Freescale MCF52211 DATA SHEET

Freescale Semiconductor

LQFP–64
10 mm x 10 mm

MAPBGA–81
10 mm x 10 mm

LQFP–100
14 mm x 14 mm

QFN–64
9mmx9mm

Data Sheet

MCF52211 ColdFire Microcontroller

Supports MCF52210 / 52211 /
52212 / 52213

The MCF52211 is a member of the ColdFire® family of
reduced instruction set computing (RISC) microprocessors.

This document provides an overview of the 32-bit MCF52211
microcontroller, focusing on its highly integrated and diverse
feature set.

This 32-bit device is based on the Version 2 ColdFire core
operating at a frequency up to 80 MHz, offering high
performance and low power consumption. On-chip memories
connected tightly to the processor core include up to
128 Kbytes of flash memory and 16 Kbytes of static random
access memory (SRAM). On-chip modules include:

• V2 ColdFire core delivering 76 MIPS (Dhrystone 2.1) at
80 MHz running from internal flash memory with Multiply
Accumulate (MAC) Unit and hardware divider

• Universal Serial Bus On-The-Go (USBOTG)

• USB Transceiver

• Up to three universal asynchronous/synchronous
receiver/transmitters (UARTs)

• Two inter-integrated circuit (I2C™) bus interface modules

• Queued serial peripheral interface (QSPI) module

• Eight-channel 12-bit fast analog-to-digital converter
(ADC)

• Four 32-bit input capture/output compare timers with
DMA support (DTIM)

• Four-channel general-purpose timer (GPT) capable of
input capture/output compare, pulse width modulation
(PWM), and pulse accumulation

• Eight-channel/Four-channel, 8-bit/16-bit pulse width
modulation timer

• Two 16-bit periodic interrupt timers (PITs)

• Real-time clock (RTC) module

• Programmable software watchdog timer

• Interrupt controller capable of handling 57 sources

• Clock module with 8 MHz on-chip relaxation oscillator
and integrated phase-locked loop (PLL)

• Test access/debug port (JTAG, BDM)

Document Number: MCF52211

Rev. 1, 09/2007

MCF52211

This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.

© Freescale Semiconductor, Inc., 2007. All rights reserved.

Table of Contents

1 MCF52211 Family Configurations . . . . . . . . . . . . . . . . . . . . . .3

1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.2 Reset Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

1.3 PLL and Clock Signals . . . . . . . . . . . . . . . . . . . . . . . . .22

1.4 Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

1.5 External Interrupt Signals . . . . . . . . . . . . . . . . . . . . . . .23

1.6 Queued Serial Peripheral Interface (QSPI). . . . . . . . . .23

1.7 USB On-the-Go. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

2

1.8 I

C I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

1.9 UART Module Signals. . . . . . . . . . . . . . . . . . . . . . . . . .24

1.10 DMA Timer Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

1.11 ADC Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

1.12 General Purpose Timer Signals . . . . . . . . . . . . . . . . . .25

1.13 Pulse Width Modulator Signals . . . . . . . . . . . . . . . . . . . 25

1.14 Debug Support Signals . . . . . . . . . . . . . . . . . . . . . . . . .25

1.15 EzPort Signal Descriptions . . . . . . . . . . . . . . . . . . . . . .26

1.16 Power and Ground Pins . . . . . . . . . . . . . . . . . . . . . . . .27

2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . .29

2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .30

2.4 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . .31

2.5 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

2.6 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . 32

2.7 Clock Source Electrical Specifications . . . . . . . . . . . . .33

2.8 USB Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

2.9 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . .34

2.10 Reset Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

2

2.11 I

C Input/Output Timing Specifications . . . . . . . . . . . . .36

2.12 Analog-to-Digital Converter (ADC) Parameters . . . . . .37

2.13 Equivalent Circuit for ADC Inputs . . . . . . . . . . . . . . . . .38

2.14 DMA Timers Timing Specifications . . . . . . . . . . . . . . . . 39

2.15 QSPI Electrical Specifications. . . . . . . . . . . . . . . . . . . .39

2.16 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . .40

2.17 Debug AC Timing Specifications. . . . . . . . . . . . . . . . . .42

3 Mechanical Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . .44

3.1 64-pin LQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . .44

3.2 64 QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

3.3 81 MAPBGA Package. . . . . . . . . . . . . . . . . . . . . . . . . .51

3.4 100-pin LQFP Package. . . . . . . . . . . . . . . . . . . . . . . . .53

4 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

List of Figures

Figure 1.MCF52211 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 4

Figure 2.100 LQFP Pin Assignments . . . . . . . . . . . . . . . . . . . . 14

Figure 3.81 MAPBGA Pin Assignments . . . . . . . . . . . . . . . . . . 15

Figure 4.64 LQFP and 64 QFN Pin Assignments . . . . . . . . . . . 16

Figure 5.GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 6.RSTI and Configuration Override Timing . . . . . . . . . . 35

Figure 7.I

2

C Input/Output Timings . . . . . . . . . . . . . . . . . . . . . . 37

Figure 8.Equivalent Circuit for A/D Loading. . . . . . . . . . . . . . . . 38

Figure 9.QSPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 10.Test Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 11.Boundary Scan (JTAG) Timing . . . . . . . . . . . . . . . . . 41

Figure 12.Test Access Port Timing . . . . . . . . . . . . . . . . . . . . . . 41

Figure 13.TRST Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 14.Real-Time Trace AC Timing . . . . . . . . . . . . . . . . . . . . 42

Figure 15.BDM Serial Port AC Timing . . . . . . . . . . . . . . . . . . . . 43

List of Tables

Table 1. MCF52211 Family Configurations . . . . . . . . . . . . . . . . . 3

Table 2. Orderable Part Number Summary. . . . . . . . . . . . . . . . 12

Table 3. Pin Functions by Primary and Alternate Purpose . . . . 17

Table 4. Reset Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 5. PLL and Clock Signals . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 6. Mode Selection Signals . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 7. Clocking Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 8. External Interrupt Signals . . . . . . . . . . . . . . . . . . . . . . 23

Table 9. Queued Serial Peripheral Interface (QSPI) Signals. . . 23
Table 10.I

Table 11.UART Module Signals . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 12.DMA Timer Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 13.ADC Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 14.GPT Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 15.PWM Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 16.Debug Support Signals . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 17.EzPort Signal Descriptions . . . . . . . . . . . . . . . . . . . . . 26

Table 18.Power and Ground Pins. . . . . . . . . . . . . . . . . . . . . . . . 27

Table 19.Absolute Maximum Ratings, . . . . . . . . . . . . . . . . . . . 28

Table 20.Current Consumption in Low-Power Mode
Table 21.Typical Active Current Consumption Specifications. . . 29

Table 22.Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . 30

Table 23.SGFM Flash Program and Erase Characteristics . . . . 31

Table 24.SGFM Flash Module Life Characteristics . . . . . . . . . . 32

Table 25.ESD Protection Characteristics, . . . . . . . . . . . . . . . . . 32

Table 26.DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . 32

Table 27.PLL Electrical Specifications . . . . . . . . . . . . . . . . . . . . 33

Table 28.USB Operation Specifications . . . . . . . . . . . . . . . . . . . 34

Table 29.GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Table 30.Reset and Configuration Override Timing . . . . . . . . . . 35

Table 31.I

Table 32.I

Table 33.ADC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 34.Timer Module AC Timing Specifications . . . . . . . . . . . 39

Table 35.QSPI Modules AC Timing Specifications. . . . . . . . . . . 39

Table 36.JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 40

Table 37.Debug AC Timing Specification . . . . . . . . . . . . . . . . . . 42

Table 38.Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

2

C I/O Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

,

. . . . . . . . . 29

2

C Input Timing Specifications between I2C_SCL

and I2C_SDA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

2

C Output Timing Specifications between I2C_SCL

and I2C_SDA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor2

1 MCF52211 Family Configurations

Table 1. MCF52211 Family Configurations

Module 52210 52211 52212 52213

MCF52211 Family Configurations

Version 2 ColdFire Core with MAC (Multiply-Accumulate
Unit)

System Clock 66, 80 MHz 50 MHz

Performance (Dhrystone 2.1 MIPS) up to 76 up to 46

Flash / Static RAM (SRAM) 64/16 Kbytes 128/16 Kbytes 64/8 Kbytes 128/8 Kbytes

Interrupt Controller (INTC)

Fast Analog-to-Digital Converter (ADC)

USB On-The-Go (USB OTG)

Four-channel Direct-Memory Access (DMA)

Software Watchdog Timer (WDT)

Secondary Watchdog Timer

Two-channel Periodic Interrupt Timer (PIT) 2 2 2 2

Four-Channel General Purpose Timer (GPT)

32-bit DMA Timers 4 4 4 4

QSPI

UART(s) 2 3 2 2

2

I

C2222

Eight/Four-channel 8/16-bit PWM Timer

••••

••••

••••

••••

••••

••••

••••

••••

••••

••••

General Purpose I/O Module (GPIO)

Chip Configuration and Reset Controller Module

Background Debug Mode (BDM)

JTAG - IEEE 1149.1 Test Access Port

Package 64 LQFP/QFN

1

The full debug/trace interface is available only on the 100-pin packages. A reduced debug interface is bonded on smaller

packages.

1

••••

••••

••••

••••

81 MAPBGA

64 LQFP/QFN

81 MAPBGA

100 LQFP

64 LQFP 64 LQFP

Figure 1 shows a top-level block diagram of the MCF52211. Package options for this family are described later in this

document.

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 3

Arbiter

Interrupt

Controller

UART

0

QSPI

UART

1

UART

2

I2C

V2 ColdFire CPU

4 CH

JTAG

TAP

16 Kbytes

SRAM

(2K×32)×2

128 Kbytes

Flash

(16K×16)×4

PORTS

CIM_IBO

RSTI
RSTO

ADC

AN[7:0]

PLL OCO

CLKGEN

Edge

Port

TIM

EXTAL XTAL CLKOUT

PIT0 PIT1 PWM

IRQ[7:1]

PMM

V

STBY

PADI – Pin Muxing

AN

Slave Mode Access

(CIM_IBO/EzPort)

M3

TMS

TDI

TDO
TRST
TCLK

JTAG_EN

DMA

M2 M0

Watch

Dog

TMR

0

RTC

TMR

1

TMR

2

TMR

3

I

2

C

DDATA

QSPI
SDAn
SCLn
UTXDn
URXDn
URTS

n

UCTSn
PWMn
DTINn/DTOUTn
GPT
RCON_B
ALLPST
PST

BDM

PORT

IPS Bus Gasket

Watchdog

CIM_IBO

CFM

V

PP

CLKMOD

GPT[3:0]

Backup

USB

On-The-Go

USB TCVR

USBD+

USBD-

M1

MCF52211 Family Configurations

Figure 1. MCF52211 Block Diagram

1.1 Features

This document contains information on a new product under development. Freescale reserves the right to change or discontinue
this product without notice. Specifications and information herein are subject to change without not ice.

