FREESCALE MPX 5010DP Datasheet
Freescale Semiconductor
MPX5010
Series
0 to 10 kPa (0 to 1.45 psi)
(0 to 1019.78 mm H2O)
0.2 to 4.7 V Output
MPXV5010
MPVZ5010
Data Sheet: Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPxx5010 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques,
thin-film metallization, and bipolar processing to provide an accurate, high
level analog output signal that is proportional to the applied pressure. The
axial port has been modified to accommodate industrial grade tubing.
Features
• 5.0% Maximum Error over 0 to 85C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over -40 to +125C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
• Available in Surface Mount (SMT) or Through-hole (DIP) Configurations
Pressure
MPX5010
Rev 13, 10/2012
Application Examples
• Hospital Beds
•HVAC
• Respiratory Systems
• Process Control
• Washing Machine Water Level
Measurement (Reference AN1950)
• Ideally Suited for Microprocessor or
Microcontroller-Based Systems
• Appliance Liquid Level and Pressure
Measurement
ORDERING INFORMATION
Device Name Case No.
Unibody Package (MPX5010 Series)
MPX5010DP
MPX5010GP
MPX5010GS
MPX5010GSX
Small Outline Package (MPXV5010 Series)
MPXV5010DP
MPXV5010G6U
MPXV5010GC6T1
MPXV5010GC6U
MPXV5010GC7U
MPXV5010GP
Small Outline Package (Media Resistant Gel) (MPVZ5010 Series)
MPVZ5010G6U
MPVZ5010G7U
MPVZ5010GW6U
MPVZ5010GW7U
867C • • MPX5010DP
867B • • MPX5010GP
867E • • MPX5010D
867F • • MPX5010D
1351 • • MPXV5010DP
482 • • MPXV5010G
482A • • MPXV5010G
482A • • MPXV5010G
482C • • MPXV5010G
1369 • • MPXV5010GP
482 • • MPVZ5010G
482B • • MPVZ5010G
1735 • • MZ5010GW
1560 • • MZ5010GW
None Single Dual Gauge Differential Absolute
# of Ports Pressure Type
Device
Marking
© 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved.
Pressure
MPXV5010GC6U/C6T1
CASE 482A-01
MPXV5010GC7U
CASE 482C-03
MPXV5010DP
CASE 1351-01
MPXV5010GP
CASE 1369-01
MPX5010GSX
CASE 867F-03
MPX5010GP
CASE 867B-04
MPX5010DP
CASE 867C-05
MPX5010GS
CASE 867E-03
UNIBODY PACKAGES
SMALL OUTLINE PACKAGES THROUGH-HOLE
SMALL OUTLINE PACKAGES SURFACE MOUNT
MPXV5010G6U,
MPVZ5010G6U
CASE 482-01
MPVZ5010G7U
CASE 482B-03
MPVZ5010GW6U
CASE 1735-01
MPVZ5010GW7U
CASE 1560-02
J
MPX5010
Sensors
2 Freescale Semiconductor, Inc.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 3 required to meet specification.)
Characteristic Symbol Min Typ Max Unit
Pressure Range P
Supply Voltage
(1)
Supply Current I
Minimum Pressure Offset
@ V
= 5.0 Volts
S
Full Scale Output
@ V
= 5.0 Volts
S
Full Scale Span
@ V
= 5.0 Volts
S
Accuracy
(3)
(4)
(5)
(2)
(0 to 85C)
(0 to 85C)
(0 to 85C)
(0 to 85C)
OP
V
S
o
V
off
V
FSO
V
FSS
———5.0 %V
Sensitivity V/P — 450
0—10
1019.78
4.75 5.0 5.25 Vdc
—5.010mAdc
0 0.2 0.425 Vdc
4.475 4.7 4.925 Vdc
4.275 4.5 4.725 Vdc
—mV/mm
4.413
Response Time
(6)
Output Source Current at Full Scale Output I
Warm-Up Time
Offset Stability
(7)
(8)
t
O+
R
—1.0— ms
—0.1—mAdc
——20— ms
——0.5 — %V
1. Device is ratiometric within this specified excitation range.
2. Offset (V
3. Full Scale Output (V
4. Full Scale Span (V
) is defined as the output voltage at the minimum rated pressure.
off
) is defined as the output voltage at the maximum or full rated pressure.
