Freescale MM908E425AIDWB User Manual

Freescale Semiconductor

Advance Information

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Integrated Quad Half H-Bridge

Document Number: MM908E425

Rev. 1.0, 8/2006

with Power Supply, Embedded
MCU, and LIN Serial
Communication

The 908E425 is an integrated single-package solution including a
high-performance HC08 microcontroller with a SMARTMOS
analog control IC. The HC08 includes Flash Memory, a timer,
Enhanced Serial Communications Interface (ESCI), an Analog-to­Digital Converter (ADC), Serial Peripheral Interface (SPI) (only
internal), and an Internal Clock Generator (ICG) module. The analog
control die provides fully protected H-Bridge/high-side outputs,
voltage regulator, autonomous watchdog with cyclic wake-up, and
Local Interconnect Network (LIN) physical layer.

The single-package solution, together with LIN, provides optimal
application performance adjustments and space-saving PCB design.
It is well suited for the control of automotive mirror, door lock, and
light-levelling applications.

Features

• High-Performance M68HC908EY16 Core

• 16 K Bytes of On-Chip Flash Memory

• 512 Bytes of RAM

• Internal Clock Generation Module

• Two 16-bit, 2-Channel Timers

• 10-Bit Analog-to-Digital Converter

• LIN Physical Layer

• Autonomous Watchdog with Cyclic Wakeup

• Three Two-Pin Hall-Effect Sensor Input Ports

• One Analog Input with Switchable C urr en t So urce

• Four Low RDS (ON) Half-Bridge Outputs

• One Low RDS (ON) High-Side Output

• 13 Micro Controller I/Os

3

VSUP

ARCHIVE INFORMATION

LIN
VREFH
VDDA
EVDD
VDD

VREFL
VSSA
EVSS
VSS

RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF

TM

908E425

GND

2

EP

MM908E425AIDWB

HB1

HB2
HB3
HB4

HS

HVDD

H1
H2
H3

PA1

PORT A I/OS
PORT B I/OS
PORT C I/OS

908E425

H-BRIDGE POWER SUPPLY WITH

EMBEDDED MCU AND LIN

DWB SUFFIX

98ASA10712D

54-PIN SOICWB-EP

ORDERING INFORMATION

Device

M M M

High-Side

Switchable Internal

2-Terminal Hall-Effect

Analog Input with

Current Source

Microcontroller

4 Half-Bridges
Controlling
3 Loads

Output

V

Output

DD

Three

Sensor Inputs

Ports

Temperature

Range (T

0°C to 85°C 54 SOICW EP

)

A

ARCHIVE INFORMATION

Package

Figure 1. 908E425 Simplified Application Diagram

* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.

© Freescale Semiconductor, Inc., 2006. All rights reserved.

BLOCK DIAGRAM

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GND1-2

VSUP1-3

RST_A

IRQ_A

BEMF

FGEN

LIN

RXD

VSS

Voltage

VDD

Regulator

Layer

LIN Physical

HVDD

Driver &

Diagnostic

Switched VDD

Module

Reset Control

BLOCK DIAGRAM

HS

VSUP

High Side

FGEN

Interrupt

Driver &

Diagnostic

Control

Module

VSUP

Half Bridge

FGEN

HB1

Driver &

Diagnostic

BEMF

SPI

VSUP

FGEN

&

HB2

Driver &

Half Bridge

CONTROL

Diagnostic

BEMF

VSUP

FGEN

HB3

Driver &

Diagnostic

Half Bridge

BEMF

VSUP

FGEN

Watchdog

Autonomous

HB4

Driver &

Diagnostic

Half Bridge

BEMF

Chip Temp

H1H2H3

VSUP

Prescaler

Hall-Effect

Sensor Inputs

Analog

Analog Input

Multiplexer

PA1

Source

with Current

ARCHIVE INFORMATION

PTD1/TACH1

PTD0/TACH0

ARCHIVE INFORMATION

SS

PTE1/RXD

PTB1/AD1

RST

IRQ

VREFL

VSSA

EVSS

EVDD

VDDA

VREFH

TXD

PTE0/TXD

Break Module

5-Bit Keyboard

Interrupt Module

Single Breakpoint

Internal Bus

ALU

M68HC08 CPU

CPU

Registers

Control and Status Register,

2-channel Timer

2-Channel Timer

Interface Module A

Interface Module B

64 Bytes

User RAM, 512 Bytes

Monitor ROM, 310 Bytes

User Flash, 15,872 Bytes

Flash Programming (burn in)

