Freescale MC7448THX1000Nx, MC7448THX1267Nx, MC7448THX1400Nx, MC7448THX1700LD, PPC7448THX1000Nx Technical Data

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Freescale Semiconductor

Technical Data

Document Number: MPC7448ECS02AD

Rev. 2, 04/2007

MPC7448 Hardware Specifications
Addendum for the
MC7448T

This document describes part-number-specific changes to
recommended operating conditions and revised electrical
specifications, as applicable, from those described in the
general MPC7448 RISC Microprocessor Hardware
Specifications. The MPC7448 is a PowerPC™
microprocessor built on Power Architecture™ technology.

Specifications provided in this document supersede those in
the MPC7448 RISC Microprocessor Hardware
Specifications, Rev. 3 or later, for the part numbers listed in

Table A only. Specifications not addressed herein are

unchanged. Because this document is frequently updated,
refer to the website on the back page of this document or to
your Freescale sales office for the latest version.

xxnnnnmx

Series

Freescale Part Numbers Affected:
MC7448T H X 1000Nx

MC7448T H X 1267Nx
MC7448T H X 1400Nx
MC7448T H X 1700LD
PPC7448THX1000Nx
PPC7448THX1267Nx
PPC7448THX1400Nx

Note that headings and table numbers in this document are
not consecutively numbered. They are intended to
correspond to the heading or table affected in the general
hardware specification.

Part numbers addressed in this document are listed in

Table A.

© Freescale Semiconductor, Inc., 2007. All rights reserved.

General Parameters

Table A. Part Numbers Addressed by This Data Sheet

Operating Conditions

Freescale

Part Number

MC7448THX1000Nx 1000 1.0 V ± 50 mV –40 to 105 Modified core frequency and voltage to reduce

MC7448THX1267NC 1267 1.1 V ± 50 mV

MC7448THX1267ND 1267 1.05 V ± 50 mV

MC7448THX1400Nx 1400 1.15 V ± 50 mV

MC7448THX1700LD 1700 1.3 V +20/-50 mV

PPC7448THX1000Nx

PPC7448THX1267NC

PPC7448THX1267ND

PPC7448THX1400Nx

Note:

1. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These
parts have only preliminary reliability and characterization data. Before pilot production prototypes can be shipped, written
authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the
fact that product changes may still occur as pilot production prototypes are shipped.

2See Section 5.1, “DC Electrical Characteristics,” for information regarding V

CPU

Frequency

(MHz)

1

1000 1.0 V ± 50 mV

1

1267 1.1 V ± 50 mV

1

1267 1.05 V ± 50 mV

1

1400 1.15 V ± 50 mV

T

V

DD

2

2

j

(•C)C)

power consumption, extended operating
temperature.

Significant Differences from

Hardware Specifications

specifications for 1400 MHz device.

DD

4 General Parameters

Core power supply 1.3 V (1700L MHz revision level D devices)

1.15 V (1400N MHz devices)

1.1 V (1267N MHz revision level C devices)

1.05 V (1267N MHz revision level D devices)

1.0 V (1000N MHz devices)

Note: See Section 5.1, “DC Electrical Characteristics,” for information regarding VDD
specifications for 1400 MHz device.

5.1 DC Electrical Characteristics

Table 4 provides the recommended operating conditions for the MPC7448 part numbers described here.

NOTE

Table 4 describes the nominal operating conditions of the device. For

information on the operation of the device at supported derated core voltage
conditions, see Section 5.3, “Voltage and Frequency Derating.”

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2

2 Freescale Semiconductor

General Parameters

Table 4. Recommended Operating Conditions

Recommended Value

Characteristic Symbol

1000N MHz

Core supply voltage V

PLL supply voltage AV

Die-junction temperature T

Notes:

1. These are the recommended and tested operating conditions. Some speed grades in addition support voltage derating; see

Section 5.3, “Voltage and Frequency Derating.” Proper device operation outside of these conditions and those specified in
Section 5.3, “Voltage and Frequency Derating,” is not guaranteed.

2. This voltage is the input to the filter discussed in Section 9.2.2, “PLL Power Supply Filtering,” in the hardware specifications
and not necessarily the voltage at the AV

3. VDD and AVDD may be reduced in order to reduce power consumption if further maximum core frequency constraints are
observed. See Section 5.3, “Voltage and Frequency Derating,” for specific information.

DD

DD

j

1.0 V

± 50 mV

1.0 V

± 50 mV

–40to105 –40to105 –40to105 –40to105 –40to105 •CC

DD

1267N MHz

Revision

Level C

1.1 V

± 50 mV

1.1 V

± 50 mV

pin, which may be reduced from VDD by the filter.

3

1267N MHz

Revision

Level D

± 50 mV

± 50 mV

1.05 V

1.05 V

3

1

1400N MHz31700L MHz

1.15 V

± 50 mV

1.15 V

± 50 mV

1.3 V

+20/-50 mV

1.3 V

+20/-50 mV

Unit Notes

V

V2

Table 7 provides the power consumption for the MPC7448 part numbers described by this document; see
Section 11.1, “Part Numbers Addressed by This Specification,” for more information. The MPC7448

RISC Microprocessor Hardware Specifications presents guidelines on the use of these parameters for
system design. For information on power consumption when dynamic frequency switching is enabled, see

Section 9.8.5, “Dynamic Frequency Switching (DFS),” in the hardware specifications.