1.1.1 Feature Overview

The MCF52211 family includes the following features:

• Version 2 ColdFire variable-length RISC processor core

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor4

MCF52211 Family Configurations

— Static operation
— 32-bit address and data paths on-chip
— Up to 80 MHz processor core frequency
— 40 MHz and 33 MHz off-platform bus frequency
— Sixteen general-purpose, 32-bit data and address registers
— Implements ColdFire ISA_A with extensions to support the user stack pointer register and four new instructions

for improved bit processing (ISA_A+)

— Multiply-Accumulate (MAC) unit with 32-bit accumulator to support 16×16 → 32 or 32×32 → 32 operations

• System debug support
— Real-time trace for determining dynamic execution path
— Background debug mode (BDM) for in-circuit debugging (DEBUG_B+)
— Real-time debug support, with six hardware breakpoints (4 PC, 1 address and 1 data) configurable into a 1- or

2-level trigger

• On-chi p memo r ies
— Up to 16-Kbyte dual-ported SRAM on CPU internal bus, supporting core and DMA access with standby power

supply support

— Up to 128 Kbytes of interleaved flash memory supporting 2-1-1-1 accesses

• Power management
— Fully static operation with processor sleep and whole chip stop modes
— Rapid response to interrupts from the low-power sleep mode (wake-up feature)
— Clock enable/disable for each peripheral when not used (except backup watchdog timer)
— Software controlled disable of external clock output for low-power consumption

• Universal Serial Bus On-The-Go (USB OTG) dual-mode host and device controller
— Full-speed / low-speed host controller
— USB 1.1 and 2.0 compliant full-speed / low speed device controller
— 16 bidirectional end points
— DMA or FIFO data stream interfaces
— Low power consumption
— OTG protocol logic

• Three universal asynchronous/synchronous receiver transmitters (UARTs)
— 16-bit divider for clock generation
— Interrupt control logic with maskable interrupts
— DMA support
— Data formats can be 5, 6, 7 or 8 bits with even, odd, or no parity
— Up to two stop bits in 1/16 increments
— Error-detection capabilities
— Modem support includes request-to-send (RTS) and clear-to-send (CTS) lines for two UARTs
— Transmit and receive FIFO buffers

•Two I

2

C modules
— Interchip bus interface for EEPROMs, LCD controllers, A/D converters, and keypads
— Fully compatible with industry-standard I

2

C bus
— Master and slave modes support multiple masters
— Automatic interrupt generation with programmable level

• Queued serial peripheral interface (QSPI)
— Full-duplex, three-wire synchronous transfers
— Up to four chip selects available

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 5

MCF52211 Family Configurations

— Master mode operation only
— Programmable bit rates up to half the CPU clock frequency
— Up to 16 pre-programmed transfers

• Fast analog-to-digital converter (ADC)
— Eight analog input channels
— 12-bit resolution
— Minimum 1.125 μs conversion time
— Simultaneous sampling of two channels for motor control applications
— Single-scan or continuous operation
— Optional interrupts on conversion complete, zero crossing (sign change), or under/over low/high limit
— Unused analog channels can be used as digital I/O

• Four 32-bit timers with DMA support
— 12.5 ns resolution at 80 MHz
— Programmable sources for clock input, including an external clock option
— Programmable prescaler
— Input capture capability with programmable trigger edge on input pin
— Output compare with programmable mode for the output pin
— Free run and restart modes
— Maskable interrupts on input capture or output compare
— DMA trigger capability on input capture or output compare

• Four-channel general purpose timer
— 16-bit architecture
— Programmable prescaler
— Output pulse-widths variable from microseconds to seconds
— Single 16-bit input pulse accumulator
— Toggle-on-overflow feature for pulse-width modulator (PWM) generation
— One dual-mode pulse accumulation channel

• Pulse-width modulation timer
— Support for PCM mode (resulting in superior signal quality compared to conventional PWM)
— Operates as eight channels with 8-bit resolution or four channels with 16-bit resolution
— Programmable period and duty cycle
— Programmable enable/disable for each channel
— Software selectable polarity for each channel
— Period and duty cycle are double buffered. Change takes effect when the end of the current period is reached

(PWM counter reaches zero) or when the channel is disabled.
— Programmable center or left aligned outputs on individual channels
— Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies
— Emergency shutdown

• Two periodic interrupt timers (PITs)
— 16-bit counter
— Selectable as free running or count down

• Real-Time Clock (RTC)
— Maintains system time-of-day clock
— Provides stopwatch and alarm interrupt functions

• Software watchdog timer

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor6

MCF52211 Family Configurations

— 32-bit counter
— Low-power mode support

• Backup watchdog timer (BWT)
— Independent timer that can be used to help software recover from runaway code
— 16-bit counter
— Low-power mode support

• Clock generation features
— One to 48 MHz crystal, 8 MHz on-chip relaxation oscillator, or external oscillator reference options
— Trimmed relaxation oscillator
— Two to 10 MHz reference frequency for normal PLL mode with a pre-divider programmable from 1 to 8
— System can be clocked from PLL or directly from crystal oscillator or relaxation oscillator
— Low power modes supported

n

—2

(n ≤ 0 ≤ 15) low-power divider for extremely low frequency operation

• Interrupt controller
— Uniquely programmable vectors for all interrupt sources
— Fully programmable level and priority for all peripheral interrupt sources
— Seven external interrupt signals with fixed level and priority
— Unique vector number for each interrupt source
— Ability to mask any individual interrupt source or all interrupt sources (global mask-all)
— Support for hardware and software interrupt acknowledge (IACK) cycles
— Combinatorial path to provide wake-up from low-power modes

• DMA controller
— Four fully programmable channels
— Dual-address transfer support with 8-, 16-, and 32-bit data capability, along with support for 16-byte (4×32-bit)

burst transfers
— Source/destination address pointers that can increment or remain constant
— 24-bit byte transfer counter per channel
— Auto-alignment transfers supported for efficient block movement
— Bursting and cycle steal support
— Software-programmable DMA requesters for the UARTs (3) and 32-bit timers (4)

• Reset
— Separate reset in and reset out signals
— Seven sources of reset:

– Power-on reset (POR)
– External
–Software
– Watchdog
– Loss of clock / loss of lock
– Low-voltage detection (LVD)
–JTAG

— Status flag indication of source of last reset

• Chip integration module (CIM)
— System configuration during reset
— Selects one of six clock modes
— Configures output pad drive strength

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 7

MCF52211 Family Configurations

— Unique part identification number and part revision number

• General purpose I/O interface
— Up to 56 bits of general purpose I/O
— Bit manipulation supported via set/clear functions
— Programmable drive strengths
— Unused peripheral pins may be used as extra GPIO

• JTAG support for system level board testing

1.1.2 V2 Core Overview

The version 2 ColdFire processor core is comprised of two separate pipelines decoupled by an instruction buffer . The two-stage
instruction fetch pipeline (IFP) is responsible for instruction-address generation and instruction fetch. The instruction buffer is
a first-in-first-out (FIFO) buffer that holds prefetched instructions awaiting execution in the operand execution pipeline (OEP).
The OEP includes two pipeline stages. The first stage decodes instructions and selects operands (DSOC); the second stage
(AGEX) performs instruction execution and calculates operand effective addresses, if needed.

The V2 core implements the ColdFire instruction set architecture revision A+ with added support for a separate user stack
pointer register and four new instructions to assist in bit processing. Additionally, the core includes the multiply-accumulate
(MAC) unit for improved signal processing capabilities. The MAC implements a three-stage arithmetic pipeline, optimized for
16×16 bit operations, with support for one 32-bit accumulator. Supported operands in clude 16- and 32-bit signed and unsigned
integers, signed fractional operands, and a complete set of instructions to process these data types. The MAC provides support
for execution of DSP operations within the context of a single processor at a minimal hardware cost.

1.1.3 Integrated Debug Module

The ColdFire processor core debug interface is provided to support system debugging with low-cost debug and emulator
development tools. Through a standard debug interface, access to debug information and real-time tracing capability is provided
on 100-lead packages. This allows the processor and system to be debugged at full speed without the need for costly in-circuit
emulators.

The on-chip breakpoint resources include a total of nine programmable 32-bit registers: an address and an address mask register,
a data and a data mask register, four PC registers, and one PC mask register. These registers can be accessed through the
dedicated debug serial communication channel or from the processor’s supervisor mode programming model. The breakpoint
registers can be configured to generate triggers by combining the address, data, and PC conditions in a variety of single- or
dual-level definitions. The trigger event can be programmed to generate a processor halt or initiate a debug interrupt exception.
The MCF52211 implements revision B+ of the ColdFire Debug Architecture.

The MCF52211’s interrupt servi cing options during emulator mode allow real-time critical interrupt service routines to be
serviced while processing a debug interr

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor8

MCF52211 Family Configurations

links the device’s pins into one shift register. Test logic, implemented using static logic design, is independent of the device
system logic.

The MCF52211 implementation can:

• Perform boundary-scan operations to test circuit board electrical continuity

• Sample MCF52211 system pins during operation and transparently shift out the result in the boundary scan register

• Bypass the MCF52211 for a given circuit board test by effectively reducing the boundary-scan register to a single bit

• Disable the output drive to pins during circuit-board testing

• Drive output pins to stable levels

1.1.5 On-Chip Memories

1.1.5.1 SRAM

The dual-ported SRAM module provides a general-purpose 8- or 16-Kbyte memory block that the ColdFire core can access in
a single cycle. The location of the memory block can be set to any 8- or 16-Kbyte boundary within the 4-Gbyte address space.
This memory is ideal for storing critical code or data structures and for use as the system stack. Because the SRAM module is
physically connected to the processor's high-speed local bus, it can quickly service core-initiated accesses or
memory-referencing commands from the debug module.

The SRAM module is also accessible by the DMA. The dual-ported nature of the SRAM makes it ideal for implementing
applications with double-buffer schemes, where the processor and a DMA device operate in alternate regions of the SRAM to
maximize system performance.

