FREESCALE MPX 2200AP Datasheet

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Freescale Semiconductor

Technical Data

MPX2200

Rev 11, 12/2006

200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors

The MPX2200 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc.

Features

• Temperature Compensated Over 0°C to + 85°C

• ±0.25% Linearity (MPX2200D)

• Easy-to-Use Chip Carrier Package Options

• Available in Absolute, Differential and Gauge Configurations

Typical Applications

• Pump/Motor Controllers

• Robotics

• Level Indicators

• Medical Diagnostics

• Pressure Switching

• Barometers

• Altimeters

MPX2200

SERIES

0 TO 200 kPA (0 TO 29 psi)

40 mV FULL SCALE SPAN

(TYPICAL)

UNIBODY PACKAGES

MPX2200A/D CASE 344-15

MPX2200AP/GP

CASE 344B-01

ORDERING INFORMATION

Device

Type

Basic Element

Ported Elements

1. MPX2200 series pressure sensors are available in absolute, differential and gauge

Absolute, Differential 344 MPX2200A

Differential 344C MPX2200DP MPX2200DP

Absolute, Gauge 344B MPX2200AP

Gauge, Vacuum 344D MPX2200GVP MPX2200GVP

configurations. Devicesare available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections.

Options Case No.

(1)

MPX Series

Order Number

MPX2200D

MPX2200GP

Device

Marking

MPX2200A MPX2200D

MPX2200AP MPX2200GP

MPX2200DP

CASE 344C-01

MPX2200GVP

CASE 344D-01

PIN NUMBER

1. Pin 1 in noted by the notch in the lead.

GND

OUT

-V

OUT

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Thin Film

Temperature

Compensation

and

Calibration

Circuitry

Sensing Element

GND

Figure 1. Temperature Compensation Pressure Sensor Schematic

VOLTAGE OUTPUT VS. APPLIED DIFFERENTIAL PRESSURE

The differential voltage output of the sensor is directly proportional to the differential pressure applied.

The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side.

The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure

Table 1. Maximum Ratings

Maximum Pressure (P1 > P2) P

Storage Temperature T

Operating Temperature T

(1)

Rating Symbol Value Unit

(P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side.

Figure 1 illustrates a block diagram of the internal circuitry

on the stand-alone pressure sensor chip.

MAX

STG

OUT

-V

OUT

800 kPa

-40 to +125 °C

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

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Table 2. Operating Characteristics (V

= 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)

Characteristic Symbol Min Typ Max Units

Differential Pressure Range

Supply Voltage

(2)

(1)

Supply Current I

Full Scale Span

(4)

Offset

(3)

FSS

OFF

0 — 200 kPa

— 10 16 V

— 6.0 — mAdc

38.5 40 41.5 mV

-1.0 — 1.0 mV

Sensitivity ∆V/∆Ρ — 0.2 — mV/kPa

Linearity

(5)

MPX2200D Series MPX2200A Series

Pressure Hysteresis

Temperature Hysteresis

Temperature Coefficient of Full Scale Span

Temperature Coefficient of Offset

(5)

(0 to 200 kPa)

(5)

(- 40°C to +125°C)

(5)

Input Impedance Z

Output Impedance Z

Response Time

(6)

(10% to 90%)

— -0.25

-1.0

— —

0.25

1.0

— — ±0.1 — %V

— — ±0.5 — %V

TCV

OUT

FSS

OFF

-1.0 — 1.0 %V

-1.0 — 1.0 mV

1300 — 2500 W

1400 — 3000 W

— 1.0 — ms

FSSl

FSS

Warm-Up Time — — 20 — ms

Offset Stability

(7)

— — ±0.5 — %V

FSS

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating.

3. Full Scale Span (V minimum related pressure.

4. Offset (V

) is defined as the output voltage at the minimum rated pressure.

OFF

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

5. Accuracy (error budget) consists of the following:

• Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified

pressure range.

• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

• Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum

or maximum rated pressure at 25°C.

• TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.

• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.

6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.

