FREESCALE MPXA 6115AC6U Datasheet

Freescale Semiconductor

Technical Data

MPXA6115A

Rev 4, 10/2007

High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated

The MPXA6115A/MPXH6115A series sensor integrates on-chip, bipolar op
amp circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-chip
integration make the pressure sensor a logical and economical choice for the
system designer.

The MPXA6115A/MPXH6115A series piezoresistive transducer is a state-of­the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor
combines advanced micromachining techniques, thin film metallization, and
bipolar semiconductor processing to provide an accurate, high level analog
output signal that is proportional to applied pressure.

Figure 1 shows a block diagram of the internal circuitry integrated on a

pressure sensor chip.

Features

• Improved Accuracy at High Temperature

• Available in Small and Super Small Outline Packages

• 1.5% Maximum Error over 0° to 85°C

• Ideally suited for Microprocessor or Microcontroller-Based Systems

• Temperature Compensated from -40° to +125°C

• Durable Thermoplastic (PPS) Surface Mount Package

MPXA6115A
MPXH6115A

SERIES

INTEGRATED PRESSURE SENSOR

15 TO 115 kPA (2.2 TO 16.7 psi)

0.2 TO 4.8 V OUTPUT

SMALL OUTLINE PACKAGE

MPXA6115A6U/6T1

CASE 482-01

MPXA6115C6U/C6T1

CASE 482A-01

SUPER SMALL OUTLINE PACKAGE

MPXA6115AC7U

CASE 482C-03

Typical Applications

• Aviation Altimeters

• Industrial Controls

• Engine Control/Manifold Absolute Pressure (MAP)

• Weather Station and Weather Reporting Device Barometers

ORDERING INFORMATION

Device Type Options Case No. MPX Series Order No. Packing Options Device Marking

SMALL OUTLINE PACKAGE

Basic Element Absolute, Element Only 482 MPXA6115A6U Rails MPXA6115A

Absolute, Element Only 482 MPXA6115A6T1 Tape & Reel MPXA6115A

Ported Element Absolute, Axial Port 482A MPXA6115AC6U Rails MPXA6115A

Absolute, Axial Port 482A MPXA6115AC6T1 Tape & Reel MPXA6115A

Absolute, Axial Port 482C MPXA6115AC7U Rails MPXA6115A
SUPER SMALL OUTLINE PACKAGE
Basic Element Absolute, Element Only 1317 MPXH6115A6U Rails MPXH6115A

Absolute, Element Only 1317 MPXH6115A6T1 Tape & Reel MPXH6115A
Ported Element Absolute, Axial Port 1317A MPXH6115AC6U Rails MPXH6115A

Absolute, Axial Port 1317A MPXH6115AC6T1 Tape & Reel MPXH6115A

MPXH6115A6U/6T1

CASE 1317-04

MPXH6115AC6U/C6T1

CASE 1317A-03

© Freescale Semiconductor, Inc., 2007. All rights reserved.

SMALL OUTLINE PACKAGE

PIN NUMBERS

(1)

1 N/C 5 N/C
2 V

S

6 N/C
3 GND 7 N/C
4 V

OUT

8 N/C

1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not
connect to external circuitry or ground. Pin 1 is denoted by the
notch in the lead.

SUPER SMALL OUTLINE PACKAGE

PIN NUMBERS

(1)

1 N/C 5 N/C
2 V

S

6 N/C
3 GND 7 N/C
4 V

OUT

8 N/C

1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not
connect to external circuitry or ground. Pin 1 is denoted by the
notch in the lead

V

S

Sensing
Element

GND

Thin Film

Temperature

Compensation

and

Gain Stage #1

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

Gain Stage #2

and Ground

Reference

Shift

Circuitry

Figure 1. Fully Integrated Pressure Sensor Schematic

Table 1. Maximum Ratings

Maximum Pressure (P1 > P2) P
Storage Temperature T
Operating Temperature T

Output Source Current @ Full Scale Output
Output Sink Current @ Minimum Pressure Offset

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

2. Maximum Output Current is controlled by effective impedance from V

(1)

Rating Symbol Value Units

max

stg

A

(2)

(2)

+0.5mAdc

I

o

Io--0.5mAdc

to Gnd or V

out

to VS in the application circuit.

out

V

OUT

400 kPa

-40° to +125°°C

-40° to +125°°C

MPXA6115A

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Table 2. Operating Characteristics (V

= 5.0 Vdc, T

S

= 25°C unless otherwise noted, P1 > P2)

A

Characteristic Symbol Min Typ Max Unit

Pressure Range P
Supply Voltage

(1)

Supply Current I
Minimum Pressure Offset

@ V

= 5.0 Volts

S

Full Scale Output

@ V

S

Full Scale Span

@ V

S

Accuracy

(3)

= 5.0 Volts

(4)

= 5.0 Volts

(5)

(2)

(0 to 85°C)