Communication

Enhanced Serial

Interface Module

Computer Operating

Internal Clock

Generator Module

36 Bytes

ROM, 1024 Bytes

User Flash Vector Space,

OSC2

OSC1

SS

MISO

PTC0/MISO

Properly Module

Interface Module

Serial Pheripheral

Integration Module

24 Internal System

RST

MOSI

SPSCK

PTC1/MOSI

PTA5/SPSCK

Module

Timebase Module

Periodic Wake-Up

Configuration Register

Module

Module

Digital Converter

10 Bit Analog-to-

Single External IRQ

IRQ

VDDA

VREFL

VSSA

VREFH

Arbiter Module

POWER

VDD

VSS

BEMF Module

Prescaler Module

Module

Security Module

Power-On Reset

PTC4/OSC1

PTC3/OSC2

PTC2/MCLK

PTC1/MOSI

PORT CPORT D

DDRCDDRD

PTA6/SS

PTA3/KBD3

PTA4/KBD4

PTA5/SPSCK

PTC0/MISO

DDRA

PORT A

PTA2/KBD2

PTA1/KBD1

PTA0/KBD0

ADOUT

PTB0/AD0

PTD1/TACH1

PTD0/TACH0

PTB5/AD5

PTB6/AD6/TBCH0

PTB7/AD7/TBCH1

PTE1/RxD

DDRB

PORT B

PTB4/AD4

PTB3/AD3

PTB2/AD2

MCU Die Analog Die

PTE0/TxD

PORT E

DDRE

PTB1/AD1

PTB0/AD0

PTA0/KBD0

PTA1/KBD1

PTA2/KBD2

PTA3/KBD3

PTB3/AD3

PTA4/KBD4

PTB5/AD5

PTB4/AD4

PTC2/MCLK

PTB6/AD6/TBCH0

PTB7/AD7/TBCH1

PTC3/OSC2

FLSVPP

PTC4/OSC1

Figure 2. 908E425 Simplified Internal Block Diagram

908E425

Analog Integrated Circuit Device Data

2 Freescale Semiconductor

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PIN CONNECTIONS

PIN CONNECTIONS

PTB7/AD7/TBCH1
PTB6/AD6/TBCH0

PTC4/OSC1
PTC3/OSC2

PTC2/MCLK

PTB5/AD5
PTB4/AD4
PTB3/AD3

IRQ

RST

PTB1/AD1

PTD0/TACH0/BEMF

PTD1/TACH1

NC
FGEN
BEMF

RST_A

IRQ_A

SS

LIN

NC

NC

HB1

VSUP1

GND1

HB2

VSUP2

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27

Exposed

Pad

54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28

PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VREFH
VDDA
EVDD
EVSS
VSSA
VREFL
PTE1/RXD
RXD
VSS
PA1
VDD
H1
H2
H3
HVDD
NC
HB4
VSUP3
GND2
HB3
HS

ARCHIVE INFORMATION

Table 1. 908E425 Pin Definitions

A functional description of each pin can be found in the Functional Pin Description section beginning on page 14.

Figure 3. 908E425 Pin Connections (Transparent Package Top View)

Pin Function Pin Pin Name Formal Name Definition

MCU 1

MCU 3

MCU 9 IRQ External Interrupt

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MCU 10 RST External Reset

MCU 12

– 14, 21, 22, 33 NC No Connect

MCU 42 PTE1/ RXD Port E I /O

MCU 43

2
6
7
8

11

4
5

13

48

PTB7/AD7/TBCH1
PTB6/AD6/TBCH0

PTB5/AD5
PTB4/AD4
PTB3/AD3
PTB1/AD1

PTC4/OSC1
PTC3/OSC2
PTC2/MCLK

PTD0/TACH0/BEMF

PTD1/TACH1

VREFL

VREFH

ADC References

Port B I/Os

Port C I/Os

Input

Port D I /Os

These pins are special-function, bidirectional I/O port pins that
are shared with other functional modules in the MCU.

These pins are special-function, bidirectional I/O port pins that
are shared with other functional modules in the MCU.

This pin is an asynchronous external interrupt input pin.

This pin is bidirectional, allowing a reset of the entire system. It
is driven low when any internal reset source is asserted.

These pins are special-function, bidirectional I /O port pins that
are shared with other functional modules in the MCU.

Not connected.
This pin is a special-function, bidirectional I/O port pin that can

is shared with other functional modules in the MCU.
These pins are the reference voltage pins for the analog-to-

digital converter (ADC).

908E425

Analog Integrated Circuit Device Data
Freescale Semiconductor 3

PIN CONNECTIONS

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Table 1. 908E425 Pin Definitions (continued)

A functional description of each pin can be found in the Functional Pin Description section beginning on page 14.