1.1.5.2 Flash Memory

The ColdFire flash module (CFM) is a non-volatile memory (NVM) module that connects to the processor’s high-speed local
bus. The CFM is constructed with up to four banks of 16-Kbyte×16-bit flash memory arrays to generate up to 128 Kbytes of
32-bit flash memory. These electrically erasable and programmable arrays serve as non-volatile program and data memory . The
flash memory is ideal for program and data storage for single-chip applications, allowing for field reprogramming without
requiring an external high voltage source. The CFM interfaces to the ColdFire core through an optimized read-only memory
controller that supports interleaved accesses from the 2-cycle flash memory arrays. A backdoor mapping of the flash memory
is used for all program, erase, and verify operations, as well as providing a read datapath for the DMA. Flash memory may also
be programmed via the EzPort, which is a serial flash memory programming interface that allows the flash memory to be read,
erased and programmed by an external controller in a format compatible with most SPI bus flash memory chips.

1.1.6 Power Management

The MCF52211 incorporates several low-power modes of operation entered under program control and exited by several
external trigger events. An integrated power-on reset (POR) circuit monitors the input supply and forces an MCU reset as the
supply voltage rises. The low voltage detector (L VD) monitors the supply voltage and is configurable to force a reset or interrupt
condition if it falls below the LVD trip point. The RAM standby switch provides power to RAM when the supply voltage to the
chip falls below the standby battery voltage.

1.1.7 USB On-The-Go Controller

The MCF52211 includes a Universal Serial Bus On-The-Go (USB OTG) dual-mode controller . USB is a popular standard for
connecting peripherals and portable consumer electronic devices such as digital cameras and handheld computers to host PCs.
The OTG supplement to the USB specification extends USB to peer-to-peer application, enabling devices to connect directly
to each other without the need for a PC. The dual-mode controller on the MCF52211 can act as a USB OTG host and as a USB
device. It also supports full-speed and low-speed modes.

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 9

MCF52211 Family Configurations

1.1.8 UARTs

The MCF52211 has three full-duplex UARTs that function independently. The three UAR Ts can be clocked by the system bus
clock, eliminating the need for an external clock source. On smaller packages, the third UART is multiplexed with other digital
I/O functions.

1.1.9 I2C Bus

The MCF52211 includes two I2C modules. The I2C bus is a two-wire, bidirectional serial bus that provides a simple, efficient
method of data exchange and minimizes the interconnection between devices. This bus is suitable for applications requiring
occasional communications over a short distance between many devices.

1.1.10 QSPI

The queued serial peripheral interface (QSPI) provides a synchronous serial peripheral interface with queued transfer capability.
It allows up to 16 transfers to be queued at once, minimizing the need for CPU intervention between transfers.

1.1.11 Fast ADC

The fast ADC consists of an eight-channel input select multiplexer and two independent sample and hold (S/H) circuits feeding
separate 12-bit ADCs. The two separate converters store their results in accessible buffers for further processing.

The ADC can be configured to perform a single scan and halt, a scan when triggered, or a programmed scan sequence repeatedly
until manually stopped.

The ADC can be configured for sequential or simultaneous conversion. When configured for sequential conversions, up to eight
channels can be sampled and stored in any order specified by the channel list register. Both ADCs may be required during a
scan, depending on the inputs to be sampled.

During a simultaneous conversion, both S/H circuits are used to capture two different channels at the same time. This
configuration requires that a single channel may not be sampled by both S/H circuits simultaneously.

Optional interrupts can be generated at the end of the scan sequence if a channel is out of range (measures below the low
threshold limit or above the high threshold limit set in the limit registers) or at several different zero crossing conditions.

1.1.12 DMA Timers (DTIM0–DTIM3)

There are four independent, DMA transfer capable 32-bit timers (DTIM0, DTIM1, DTIM2, and DTIM3) on the MCF52211.
Each module incorporates a 32-bit timer with a separate register set for configuration and control. The timers can be configured
to operate from the system clock or from an external clock source using one of the DTINn signals. If the system clock is selected,
it can be divided by 16 or 1. The input clock is further divided by a user-programmable 8-bit prescaler that clocks the actual
timer counter register (TCRn). Each of these timers can be configured for input capture or reference (output) compare mode.
Timer events may optionally cause interrupt requests or DMA transfers.

1.1.13 General Purpose Timer (GPT)

The general purpose timer (GPT) is a four-channel timer module consisting of a 16-bit programmable counter driven by a
seven-stage programmable prescaler. Each of the four channels can be configured for input capture or output compare.
Additionally , channel th ree, can be configured as a pulse accumulator.

A timer overflow function allows software to extend the timing capability of the system beyond the 16-bit range of the counter.
The input capture and output compare functions allow simultaneous input waveform measurements and output waveform
generation. The input capture function can capture the time of a selected transition edge. The output compare function can

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor10

MCF52211 Family Configurations

generate output waveforms and timer software delays. The 16-bit pulse accumulator can operate as a simple event counter or a
gated time accumulator.

1.1.14 Periodic Interrupt Timers (PIT0 and PIT1)

The two periodic interrupt timers (PIT0 and PIT1) are 16-bit timers that provide interrupts at regular intervals with minimal
processor intervention. Each timer can count down from the value written in its PIT modulus register or it can be a free-running
down-counter.

1.1.15 Real-Time Clock (RTC)

The Real-Time Clock (RTC) module maintains the system (time-of-day) clock and provides stopwatch, alarm , and interrupt
functions. It includes full clock features: seconds, minutes, hours, days and supports a host of time-of-day interrupt functions
along with an alarm interrupt.

1.1.16 Pulse-Width Modulation (PWM) Timers

The MCF52211 has an 8-channel, 8-bit PWM timer. Each channel has a programmable peri od a nd duty cycle as well as a
dedicated counter. Each of the modulators can create independent continuous waveforms with software-selectable duty rates
from 0% to 100%. The timer supports PCM mode, which results in superior signal quality when compared to that of a
conventional PWM. The PWM outputs have programmable polarity, and can be programmed as left aligned outputs or center
aligned outputs. For higher period and duty cycle resolution, each pair of adjacent channels ([7:6], [5:4], [3:2], and [1:0]) can
be concatenated to form a single 16-bit channel. The module can, therefore, be configured to support 8/0, 6/1, 4/2, 2/3, or 0/4
8-/16-bit channels.

1.1.17 Software Watchdog Timer

The watchdog timer is a 32-bit timer that facilitates recovery from runaway code. The watchdog counter is a free-running
down-counter that generates a reset on underflow. To prevent a reset, software must periodically restart the countdown.

1.1.18 Backup Watchdog Timer

The backup watchdog timer is an independent 16-bit timer that, like the software watchdog timer, facilitates recovery from
runaway code. This timer is a free-running down-counter that gene

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 11

MCF52211 Family Configurations

1.1.21 DMA Controller

The direct memory access (DMA) controller provides an efficient way to move blocks of data with minimal processor
intervention. It has four channels that allow byte, word, longword, or 16-byte burst line transfers. These transfers are triggered
by software explicitly setting a DCRn[START] bit or by the occurrence of certain UART or DMA timer events.

1.1.22 Reset

The reset controller determines the source of reset, asserts the appropriate reset signals to the system, and keeps track of what
caused the last reset. There are seven sources of reset:

• External reset input

• Power-on reset (POR)

• Watchdog timer

• Phase locked-loop (PLL) loss of lock / loss of clock

•Software

• Low-voltage detector (LVD)

•JTAG

Control of the L VD and its associated reset and interrupt are managed by the reset controller . Other registers provide status flags
indicating the last source of reset and a control bit for software assertion of the RSTO

pin.

1.1.23 GPIO

Nearly all pins on the MCF52211 have general purpose I/O capability and are grouped into 8-bit ports. Some ports do not use
all eight bits. Each port has registers that configure, monitor, and control the port pins.

1.1.24 Part Numbers and Packaging

This product is RoHS-compliant. Refer to the product page at freescale.com or contact your sales office for up-to-date RoHS
information.

Table 2. Orderable Part Number Summary

Freescale Part

Number

MCF52210CAE66 MCF52210 Microcontroller, 2 UARTs 66 64 / 16 64 LQFP -40 to +85

MCF52210CEP66 MCF52210 Microcontroller, 2 UARTs 66 64 / 16 64 QFN -40 to +85

MCF52210CVM66 MCF52210 Microcontroller, 2 UARTs 66 64 / 16 81 MAPBGA -40 to +85

MCF52210CVM80 MCF52210 Microcontroller, 2 UARTs 80 64 / 16 81 MAPBGA -40 to +85

MCF52211CAE66 MCF52211 Microcontroller, 3 UARTs 66 128 / 16 64 LQFP -40 to +85

MCF52211CAF80 MCF52211 Microcontroller, 3 UARTs 80 128 / 16 100 LQFP -40 to +85

MCF52211CEP66 MCF52211 Microcontroller, 3 UARTs 66 128 / 16 64 QFN -40 to +85

MCF52211CVM66 MCF52211 Microcontroller, 3 UARTs 66 128 / 16 81 MAPBGA -40 to +85

Description

Speed

(MHz)

Flash/SRAM

(Kbytes)

Package

Tem p rang e

(°C)

MCF52211CVM80 MCF52211 Microcontroller, 3 UARTs 80 128 / 16 81 MAPBGA -40 to +85

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor12

MCF52211 Family Configurations

Table 2. Orderable Part Number Summary (continued)

Freescale Part

Number

MCF52212CAE50 MCF52212 Microcontroller, 2 UARTs 50 64 / 8 64 LQFP -40 to +85

MCF52212AE50 MCF52212 Microcontroller, 2 UARTs 50 64 / 8 64 LQFP 0 to +70

MCF52213CAE50 MCF52213 Microcontroller, 2 UARTs 50 128 / 8 64 LQFP -40 to +85

MCF52213AE50 MCF52213 Microcontroller, 2 UARTs 50 128 / 8 64 LQFP 0 to +70

Description

Speed

(MHz)

Flash/SRAM

(Kbytes)

Package

Tem p rang e

(°C)

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 13

MCF52211 Family Configurations

AN5

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25

V

DD

V

DD

V

SS

URTS1

TEST

UCTS0

UTXD0
URTS0

SCL

SDA
QSPI_CS3
QSPI_CS2

V

DD

V

SS

QSPI-DIN

QSPI_DOUT

QSPI_CLK
QSPI_CS1
QSPI_CS0

RCON

V

DD

V

DD

V

SS

100 LQFP

75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51

V

SS

V

DDPLL

EXTAL
XTAL
V

SSPLL

PST3
PST2
V

DD

V

SS

PST1
PST0

PSTCLK

GPT3
V

DD

USB

USB_DM
USB_DP

V

SS

USB

GPT2
V

DD

V

SS

V

STBY

AN6
AN7

100

9998979695949392919089888786858483828180797877

76

URXD1

UTXD1

UCTS1

RSTO

RSTI

IRQ7

IRQ6

VDDVSSIRQ5

IRQ4

IRQ3

IRQ2

IRQ1

ALLPST

DDATA3

DDATA2

VSSVDDDSO

DSI

DDATA1

DDATA0

BKPT

26272829303132333435363738394041424344454647484950

JTAG_EN

UCTS2

URXD2

UTXD2

URTS2

DTIN2

DTIN3

GPT1

V

DD

V

SS

DTIN0

DTIN1

GPT0

CLKMOD1

CLKMOD0

V

DD

V

SS

AN0

AN1

AN2

AN3

V

SSA

V

RL

V

RH

V

DDA

V

SS

URXD0

AN4

DSCLK

Figure 2 shows the pinout configuration for the 100 LQFP.

