Designed for WLL/MMDS/BWA or UMTS driver applications with frequencies
from 1.8 to 3.6 GHz. This device is unmatched and is suitable for use in Class
AB linear base station applications.
• Excellent Phase Linearity and Group Delay Characteristics
• High Gain, High Efficiency and High Linearity
• N Suffix Indicates Lead- Free Terminations. RoHS Compliant.
• In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.
RMATI
MRFG35010NT1
3.5 GHz, 9 W, 12 V
POWER FET
GaAs PHEMT
CASE 466-03, STYLE 1
PLD-1.5
PLASTIC
Table 1. Maximum Ratings
RatingSymbolValueUnit
Drain-Source VoltageV
Total Device Dissipation @ TC = 25°C
Derate above 25°C
Gate- Source VoltageV
RF Input PowerP
HIVE INF
Storage Temperature RangeT
Channel Temperature
Operating Case Temperature RangeT
Table 2. Thermal Characteristics
AR
Thermal Resistance, Junction to CaseR
Table 3. Moisture Sensitivity Level
Per JESD 22-A113, IPC/JEDEC J-STD - 0201260°C
1. For reliable operation, the operating channel temperature should not exceed 150°C.
2. Simulated.
(1)
CharacteristicSymbolValueUnit
Test MethodologyRatingPackage Peak TemperatureUnit
DSS
P
GS
stg
T
ch
θ
D
in
C
JC
15Vdc
(2)
22.7
(2)
0.15
-5Vdc
33dBm
-65 to +150°C
175°C
-20 to +85°C
(2)
6.6
W
W/°C
ARCHIVE INFORMATION
°C/W
Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
RF Device DataFreescale Semiconductor
MRFG35010NT1
1
C
O
O
Table 4. Electrical Characteristics
CharacteristicSymbolMinTypMaxUnit
Saturated Drain Current
(VDS = 3.5 Vdc, VGS = 0 Vdc)
Off State Leakage Current
(VGS = - 0.4 Vdc, VDS = 0 Vdc)
Off State Drain Current
(VDS = 12 Vdc, VGS = -1.9 Vdc)
Off State Current
(VDS = 28.5 Vdc, VGS = -2.5 Vdc)
Gate- Source Cut - off Voltage
(VDS = 3.5 Vdc, IDS = 15 mA)
Quiescent Gate Voltage
(VDS = 12 Vdc, IDQ = 180 mA)
Power Gain
(VDD = 12 Vdc, IDQ = 180 mA, f = 3.55 GHz)
N
Output Power, 1 dB Compression Point
(VDD = 12 Vdc, IDQ = 180 mA, f = 3.55 GHz)
Drain Efficiency
(VDD = 12 Vdc, IDQ = 180 mA, P
f = 3.55 GHz)
Adjacent Channel Power Ratio
(VDD = 12 Vdc, P
f = 3.55 GHz, W- CDMA, 8.5 P/A @ 0.01% Probability,
64 CH, 3.84 MCPS)
RMATI
= 900 mW Avg., IDQ = 180 mA,
out
(TC = 25°C unless otherwise noted)
= 900 mW Avg.,
out
I
DSS
I
GSS
I
DSO
I
DSX
V
GS(th)
V
GS(Q)
G
ps
P1dB—9—W
h
D
ACPR—-43-40dBc
—2.9—Adc
—< 1.0100µAdc
—0.11.0mAdc
—2.015mAdc
-1.2-1.0- 0.7Vdc
-1.2-0.95-0.7Vdc
9.010—dB
2328—%
HIVE INF
AR
MRFG35010NT1
2
ARCHIVE INFORMATION
RF Device Data
Freescale Semiconductor
C
O
O
V
BIAS
C11
C10C9C8C7C6C5C18C17C16C15C14C13C12
C4
C19
V
SUPPLY
Z9
RF
INPUT
Z1Z2Z3Z5Z6Z7Z10 Z11Z13Z14Z17
C1
Z4
C3
C2
R1
Z8
Z12
Z15Z16
C22C21
N
Z10.045″ x 0.689″ Microstrip
Z20.045″ x 0.089″ Microstrip
Z30.020″ x 0.360″ Microstrip
Z40.045″ x 0.029″ Microstrip
Z50.045″ x 0.061″ Microstrip
Z60.045″ x 0.055″ Microstrip
Z70.300″ x 0.125″ Microstrip
Z8, Z100.146″ x 0.070″ Microstrip
Z90.025″ x 0.485″ Microstrip
Z110.400″ x 0.215″ Microstrip
Z120.025″ x 0.497″ Microstrip
Z130.025″ x 0.271″ Microstrip
Z140.025″ x 0.363″ Microstrip
Z150.025″ x 0.041″ Microstrip
Z160.045″ x 0.050″ Microstrip
Z170.045″ x 0.467″ Microstrip
PCBRogers 4350, 0.020″, εr = 3.5
RMATI
Figure 1. 3.5 GHz Test Circuit Schematic
Table 5. 3.5 GHz Test Circuit Component Designations and Values
The following table summarizes revisions to this document.
RevisionDateDescription
7Jan. 2008• Listed replacement part, p. 1
• Added Revision History, p. 9
N
RMATI
HIVE INF
AR
ARCHIVE INFORMATION
RF Device Data
Freescale Semiconductor
MRFG35010NT1
9
C
O
O
How to Reach Us:
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Freescale Semiconductor, Inc. 2006, 2008. All rights reserved.
ARCHIVE INFORMATION
MRFG35010NT1
Document Number: MRFG35010N
Rev. 7, 1/2008
10
RoHS-compliant and/or Pb -free versions of Freescale products have the functionality and electrical
characteristics of their non-RoHS- compliant and/or non-Pb -free counterparts. For further
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RF Device Data
Freescale Semiconductor
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