Pin Function Pin Pin Name Formal Name Definition

MCU 44

47

MCU 45

46

MCU 49

MCU 51 FLSVPP Test Pin

Analog 15 FGEN Current Limitation

Analog 16 BEMF Back Electromagnetic

Analog 17 RST_A Internal Reset
Analog 18 IRQ_A Internal Interrupt

Analog 19 SS Slave Select
Analog 20 LIN LIN Bus
Analog 23

Analog 24

Analog 25

Analog 28 HS High-Side Output
Analog 34 HVDD Switchable

Analog 35

Analog 38 VDD Voltage Regulator

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Analog 39 PA1 Analog Input
Analog 40 VSS Voltage Regulator

Analog 41 RXD LIN Transceiver

– EP Exposed Pad Exposed Pad

50
52
53
54

26
29
32

27
31

30

36
37

VSSA

VDDA

EVSS

EVDD

PTA4/KBD4
PTA3/KBD3
PTA2/KBD2
PTA1/KBD1
PTA0/KBD0

HB1
HB2
HB3
HB4

VSUP1
VSUP2
VSUP3

GND1
GND2

H3
H2
H1

ADC Supply

MCU Power Supply

Port A I /Os

Frequency Input

Force Output

Output

Half-Bridge Outputs

Power Supply Pins

Power Ground Pins

V

DD

Hall-Effect Sensor

Output

Ground

Output

Pins

Pins

Output

Inputs

These pins are the power supply pins for the analog-to-digital
converter.

These pins are the ground and power supply pins, respectively.
The MCU operates from a single power supply.

These pins are special-function, bidirectional I/O port pins that
are shared with other functional modules in the MCU.

For test purposes only. Do not connect in the application.
This is the input pin for the half-bridge current limitation and the

high-side inrush current limiter PWM frequency.
This pin gives the user information about back electromagnetic

force (BEMF).
This pin is the bidirectional reset pin of the analog die.
This pin is the interrupt output pin of the analog die indicating

errors or wake-up events.
This pin is the SPI slave select pin for the analog chip.
This pin represents the single-wire bus transmitter and receiver.
This device includes power MOSFETs configured as four half-

bridge driver outputs. These outputs may be configured for step
motor drivers, DC motor drivers, or as high-side and low-side
switches.

These pins are device power supply pins.

These pins are device power ground connections.

This output pin is a low R
This pin is a switchable VDD output for driving resistive loads

requiring a regulated 5.0
sensors.

These pins provide inputs for Hall-effect sensors and switches.

The + 5.0 V voltage regulator output pin is intended to supply
the embedded microcontroller.

This pin is an analog input port with selectable source values.
Ground pin for the connection of all non-power ground

connections (microcontroller and sensors).
This pin is the output of LIN transceiver.

The exposed pad pin on the bottom side of the package
conducts heat from the chip to the PCB board.

high-side switch.

DS(ON)

V supply; e.g., 3-pin Hall-effect

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908E425

Analog Integrated Circuit Device Data

4 Freescale Semiconductor

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

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ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings Symbol Value Unit

ELECTRICAL RATINGS

Supply Voltage

Analog Chip Supply Voltage under Normal Operation, Steady State

(1)

(5)

= 200 pF, R

ZAP

ZAP

Analog Chip Supply Voltage under Transient Conditions
Microcontroller Chip Supply Voltage

Input Pin Voltage

Analog Chip
Microcontroller Chip

Maximum Microcontroller Current per Pin

All Pins Except VDD, VSS, PTA0 : PTA6, PTC0 : PTC1

Pins PTA0 : PTA6, PTC0 : PTC1
Maximum Microcontroller VSS Output Current
Maximum Microcontroller VDD Input Current
LIN Supply Voltage

Normal Operation (Steady-State)

Transient Conditions
ESD Voltage

Human Body Model (HBM)

Machine Model (MM)

Charge Device Model (CDM)

THERMAL RATINGS

Storage Temperature
Ambient Operating Temperature
Operating Case Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Solder Mounting

Notes

1. Transient capability for pulses with a time of t < 0.5 sec.

ARCHIVE INFORMATION

2. ESD voltage testing is performed in accordance with the Human Body Model (C

3. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.

4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because

5. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause

(2)

performed in accordance with the Machine Model (C
Charge Device Model, robotic (C

of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.

malfunction or permanent damage to the device.

(1)

(3)

(4)

= 4.0 pF).

ZAP

V

SUP(SS)

V

SUP(PK)

V

DD

V

(ANALOG)

IN

V

(MCU)

IN

I

(1)

PIN

I

(2)

PIN

I

MVSS

I

MVDD

V

BUS(SS)

V

BUS(DYNAMIC)

V

ESD

T

STG

T

A

T

C

T

J

T

SOLDER

= 100 pF, R

ZAP

= 0 Ω, ESD voltage testing is performed in accordance with

- 0.3 to 28

- 0.3 to 40

- 0.3 to 6.0

- 0.3 to 5.5

- 0.3 to VDD + 0.3

V

SS

±15
± 25

100 mA
100 mA

-18 to 28
40

± 3000

± 150
± 500

– °C
0 to 85 °C
0 to 85 °C

0 to 125 °C

245 °C

= 1500 Ω), ESD voltage testing is

ZAP

ARCHIVE INFORMATION

V

V

mA

V

V

908E425

Analog Integrated Circuit Device Data
Freescale Semiconductor 5

ELECTRICAL CHARACTERISTICS

STATIC ELECTRICAL CHARACTERISTICS

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STATIC ELECTRICAL CHARACTERISTICS

Table 3. Static Electrical Characteristics

All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the

microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V

≤ 16 V, 0°C ≤ TJ ≤ 125°C unless otherwise noted.