Figure 2. 100 LQFP Pin Assignments

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor14

Figure 3 shows the pinout configuration for the 81 MAPBGA.

V

SS

UTXD1 RSTI IRQ5 IRQ3 ALLPST TDO TMS V

SS

A

123456789

URTS1 URXD1 RSTO IRQ6 IRQ2 TRST TDI VDDPLL EXTALB

UCTS0 TEST UCTS1 IRQ7 IRQ4 IRQ1 TCLK VSSPLL XTALC

URXD0 UTXD0 URTS0 V

SS

V

DD

V

SS

GPT3 VDDUSB USB_DMD

SCL SDA V

DD

V

DD

V

DD

V

DD

V

DD

GPT2 USB_DPE

QSPI_CS3 QSPI_CS2 QSPI_DIN V

SS

V

DD

V

SS

VSSUSB V

STBY

AN4F

QSPI_DOUT QSPI_CLK RCON DTIN1 CLKMOD0 AN2 AN3 AN5 AN6G

QSPI_CS0 QSPI_CS1 DTIN3 DTIN0 CLKMOD1 AN1 V

SSA

V

DDA

AN7H

V

SS

JTAG_EN DTIN2 GPT1 GPT0 AN0 V

RL

V

RH

V

SSA

J

Figure 3. 81 MAPBGA Pin Assignments

MCF52211 Family Configurations

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 15

MCF52211 Family Configurations

Figure 4 shows the pinout configuration for the 64 LQFP and 64 QFN.

Figure 4. 64 LQFP and 64 QFN Pin Assignments

Table 3 shows the pin functions by primary and alternate purpose, and illustrates which packages contain each pin.

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor16

Freescale Semiconductor 17

Table 3. Pin Functions by Primary and Alternate Purpose

Pin

Group

Primary

Function

Secondary

Function

Ter tia r y

Function

Quaternary

Function

Drive

Strength /

Control

1

Slew Rate /

Control

1

Pull-up /

Pull-down

2

100 LQFP

Pin on

Pin on 81
MAPBGA

Pin on 64

LQFP/QFN

ADC AN7 — — GPIO Low FAST — 51 H9 33

AN6 — — GPIO Low FAST — 52 G9 34

AN5 — — GPIO Low FAST — 53 G8 35

AN4 — — GPIO Low FAST — 54 F9 36

AN3 — — GPIO Low FAST — 46 G7 28

MCF52211 ColdFire Microcontroller, Rev. 1

AN2 — — GPIO Low FAST — 45 G6 27

AN1 — — GPIO Low FAST — 44 H6 26

AN0 — — GPIO Low FAST — 43 J6 25

SYNCA

SYNCB

3

3

— — —N/AN/A————

— — —N/AN/A————

VDDA — — — N/A N/A — 50 H8 32

VSSA — — — N/A N/A — 47 H7, J9 29

VRH — — — N/A N/A — 49 J8 31

VRL — — — N/A N/A — 48 J7 30

Clock

Generation

EXTAL — — — N/A N/A — 73 B9 47

XTAL — — — N/A N/A — 72 C9 46

VDDPLL — — — N/A N/A — 74 B8 48

VSSPLL — — — N/A N/A — 71 C8 45

Debug Data ALLPST — — — High FAST — 86 A6 55

DDATA[3:0] — — GPIO High FAST — 84,83,78,77 — —

PST[3:0] — — GPIO High FAST — 70,69,66,65 — —

2

C SCL USB_DMI UTXD2 GPIO PDSR[0] PSRR[0] pull-up

I

SDA USB_DPI URXD2 GPIO PDSR[0] PSRR[0] pull-up

4

4

10 E1 8

11 E2 9

MCF52211 Family Configurations

Table 3. Pin Functions by Primary and Alternate Purpose (continued)

MCF52211 Family Configurations

Pin

Group

Primary

Function

Secondary

Function

Ter tia r y

Function

Quaternary

Function

Drive

Strength /

Control

1

Slew Rate /

Control

1

Pull-up /

Pull-down

2

100 LQFP

Pin on

Pin on 81
MAPBGA

Pin on 64

LQFP/QFN

Interrupts IRQ7 — —GPIOLowFAST—95C458

IRQ6

IRQ5

IRQ4

IRQ3

MCF52211 ColdFire Microcontroller, Rev. 1

IRQ2

IRQ1

— — GPIO Low FAST — 94 B4 —

— — GPIO Low FAST — 91 A4 —

— —GPIOLowFAST—90C557

— — GPIO Low FAST — 89 A5 —

— — GPIO Low FAST — 88 B5 —

SYNCA USB_ALT_CL

GPIO High FAST pull-up

4

87 C6 56

K

JTAG/BDM JTAG_EN — — — N/A N/A pull-down 26 J2 17

TCLK/

CLKOUT — — High FAST pull-up

5

64 C7 44

PSTCLK

TDI/DSI — — — N/A N/A pull-up

5

79 B7 50

TDO/DSO— — —HighFAST—80A751

TMS

— — — N/A N/A pull-up

5

76 A8 49

/BKPT

TRST

— — — N/A N/A pull-up

5

85 B6 54

/DSCLK

Mode

Selection

CLKMOD0 — — — N/A N/A pull-down

6

CLKMOD1 — — — N/A N/A pull-down

RCON

/

— — — N/A N/A pull-up 21 G3 16

6

6

40 G5 24

39 H5 —

EZPCS

Freescale Semiconductor18

Freescale Semiconductor 19

Table 3. Pin Functions by Primary and Alternate Purpose (continued)

Pin

Group

Primary

Function

QSPI QSPI_DIN/

Secondary

Function

Ter tia r y

Function

Quaternary

Function

— URXD1 GPIO PDSR[2] PSRR[2] — 16 F3 12

Drive

Strength /

Control

1

Slew Rate /

Control

1

Pull-up /

Pull-down

2

100 LQFP

Pin on

Pin on 81
MAPBGA

Pin on 64

LQFP/QFN

EZPD

QSPI_DOUT/

— UTXD1 GPIO PDSR[1] PSRR[1] — 17 G1 13

EZPQ

QSPI_CLK/

SCL URTS1 GPIO PDSR[3] PSRR[3] pull-up

8

18 G2 14

EZPCK

MCF52211 ColdFire Microcontroller, Rev. 1

QSPI_CS3 SYNCA — GPIO PDSR[7] PSRR[7] pull-up/pull-

QSPI_CS2 — — GPIO PDSR[6] PSRR[6] pull-up/pull-

down

down

7

7

12 F1 —

13 F2 —

QSPI_CS1 — — GPIO PDSR[5] PSRR[5] — 19 H2 —

8

9

20 H1 15

96 A3 59

Reset

QSPI_CS0 SDA UCTS1 GPIO PDSR[4] PSRR[4] pull-up

9

RSTI — — — N/A N/A pull-up

RSTO

— — —highFAST—97B360

Test TEST — — — N/A N/A pull-down 5 C2 3

Timers, 16-bit GPT3 — PWM7 GPIO PDSR[23] PSRR[23] pull-up

GPT2 — PWM5 GPIO PDSR[22] PSRR[22] pull-up

GPT1 — PWM3 GPIO PDSR[21] PSRR[21] pull-up

GPT0 — PWM1 GPIO PDSR[20] PSRR[20] pull-up

Timers, 32-bit DTIN3 DTOUT3 PWM6 GPIO PDSR[19] PSRR[19] — 32 H3 19

10

10

10

10

63 D7 —

58 E8 —

33 J4 —

38 J5 —

MCF52211 Family Configurations

DTIN2 DTOUT2 PWM4 GPIO PDSR[18] PSRR[18] — 31 J3 18

DTIN1 DTOUT1 PWM2 GPIO PDSR[17] PSRR[17] — 37 G4 23

DTIN0 DTOUT0 PWM0 GPIO PDSR[16] PSRR[16] — 36 H4 22

UART 0 UCTS0

URTS0

URXD0 RTC_EXTAL — GPIO PDSR[9] PSRR[9] — 7 D1 5

UTXD0 RTC_XTAL — GPIO PDSR[8] PSRR[8] — 8 D2 6

— — GPIO PDSR[11] PSRR[11] — 6 C1 4

— — GPIO PDSR[10] PSRR[10] — 9 D3 7

Table 3. Pin Functions by Primary and Alternate Purpose (continued)

MCF52211 Family Configurations

Freescale Semiconductor20

Pin

Group

Primary

Function

Secondary

Function

Ter tia r y

Function

Quaternary

Function

Drive

Strength /

Control

1

Slew Rate /

Control

1

Pull-up /

Pull-down

2

100 LQFP

Pin on

Pin on 81
MAPBGA

Pin on 64

LQFP/QFN

UART 1 UCTS1 SYNCA URXD2 GPIO PDSR[15] PSRR[15] — 98 C3 61

URTS1

SYNCB UTXD2 GPIO PDSR[14] PSRR[14] — 4 B1 2

URXD1 — — GPIO PDSR[13] PSRR[13] — 100 B2 63

UTXD1 — — GPIO PDSR[12] PSRR[12] — 99 A2 62

UART 2 UCTS2

MCF52211 ColdFire Microcontroller, Rev. 1

URTS2

— — GPIO PDSR[27] PSRR[27] — 27 — —

— — GPIO PDSR[26] PSRR[26] — 30 — —

URXD2 — — GPIO PDSR[25] PSRR[25] — 28 — —

UTXD2 — — GPIO PDSR[24] PSRR[24] — 29 — —

VSTBY VSTBY — — — N/A N/A — 55 F8 37

USB VDDUSB — — — N/A N/A — 62 D8 43

VSSUSB — — — N/A N/A — 59 F7 40

USB_DM — — — N/A N/A — 61 D9 42

USB_DP — — — N/A N/A — 60 E9 41

VDD VDD — — — N/A N/A — 1,2,14,22,

23,34,41,

D5,E3–E7, F51,10,20,39,5

2

57,68,81,93

VSS VSS — — — N/A N/A — 3,15,24,25,3

5,42,56,

A1,A9,D4,D

6,F4,F6,J1

11,21,38,

53,64

67,75,82,92

1

The PDSR and PSSR registers are described in the General Purpose I/O chapter. All programmable signals default to 2 mA drive and FAST slew rate in

normal (single-chip) mode.

