FREESCALE MPX 2100AP Datasheet

Pressure

Freescale Semiconductor

+

100 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors

The MPX2100 series devices silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output directly proportional to
the applied pressure. The sensor is a single, monolithic silicon diaphragm
with the strain gauge and a thin-film resistor network integrated on-chip.
The chip is laser trimmed for precise span and offset calibration an
temperature compensation.

Features

• Temperature Compensated Over 0°C to +85°C

• Available in Absolute, Differential and Gauge Configurations

• Easy to Use Chip Carrier Package Options

• Ratiometric to Supply Voltage

• ±0.25% Linearity (MPX2100D Series)

MPX2100

Rev 10, 10/2008

MPX2100

Series

0 to 100 kPa (0 to 14.5 psi)

40 mV Full Scale Span

(Typical)

Application Examples

• Pump/Motor Controllers

• Robotics

• Level Indicators

• Medical Diagnostics

• Pressure Switching

• Barometers

Device Name

Unibody Package (MPX2100 Series)

MPX2100A
MPX2100D
MPX2100AP
MPX2100GP
MPX2100DP
MPX2100GVP
MPX2100ASX

MPX2100A/D
CASE 344-15

Package

Options

Tray 344
Tray 344
Tray 344B
Tray 344B
Tray 344C
Tray 344D
Tray 344F

MPX2100AP/GP

CASE 344B-01

Case

No.

ORDERING INFORMATION

# of Ports Pressure Type

None Single Dual Gauge Differential Absolute

• •

• •

• •

• •

• •

• •

• •

PACKAGES

MPX2100DP

CASE 344C-01

MPX2100GVP

CASE 344D-01

MPX2100ASX

CASE 344F-01

Device

Marking

MPX2100A

MPX2100D
MPX2100AP
MPX2100GP
MPX2100DP

MPX2100GVP

MPX2100A

© Freescale Semiconductor, Inc., 2002, 2008. All rights reserved.

Pressure

Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.

V

S

3

Thin Film

Temperature

Sensing
Element

GND

Compensation

and Calibration

Circuitry

1

Figure 1. Temperature Compensated Pressure Sensor Schematic

Voltage Output versus Applied Differential Pressure

The differential voltage output of the sensor is directly

proportional to the differential pressure applied.

The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.

The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).

2

+V

OUT

4

-V

OUT

MPX2100

Sensors

2 Freescale Semiconductor

Operating Characteristics

Table 1. Operating Characteristics

(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

Characteristics Symbol Min Typ Max Unit

Pressure Range
Supply Voltage

Supply Current

Full Scale Span

(4)

Offset

Sensitivity

Linearity

Pressure Hysteresis
Temperature Hysteresis
Temperature Effect on Full Scale Span
Temperature Effect on Offset

Input Impedance
Output Impedance

Response Time
Warm-Up

Offset Stability

(1)

(2)

(3)

MPX2100D Series

MPX2100A Series

(5)

MPX2100D Series

MPX2100A Series

(5)

(0 to 100 kPa)

(5)

(-40°C to +125°C)

(5)

(5)

(6)

(10% to 90%)

(7)

Pressure

P

OP

V

S

I

o

V

FSS

V

off

ΔV/ΔP— 0.4 —mV/kPa

—
—

——± 0.1 — %V
——± 0.5 — %V

TCV

FSS

TCV

off

Z

in

Z

out

t

R

——20—ms
——± 0.5 — %V

0—100kPa
—1016Vdc
—6.0—mAdc

38.5 40 41.5 mV

-1.0

-2.0

-0.25

-1.0

-1.0 — 1.0 %V

—
—

—
—

1.0

2.0

0.25

1.0

%V

mV

FSS

FSS

FSS

FSS

-1.0 — 1.0 mV

1000 — 2500 Ω
1400 — 3000 Ω

—1.0—ms

FSS

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.

3. Full Scale Span (V
minimum rated pressure.

4. Offset (V

) is defined as the output voltage at the minimum rated pressure.

off

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

5. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified

pressure range.

T emperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and

from the minimum or maximum operating temperature points, with zero differential pressure applied.

Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum

or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.

6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.

7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

MPX2100

Sensors
Freescale Semiconductor 3

Pressure

Maximum Ratings

Table 2. Maximum Ratings

Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

(1)

Rating Symbol Value Unit

P

max

T

stg

T

A

LINEARITY

Linearity refers to how well a transducer's output follows

= V

the equation: V

out

pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the

+ sensitivity x P over the operating

off

Least Squares Fit

Exaggerated
Performance
Curve

calculations required are burdensome.

Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.

Relative Voltage Output

400 kPa

-40 to +125 °C

-40 to +125 °C

Straight Line
Deviation

Deviation

End Point
Straight Line Fit

Least

Square

Offset

0 50 100

Pressure (% Fullscale)

Figure 2. Linearity Specification Comparison

MPX2100

Sensors

4 Freescale Semiconductor

On-Chip Temperature Compensation and Calibration

Pressure

Figure 3 shows the output characteristics of the

MPX2100 series at 25°C. The output is directly proportional
to the differential pressure and is essentially a straight line.

VS = 10 Vdc

40

T

= 25°C

35
30
25
20
15

Output (mVdc)

10

-5

kPa
PSI

A

P1 > P2

MAX

5
0

025

3.62

TYP

Figure 3. Output versus Pressure Differential

Silicone Gel
Die Coat

Wire Bond

Differential/Gauge
Die

P1

Stainless Steel
Metal Cover

Epoxy

Case

50

7.25

The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.

