TMLT2 TMLT1 TMLT0

27 PULSE_LTCY Pulse Latency R/W LTCY7 LTCY6 LTCY5 LTCY4 LTCY3 LTCY2 LTCY1 LTCY0

28 PULSE_WIND

29 ASLP_COUNT

2A CTRL_REG1 Control Reg1 R/W ASLP_RATE1 ASLP_RATE0 DR2 DR1 DR0 LNOISE F_READ ACTIVE

2B CTRL_REG2 Control Reg2 R/W ST RST 0 SMODS1 SMODS0 SLPE MODS1 MODS0

2C CTRL_REG3

2D CTRL_REG4

Transient Debounce

R/W

Pulse 2nd Window

R/W

Auto-SLEEP Counter

R/W

Control Reg3

(WAKE Interrupts from

SLEEP) R/W

Control Reg4

(Interrupt Enable Map)

R/W

D7 D6 D5 D4 D3 D2 D1 D0

WIND7 WIND6 WIND5 WIND4 WIND3 WIND2 WIND1 WIND0

D7 D6 D5 D4 D3 D2 D1 D0

0 WAKE_TRANS WAKE_LNDPRT WAKE_PULSE WAKE_FF_MT 0 IPOL PP_OD

INT_EN_ASLP 0 INT_EN_TRANS INT_EN_LNDPRT INT_EN_PULSE INT_EN_FF_MT 0 INT_EN_DRDY

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Sensors Freescale Semiconductor, Inc. 41

Table 66. MMA8452Q Register Map

Control Reg5

2E CTRL_REG5

2F OFF_X X 8-bit offset R/W D7 D6 D5 D4 D3 D2 D1 D0

30 OFF_Y Y 8-bit offset R/W D7 D6 D5 D4 D3 D2 D1 D0

31 OFF_Z Z 8-bit offset R/W D7 D6 D5 D4 D3 D2 D1 D0

(Interrupt Configuration)

R/W

INT_CFG_ASLP 0 INT_CFG_TRANS

INT_CFG_LNDPR

INT_CFG_PULSE INT_CFG_FF_MT 0

INT_CFG_DRD

Table 67. Accelerometer Output Data

12-bit Data Range ±2g (1 mg) Range ±4g (2 mg) Range ±8g (3.9 mg)

0111 1111 1111 1.999g +3.998g +7.996g 0111 1111 1110 1.998g +3.996g +7.992g

…… … … 0000 0000 0001 0.001g +0.002g +0.004g 0000 0000 0000 0.0000g 0.0000g 0.0000g 1111 1111 1111 -0.001g -0.002g -0.004g

…… … … 1000 0000 0001 -1.999g -3.998g -7.996g 1000 0000 0000 -2.0000g -4.0000g -8.0000g

8-bit Data Range ±2g (15.6 mg) Range ±4g (31.25 mg) Range ±8g (62.5 mg)

0111 1111 1.9844g +3.9688g +7.9375g 0111 1110 1.9688g +3.9375g +7.8750g

…… … …

0000 0001 +0.0156g +0.0313g +0.0625g 0000 0000 0.000g 0.0000g 0.0000g 1111 1111 -0.0156g -0.0313g -0.0625g

…… … …

1000 0001 -1.9844g -3.9688g -7.9375g 1000 0000 -2.0000g -4.0000g -8.0000g

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42 Freescale Semiconductor, Inc.

7 Printed Circuit Board Layout and Device Mounting

Printed Circuit Board (PCB) layout and device mounting are critical portions of the total design. The footprint for the surface mount packages must be the correct size as a base for a proper solder connection between the PCB and the package. This, along with the recommended soldering materials and techniques, will optimize assembly and minimize the stress on the package after board mounting.

Freescale application note AN4530, “QFN (Quad Flat Pack No-Lead)” discusses the QFN package used by the FXAS21000.

7.1 Printed Circuit Board Layout

The following recommendations are a guide to an effective PCB layout. See Figure 14 for footprint dimensions.