2

All signals have a pull-up in GPIO mode.

3

These signals are multiplexed on other pins.

4

For primary and GPIO functions only.

5

Only when JTAG mode is enabled.

6

CLKMOD0 and CLKMOD1 have internal pull-down resistors; however, the use of external resistors is very strongly recommended.

7

When these pins are configured for USB signals, they should use the USB transceiver’s internal pull-up/pull-down resistors (see the description of the
OTG_CTRL register). If these pins are not configured for USB signals, each pin should be pulled down externally using a 10 kΩ resistor.

8

For secondary and GPIO functions only.

9

RSTI has an internal pull-up resistor; however, the use of an external resistor is very strongly recommended.

10

For GPIO function. Primary Function has pull-up control within the GPT module.

Freescale Semiconductor 21

MCF52211 ColdFire Microcontroller, Rev. 1

MCF52211 Family Configurations

MCF52211 Family Configurations

1.2 Reset Signals

Table 4 describes signals used to reset the chip or as a reset indication.

Table 4. Reset Signals

Signal Name Abbreviation Function I/O

Reset In RSTI

Reset Out RSTO

Primary reset input to the device. Asserting RSTI for at least 8 CPU
clock cycles immediately resets the CPU and peripherals.

Driven low for 1024 CPU clocks after the reset source has deasserted. O

1.3 PLL and Clock Signals

Table 5 describes signals used to support the on-chip clock generation circuitry.

Table 5. PLL and Clock Signals

Signal Name Abbreviation Function I/O

External Clock In EXTAL Crystal oscillator or external clock input except when the on-chip

relaxation oscillator is used.

Crystal XTAL Crystal oscillator output except when CLKMOD1=1, then sampled as

part of the clock mode selection mechanism.

Clock Out CLKOUT This output signal reflects the internal system clock. O

1.4 Mode Selection

Table 6 describes signals used in mode selection; Table 7 de scribes the particular clocking modes.

Table 6. Mode Selection Signals

Signal Name Abbreviation Function I/O

I

I

O

Clock Mode Selection CLKMOD[1:0] Selects the clock boot mode. I

Reset Configuration RCON The Serial Flash Programming mode is entered by asserting the

RCON pin (with the TEST pin negated) as the chip comes out of
reset. During this mode, the EzPort has access to the flash memory
which can be programmed from an external device.

Test TEST Reserved for factory testing only and in normal modes of operation

should be connected to VSS to prevent unintentional activation of
test functions.

Table 7. Clocking Modes

CLKMOD[1:0] XTAL Configure the clock mode.

00 0 PLL disabled, clock driven by external oscillator

00 1 PLL disabled, clock driven by on-chip oscillator

01 N/A PLL disabled, clock driven by crystal

10 0 PLL in normal mode, clock driven by external oscillator

10 1 PLL in normal mode, clock driven by on-chip oscillator

11 N/A PLL in normal mode, clock driven by crystal

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor22

I

1.5 External Interrupt Signals

Table 8 describes the external interrupt signals.

Table 8. External Interrupt Signals

Signal Name Abbreviation Function I/O

MCF52211 Family Configurations

External Interrupts IRQ

[7:1] External interrupt sources. I

1.6 Queued Serial Peripheral Interface (QSPI)

Table 9 describes the QSPI signals.

Table 9. Queued Serial Peripheral Interface (QSPI) Signals

Signal Name Abbreviation Function I/O

QSPI Synchronous

Serial Output

QSPI Synchronous

Serial Data Input

QSPI Serial Clock QSPI_CLK Provides the serial clock from the QSPI. The polarity and phase of

Synchronous Peripheral

Chip Selects

QSPI_DOUT Provides the serial data from the QSPI and can be programmed to be

driven on the rising or falling edge of QSPI_CLK.

QSPI_DIN Provides the serial data to the QSPI and can be programmed to be

sampled on the rising or falling edge of QSPI_CLK.

QSPI_CLK are programmable.

QSPI_CS[3:0] QSPI peripheral chip select; can be programmed to be active high or

low.

1.7 USB On-the-Go

This device is compliant with industry standard USB 2.0 specification.

1.8 I2C I/O Signals

O

I

O

O

Table 10 describes the I2C serial interface module signals.

Table 10. I2C I/O Signals

Signal Name Abbreviation Function I/O

2

Serial Clock SCL Open-drain clock signal for the for the I

In master mode, this clock is driven by the I
is in slave mode, this clock becomes the clock input.

Serial Data SDA Open-drain signal that serves as the data input/output for the I

interface.

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 23

C interface. When the bus is

2

C module; when the bus

2

C

I/O

I/O

MCF52211 Family Configurations

1.9 UART Module Signals

Table 11 describes the UART module signals.

Table 11. UART Module Signals

Signal Name Abbreviation Function I/O

Transmit Serial Data

Output

Receive Serial Data

Input

Clear-to-Send UCTS

Request-to-Send URTS

UTXDn Transmitter serial data outputs for the UART modules. The output is

held high (mark condition) when the transmitter is disabled, idle, or in
the local loopback mode. Data is shifted out, LSB first, on this pin at
the falling edge of the serial clock source.

URXDn Receiver serial data inputs for the UART modules. Data is received on

this pin LSB first. When the UART clock is stopped for power-down
mode, any transition on this pin restarts the clock.

n Indication to the UART modules that they can begin data

transmission.

n Automatic request-to-send outputs from the UART modules. This

signal can also be configured to be asserted and negated as a
function of the RxFIFO level.

1.10 DMA Timer Signals

Table 12 describes the signals of the four DMA timer modules.

Table 12. DMA Timer Signals

Signal Name Abbreviation Function I/O

DMA Timer Input DTIN Event input to the DMA timer modules. I

DMA Timer Output DTOUT Programmable output from the DMA timer modules. O

O

I

I

O

1.11 ADC Signals

Table 13 describes the signals of the Analog-to-Digital Converter.

Table 13. ADC Signals

Signal Name Abbreviation Function I/O

Analog Inputs AN[7:0] Inputs to the analog-to-digital converter. I

Analog Reference V

Analog Supply V

ADC Sync Inputs SYNCA /

RH

V

RL

DDA

V

SSA

SYNCB

MCF52211 ColdFire Microcontroller, Rev. 1

Reference voltage high and low inputs. I

Isolate the ADC circuitry from power supply noise. —

These signals can initiate an analog-to-digital conversion
process.

I

—

I

Freescale Semiconductor24

MCF52211 Family Configurations

1.12 General Purpose Timer Signals

Table 14 describes the general purpose timer signals.

Table 14. GPT Signals

Signal Name Abbreviation Function I/O

General Purpose Timer

Input/Output

GPT[3:0] Inputs to or outputs from the general purpose timer module. I/O

1.13 Pulse Width Modulator Signals

Table 15 describes the PWM signals.

Table 15. PWM Signals

Signal Name Abbreviation Function I/O

PWM Output Channels PWM[7:0] Pulse width modulated output for PWM channels. O

1.14 Debug Support Signals

These signals are used as the interface to the on-chip JTAG controller and the BDM logic.

Table 16. Debug Support Signals

Signal Name Abbreviation Function I/O

JTAG Enable JTAG_EN Select between debug module and JTAG signals at reset. I

Test Reset TRST This active-low signal is used to initialize the JTAG logic

asynchronously.

Test Clock TCLK Used to synchronize the JTAG logic. I

Test Mode Select TMS Used to sequence the JTAG state machine. TMS is sampled on the

rising edge of TCLK.

I

I

Test Data Input TDI Serial input for test instructions and data. TDI is sampled on the rising

edge of TCLK.

Test Data Output TDO Serial output for test instructions and data. TDO is tri-stateable and is

actively driven in the shift-IR and shift-DR controller states. TDO
changes on the falling edge of TCLK.

Development Serial

Clock

Breakpoint BKPT

Freescale Semiconductor 25

DSCLK Development Serial Clock - Internally synchronized input. (The logic

level on DSCLK is validated if it has the same value on two
consecutive rising bus clock edges.) Clocks the serial communication
port to the debug module during packet transfers. Maximum frequency
is PSTCLK/5. At the synchronized rising edge of DSCLK, the data
input on DSI is sampled and DSO changes state.

Breakpoint - Input used to request a manual breakpoint. Assertion of

puts the processor into a halted state after the current

BKPT
instruction completes. Halt status is reflected on processor
status/debug data signals (PST[3:0] and PSTDDATA[7:0]) as the
value 0xF. If CSR[BKD] is set (disabling normal BKPT
asserting BKPT
processor.

MCF52211 ColdFire Microcontroller, Rev. 1

generates a debug interrupt exception in the

functionality),

I

O

I

I

MCF52211 Family Configurations

Signal Name Abbreviation Function I/O

Table 16. Debug Support Signals (continued)

Development Serial

Input

Development Serial

Output

Debug Data DDATA[3:0] Display captured processor data and breakpoint status. The CLKOUT

Processor Status Clock PSTCLK Processor Status Clock - Delayed version of the processor clock. Its

Processor Status

Outputs

All Processor Status

Outputs

DSI Development Serial Input - Internally synchronized input that provides

data input for the serial communication port to the debug module, after
the DSCLK has been seen as high (logic 1).

DSO Development Serial Output - Provides serial output communication for

debug module responses. DSO is registered internally. The output is
delayed from the validation of DSCLK high.

signal can be used by the development system to know when to
sample DDATA[3:0].

rising edge appears in the center of valid PST and DDATA output.
PSTCLK indicates when the development system should sample PST
and DDATA values.
If real-time trace is not used, setting CSR[PCD] keeps PSTCLK, and
PST and DDATA outputs from toggling without disabling triggers.
Non-quiescent operation can be reenabled by clearing CSR[PCD],
although the external development systems must resynchronize with
the PST and DDATA outputs.
PSTCLK starts clocking only when the first non-zero PST value (0xC,
0xD, or 0xF) occurs during system reset exception processing.

PST[3:0] Indicate core status. Debug mode timing is synchronous with the

processor clock; status is unrelated to the current bus transfer. The
CLKOUT signal can be used by the development system to know
when to sample PST[3:0].

ALLPST Logical AND of PST[3:0]. The CLKOUT signal can be used by the

development system to know when to sample ALLPST.

I

O

O

O

O

O

1.15 EzPort Signal Descriptions

Table contains a list of EzPort external signals.