The power consumptions provided in Table 7 represent the power consumption of each speed grade when
operated at the rated maximum core frequency (see Table 8). Freescale sorts devices by power as well as
by core frequency, and power limits for each speed grade are independent of each other. Each device is
tested at its maximum core frequency only. (Note that Deep Sleep Mode power consumption is
independent of clock frequency.) Operating a device at a frequency lowe r than its rated maximum is fully
supported provided the clock frequencies are within the specifications given in Table 8, and a device
operated below its rated maximum will have lower power consumption. However, inferences should not
be made about a device’ s power consumption based on the power specifications of another (lower) speed
grade. For example, a 1400 MHz device operated at 1267 MHz will not exhibit the same power
consumption as a 1267 MHz device operated at 1267 MHz.

NOTE

The power consumption information in this table applies when the device
operates at the nominal core voltage indicated in Table 4. For power
consumption at derated core voltage conditions, see Section 5.3, “Voltage

and Frequency Derating.”

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2

Freescale Semiconductor 3

General Parameters

Table 7. Power Consumption for MPC7448 at Maximum Rated Frequency

Die

Junction

(Tj) (•C)C)

Typical 65 9.5 8.4 11.0 21.0 W 1, 2

Thermal 105 12.0 10.3 13.7 25.6 W 1, 5

Maximum 105 13.9 12.0 15.9 29.8 W 1, 3

Typical 105 6.5 6.5 8.3 13.0 W 1, 6

Typical 105 6.3 6.3 8.0 12.5 W 1, 6

Deep Sleep Mode (PLL Disabled)

Typical 105 6.0 6.0 7.7 12.0 W 1, 6

Notes:

1. These values specify the power consumption for the core power supply (V
processor bus frequencies and configurations. The values do not include I/O supply power (OV

). OVDD power is system dependent but is typically < 5% of VDD power. Worst case power consumption for

(AV

DD

AV

<13mW.

DD

2. Typical nominal power consumption is an average value measured at the nominal recommended V
65°C while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz. This parameter is not 100%
tested but periodically sampled.

3. Maximum power consumption is the average measured at nominal VDD and maximum operating junction temperature (see

Ta bl e 4) while running an entirely cache-resident, contrived sequence of instructions to keep all the execution units

maximally busy.

4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep mode. As a
result, power consumption for this mode is not tested.

5. Typical thermal power consumption is an average value measured at the nominal recommended V
105°C while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz. This parameter is not 100%
tested but periodically sampled.

6. Typical power consumption for these modes is measured at the nominal recommended V
mode described. This parameter is not 100% tested but is periodically sampled.

7. Power consumption for the 1267 MHz device is intentionally constrained via testing and sorting to assure low power
consumption for this device.

Maximum Processor Core Frequency

(Speed Grade, MHz)

1000N 1267N

Full-Power Mode

Nap Mode

Sleep Mode

7

1400N 1700L

) at nominal voltage and apply to all valid

DD

Unit Notes

) or PLL supply power

DD

(see Ta bl e 4) and

DD

(see Ta bl e 4) and

DD

(see Ta b l e 4 ) and 105°C in the

DD

5.2.1 Clock AC Specifications

Table 8 provides the clock AC timing specifications for the MPC7448 part numbers discussed here.

NOTE

The core frequency information in this table applies when the device
operates at the nominal core voltage indicated in Table 4. For core
frequency specifications at derated core voltage conditions, see Section 5.3,

“Voltage and Frequency Derating.”

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2

4 Freescale Semiconductor

Table 8. Clock AC Timing Specifications

At recommended operating conditions. See Ta bl e 4 .

General Parameters

Maximum Processor Core Frequency (MHz)

Characteristic Symbol

Min Max Min Max Min Max Min Max

Processor frequency

DFS mode disabled

Processor frequency

DFS mode enabled

VCO frequency f

Notes:

1. Caution: The SYSCLK frequency and PLL_CFG[0:5] settings must be chosen such that the resulting SYSCLK (bus)

frequency, processor core frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum
operating frequencies. Refer to the PLL_CFG[0:5] signal description in Section 9.1.1, “PLL Configuration,” in the hardware
specifications for valid PLL_CFG[0:5] settings.

8. This reflects the maximum and minimum core frequencies when the dynamic frequency switching feature (DFS) is disabled.

f

core_DFS

9. Caution: These values specify the maximum processor core and VCO frequencies when the device is operated at the

nominal core voltage. If operating the device at the derated core voltage, the processor core and VCO frequencies must be
reduced. See Section 5.3, “Voltage and Frequency Derating,” for more information.