(0 to 85°C)

(0 to 85°C)

(0 to 85°C)

V

V

OP

V

S

o

V

off

FSO

FSS

———±1.5 %V

15 — 115 kPa

4.75 5.0 5.25 Vdc

-6.010mAdc

0.133 0.200 0.268 Vdc

4.633 4.700 4.768 Vdc

4.433 4.500 4.568 Vdc

FSS

Sensitivity V/P — 45.9 — mV/kPa
Response Time
Warm-Up Time
Offset Stability

(6)

(7)

(8)

t

R

—1.0—ms
——20—ms
——±0.25 — %V

FSS

1. Device is ratiometric within this specified excitation range.

2. Offset (V

3. Full Scale Output (V

4. Full Scale Span (V

) is defined as the output voltage at the minimum rated pressure.

off

) is defined as the output voltage at the maximum or full rated pressure.

FSO

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

minimum rated pressure.

5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:

• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum

or maximum rated pressure at 25°C.

• TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

• TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.

7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.

8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

MPXA6115A

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Freescale Semiconductor 3

.

Fluoro Silicone

Gel Die Coat

Die

P1

Wire Bond

Lead

Frame

Absolute Element

Sealed Vacuum Reference

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Figure 2. Cross Sectional Diagram SSOP (Not to Scale)

5.0
Transfer Function:

4.5
V

= Vs* (.009*P-.095) ± Error

out

4.0

V

= 5.0 Vdc

S

TEMP = 0 to 85ºC

3.5

3.0

2.5

2.0

Output (Volts)

1.5

1.0

0.5

0

5

101520253035404550

Pressure (ref: to sealed vacuum) in kPa

+5.0 V

VS Pin 2

100 nF

MPXA6115A
MPXH6115A

GND Pin 3

Figure 3. Typical Application Circu it

(Output Source Current Operation)

MAX

MIN

556065707580859095

100

to ADC

Pin 4

V

out

105

TYP

110

115

47 pF

120

51 K

Figure 4. Output versus Absolute Pressure

Figure 2 illustrates the absolute sensing chip in the basic

Super Small Outline chip carrier (Case 1317).

Figure 3 shows a typical application circuit (output source

current operation).

Figure 4 shows the sensor output signal relative to

pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85×C temperature
range. The output will saturate outside of the rated pressure
range.

A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXA6115A/
MPXH6115A series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information
regarding media compatibility in your application.

MPXA6115A

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Transfer Function (MPXA6115A/MPXH6115A)

Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095)

± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc

Temperature Error Band

4.0

3.0

Temperature

Error

Factor

2.0

1.0

0.0

NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC

Pressure Error Band

3.0

2.0

1.0

0.0

-1.0

Pressure Error (kPa)

-2.0

-3.0

MPXA6115A/MPXH6115A SERIES

Break Points

Temp Multiplier

- 40 3

0 to 85 1

125 1.75

-40 -20 0 20 40 60
Temperature in Cº

Error Limits for Pressure

20

40 60 80 100 120

14012010080

Pressure (in kPa)

Pressure Error (Max)

15 to 115 (kPa) ±1.5 (kPa)

MPXA6115A

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Freescale Semiconductor 5

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.

0.100 TYP

0.660

16.76

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch
mm

Figure 5. SOP Footprint (Case 482)

0.150

3.81

0.050

1.27
TYP

0.387

9.83

0.027 TYP 8X

0.69

0.053 TYP 8X

1.35

inch

mm

Figure 6. SSOP Footprint (Case 1317 and 1317A)

MPXA6115A

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6 Freescale Semiconductor

PACKAGE DIMENSIONS

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

MPXA6115A

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PACKAGE DIMENSIONS

CASE 482C-03

ISSUE B

SMALL OUTLINE PACKAGE

MPXA6115A

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8 Freescale Semiconductor

PACKAGE DIMENSIONS

CASE 1317-04

ISSUE F

SUPER SMALL OUTLINE PACKAGE

MPXA6115A

Sensors
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PACKAGE DIMENSIONS

CASE 1317-04

ISSUE F

SUPER SMALL OUTLINE PACKAGE

MPXA6115A

Sensors

10 Freescale Semiconductor

PACKAGE DIMENSIONS

CASE 1317-04

ISSUE F

SUPER SMALL OUTLINE PACKAGE

MPXA6115A

Sensors
Freescale Semiconductor 11

PACKAGE DIMENSIONS

CASE 1317A-04

ISSUE D

SUPER SMALL OUTLINE PACKAGE

MPXA6115A

Sensors

12 Freescale Semiconductor

PACKAGE DIMENSIONS

CASE 1317A-04

ISSUE D

SUPER SMALL OUTLINE PACKAGE

MPXA6115A

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Freescale Semiconductor 13

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© Freescale Semiconductor, Inc. 2007. All rights reserved.

MPXA6115A
Rev. 4
10/2007