SUP

Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic Symbol Min Typ Max Unit

SUPPLY VOLTAGE

Nominal Operating Voltage

SUPPLY CURRENT

NORMAL Mode

V

= 12 V, Power Die ON (PSON = 1), MCU Operating Using

SUP

Internal Oscillator at 32
ADC Enabled

STOP Mode

V

SUP

DIGITAL INTERFACE RATINGS (ANALOG DIE)

Output Pins RST_A, IRQ_A

Low-State Output Voltage (I
High-State Output Voltage (I

Output Pins BEMF, RXD

Low-State Output Voltage (I
High-State Output Voltage (I

Output Pin RXD – Capacitance
Input Pins RST_A, FGEN, SS

Input Logic Low Voltage

Input Logic High Voltage
Input Pins RST_A, FGEN, SS – Capacitance
Pins RST_A, IRQ_A – Pullup Resistor
Pin SS – Pullup Resistor
Pins FGEN, MOSI, SPSCK – Pulldown Resistor
Pin TXD – Pullup Current Source

Notes

6. STOP mode current will increase if V

7. This parameter is guaranteed by process monitoring but is not production tested.

(6)

= 12 V, Cyclic Wake-Up Disabled

MHz (8.0 MHz Bus Frequency), SPI, ESCI,

= - 1.5 mA)

OUT

= 1.0 μA)

OUT

= - 1.5 mA)

OUT

= 1.5 mA)

OUT

(7)

(7)

exceeds 15 V.

SUP

V

SUP

I

RUN

I

STOP

V

OL

V

OH

V

OL

V

OH

C

IN

V

IL

V

IH

C

IN

R

PULLUP

R

PULLUP

R

PULLDOWN

I

PULLUP

8.0 – 18 V

–

–

–

3.85

–

3.85
– 4.0 – pF

–

3.5
– 4.0 – pF

1
2

– 10 – kΩ
– 60 – kΩ
– 60 – kΩ
– 35 – μA

20

–

–

–
–

–
–

–
–

60

0.4
–

0.4
–

1.5
–

mA

μA

V

V

V

ARCHIVE INFORMATION

ARCHIVE INFORMATION

908E425

Analog Integrated Circuit Device Data

6 Freescale Semiconductor

STATIC ELECTRICAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

查询"MM908E425"供应商

Table 3. Static Electrical Characteristics (continued)

All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic Symbol Min Typ Max Unit

≤ 16 V, 0°C ≤ TJ ≤ 125°C unless otherwise noted.

SUP

SYSTEM RESETS AND INTERRUPTS

High-Voltage Reset

Threshold
Hysteresis

Low-Voltage Reset

Threshold
Hysteresis

High-Voltage Interrupt

Threshold
Hysteresis

Low-Voltage Interrupt

Threshold
Hysteresis

High-Temperature Reset
Threshold
Hysteresis

High-Temperature Interrupt

Threshold
Hysteresis

VOLTAGE REGULATOR

Normal Mode Output Voltage

I

= 60 mA, 6.0 V < V

OUT

Load Regulation

I

= 80 mA, V

OUT

STOP Mode Output Voltage (Maximum Output Current 100 μA)

LIN PHYSICAL LAYER

Output Low Level

TXD LOW, 500 Ω Pullup to V

Output High Level

TXD HIGH, I

Pullup Resistor to V

ARCHIVE INFORMATION

Leakage Current to GND

Recessive State (- 0.5 V < V

Leakage Current to GND (V

Including Internal Pullup Resistor, V
Including Internal Pullup Resistor, V

Notes

8. This parameter is guaranteed by process monitoring but is not production tested.

9. High-Temperature Interrupt (HTI) threshold is linked to High-Temperature Reset (HTR) threshold (HTR = HTI + 10°C).

OUT

(8)

(9)

< 18 V

SUP

= 9.0 V, TJ = 125°C

SUP

SUP

= 1.0 μA

SUP

< V

LIN

Disconnected)

SUP

SUP

LIN
LIN

)