10.This specification supports the Dynamic Frequency Switching (DFS) feature and is applicable only when one of the DFS

modes (divide-by-2 or divide-by-4) is enabled. When DFS is disabled, the core frequency must conform to the maximum and
minimum frequencies stated for f

provides the maximum and minimum core frequencies in a DFS mode.

f

core

f

core_DFS

VCO

500 1000 500 1267 500 1400 600 1700 MHz 1, 8, 9

250 500 250 633 250 700 300 850 MHz 10

500 1000 500 1267 500 1400 600 1700 MHz 1, 9

.

core

Unit Notes1000N 1267N 1400N 1700L

5.3 Voltage and Frequency Derating

To reduce power consumption, these devices support voltage and frequency derating in which the core
voltage (VDD) may be reduced if the reduced maximum processor core frequency requirements are
observed. The supported derated core voltage, resulting maximum processor core frequency (f
power consumption are provided in Table 11. Only those parameters in Table 11 are affected; all other
parameter specifications are unaffected.

Table 11. Supported Voltage, Core Frequency, and Power Consumption Derating

Maximum Rated
Core Frequency

(Device Marking)

1000N N/A

1267N 1.0 V ± 50 mV 1000 MHz 6.0 W 7.3 W 8.5 W

1400N 1.0 V ± 50 mV 1000 MHz 8.0 W 9.9 W 11.5 W

1700L N/A

Supported
Derated Core
Voltage ( V

Maximum Derated

Core Frequency

)

DD

(f

core

Full-Power Mode Power Consumption

)

Typical Thermal Maximum

core

), and

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2

Freescale Semiconductor 5

Part Numbering and Marking

9.2 Power Supply Design and Sequencing

The power supply design and sequencing requirements of the devices described here are identical to those
described in the MPC7448 RISC Microprocessor Hardware Specifications.

11 Part Numbering and Marking

11.1 Part Numbers Addressed by This Specification

Table 17 provides the ordering information for the MPC7448 parts described in this document.

Table 17. Part Marking Nomenclature

xx

Product

Code

MC

PPC

MC 1700 L: 1.3 V +20/-50 mV

Notes:

1. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These
parts have only preliminary reliability and characterization data. Before pilot production prototypes can be shipped, written
authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the
fact that product changes may still occur as pilot production prototypes are shipped.

7448 T

Part

Identifier

7448 T = Extended

1

Specification

Modifier

Temperature

Device

xx nnnn

Package

HX = HCTE BGA 1000 N: 1.0 V ± 50 mV

Processor

Frequency

1267

Revision C only

1267

Revision D only

1400 N: 1.15 V ± 50 mV

Application Modifier Revision Level

N: 1.1 V ± 50 mV

N: 1.05 V ± 50 mV

m

– 40 to 105 °C

– 40 to 105 °C

– 40 to 105 °C

– 40 to 105 °C

– 40 to 105 °C

x

C: 2.1: PVR = 0x8004_0201
D: 2.2: PVR = 0x8004_0202

D:2.2: PVR = 0x8004_0202

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2

6 Freescale Semiconductor

11.3 Part Marking

Parts are marked as the example shown in Figure 23.

xx7448T
xxnnnnmx

AWLYYWW
MMMMMM

YWWLAZ

7448

Notes:

AWLYYWW is the test code, where YYWW is the date code (YY = year, WW = work week)
MMMMMM is the M00 (mask) number.
YWWLAZ is the assembly traceability code.

Figure 23. Part Marking for BGA Device

BGA

Document Revision History

Document Revision History

Table B provides a revision history for this part number specification.

Table B. Document Revision History

Revision Date Substantive Change(s)

2 04/2007 Added 1700LD device information.

On first page changed title part number from being N application modifier specific (MC7448TxxxnnnnNx)

to generic MC7448Txxnnnnmx.
On first page under Freescale Part Numbers Affected added MC7448THX1700LD.

Ta bl e A : Added a 1700L MHz revision D row.
Section 4, “General Parameters”: Added 1700L MHz revision level D information and added N application

modifier information to the 1000, 1267, and 1400 devices.

Ta bl e 4, Ta b l e 7 , and Ta bl e 8: Added 1700L columns.
Ta bl e 4, Ta b l e 7 , Ta b l e 8 , and Ta bl e 1 1 : Added added N application modifier information to the 1000,

1267, and 1400 column headings.

Ta bl e 11 : Added 1700L row.
Ta bl e 17 : Changed ‘N’ application modifier at top of table to generic ‘m’. Added 1700L information for

revision level D.

Figure 23: Updated part marking replacing ‘N’ application modifier with ‘m’.

1 10/2006 Added revision level D device information.

On first page under Freescale Part Numbers Affected added PPC7448THX1000Nx,

PPC7448THX1267Nx, and PPC7448THX1400Nx.

Ta bl e A and list on first page: x stands for C or D revision level.
Ta bl e A : Added 1267 MHz revision D row and 4 PPC part number rows.
Section 4, “General Parameters”: Added 1267 MHz revision level D information.
Ta bl e 4: Added 1267 MHz revision D only column.
Ta bl e 17 : Added PVR and 1267 information for revision level D, added PPC product code, and footnote 1.

0 6/2006 Initial release.

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2

Freescale Semiconductor 7

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Document Number: MPC7448ECS02AD
Rev. 2
04/2007