1. Do not solder down Exposed Pad (EP) under the package to minimize board mounting stress impact to product performance.

2. PCB landing pad is 0.813 mm x 0.305 mm as shown in Figure 14.

3. Solder mask opening = PCB land pad edge + 0.2 mm larger all around.

4. Stencil opening size is 0.787 mm x 0.280 mm.

5. Stencil thickness is 100 or 125 μm.

6. The solder mask should not cover any of the PCB landing pads, as shown in Figure 14.

7. No additional via nor metal pattern underneath package on the top of the PCB layer.

8. Do not place any components or vias within 2 mm of the package land area. This may cause additional package stress if it is too close to the package land area.

9. Signal traces connected to pads should be as symmetric as possible. Put dummy traces on NC pads, to have same length of exposed trace for all pads.

10. Use a standard pick and place process and equipment. Do not use a hand soldering process.

11. Customers are advised to be cautious about the proximity of screw down holes to the sensor, and the location of any press fit to the assembled PCB when in an enclosure. It is important that the assembled PCB remain flat after assembly to keep electronic operation of the device optimal.

12. The PCB should be rated for the multiple lead-free reflow condition with max 260°C temperature.

13. Freescale sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free molding compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tinsilver-copper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for soldering the devices.

MMA8452Q

Sensors Freescale Semiconductor, Inc. 43

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7.2 Overview of Soldering Considerations

Information provided here is based on experiments executed on QFN devices. These experiments cannot represent exact

Figure 14. Footprint

conditions present at a customer site. Therefore, information herein should be used for guidance only. Process and design optimizations are recommended to develop an application-specific solution. With the proper PCB footprint and solder stencil designs, the package will self-align during the solder reflow process.

• Stencil thickness is 100 or 125 μm.

• The PCB should be rated for the multiple lead-free reflow condition with a maximum 260 °C temperature.

• Use a standard pick-and-place process and equipment. Do not use a hand soldering process.

• Do not use a screw-down or stacking to mount the PCB into an enclosure. These methods could bend the PCB, which would put stress on the package.

7.3 Halogen Content

This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that no homogeneous material within the assembled package will contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or bromine (Br) in excess of 900 ppm or 0.09% weight/weight.

MMA8452Q

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44 Freescale Semiconductor, Inc.

8 Package Information

Top View

263

8451

ALYW

Traceability date code

Assembly site

Lot code

Work week

Part number

Freescale code

Pin 1

The MMA8451Q device is housed in a 16-lead QFN package, case number 2077.

8.1 Product identification markings

8.2 Tape and reel information

Sensors Freescale Semiconductor, Inc. 45

MMA8452Q

8.3 Package Description

CASE 2077-02

ISSUE A

16-LEAD QFN

MMA8452Q

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46 Freescale Semiconductor, Inc.

PACKAGE DIMENSIONS

CASE 2077-02

ISSUE A

16-LEAD QFN

MMA8452Q

Sensors Freescale Semiconductor, Inc. 47

PACKAGE DIMENSIONS

CASE 2077-02

ISSUE A

16-LEAD QFN

MMA8452Q

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48 Freescale Semiconductor, Inc.

9 Revision History

Table 68. Revision history

Revision

number

5 07/2012

6 02/2013

7 03/2013

8 07/2013

8.1 10/2013

Revision

date

Description of changes

• Table 2. Updated Typ values for Sensitivity Accuracy from 2.5% to 2.68%; Zero-g Level Offset Accuracy from ±20 mg to ±17 mg and Zero-g Level Offset Accuracy Post Board Mount from ±30 mg to ±20 mg.

• Updated section 2.3 I

• Added Table 8. Features of the MMA845xQ devices.

• Removed FIFO paragraph at the end of Section 6.1.

• Updated Case outline.

• Replaced Section 2.3 I

• Table 66: Register Map table, corrected registers 01, 03, and 05, bits 7-1 values from xD9-xD2 to xD11-xD4; corrected registers 02, 04, and 06, bits 02, 04, and 06 from xD1, xD0, 0, 0 to xD3, xD2, xD1, xD0 respectively.