@ -18 V
@ +18 V

V

HVRON

V

HVRH

V

LVRON

V

LVRH

V

HVION

V

HVIH

V

LVION

V

LVIH

T

RON

T

RH

T

ION

T

IH

V

DDRUN

V

LR

V

DDSTOP

V

LIN-LOW

V

LIN-HIGH

R

SLAVE

I

BUS_PAS_

I

BUS_NO_GND

I

BUS

rec

27

–

3.6
–

17.5
–

6.5
–

–

5.0

–

5.0

4.75 5.0 5.25

– – 100

4.5 4.7 4.9 V

– – 1.4

V

- 1.0 – –

SUP

20 30 60 kΩ

0.0 – 20

–
–

30

1.5

4.0

100

21

1.0

–

0.4

170

–

160

–

- 600
25

33

4.5

23

8.0

V

ARCHIVE INFORMATION

–

V

–

–

–

–
–

–
–

–
–

mV

V

V

°C

°C

V

mV

V

V

μA

μA

908E425

Analog Integrated Circuit Device Data
Freescale Semiconductor 7

ELECTRICAL CHARACTERISTICS

STATIC ELECTRICAL CHARACTERISTICS

查询"MM908E425"供应商

Table 3. Static Electrical Characteristics (continued)

All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic Symbol Min Typ Max Unit

≤ 16 V, 0°C ≤ TJ ≤ 125°C unless otherwise noted.

SUP

LIN PHYSICAL LAYER (continued)

LIN Receiver

Recessive
Dominant
Threshold
Input Hysteresis

LIN Wake-Up Threshold

HIGH-SIDE OUTPUT (HS)

Switch ON Resistance @ TJ = 25°C with I
High-Side Overcurrent Shutdown

HALF-BRIDGE OUTPUTS (HB1:HB4)

Switch ON Resistance @ TJ = 25°C with I

High Side

Low Side
High-Side Overcurrent Shutdown
Low-Side Overcurrent Shutdown
Low-Side Current Limitation @ TJ = 25°C

Current Limit 1 (CLS2 = 0, CLS1 = 1, CLS0 = 1)

Current Limit 2 (CLS2 = 1, CLS1 = 0, CLS0 = 0)

Current Limit 3 (CLS2 = 1, CLS1 = 0, CLS0 = 1)

Current Limit 4 (CLS2 = 1, CLS1 = 1, CLS0 = 0)

Current Limit 5 (CLS2 = 1, CLS1 = 1, CLS0 = 1)
Half-Bridge Output HIGH Threshold for BEMF Detection

Half-Bridge Output LOW Threshold for BEMF Detection
Hysteresis for BEMF Detection
Low-Side Current-to-Voltage Ratio (V

CSA = 1

CSA = 0

SWITCHABLE VDD OUTPUT (HVDD)

Overcurrent Shutdown Threshold

V

DOWN-SCALER

SUP

ARCHIVE INFORMATION

Voltage Ratio (RATIO

INTERNAL DIE TEMPERATURE SENSOR

Voltage / Temperature Slope
Output Voltage @ 25°C

VSUP

= V

SUP

/ V

LOAD

LOAD

ADOUT

ADOUT

[V] / IHB [A])

)

= 1.0 A

= 1.0 A

V

IH

V

IL

V

ITH

V

IHY

V

WTH

R

DS(ON)HS

I

HSOC

R

DS(ON)HB_HS

R

DS(ON)HB_LS

I

HBHSOC

I

HBLSOC

I

CL1

I

CL2

I

CL3

I

CL4

I

CL5

V

BEMFH

V

BEMFL

V

BEMFHY

RATIO

RATIO

I

HVDDOCT

RATIO

VSUP

S

TtoV

V

T25

V

ARCHIVE INFORMATION

0.6 V

LIN

0.0
–

0.01 V

SUP

– V

– 600 700 mΩ

3.9 – 7.0 A

–
–

4.0–7.5

2.8–7.5A

–

210
300
450
600

–- 300 V
– - 60 - 5.0 mV
–30–mV

H
L

7.0

1.0

24 30 40 mA

4.8 5.1 5.35 –

–19–mV/ °C

1.7 2.1 2.5 V

V

–
–

SUP

–

SUP

425
400

55
260
370
550
740

12

2.0

V

SUP

0.4 V

/ 2

/ 2 – V

–

0.1 V

500
500

–
315
440
650
880

14

3.0

LIN

SUP

mΩ

A

mA

V/A

908E425

Analog Integrated Circuit Device Data

8 Freescale Semiconductor

STATIC ELECTRICAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

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Table 3. Static Electrical Characteristics (continued)

All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic Symbol Min Typ Max Unit

≤ 16 V, 0°C ≤ TJ ≤ 125°C unless otherwise noted.