Span

Range

(Typ)

MIN

75

10.87

Wire Bond

14.5

Silicone Gel
Die Coat

100

Offset

(Typ)

Absolute

Die

P1

Stainless Steel
Metal Cover

Epoxy

Case

Lead Frame

Differential/Gauge

P2

Element

Bond
Die

Figure 4. Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the absolute sensing configuration

(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.

Lead Frame

Absolute Element

P2

Die

Bond

The MPX2100 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.

MPX2100

Sensors
Freescale Semiconductor 5

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die. The differential or gauge sensor is
designed to operate with positive differential pressure

Part Number Case Type Pressure (P1) Side Identifier

MPX2100A, MPX2100D
MPX2100DP
MPX2100AP, MPX2100GP
MPX2100ASX
MPX2100GVP

344
344C
344B
344F
344D

applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.

The Pressure (P1) side may be identified by using the

table below:

Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Side with Port Attached
Stainless Steel Cap

MPX2100

Sensors

6 Freescale Semiconductor

PACKAGE DIMENSIONS

Pressure

C

R

M

1

B

-A-

23

4

N

PIN 1

1234

L

-T-

SEATING

J

PLANE

F

D

4 PL

0.136 (0.005) T

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

G

M

M

A

STYLE 2:

PIN 1. V

2. - SUPPLY

3. + SUPPLY

4. GROUND

F

DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL

CC

Y

STYLE 3:

PIN 1. GND

2. -VOUT

3. VS

4. +VOUT

NOTES:

DIMENSIONING AND TOLERANCING PER ASME

1.
Y14.5M, 1994.

2.

CONTROLLING DIMENSION: INCH.

3.

DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED

Z

16.00 (0.630).

DIM MIN MAX MIN MAX

A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M 30˚ NOM 30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
Y 0.048 0.052 1.22 1.32
Z 0.106 0.118 2.68 3.00

MILLIMETERSINCHES

CASE 344-15

ISSUE AA

UNIBODY PACKAGE

SEATING

PLANE

-T-

R

-A-

U

L

H

N

PORT #1

POSITIVE

PRESSURE

(P1)

B

PIN 1

12 34

-P-

0.25 (0.010) T

M

J

C

S

Q

F

G

D 4 PL

0.13 (0.005) Q

S

M

S

S

T

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

MILLIMETERSINCHES

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16

-Q-

K

S

C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.230 0.250 5.84 6.35
S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC

STYLE 1:
PIN 1. GROUND

CASE 344B-01

ISSUE B

UNIBODY PACKAGE

MPX2100

Sensors
Freescale Semiconductor 7

Pressure

PACKAGE DIMENSIONS

PORT #2

SEATING
PLANE

R

V

-T- -T-

J

C

B

PORT #1

N

SEATING

PLANE

-P-

PORT #2
VACUUM
(P2)

PIN 1

0.25 (0.010) T

M

S

Q

F

M

0.13 (0.005) Q

S

T

-A­U

W

L

H

PORT #1
POSITIVE PRESSURE
(P1)

12 43

S

G

4 PL

D

S

S

CASE 344C-01

ISSUE B

UNIBODY PACKAGE

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16

-Q-

K

C 0.405 0.435 10.29 11.05
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11

0.220 0.240 5.59 6.10

S
U 0.910 BSC 23.11 BSC
V 0.248 0.278 6.30 7.06

W 0.310 0.330 7.87 8.38

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

MILLIMETERSINCHES

V

PORT #1
POSITIVE
PRESSURE

(P1)

R

-Q-

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.080 1.120 27.43 28.45
B 0.740 0.760 18.80 19.30
C 0.630 0.650 16.00 16.51

B

D 0.016 0.020 0.41 0.51
E 0.160 0.180 4.06 4.57
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
K

0.220 0.240 5.59 6.10

N 0.070 0.080 1.78 2.03
P 0.150 0.160 3.81 4.06
Q 0.150 0.160 3.81 4.06
R 0.440 0.460 11.18 11.68
S 0.695 0.725 17.65 18.42
U 0.840 0.860 21.34 21.84
V 0.182 0.194 4.62 4.92

STYLE 1:

PIN 1. GROUND

2. V (+) OUT

3. V SUPPLY

4. V (-) OUT

MILLIMETERSINCHES

C

E

A

U

N

-T-

-P-

0.25 (0.010) T

M

M

Q

4321

PIN 1

S

K

J

F

4 PL

D

0.13 (0.005) Q

G

M

S

P

T

S

CASE 344F-01

ISSUE B

UNIBODY PACKAGE

MPX2100

Sensors

8 Freescale Semiconductor

Pressure

PACKAGE DIMENSIONS

NOTES:

-A-

SEATING

-T-

PLANE

R

PORT #2
VACUUM
(P2)

N

U

L

H

POSITIVE
PRESSURE
(P1)

-Q-

B

12 34

PIN 1

K

S

C

-P-

J

0.25 (0.010) T

F

M

S

Q

G
D 4 PL

0.13 (0.005) Q

M

T

S

S

1.2.DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.158 3.89 4.04
R 0.230 0.250 5.84 6.35
S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC

STYLE 1:

S

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

MILLIMETERSINCHES

CASE 344D-01

ISSUE B

UNIBODY PACKAGE

MPX2100

Sensors
Freescale Semiconductor 9

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MPX2100
Rev. 10
10/2008