Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPxx5010 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques,
thin-film metallization, and bipolar processing to provide an accurate, high
level analog output signal that is proportional to the applied pressure. The
axial port has been modified to accommodate industrial grade tubing.
Features
• 5.0% Maximum Error over 0 to 85C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over -40 to +125C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
• Available in Surface Mount (SMT) or Through-hole (DIP) Configurations
Pressure
MPX5010
Rev 13, 10/2012
Application Examples
• Hospital Beds
•HVAC
• Respiratory Systems
• Process Control
• Washing Machine Water Level
Measurement (Reference AN1950)
• Ideally Suited for Microprocessor or
Microcontroller-Based Systems
1. Device is ratiometric within this specified excitation range.
2. Offset (V
3. Full Scale Output (V
4. Full Scale Span (V
) is defined as the output voltage at the minimum rated pressure.
off
) is defined as the output voltage at the maximum or full rated pressure.
FSO
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V
, at 25°C.
FSS
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
kPa
mm H
FSS
mV/mm H
FSS
O
2
O
2
MPX5010
Sensors
Freescale Semiconductor, Inc.3
Pressure
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
V
S
V
out
GND
Pins 1 and 5 through 8 are NO CONNECTS
for small outline package.
Pins 4, 5, and 6 are NO CONNECTS for
unibody package.
2 (SOP)
3 (Unibody)
1 (Unibody)
4 (SOP)
2 (Unibody)
3 (SOP)
Maximum Ratings
Table 2. Maximum Ratings
Maximum Pressure (P1 > P2)P
Storage TemperatureT
Operating TemperatureT
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
(1)
RatingSymbolValueUnit
max
stg
A
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 3 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPxx5010G series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effect s on sen so r
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 5 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0 to 85C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Sensors
Freescale Semiconductor, Inc.5
Figure 4. Output vs. Pressure Differential
MPX5010
Pressure
Nominal Transfer Value: V
out
= VS x (0.09 x P + 0.04)
± (Pressure Error x Temp. Factor x 0.09 x V
S
)
V
S
= 5.0 V 0.25 Vdc
Transfer Function
TempMultiplier
–403
0 to 851
+1253
Temperature in C
4.0
3.0
2.0
0.0
1.0
–40–200204060
14012010080
Temperature
Error
Factor
NOTE: The Temperature Multiplier is a linear response from 0 to –40C and from 85 to 125C.
Temperature Error Band
Pressure Error (Max)
Pressure Error Band
0 to 10 (kPa) ±0.5 (kPa)
Pressure (kPa)
0.5
0.4
0.2
–0.3
–0.4
–0.5
0
123456
7890
0.3
0.1
–0.2
–0.1
10
Pressure
Error
(kPa)
MPX5010
6Freescale Semiconductor, Inc.
Sensors
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
Pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Part NumberCase Type
MPX5010DP867CSide with Part Marking
MPX5010GP867BSide with Port Attached
MPX5010GS867ESide with Port Attached
MPX5010GSX867FSide with Port Attached
MPXV5010G6U482Stainless Steel Cap
MPXV5010GC6U/6T1482ASide with Port Attached
MPXV5010GC7U482CSide with Port Attached
MPXV5010GP1369Side with Port Attached
MPXV5010DP1351Side with Part Marking
MPVZ5010G6U
MPVZ5010G7U
MPVZ5010GW6U
MPVZ5010GW7U
482
482B
1735
1560
Stainless Steel Cap
Stainless Steel Cap
Vertical Port Attached
Vertical Port Attached
Pressure (P1)
Side Identifier
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Figure 5. SOP Footprint (Case 482)
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.