SUP

HALL-EFFECT SENSOR INPUTS (H1: H3)

Output Voltage

V

< 16.2 V

SUP

V

> 16.2 V

SUP

Sense Current

Threshold

Hysteresis
Output Current Limitation
Overcurrent Warning HP_OCF Flag Threshold]
Dropout Voltage @ I

ANALOG INPUT (PA1)

Current Source PA1

CSSEL1 = 1, CSSEL0 = 1
Selectable Scaling Factor Current Source PA1 (I(N) = I

CSSEL1 = 0, CSSEL0 = 0

CSSEL1 = 0, CSSEL0 = 1

CSSEL1 = 1, CSSEL0 = 0

LOAD

= 15 mA

CSPA1

* N)

V

HALL1

V

HALL2

I

HSCT

I

HSCH

I

V

HPOCT

V

HPDO

I

CSPA1

N

CSPA1-0

N

CSPA1-1

N

CSPA1-2

HL

–
–

6.9
–

– 90 – mA
– 3.0 – V
– 0.5 – V

570 670 770

8.5

28.5

58.5

V

SUP

8.8

0.88

10
30
60

–

- 1.2

–

15

11

–

11.5

31.5

61.5

V

mA

μA

%

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908E425

Analog Integrated Circuit Device Data
Freescale Semiconductor 9

ELECTRICAL CHARACTERISTICS

DYNAMIC ELECTRICAL CHARACTERISTICS

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DYNAMIC ELECTRICAL CHARACTERISTICS

Table 4. Dynamic Electrical Characteristics

All characteristics are for the analog chip only. Please refer to the specification for 68HC908EY16 for characteristics of the

≤ V

microcontroller chip. Characteristics noted under conditions 9.0 V
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.

Characteristic Symbol Min Typ Max Unit

LIN PHYSICAL LAYER

Propagation Delay

TXD LOW to LIN LOW
TXD HIGH to LIN HIGH
LIN LOW to RXD LOW
LIN HIGH to RXD HIGH
TXD Symmetry
RXD Symmetry

Output Falling Edge Slew Rate

80% to 20%

Output Rising Edge Slew Rate

20% to 80%, R

LIN Rise / Fall Slew Rate Symmetry

HALL-EFFECT SENSOR INPUTS (H1:H3)

Propagation Delay

AUTONOMOUS WATCHDOG (AWD)

AWD Oscillator Period
AWD Period Low = 512 t
AWD Period High = 256 t
AWD Cyclic Wake-Up On Time

Notes

10. All LIN characteristics are for initial LIN slew rate selection (20 kBaud) (SRS0 : SRS1= 00).

11. See Figure 2.

12. See Figure 3.

(10), (11)

> 1.0 kΩ, C

BUS

OSC

OSC

(10), (12)

(10), (12)

BUS

(10), (12)

< 10 nF

≤ 16 V, 0°C ≤ TJ ≤ 125°C unless otherwise noted.

SUP

t

TXD-LIN-

t

TXD-LIN-

t

LIN-RXD-

t

LIN-RXD-

t

TXD-SYM

t

RXD-SYM

SR

SR

SR

t

HPPD

t

OSC

t

AWDPH

t

AWDPL

t

AWDHPON

low

high

low

high

F

R

S

–
–
–
–

- 2.0

- 2.0

-1.0 - 2.0 - 3.0

1.0 2.0 3.0

- 2.0 – 2.0 μs

– 1.0 – μs

– 40 – μs

16 22 28 ms

8.0 11 14 ms
– 90 – μs

4.0

4.0

–
–

–
–

6.0

6.0

8.0

8.0

2.0

2.0

μs

V/μs

V/μs

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908E425

Analog Integrated Circuit Device Data

10 Freescale Semiconductor

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MICROCONTROLLER

Table 5. Microcontroller Description

For a detailed microcontroller description, refer to the MC68HC908EY16 data sheet.

ELECTRICAL CHARACTERISTICS

MICROCONTROLLER

Module Description

Core High-Performance HC08 Core with a Maximum Internal Bus Frequency of 8.0 MHz
Timer Two 16-Bit Timers with Two Channels (TIM A and TIM B)
Flash 16 K Bytes
RAM 512 Bytes
ADC 10-Bit Analog-to-Digital Converter
SPI SPI Module
ESCI Standard Serial Communication Interface (SCI) Module

Bit-Time Measurement
Arbitration

Prescaler with Fine Baud-Rate Adjustment
ICG Internal Clock Generation Module (25% Accuracy with Trim Capability to 2%)
BEMF Counter Special Counter for SMARTMOS™ BEMF Output

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Freescale Semiconductor 11

ELECTRICAL CHARACTERISTICS

TIMING DIAGRAMS

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TIMING DIAGRAMS

t

t

Tx-LIN-low

TXD-LIN-LOW

TXD

Tx

TXD

LIN

LIN

Recessive State Recessive State

0.4 VSUP

0.4 V

SUP

Rx

RXD

t

t

LIN-RXD-LOW

LIN-Rx-low

Figure 4. LIN Timing Description

t

t

TXD-LIN-HIGH

Tx-LIN-high

0.9 V

0.9 VSUP

SUP

0.1 V

0.1 VSUP

Dominant State

SUP

0.6 V

0.6 VSUP

SUP

t

t

LIN-RXD-HIGH

LIN-Rx-high

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Δt Fall-time Δt Rise-time

0.8 V

0.8 VSUP

SUP

0.2 V

0.2 VSUP

SUP

SRF =

ΔV Fall ΔV Rise

Dominant State

ΔV Fall

Δt Fall-time

Figure 5. LIN Slew Rate Description

SRR =

Δt Rise-time

ΔV Rise

0.8 VSUP

0.8 V

SUP

0.2 V

0.2 VSUP

SUP

908E425

Analog Integrated Circuit Device Data

12 Freescale Semiconductor

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ELECTRICAL PERFORMANCE CURVES

