FREESCALE MPX 4250DP Datasheet

Page 1

Pressure

Freescale Semiconductor

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

The MPX4250 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the Freescale sensor a logical and economical choice for the automotive system engineer.

Features

• Differential and Gauge Applications Available

• 1.4% Maximum Error Over 0° to 85°C

• Patented Silicon Shear Stress Strain Gauge

• Temperature Compensated Over –40° to +125°C

• Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules

• Durable Epoxy Unibody Element

MPX4250

Rev 7, 1/2009

MPX4250

Series

0 to 250 kPa (0 to 36.3 psi)

0.2 to 4.9 V Output

Application Examples

• Ideally Suited for Microprocessor or Microcontroller-Based Systems

Device Name

Unibody Package (MPX4250 Series)

MPX4250D MPX4250GP MPX4250DP

Package

Options

Tray 867 Tray 867B Tray 867C

MPX4250D

CASE 867

Case

No.

ORDERING INFORMATION

# of Ports Pressure Type

None Single Dual Gauge Differential Absolute

• •

UNIBODY PACKAGES

MPX4250GP

CASE 867B

MPX4250DP

CASE 867C

Device Marking

MPX4250D MPX4250GP MPX4250DP

Page 2

Pressure

Operating Characteristics

Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.

Decoupling circuit shown in Figure 3 required to meet electrical specifications.)

Characteristic Symbol Min Typ Max Unit

Pressure Range Supply Voltage Supply Current I Minimum Pressure Offset @ V Full Scale Output @ V Full Scale Span @ V Accuracy Sensitivity ΔV/ΔP — 18.8 —- mV/kPa

Response Time Output Source Current at Full Scale Output I Warm-Up Time

Offset Stability

(1)

(2)

= 5.1 Volts

(6)

(7)

(8)

(9)

(5)

(3)

(4)

(0 to 85°C) (0 to 85°C) (0 to 85°C) (0 to 85°C)

off

FSO

FSS

———±1.4 %V

0 — 250 kPa

4.85 5.1 5.35 Vdc — 7.0 10 mAdc

0.139 0.204 0.269 Vdc

4.844 4.909 4.974 Vdc — 4.705 — Vdc

FSS

—1.0—-ms —0.1—-mAdc

——20—-ms ——±0.5 —- %V

FSS

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range.

3. Offset (V

4. Full Scale Output (V

5. Full Scale Span (V minimum rated pressure.

) is defined as the output voltage at the minimum rated pressure.

off

) is defined as the output voltage at the maximum or full rated pressure.

FSO

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the

minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. T cOf fset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V

, at 25°C.

FSS

7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.

8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

MPX4250

Sensors

2 Freescale Semiconductor

Page 3

Maximum Ratings

Pressure

Table 2. Maximum Ratings

Maximum Pressure (P1 > P2) P Storage Temperature T Operating Temperature T

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

(1)

Rating Symbol Value Unit

MAX

STG

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Sensing Element

Thin Film

Temperature

Compensation

and

Gain Stage #1

Gain Stage #2

and

Ground

Reference

Shift Circuitry

1000 kPa –40 to +125 °C –40 to +125 °C

out

GND

Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices.

Figure 1. Fully Integrated Pressure Sensor Schema ti c

MPX4250

Sensors Freescale Semiconductor 3

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Pressure

On-chip Temperature Compensation and Calibration

Figure 2 illustrates the differential/gauge pressure sensing

chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.