7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

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LINEARITY

Linearity refers to how well a transducer's output follows

= V

the equation: V

OUT

+ sensitivity x P over the operating

OFF

pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the

Least Squares Fit

Exaggerated Performance Curve

End Point Straight Line Fit

Relative Voltage Output

Offset

“best case” linearity error (lower numerical value), the calculations required are burdensome.

Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.

Least Square Deviation

Straight Line Deviation

50 100

Pressure (% Fullscale)

Figure 2. Linearity Specification Comparison

ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION

Figure 3 shows the output characteristics of the MPX2102/

MPXV2102G series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line.

VS = 10 VDCTA = 25°C

P1 > P2

)

Output (mV

-5

0 50 100 150 200kPa

PSI 7.25 14.5 21.75 29

MAX

TYP

MIN

Pressure

The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics.

Span

Range

(TYP)

1751257525

Offset

(TYP)

Figure 3. Output vs. Pressure Differential

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Silicone Gel Die Coat

Wire Bond

Differential/Gauge Die

Stainless Steel Metal Cover

Epoxy

Case

Wire Bond

Silicone Gel

Die Coat

Absolute

Die

Stainless Steel

Metal Cover

Epoxy

Case

Lead Frame

Differential/Gauge

Element

Bond Die

Figure 4. Cross Sectional Diagrams (Not to Scale)

Figure 4 illustrates an absolute sensing die (right) and the

differential or gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the

environment, while allowing the pressure signal to be

transmitted to the silicon diaphragm.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die from the environment. The differential

or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side.

The Pressure (P1) side may be identified by using

Figure 3.

Lead Frame

Absolute Element

Die

Bond

The MPX2200 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.

Table 3. Pressure (P1) Side Delineation

Part Number Case Type Pressure (P1) Side Identifier

MPX2200A/D 344 Stainless Steep Cap

MPX2200DP 344C Side with Part Marking

MPX2200AP/GP 344B Side with Port Attached

MPX2200GVP 344D Stainless Steep Cap

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PACKAGE DIMENSIONS

-A-

PIN 1

1234

-T-

SEATING

PLANE

4 PL

0.136 (0.005) T

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

STYLE 2:

PIN 1. V

2. - SUPPLY

3. + SUPPLY

4. GROUND

DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL

STYLE 3:

PIN 1. GND

2. -VOUT

3. VS

4. +VOUT

NOTES:

DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.

2. DIMENSION -A- IS INCLUSIVE OF THE MOLD

3. STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

DIM MIN MAX MIN MAX

A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00

MILLIMETERSINCHES

CASE 344-15

ISSUE AA

UNIBODY PACKAGE

SEATING

PLANE

-T-

-A-

PORT #1

POSITIVE

PRESSURE

(P1)

PIN 1

12 34

-P-

0.25 (0.010) T

D 4 PL

0.13 (0.005) Q

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH.

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

MILLIMETERSINCHES

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16

-Q-

C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC

STYLE 1: PIN 1. GROUND

CASE 344B-01

ISSUE B

UNIBODY PACKAGE

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PACKAGE DIMENSIONS

PORT #2

SEATING PLANE

-T- -T-

PORT #1

-A-

PORT #2

VACUUM (P2)

PORT #1 POSITIVE PRESSURE (P1)

-Q-

SEATING

PLANE

PIN 1

-P-

0.25 (0.010) T

0.13 (0.005) Q

12 43

4 PL

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

MILLIMETERSINCHES

CASE 344C-01

ISSUE B

UNIBODY PACKAGE

NOTES:

-A-

SEATING

-T-

PLANE

PORT #2 VACUUM (P2)

POSITIVE PRESSURE (P1)

-Q-

12 34

PIN 1

-P-

0.25 (0.010) T

G D 4 PL

0.13 (0.005) Q

1.2.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51

F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93

J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42

L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.158 3.89 4.04 R 0.230 0.250 5.84 6.35 S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

MILLIMETERSINCHES

CASE 344D-01

ISSUE B

UNIBODY PACKAGE

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MPX2200 Rev. 11 12/2006