ELECTRICAL CHARACTERISTICS

ELECTRICAL PERFORMANCE CURVES

1.6

1.4

1.2

TJ = 25°C

1.0

0.8

0.6

0.4

Forward Voltage (V)

0.2

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
(A)

250

200

I

LOAD

Figure 6. Free Wheel Diode Forward Voltage vs I

H-Bridge Low Side

LOAD

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(mA )

TA = 125°C

TA = 25°C

TA = 0°C

150

100

Drop Out Voltage (mV)

50

0

0 5 10 15 20 25

I

Load

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Figure 7. Dropout Voltage on HVDD vs I

Analog Integrated Circuit Device Data
Freescale Semiconductor 13

LOAD

908E425

FUNCTIONAL DESCRIPTION

INTRODUCTION

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FUNCTIONAL DESCRIPTION

INTRODUCTION

The 908E425 device was designed and developed as a
highly integrated and cost-effective solution for automotive
and industrial applications. For automotive body electronics,
the 908E425 is well suited to perform complete mirror, door
lock, and light-levelling control all via a three-wire LIN bus.

This device combines an standard HC08 MCU core
(68HC908EY16) with flash memory together with a

SMARTMOS

combines power and control in one chip. Power switches are
provided on the SMARTMOS

™ IC chip. The SMARTMOS™ IC chip

™ IC configured as half-bridge

FUNCTIONAL PIN DESCRIPTION

See Figure 1 for a graphic representation of the various
pins referred to in the following paragraphs. Also, see the pin
diagram on Figure 3
package.

for a depiction of the pin locations on the

PORT A I /O PINS (PTA0:4)

These pins are special-function, bidirectional I/O port pins
that are shared with other functional modules in the MCU.
PTA0 : PTA4 are shared with the keyboard interrupt pins,
KBD0 : KBD4.

The PTA5/SPSCK pin is not accessible in this device and
is internally connected to the SPI clock pin of the analog die.
The PTA6/

For details refer to the 68HC908EY16 datasheet.

SS pin is likewise not accessible.

PORT B I/O PINS (PTB1, PTB3:7)

These pins are special-function, bidirectional I/O port pins
that are shared with other functional modules in the MCU. All
pins are shared with the ADC module. The PTB6 : PTB7 pins
are also shared with the Timer B module.

PTB0/AD0 is internally connected to the ADOUT pin of the
analog die, allowing diagnostic measurements to be
calculated; e.g., current recopy, V
pin is not accessible in this device.

For details refer to the 68HC908EY16 datasheet.

, etc. The PTB2/AD2

SUP

PORT C I/O PINS (PTC2:4)

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These pins are special-function, bidirectional I/O port pins
that are shared with other functional modules in the MCU. For
example, PTC2 : PTC4 are shared with the ICG module.

PTC0/MISO and PTC1/MOSI are not accessible in this
device and are internally connected to the MISO and MOSI
SPI pins of the analog die.

For details refer to the 68HC908EY16 datasheet.

outputs with one high-side switch. Other ports are also
provided; they include Hall-effect sensor input ports, analog
input ports
regulator is provided on the SMARTMOS™ IC chip, which
provides power to the MCU chip.

Also included in this device is a LIN physical layer, which
communicates using a single wire. This enables the device to
be compatible with three-wire bus systems, where one wire is
used for communication, one for battery, and the third for
ground.

, and a selectable HVDD pin. An internal voltage

PORT D I /O PINS (PTD0:1)

PTD1/ TACH1 and PTD0/ TACH0/BEMF are special­function, bidirectional I /O port pins that can also be
programmed to be timer pins.

In step motor applications the PTD0 pin should be
connected to the BEMF output of the analog die in order to
evaluate the BEMF signal with a special BEMF module of the
MCU.

PTD1 pin is recommended for use as an output pin for
generating the FGEN signal (PWM signal) if required by the
application.

PORT E I /O PIN (PTE1)

PTE1/ RXD and PTE0/ TXD are special-function,
bidirectional I/O port pins that can also be programmed to be
enhanced serial communication.

PTE0/TXD is internally connected to the TXD pin of the
analog die. The connection for the receiver must be done
externally.

EXTERNAL INTERRUPT PIN (IRQ)

The IRQ pin is an asynchronous external interrupt pin. This
pin contains an internal pull-up resistor that is always
activated, even when the IRQ pin is pulled LOW.

For details refer to the 68HC908EY16 datasheet.