FSO
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V
, at 25°C.
FSS
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
kPa
mm H
FSS
mV/mm H
FSS
O
2
O
2
MPX5010
Sensors
Freescale Semiconductor, Inc. 3
Pressure
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
S
V
out
GND
Pins 1 and 5 through 8 are NO CONNECTS
for small outline package.
Pins 4, 5, and 6 are NO CONNECTS for
unibody package.
2 (SOP)
3 (Unibody)
1 (Unibody)
4 (SOP)
2 (Unibody)
3 (SOP)
Maximum Ratings
Table 2. Maximum Ratings
Maximum Pressure (P1 > P2) P
Storage Temperature T
Operating Temperature T
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
(1)
Rating Symbol Value Unit
max
stg
A
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
40 kPa
–40 to +125 C
–40 to +125 C
Figure 1. Fully Integrated Pressure Sensor Schematic
MPX5010
4 Freescale Semiconductor, Inc.
Sensors
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Fluoro Silicone
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Differential Sensing
Element
P2
+5 V
1.0 F
0.01 F
470 pFGND
V
s
V
out
IPS
OUTPUT
Lead
Frame
Differential Pressure (kPa)
Output (V)
5.0
4.0
3.0
2.0
0
4.0 10
2.0
Transfer Function (kPa):
V
out
= VS (0.09 P + 0.04) ± 5.0% V
FSS
VS = 5.0 Vdc
TEMP = 0 to 85C
MIN
TYPICAL
08.0
6.0
1.0
MAX
Pressure
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 3 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPxx5010G series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effect s on sen so r
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 5 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0 to 85C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Sensors
Freescale Semiconductor, Inc. 5
Figure 4. Output vs. Pressure Differential
MPX5010
Pressure
Nominal Transfer Value: V
out
= VS x (0.09 x P + 0.04)
± (Pressure Error x Temp. Factor x 0.09 x V
S
)
V
S
= 5.0 V 0.25 Vdc
Transfer Function
Temp Multiplier
–40 3
0 to 85 1
+125 3
Temperature in C
4.0
3.0
2.0
0.0
1.0
–40 –20 0 20 40 60
14012010080
Temperature
Error
Factor
NOTE: The Temperature Multiplier is a linear response from 0 to –40C and from 85 to 125C.
Temperature Error Band
Pressure Error (Max)
Pressure Error Band
0 to 10 (kPa) ±0.5 (kPa)
Pressure (kPa)
0.5
0.4
0.2
–0.3
–0.4
–0.5
0
123456
7 890
0.3
0.1
–0.2
–0.1
10
Pressure
Error
(kPa)
MPX5010
6 Freescale Semiconductor, Inc.
Sensors
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
Pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Part Number Case Type
MPX5010DP 867C Side with Part Marking
MPX5010GP 867B Side with Port Attached
MPX5010GS 867E Side with Port Attached
MPX5010GSX 867F Side with Port Attached
MPXV5010G6U 482 Stainless Steel Cap
MPXV5010GC6U/6T1 482A Side with Port Attached
MPXV5010GC7U 482C Side with Port Attached
MPXV5010GP 1369 Side with Port Attached
MPXV5010DP 1351 Side with Part Marking
MPVZ5010G6U
MPVZ5010G7U
MPVZ5010GW6U
MPVZ5010GW7U
482
482B
1735
1560
Stainless Steel Cap
Stainless Steel Cap
Vertical Port Attached
Vertical Port Attached
Pressure (P1)
Side Identifier
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Figure 5. SOP Footprint (Case 482)
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
MPX5010
Sensors
Freescale Semiconductor, Inc. 7
Pressure
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) A
S
T
-A-
-B-
N
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 5.380.2300.212 5.84
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0˚ 7˚ 0˚ 7˚
N 0.405 0.415 10.29 10.54
S 0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0 7 0 7
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
TYPICAL DRAFT.
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010) A
S
T
–A–
–B–
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
–T–
N
V
W
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
PACKAGE DIMENSIONS
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
MPX5010
8 Freescale Semiconductor, Inc.
CASE 482A-0
SMALL OUTLINE PACKAGE
ISSUE A
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