Table 17. EzPort Signal Descriptions

Signal Name Abbreviation Function I/O

EzPort Clock EZPCK Shift clock for EzPort transfers. I

EzPort Chip Select EZPCS Chip select for signalling the start and end of

EzPort Serial Data In EZPD EZPD is sampled on the rising edge of

EzPort Serial Data Out EZPQ EZPQ transitions on the falling edge of

MCF52211 ColdFire Microcontroller, Rev. 1

I

serial transfers.

I

EZPCK.

O

EZPCK.

Freescale Semiconductor26

Electrical Characteristics

1.16 Power and Ground Pins

The pins described in Table 18 provide system power and ground to the chip. Multiple pins are provided for adequate current
capability. All power supply pins must have adequate bypass capacitance for high-frequency noise suppression.

Table 18. Power and Ground Pins

Signal Name Abbreviation Function

PLL Analog Supply VDDPLL,

VSSPLL

Positive Supply VDD These pins supply positive power to the core logic.

Ground VSS This pin is the negative supply (ground) to the chip.

Dedicated power supply signals to isolate the sensitive PLL analog
circuitry from the normal levels of noise present on the digital power
supply.

2 Electrical Characteristics

This section contains electrical specification tables and reference timing diagrams for the MCF52211 microcontroller unit,
including detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications.

The electrical specifications are preliminary and are from previous designs or design simulations. These specifications may not
be fully tested or guaranteed at this early stage of the product life cycle. These specifications will, however, be met for
production silicon. Finalized specifications will be published after complete characterization and device qualifications have
been completed.

NOTE

The parameters specified in this data sheet supersede any values found in the module
specifications.

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 27

Electrical Characteristics

2.1 Maximum Ratings

Table 19. Absolute Maximum Ratings

Rating Symbol Value Unit

1, 2

Supply voltage V

Clock synthesizer supply voltage V

RAM standby supply voltage V

USB standby supply voltage V

Digital input voltage

3

EXTAL pin voltage V

XTAL pin voltage V

Instantaneous maximum current
Single pin limit (applies to all pins)

4, 5

Operating temperature range (packaged) T

DD

DDPLL

STBY

DDUSB

V

IN

EXTAL

XTAL

I

DD

A

(TL - TH)

Storage temperature range T

1

Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum Ratings

stg

–0.3 to +4.0 V

–0.3 to +4.0 V

+1.8 to 3.5 V

–0.3 to +4.0 V

–0.3 to +4.0 V

0 to 3.3 V

0 to 3.3 V

25 mA

–40 to 85 or

0 to 70

6

–65 to 150 °C

°C

are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond
those listed may affect device reliability or cause permanent damage to the device.

2

This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher
than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if
unused inputs are tied to an appropriate logic voltage level (V

3

Input must be current limited to the IDD value specified. To determine the value of the required

or VDD).

SS

current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then
use the larger of the two values.

4

All functional non-supply pins are internally clamped to VSS and VDD.

5

The power supply must maintain regulation within operating VDD range during instantaneous and
operating maximum current conditions. If positive injection current (Vin > VDD) is greater than IDD, the
injection current may flow out of V

and could result in the external power supply going out of

DD

regulation. Ensure that the external VDD load shunts current greater than maximum injection current.
This is the greatest risk when the MCU is not consuming power (e.g., no clock).

6

Depending on the packaging; see the orderable part number summary.

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor28

Electrical Characteristics

2.2 Current Consumption

Table 20. Current Consumption in Low-Power Mode

Flash memory SRAM

Mode

8 MHz 16 MHz 64 MHz 80 MHz 8 MHz 16 MHz 64 MHz 80 MHz

Stop mode 3 (Stop 11)

Stop mode 2 (Stop 10)

Stop mode 1 (Stop 01)

Stop mode 0 (Stop 00)

Wait / Doze 12.3 22.7 40.3 45 5.3 7.9 24 30

Run TBD TBD TBD TBD 6.7 10.8 35 43

1

All values are measured with a 3.30V power supply.

2

Refer to the Power Management chapter in the MCF52211 Reference Manual for more information on low-power modes.

3

See the description of the Low-Power Control Register (LPCR) in the MCF52211 Reference Manual for more information on
stop modes 0–3.

4

Results are identical to STOP 00 for typical values because they only differ by CLKOUT power consumption. CLKOUT is
already disabled in this instance prior to entering low power mode.

3

3

3,4

3

0.057 0.002 mA

2.5 2.3

3.03 3.3 4.9 5.6 2.9 3.1 4.8 5.4

3.03 3.3 4.9 5.6 2.9 3.1 4.8 5.4

1,2

Units

Table 21. Typical Active Current Consumption Specifications

Characteristic Symbol

Typica l1

Active

Typical

(SRAM)

PLL @ 8 MHz I

DD

81121mA

PLL @ 16 MHz 12 19 38

PLL @ 64 MHz 38 45 102

PLL @ 80 MHz 45 54 118

RAM standby supply current

• Normal operation: V

• Transient condition: V

• Standby operation: V

DD

STBY

DD

> V

< V

- 0.3 V

STBY

- 0.3 V > V
+ 0.5 V

SS

DD

> V

SS

+ 0.5 V

Analog supply current

• Normal operation

• Standby

• Powered down

USB supply current I
PLL supply current I

1

Tested at room temperature with CPU polling a status register. All clocks were off except the UART and CFM (when

I

STBY

I

DDA

DDUSB

DDPLL

0
TBD
TBD

—
—
—

——TBDmA

——6

running from flash memory).

2

Peak current measured with all modules active, CPU polling a status register, and default drive strength with matching
load.

3

Tested with the PLL MFD set to 7 (max value). Setting the MFD to a lower value results in lower current consumption.

Active

(Flash)

—
—
—

1

2

Peak

(Flash)

TBD
TBD
TBD

14

0.8

0

(see note 3)

Unit

μA

mA

μA

mA

mA

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 29

Electrical Characteristics

2.3 Thermal Characteristics

Table 22 lists thermal resistance values.

Table 22. Thermal Characteristics

Characteristic Symbol Value Unit

100 LQFP Junction to ambient, natural convection Single layer board (1s) θ

Junction to ambient, natural convection Four layer board (2s2p) θ

Junction to ambient, (@200 ft/min) Single layer board (1s) θ

Junction to ambient, (@200 ft/min) Four layer board (2s2p) θ

Junction to board — θ

Junction to case — θ

Junction to top of package Natural convection Ψ

Maximum operating junction temperature — T

81 MAPBGA Junction to ambient, natural convection Single layer board (1s) θ

Junction to ambient, natural convection Four layer board (2s2p) θ

Junction to ambient, (@200 ft/min) Single layer board (1s) θ

Junction to ambient, (@200 ft/min) Four layer board (2s2p) θ

Junction to board — θ

Junction to case — θ

Junction to top of package Natural convection Ψ

Maximum operating junction temperature — T

64 LQFP Junction to ambient, natural convection Single layer board (1s) θ

Junction to ambient, natural convection Four layer board (2s2p) θ

Junction to ambient (@200 ft/min) Single layer board (1s) θ

Junction to ambient (@200 ft/min) Four layer board (2s2p) θ

Junction to board — θ

Junction to case — θ

Junction to top of package Natural convection Ψ

Maximum operating junction temperature — T

64 QFN Junction to ambient, natural convection Single layer board (1s) θ

Junction to ambient, natural convection Four layer board (2s2p) θ

Junction to ambient (@200 ft/min) Single layer board (1s) θ

Junction to ambient (@200 ft/min) Four layer board (2s2p) θ

Junction to board — θ

Junction to case (bottom) — θ

Junction to top of package Natural convection Ψ

Maximum operating junction temperature — T

JA

JA

JMA

JMA

JB

JC

JA

JA

JMA

JMA

JB

JC

JA

JA

JMA

JMA

JB

JC

JA

JA

JMA

JMA

JB

JC

1,2

53

1,3

39

1,3

42

1,3

33

4

25

5

9

6

105

61

35

50

31

20

12

105

62

43

50

36

26

105

68

24

55

19

0.6

105

2

1,2

2,3

2,3

2,3

4

5

6

2

1,2

1,3

1,3

1,3

4

5

9

6

2

1,2

1,3

1,3

1,3

4

8

5

6

3

jt

j

jt

j

jt

j

jt

j

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

o

C

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

o

C

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

o

C

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

°C / W

o

C

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor30

Electrical Characteristics

TJTAP

DΘJMA

×()+=

PDKTJ273°C+()÷=

1

θJA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale

recommends the use of θJA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψ

parameter, the device power

jt

dissipation, and the method described in EIA/JESD Standard 51-2.

2

Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.

3

Per JEDEC JESD51-6 with the board JESD51-7) horizontal.

4

Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.

5

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).

6

Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.

The average chip-junction temperature (T

) in °C can be obtained from:

J

(1)

Where:

T

A

Θ

JA

P

D

P

INT

P

I/O

For most applications P

= ambient temperature, °C

= package thermal resistance, junction-to-ambient, °C/W

= P

+ P

INT

I/O

= chip internal power, IDD × VDD, watts

= power dissipation on input and output pins — user determined, watts

< P

I/O

and can be ignored. An approximate relationship between PD and TJ (if P

INT

(2)

Solving equations 1 and 2 for K gives:

2

K = PD × (TA + 273 °C) + Θ

JMA

× P

(3)

D

where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P
for a known T
any value of T

. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for

A

.

A

2.4 Flash Memory Characteristics

The flash memory characteristics are shown in Table 23 and Table 24.

Table 23. SGFM Flash Program and Erase Characteristics

(V

= 2.7 to 3.6 V)

DDF

is neglected) is:

I/O

(at equilibrium)

D

Parameter Symbol Min Typ Max Unit

System clock (read only) f

System clock (program/erase)

1

Depending on packaging; see Ta bl e 2 .

2

Refer to the flash memory section for more information

2

sys(R)

f

sys(P/E)

0—50–80

0.15 — 102.4 MHz

1

MHz

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 31

Electrical Characteristics

Table 24. SGFM Flash Module Life Characteristics

(V

= 2.7 to 3.6 V)

DDF

Parameter Symbol Value Unit

Maximum number of guaranteed program/erase cycles

1

before failure

P/E 10,000

2

Data retention at average operating temperature of 85°C Retention 10 Years

1

A program/erase cycle is defined as switching the bits from 1 → 0 → 1.

2

Reprogramming of a flash memory array block prior to erase is not required.

2.5 ESD Protection

Table 25. ESD Protection Characteristics1,

2

Cycles

Characteristics

Symbol Value Units

ESD target for Human Body Model HBM 2000 V

ESD target for Machine Model MM 200 V

HBM circuit description R

series

1500 Ω

C 100 pF

MM circuit description R

series

0 Ω

C 200 pF

Number of pulses per pin (HBM)

• Positive pulses

• Negative pulses

Number of pulses per pin (MM)

• Positive pulses

• Negative pulses

—
—

—
—

1
1

3
3

—

—

Interval of pulses — 1 sec

1

All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.