EXTERNAL RESET PIN (RST)

A Logic [0] on the RST pin forces the MCU to a known
startup state.
entire system. It is driven LOW when any internal reset
source is asserted.

This pin contains an internal pull-up resistor that is always
activated, even when the reset pin is pulled LOW.

For details refer to the 68HC908EY16 datasheet.

RST is bidirectional, allowing a reset of the

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Analog Integrated Circuit Device Data

14 Freescale Semiconductor

FUNCTIONAL DESCRIPTION

FUNCTIONAL PIN DESCRIPTION

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CURRENT LIMITATION FREQUENCY INPUT PIN
(FGEN)

Input pin for the half-bridge current limitation and the high­side inrush current limiter PWM frequency. This input is not a
real PWM input pin; it should just supply the period of the
PWM. The duty cycle will be generate automatically.

Important The recommended FGEN frequency should
be in the range of 0.1 kHz to 20 kHz.

BACK ELECTROMAGNETIC FORCE OUTPUT PIN
(BEMF)

This pin gives the user information about back
electromagnetic force (BEMF). Thi s feature is mainl y used in
step motor applications for detecting a stalled motor. In order
to evaluate this signal the pin must be directly connected to
pin PTD0 / TACH0 / BEMF.

RESET PIN (RST_A)

RST_A is the bidirectional reset pin of the analog die. It is

an open drain with pull-up resistor and must be connected to
the RST pin of the MCU.

INTERRUPT PIN (IRQ_A)

IRQ_A is the interrupt output pin of the analog die

indicating errors or wake-up events. It is an open drain with
pull-up resistor and must be connected to the
MCU.

SLAVE SELECT PIN (SS)

This pin is the SPI Slave Select pin for the analog chip. All
other SPI connections are done internally. SS must be
connected to PTB1 or any other logic I /O of the
microcontroller.

LIN BUS PIN (LIN)

The LIN pin represents the single-wire bus transmitter and
receiver. It is suited for automotive bus systems and is based
on the LIN bus specification.

HALF-BRIDGE OUTPUT PINS (HB1: HB4)

The 908E425 device includes power MOSFETs
configured as four half-bridge driver outputs. The HB1: HB4
outputs may be configured for step motor drivers, DC motor
drivers, or as high-side and low-side switches.

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The HB1: HB4 outputs are short-circuit and
overtemperature protected, and they feature current recopy,
current limitation, and BEMF generation. Current limitation
and recopy are done on the low-side MOSFETs.

POWER SUPPLY PINS (VSUP1: VSUP3)

VSUP1: VSUP3 are device power supply pins. The
nominal input voltage is designed for operation from 12 V

IRQ pin of the

systems. Owing to the low ON-resistance and current
requirements of the half-bridge driver outputs and high-side
output driver, multiple VSUP pins are provided.

All VSUP pins must be connected to get full chip

functionality.

POWER GROUND PINS (GND1 AND GND2)

GND1 and GND2 are device power ground connections.
Owing to the low ON-resistance and current requirements of
the half-bridge driver outputs and high-side output driver,
multiple pins are provided.

GND1 and GND2 pins must be connected to get full chip
functionality.

HIGH-SIDE OUTPUT PIN (HS)

The HS output pin is a low R
switch is protected against overtemperature and overcurrent.
The output is capable of limiting the inrush current with an
automatic PWM generation using the FGEN module.

high-side switch. The

DS(ON)

SWITCHABLE VDD OUTPUT PIN (HVDD)

The HVDD pin is a switchable VDD output for driving
resistive loads requiring a regulated 5.0 V supply; e.g., 3-pin
Hall-effect sensors. The output is short-circuit protected.

HALL-EFFECT SENSOR INPUT PINS (H1: H3)

The Hall-effect sensor input pins H1: H3 provide inputs for
Hall-effect sensors and switches.

+ 5.0 V VOLTAGE REGULATOR OUTPUT PIN (VDD)

The VDD pin is needed to place an external capacitor to
stabilize the regulated output voltage. The VDD pin is
intended to supply the embedded microcontroller.

Important The VDD pin should not be used to supply
other loads; use the HVDD pin for this purpose. The VDD,
EVDD, VDDA, and VREFH pins must be connected together.

ANALOG INPUT PIN (PA1)

This pin is an analog input port with selectable current
source values.

VOLTAGE REGULATOR GROUND PIN (VSS)

The VSS pin is the ground pin for the connection of all non­power ground connections (microcontroller and sensors).

Important VSS, EVSS, VSSA, and VREFL pins must be
connected together.

LIN TRANSCEIVER OUTPUT PIN (RXD)

This pin is the output of LIN transceiver. The pin must be
connected to the microcontroller’s Enhanced Serial
Communications Interface (ESCI) module (RXD pin).

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908E425

Analog Integrated Circuit Device Data
Freescale Semiconductor 15