The MPX4250 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor

Fluoro Silicone

Die Coat

Die

Wire Bond

Lead Frame

Figure 2. Cross Sectional Diagram (not to scale)

performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range

Stainless Steel

Metal Cover

Epoxy Case

RTV Die Bond

+5.1 V

Output

470 pFGND

1.0 μF

0.01 μF

out

IPS

Figure 3. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1535)

5.0 Transfer Function:

4.5 V

= Vs* (0.00369*P + 0.04) ± Error

out

4.0

= 5.1 Vdc

Temperature = 0 to 85°C

3.5

3.0

2.5

2.0

Output (Volts)

1.5

1.0

0.5

MAX

102030405060708090

100

110

120

130

Pressure in kPa

140

MIN

150

160

170

180

190

TYP

200

210

220

230

240

250

260

Figure 4. Output versus Absolute Pressure

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Transfer Function (MPX4250)

Pressure

Nominal Transfer Value: V

Temperature Error Band

4.0

3.0

Temperature

Error

Factor

2.0

1.0

0.0

NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.

= VS x (0.00369 x P + 0.04)

out

± (Pressure Error x Temp. Factor x 0.00369 x V V

= 5.1 ± 0.25 Vdc

Temp Multiplier

–40 3

0 to 85 1

+125 3

–40 –20 0 20 40 60

Temperature in °C

)

14012010080

Pressure Error Band

Pressure

Error (kPa)

5.0

4.0

3.0

2.0

1.0

–1.0 –2.0 –3.0 –4.0 –5.0

75 100 125 150 175 200 22525 50 250

Pressure Error (Max)

0 to 250 kPa ±3.45 kPa

Pressure

(kPa)

MPX4250

Sensors Freescale Semiconductor 5

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Pressure

PACKAGE DIMENSIONS

POSITIVE PRESSURE

J S

-A-

SEATING PLANE

STYLE 1:

PIN 1. VOUT

2. GROUND

3. VCC

4. V1

5. V2

6. VEX

PIN 1

-T-

123456

STYLE 2:

PIN 1. OPEN

(P1)

6 PL

0.136 (0.005) T

2. GROUND

3. -VOUT

4. VSUPPLY

5. +VOUT

6. OPEN

STYLE 3:

PIN 1. OPEN

NOTES:

2. GROUND

3. +VOUT

4. +VSUPPLY

5. -VOUT

6. OPEN

DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH.

2. DIMENSION -A- IS INCLUSIVE OF THE MOLD

3. STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

MILLIMETERSINCHES

DIM

MIN

0.595

0.514

0.200

0.027

0.048

0.100 BSC 2.54 BSC

0.014

0.695 30˚ NOM 30˚ NOM

M N

0.475

0.430

0.090

MAX

0.630

0.534

0.220

0.033

0.064

0.016

0.725

0.495

0.450

0.105

MAX

MIN

16.00

15.11

13.56

13.06

5.59

5.08

0.84

0.68

1.63

1.22

0.40

0.36

18.42

17.65

12.57

12.07

11.43

10.92

2.29 2.66

BASIC ELEMENT (D)

CASE 867-08

ISSUE N

PORT #1

POSITIVE

PRESSURE

(P1)

PORT #2

VACUUM

(P2)

SEATING

PLANE

0.25 (0.010) T

-T- -T-

-A-

PORT #2 VACUUM (P2)

PORT #1 POSITIVE PRESSURE (P1)

-Q-

SEATING PLANE

PIN 1

123456

6 PL

0.13 (0.005)

PRESSURE AND VACUUM SIDE DUAL PORTED (DP)

CASE 867C-05

ISSUE F

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93

W 0.310 0.330 7.87 8.38

X 0.248 0.278 6.30 7.06

STYLE 1:

PIN 1. VOUT

2. GROUND

3. V

4. V1

5. V2

6. V

MILLIMETERSINCHES

MPX4250

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PACKAGE DIMENSIONS

Pressure

PAGE 1 OF 2

PRESSURE SIDE PORTED (GP)

CASE 867B-04

ISSUE G

MPX4250

Sensors Freescale Semiconductor 7

Page 8

Pressure

PACKAGE DIMENSIONS

PAGE 2 OF 2

PRESSURE SIDE PORTED (GP)

CASE 867B-04

ISSUE G

MPX4250

Sensors

8 Freescale Semiconductor

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MPX4250 Rev. 7 1/2009