2

A device is defined as a failure if after exposure to ESD pulses the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing is performed per applicable device specification at room temperature followed by
hot temperature, unless specified otherwise in the device specification.

2.6 DC Electrical Specifications

Characteristic Symbol Min Max Unit

Supply voltage V

Standby voltage V

Input high voltage V

Input low voltage V

Input hysteresis V

Table 26. DC Electrical Specifications

MCF52211 ColdFire Microcontroller, Rev. 1

DD

STBY

IH

IL

HYS

1

3.0 3.6 V

3.0 3.5 V

0.7 × V

DD

V

– 0.3 0.35 × V

SS

0.06 × V

DD

4.0 V

—mV

Freescale Semiconductor32

DD

V

Electrical Characteristics

Table 26. DC Electrical Specifications (continued)

Characteristic Symbol Min Max Unit

Low-voltage detect trip voltage (VDD falling) V

Low-voltage detect hysteresis (V

Input leakage current

= VDD or VSS, digital pins

V

in

Output high voltage (all input/output and all output pins)
I

= –2.0 mA

OH

Output low voltage (all input/output and all output pins)

= 2.0mA

I

OL

Output high voltage (high drive)

= -5 mA

I

OH

Output low voltage (high drive)
I

= 5 mA

OL

Output high voltage (low drive)

= -2 mA

I

OH

Output low voltage (low drive)

= 2 mA

I

OL

Weak internal pull Up device current, tested at VIL Max.

Input Capacitance

3

• All input-only pins

• All input/output (three-state) pins

1

Refer to Table 27 for additional PLL specifications.

2

Refer to Ta bl e 3 for pins having internal pull-up devices.

3

This parameter is characterized before qualification rather than 100% tested.

rising) V

DD

2

LV D

LV DH Y S

I

in

V

OH

V

OL

V

OH

V

OL

V

OH

V

OL

I

APU

C

in

1

2.15 2.3 V

60 120 mV

–1.0 1.0 μA

V

– 0.5 — V

DD

—0.5V

V

– 0.5 — V

DD

—0.5V

V

- 0.5 — V

DD

—0.5V

–10 –130 μA

pF
—
—

7
7

2.7 Clock Source Electrical Specifications

Characteristic Symbol Min Max Unit

PLL reference frequency range

• Crystal reference

• External reference

System frequency

1

• External clock mode

• On-chip PLL frequency

Loss of reference frequency

Self clocked mode frequency

Crystal start-up time

5, 6

3, 5

4

EXTAL input high voltage

• External reference

Freescale Semiconductor 33

Table 27. PLL Electrical Specifications

(VDD and V

MCF52211 ColdFire Microcontroller, Rev. 1

= 2.7 to 3.6 V, VSS = V

DDPLL

f

ref_crystal

f

ref_ext

f

sys

f

LOR

f

SCM

t

cst

V

IHEXT

SSPLL

= 0 V)

MHz
2
2

0

f

/ 32

ref

10.0

10.0

50-80
50-80

2
2

MHz

100 1000 kHz

15MHz

—0.1ms

V

2.0 V

DD

Electrical Characteristics

Table 27. PLL Electrical Specifications (continued)

(VDD and V

Characteristic Symbol Min Max Unit

= 2.7 to 3.6 V, VSS = V

DDPLL

SSPLL

= 0 V)

EXTAL input low voltage

• External reference

PLL lock time

Duty cycle of reference

4,7

4

Frequency un-LOCK range f
Frequency LOCK range f

CLKOUT period jitter

4, 5, 8 ,9

, measured at f

SYS

Max

• Peak-to-peak (clock edge to clock edge)

• Long term (averaged over 2 ms interval)

On-chip oscillator frequency f

1

All internal registers retain data at 0 Hz.

2

Depending on packaging; see Ta b l e 2 .

3

Loss of Reference Frequency is the reference frequency detected internally, which transitions the PLL into self clocked mode.

4

Self clocked mode frequency is the frequency at which the PLL operates when the reference frequency falls below f

V

C

ILEXT

t

lpll

t

dc

UL

LCK

jitter

oco

V

SS

0.8

—500μs

40 60 % f

–1.5 1.5 % f

–0.75 0.75 % f

—
—

10

.01

% f

7.84 8.16 MHz

LOR

default MFD/RFD settings.

5

This parameter is characterized before qualification rather than 100% tested.

6

Proper PC board layout procedures must be followed to achieve specifications.

7

This specification applies to the period required for the PLL to relock after changing the MFD frequency control bits in the
synthesizer control register (SYNCR).

8

Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f

sys

.

Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the PLL circuitry via V

DDPLL

and V

and variation in crystal oscillator frequency increase the C

SSPLL

percentage

jitter

for a given interval.

9

Based on slow system clock of 40 MHz measured at f

sys

max.

V

ref

ref

ref

sys

with

2.8 USB Operation

Table 28. USB Operation Specifications

Characteristic Symbol Value Unit

Minimum core speed for USB operation f

sys_USB_min

16 MHz

2.9 General Purpose I/O Timing

GPIO can be configured for certain pins of the QSPI, DDR Control, timer, UART, Interrupt and USB interfaces. When in
GPIO mode, the timing specification for these pins is given in Table 29 and Figure 5.

The GPIO timing is met under the following load test conditions:

•50pF/50Ω for high drive

•25pF/25Ω for low drive

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor34

Electrical Characteristics

G1

CLKOUT

GPIO Outputs

G2

G3 G4

GPIO Inputs

1R1

R2

CLKOUT

RSTI

RSTO

R3

R4 R4

Table 29. GPIO Timing

NUM Characteristic Symbol Min Max Unit

G1 CLKOUT High to GPIO Output Valid t

G2 CLKOUT High to GPIO Output Invalid t

G3 GPIO Input Valid to CLKOUT High t

G4 CLKOUT High to GPIO Input Invalid t

CHPOV

CHPOI

PVCH

CHPI

—10ns

1.5 — ns

9—ns

1.5 — ns

Figure 5. GPIO Timing

2.10 Reset Timing

Table 30. Reset and Configuration Override Timing

(V

= 2.7 to 3.6 V, V

DD

SS

= 0 V, T

= TL to TH)

A

NUM Characteristic Symbol Min Max Unit

1

R1 RSTI

R2 CLKOUT High to RSTI

R3 RSTI

R4 CLKOUT High to RSTO Val i d t

1

All AC timing is shown with respect to 50% VDD levels unless otherwise noted.

2

During low power STOP, the synchronizers for the RSTI input are bypassed and RSTI is asserted asynchronously to the

input valid to CLKOUT High t

Input invalid t

input valid time

2

RVCH

CHRI

t

RIVT

CHROV

9—ns

1.5 — ns

5—t

CYC

—10ns

system. Thus, RSTI must be held a minimum of 100 ns.

Figure 6. RSTI and Configuration Override Timing

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 35

Electrical Characteristics

2.11 I2C Input/Output Timing Specifications

Table 31 lists specifications for the I2C input timing parameters shown in Figure 7.

Table 31. I2C Input Timing Specifications between I2C_SCL and I2C_SDA

Num Characteristic Min Max Units

11 Start condition hold time 2 × t

I2 Clock low period 8 × t

I3 SCL/SDA rise time (V

I4 Data hold time 0 — ns

I5 SCL/SDA fall time (VIH= 2.4 V to VIL= 0.5 V) — 1 ms

I6 Clock high time 4 × t

I7 Data setup time 0 — ns

I8 Start condition setup time (for repeated start condition only) 2 × t

I9 Stop condition setup time 2 × t

Table 32 lists specifications for the I

1

2

3

Table 32 . I2C Output Timing Specifications between I2C_SCL and I2C_SDA

Num Characteristic Min Max Units

1

11

Start condition hold time 6 × t

1

Clock low period 10 × t

I2

2

I2C_SCL/I2C_SDA rise time

I3

= 0.5 V to VIH= 2.4 V)

(V

IL

1

I4

Data hold time 7 × t

3

I5

I2C_SCL/I2C_SDA fall time

= 2.4 V to VIL= 0.5 V)

(V

IH

1

I6

Clock high time 10 × t

1

Data setup time 2 × t

I7

1

I8

Start condition setup time (for repeated start
condition only)

1

Stop condition setup time 10 × t

I9

Output numbers depend on the value programmed into the IFDR; an IFDR programmed with the
maximum frequency (IFDR = 0x20) results in minimum output timings as shown in Ta bl e 32 . The I2C
interface is designed to scale the actual data transition time to move it to the middle of the SCL low
period. The actual position is affected by the prescale and division values programmed into the IFDR;
however, the numbers given in Ta b l e 3 2 are minimum values.

Because SCL and SDA are open-collector-type outputs, which the processor can only actively drive
low, the time SCL or SDA take to reach a high level depends on external signal capacitance and pull-up
resistor values.

Specified at a nominal 50-pF load.

CYC

CYC

= 0.5 V to VIH= 2.4 V) — 1 ms

IL

CYC

CYC

CYC

2

C output timing parameters shown in Figure 7.

—ns

CYC

CYC

—ns

—ns

—ns

—ns

—ns

—ns

——µs

CYC

—ns

—3ns

—ns

—ns

—ns

—ns

20 × t

CYC

CYC

CYC

CYC

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor36

Figure 7 shows timing for the values in Table 31 and Table 32.

I2 I6

I1 I4

I7

I8 I9

I5

I3

SCL

SDA

Electrical Characteristics

Figure 7. I

2

C Input/Output Timings

2.12 Analog-to-Digital Converter (ADC) Parameters

Table 33 lists specifications for the analog-to-digital converter.