• Table 2: Updated Self-test Output Change row; X, Y, and Z Typ values from +181, +255, and +1680 to +44, +61, and +392 respectively.

• Table 3: Updated Parameter and Test Condition column definitions for “Time from VDDIO on...”, “Turn-on (STANDBY)” and “Turn-on time (Power Down to STANDBY)” rows. Expanded Max value for Ton1 into Typ column and corrected Typ and Max value for Ton2 from “2” to “2/ODR + 2 ms”.

• Global change: Updated Pin 3 naming (from NC to DNC) to clarify which pins are not connected internally, and which pins the customer should not connect anything to.

• Table1: Updated descriptions for most pins, removed Pin Status column.

• Section 4: Changed title from Modes of Operation to System Modes (SYSMOD).

• Updated Figure 6 with more detailed graphic.

• Table 7: Removed VDDIO column, combined contents into other columns and rows.

• Added Section 7. Printed Circuit Board Layout and Device Mounting.

• Created Section 8 for Package Information including pin marking information, tape and reel information and package.

C Interface Characteristics

C interface characteristics, including Table 4 and Figure 5.

MMA8452Q

Sensors Freescale Semiconductor, Inc. 49

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Information in this document is provided solely to enable system and software

implementers to use Freescale products. There are no express or implied copyright

licenses granted hereunder to design or fabricate any integra ted circuits based on the

information in this document.

Free scale reserves the right to make changes without fur ther notice to any produ cts

herein. Freesca

suitability of its products for any particular purpose, nor does Freescale assume any

liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation conseq

damages. “Typical” parameters that may be provided in Freescale data sheets and/or

specifications can and do vary in different applications, and actual performance may

vary over time. All operating parameters, including “typicals,” m ust be validated for each

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le makes no warranty, representation, or guarantee regarding the

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ation by customer’s technical experts. Freescale does not convey any

Document Number: MMA8452Q Rev. 9 07/2014

Freescale, the Freescale logo, a

of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Xtrinsic is a trademarks of

Freescale Semiconductor, Inc. All other product or service names are the property of

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nd the Energy Efficient Solutions logo are trademarks

Freescale Semiconductor Energy Efficient Solutions Xtrinsic MMA8452Q Data Sheet: Technical Data

Specifications and Main Features

Frequently Asked Questions

User Manual

Contents

1 Block Diagram and Pin Description

1.1 Soldering Information

2 Mechanical and Electrical Specifications

2.1 Mechanical Characteristics

2.2 Electrical Characteristics

2.3 I2C interface characteristics

2.4 Absolute Maximum Ratings

3 Terminology

3.1 Sensitivity

3.2 Zero-g Offset

3.3 Self-Test

4 System Modes (SYSMOD)

5 Functionality

5.1 Device Calibration

5.2 8-bit or 12-bit Data

5.3 Low-Power Modes vs. High-Resolution Modes

5.4 Auto-WAKE/SLEEP Mode

5.5 Freefall and Motion Detection

5.5.1 Freefall Detection

5.5.2 Motion Detection

5.6 Transient Detection

5.7 Pulse Detection

5.8 Orientation Detection

5.9 Interrupt Register Configurations

5.10 Serial I2C Interface

5.10.1 I2C Operation

6 Register Descriptions

6.1 Data Registers

6.2 Portrait/ Landscape Embedded Function Registers

6.3 Motion and Freefall Embedded Function Registers

6.4 Transient (HPF) Acceleration Detection

6.5 Single, Double and Directional Pulse-Detection Registers

6.6 Auto-WAKE/SLEEP Detection

6.7 Control Registers

6.8 User Offset Correction Registers

7 Printed Circuit Board Layout and Device Mounting

7.1 Printed Circuit Board Layout

7.2 Overview of Soldering Considerations

7.3 Halogen Content

8 Package Information

8.1 Product identification markings

8.2 Tape and reel information

8.3 Package Description

PACKAGE DIMENSIONS

PACKAGE DIMENSIONS

9 Revision History