Table 33. ADC Parameters

Name Characteristic Min Typical Max Unit

V

V

V

V

REFL

REFH

DDA

ADIN

Low reference voltage V

High reference voltage V

ADC analog supply voltage 3.0 3.3 3.6 V

Input voltages V

RES Resolution 12 — 12 Bits

INL Integral non-linearity (full input signal range)

INL Integral non-linearity (10% to 90% input signal range)

2

4

DNL Differential non-linearity — –1 < DNL < +1<+1LSB

Monotonicity GUARANTEED

f

ADIC

R

t

ADPU

t

REC

t

ADC

t

ADS

C

X

I

ADI

I

VREFHVREFH

V

OFFSET

E

GAIN

V

OFFSET

ADC internal clock 0.1 — 5.0 MHz

Conversion range V

AD

ADC power-up time

5

Recovery from auto standby — 0 1 t

Conversion time — 6 — t

Sample time — 1 — t

Input capacitance — See Figure 8 —pF

ADI

Input impedance — See Figure 8 —W

IN

Input injection current7, per pin — — 3 mA

current — 0 — m

Offset voltage internal reference — ±8 ±15 mV

Gain error (transfer path) .99 1 1.01 —

Offset voltage external reference — ±3TBDmV

SNR Signal-to-noise ratio — 62 to 66 — dB

1

SS

REFL

REFL

—V

—V

—V

REFH

DDA

REFH

V

V

V

— ±2.5 ±3LSB

— ±2.5 ±3LSB

REFL

—V

REFH

—613t

AIC

AIC

AIC

AIC

V

cycles

cycles

cycles

cycles

3

6

Freescale Semiconductor 37

MCF52211 ColdFire Microcontroller, Rev. 1

Electrical Characteristics

1

2

3

Analog Input

4

S1

S2

S3

C1

C2

S/H

C1 = C2 = 1pF

(V

REFH

- V

REFL

)/ 2

125W ESD Resistor

8pF noise damping capacitor

1

(ADC Clock Rate) × (1.4×10

-12

)

Table 33. ADC Parameters1 (continued)

Name Characteristic Min Typical Max Unit

THD Total harmonic distortion — −75 — dB

SFDR Spurious free dynamic range — 67 to 70.3 — dB

SINAD Signal-to-noise plus distortion — 61 to 63.9 — dB

ENOB Effective number of bits 9.1 10.6 — Bits

1

All measurements are preliminary pending full characterization, and made at VDD = 3.3V, V

2

INL measured from VIN = V

3

LSB = Least Significant Bit

4

INL measured from VIN = 0.1V

5

Includes power-up of ADC and V

6

ADC clock cycles

7

Current that can be injected or sourced from an unselected ADC signal input without impacting the performance of the ADC

REFL

to VIN = V

to VIN = 0.9V

REFH

REF

REFH

REFH

= 3.3V, and V

REFH

REFL

= ground

2.13 Equivalent Circuit for ADC Inputs

Figure 10-17 shows the ADC input circuit during sample and hold. S1 and S2 are always open/closed at the same time that S3
is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and hold circuit moves to (V

REFH-VREFL

the other charges to the analog input voltage. When the switches are flipped, the charge on C1 and C2 are averaged via S3, with
the result that a single-ended analog input is switched to a differential voltage centered about (V

REFH-VREFL

)/2. The switches
switch on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). There are additional
capacitances associated with the analog input pad, routing, etc., but these do not filter into the S/H output voltage, as S1 provides
isolation during the charge-sharing phase. One aspect of this circuit is that there is an on-going input current, which is a function
of the analog input voltage, V

and the ADC clock frequency.

REF

)/2, while

1. Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pF

2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routi ng; 2.04 pF

3. Equivalent resistance for the channel select mux; 100 Ωs

4. Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1.4pF

5. Equivalent input imp edance, when the input is selected =

Figure 8. Equivalent Circuit for A/D Loading

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor38

2.14 DMA Timers Timing Specifications

QSPI_CS[3:0]

QSPI_CLK

QSPI_DOUT

QS5

QS1

QSPI_DIN

QS3

QS4

QS2

Table 34 lists timer module AC timings.

Table 34. Timer Module AC Timing Specifications

Electrical Characteristics

Name Characteristic

T1 DTIN0 / DTIN1 / DTIN2 / DTIN3 cycle time 3 × t

T2 DTIN0 / DTIN1 / DTIN2 / DTIN3 pulse width 1 × t

1

All timing references to CLKOUT are given to its rising edge.

1

Min Max Unit

CYC

CYC

—ns

—ns

2.15 QSPI Electrical Specifications

Table 35 lists QSPI timings.

Table 35. QSPI Modules AC Timing Specifications

Name Characteristic Min Max Unit

QS1 QSPI_CS[3:0] to QSPI_CLK 1 510 t

QS2 QSPI_CLK high to QSPI_DOUT valid — 10 ns

QS3 QSPI_CLK high to QSPI_DOUT invalid (Output hold) 2 — ns

QS4 QSPI_DIN to QSPI_CLK (Input setup) 9 — ns

QS5 QSPI_DIN to QSPI_CLK (Input hold) 9 — ns

The values in Table 35 correspond to Figure 9.

CYC

Figure 9. QSPI Timing

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 39

Electrical Characteristics

TCLK

V

IL

V

IH

J3 J3

J4 J4

J2

(input)

2.16 JTAG and Boundary Scan Timing

Table 36. JTAG and Boundary Scan Timing

Num Characteristics

J1 TCLK frequency of operation f

J2 TCLK cycle period t

J3 TCLK clock pulse width t

J4 TCLK rise and fall times t

J5 Boundary scan input data setup time to TCLK rise t

J6 Boundary scan input data hold time after TCLK rise t

J7 TCLK low to boundary scan output data valid t

J8 TCLK low to boundary scan output high Z t

J9 TMS, TDI input data setup time to TCLK rise t

J10 TMS, TDI Input data hold time after TCLK rise t

J11 TCLK low to TDO data valid t

J12 TCLK low to TDO high Z t

J13 TRST

J14 TRST

1

JTAG_EN is expected to be a static signal. Hence, it is not associated with any timing.

assert time t

setup time (negation) to TCLK high t

1

Symbol Min Max Unit

JCYC

JCYC

JCW

JCRF

BSDST

BSDHT

BSDV

BSDZ

TAPBST

TAPBHT

TDODV

TDODZ

TRSTAT

TRSTST

DC 1/4 f

4 × t

CYC

—ns

sys/2

26 — ns

03ns

4—ns

26 — ns

033ns

033ns

4—ns

10 — ns

026ns

08ns

100 — ns

10 — ns

MCF52211 ColdFire Microcontroller, Rev. 1

Figure 10. Test Clock Input Timing

Freescale Semiconductor40

Electrical Characteristics

Input Data Valid

Output Data Valid

Output Data Valid

TCLK

Data Inputs

Data Outputs

Data Outputs

Data Outputs

V

IL

V

IH

J5 J6

J7

J8

J7

Input Data Valid

Output Data Valid

Output Data Valid

TCLK

TDI

TDO

TDO

TDO

TMS

V

IL

V

IH

J9 J10

J11

J12

J11

TCLK

TRST

14

13

Figure 11. Boundary Scan (JTAG) Timing

Figure 12. Test Access Port Timing

Figure 13. TRST Timing

Freescale Semiconductor 41

MCF52211 ColdFire Microcontroller, Rev. 1

Electrical Characteristics

CLKOUT

PST[3:0]

D2D1

DDATA[3:0]

2.17 Debug AC Timing Specifications

Table 37 lists specifications for the debug AC timing parameters shown in Figure 15.

Table 37. Debug AC Timing Specification

Num Characteristic

Min Max

D1 PST, DDATA to CLKOUT setup 4 — ns

D2 CLKOUT to PST, DDATA hold 1.5 — ns

D3

D4

D5 DSCLK cycle time 5 × t

D6 BKPT

D7 BKPT

DSI-to-DSCLK setup 1 × t

1

DSCLK-to-DSO hold 4 × t

input data setup time to CLKOUT rise 4 — ns

input data hold time to CLKOUT rise 1.5 — ns

66/80 MHz

CYC

CYC

CYC

Units

—ns

—ns

—ns

D8 CLKOUT high to BKPT

1

DSCLK and DSI are synchronized internally. D4 is measured from the synchronized DSCLK input relative to

high Z 0.0 10.0 ns

the rising edge of CLKOUT.

Figure 14 shows real-time trace timing for the values in Table 37.

Figure 14. Real-Time Trace AC Timing

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor42

Figure 15 shows BDM serial port AC timing for the values in Table 37.

DSI

DSO

Current Next

CLKOUT

Past Current

DSCLK

D3

D4

D5

Figure 15. BDM Serial Port AC Timing

Electrical Characteristics

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 43

Mechanical Outline Drawings

3 Mechanical Outline Drawings

This section describes the physical properties of the MCF52211 and its derivatives.

3.1 64-pin LQFP Package

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor44

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 45

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor46

3.2 64 QFN Package

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 47

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor48

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 49

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor50

3.3 81 MAPBGA Package

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 51

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor52

3.4 100-pin LQFP Package

Mechanical Outline Drawings

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 53

Revision History

4 Revision History

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor54

Table 38. Revision History

Revision Description

0 Initial public release.

1 • Formatting, layout, spelling, and grammar corrections.

• Added information about the MCF52212 and MCF52213 devices.

• Synchronized the “Pin Functions by Primary and Alternate Purpose” table in this document and the
reference manual.

• Added a specification for V

• Added specifications for V

• Added the “USB Operation” section.

• Changed the maximum value for f
(was “66.67 or 80”, is “102.4”).

• Changed the maximum value for f
(was “66.67 or 80”, is “50–80”).

• Changed the crystal start-up time in the “PLL Electrical Specifications” table (was 10 ms, is 0.1 ms).

• Updated the current consumption specifications.

• Updated the maximum temperature and added clarifying footnote.

• Changed the absolute maximum rating for V

• Changed the maximum value for f
“50–80”).

to the “Absolute maximum ratings” table.

DDUSB

LV D

and V

sys(P/E)

sys(R)

sys

to the “DC electrical specifications” table.

LV DH Y S

in the “SGFM Flash Program and Erase Characteristics” table

in the “SGFM Flash Program and Erase Characteristics” table

(was “-0.3 to 4.0”, is “+1.8 to 3.5”).

STBY

in the “PLL Electrical Specifications” table (was “66.67 or 80”, is

Revision History

MCF52211 ColdFire Microcontroller, Rev. 1

Freescale Semiconductor 55

How to Reach Us:

Home Page:

www.freescale.com

Web Support:

http://www.freescale.com/support

USA/Europe or Locations Not Listed:

Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
[phone] or [phone]
www.freescale.com/support

Europe, Middle East, and Africa:

Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
[phone] (English)
[phone] (English)
[phone] (German)
[phone] (French)

www.freescale.com/support

Japan:

Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or [phone]
[e-mail]

Asia/Pacific:

Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
[phone]
[e-mail]

For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: [phone]
[e-mail]

Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.

Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.

RoHS-compliant and/or Pb-free versions of Freescale products have the functionality
and electrical characteristics as their non-RoHS-compliant and/or non-Pb-free
counterparts. For further information, see http://www.freescale.com or contact your
Freescale sales representative.

For information on Freescale’s Environmental Products program, go to

http://www.freescale.com/epp.

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2007. All rights reserved.

Document Number: MCF52211

Rev. 1
09/2007