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Revision History
Date
September,
2004
Revision
Level
1.0Initial external release.
Description
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
This product incorporates SuperFlash® technology licensed from SST.
The MC9S12NE64 is a 112-/80-pin cost-effective, low-end connectivity applications MCU family. The
MC9S12NE64 is composed of standard on-chip peripherals including a 16-bit central processing unit
(HCS12 CPU), 64K bytes of FLASH EEPROM, 8K bytes of RAM, Ethernet media access controller
(EMAC) with integrated 10/100 Mbps Ethernet physical transceiver (EPHY), two asynchronous serial
communications interface modules (SCI), a serial peripheral interface (SPI), one inter-IC bus (IIC), a
4-channel/16-bit timer module (TIM), an 8-channel/10-bit analog-to-digital converter (ATD), up to 21 pins
available as keypad wakeup inputs (KWU), and two additional external asynchronous interrupts. The
inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit operational
requirements. Furthermore, an on-chip bandgap-based voltage regulator (VREG_PHY) generates the
internal digital supply voltage of 2.5 V (VDD) from a 3.15 V to 3.45 V external supply range. The
MC9S12NE64 has full 16-bit data paths throughout. The 112-pin package version has a total of 70 I/O port
pins and 10 input-only pins available. The 80-pin package version has a total of 38 I/O port pins and 10
input-only pins available.
1.1.1Features
•16-bit HCS12 core
— HCS12 CPU
– Upward compatible with M68HC11 instruction set
– Interrupt stacking and programmer’s model identical to M68HC11
– Instruction queue
– Enhanced indexed addressing
— Memory map and interface (MMC)
— Interrupt control (INT)
— Background debug mode (BDM)
— Enhanced debug12 module, including breakpoints and change-of-flow trace buffer (DBG)
— Multiplexed expansion bus interface (MEBI) — available only in 112-pin package version
•Wakeup interrupt inputs
— Up to 21 port bits available for wakeup interrupt function with digital filtering
•Memory
— 64K bytes of FLASH EEPROM
— 8K bytes of RAM
•Analog-to-digital converter (ATD)
— One 8-channel module with 10-bit resolution
— External conversion trigger capability
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor45
Chapter 1 Device Overview
•Timer module (TIM)
— 4-channel timer
— Each channel configurable as either input capture or output compare
— Simple PWM mode
— Modulo reset of timer counter
— 16-bit pulse accumulator
— External event counting
— Gated time accumulation
•Serial interfaces
— Two asynchronous serial communications interface (SCI)
— One synchronous serial peripheral interface (SPI)
— One inter-IC bus (IIC)
•Ethernet Media access controller (EMAC)
— IEEE 802.3 compliant
— Medium-independent interface (MII)
— Full-duplex and half-duplex modes
— Flow control using pause frames
— MII management function
— Address recognition
– Frames with broadcast address are always accepted or always rejected
– Exact match for single 48-bit individual (unicast) address
– Hash (64-bit hash) check of group (multicast) addresses
– Promiscuous mode
•Ethertype filter
•Loopback mode
•Two receive and one transmit Ethernet buffer interfaces
— Clock monitor
— Pierce oscillator
— Phase-locked loop clock frequency multiplier
— Limp home mode in absence of external clock
— 25-MHz crystal oscillator reference clock
•Operating frequency
— 50 MHz equivalent to 25 MHz bus speed for single chip
— 32 MHz equivalent to 16 MHz bus speed in expanded bus modes
•Internal 2.5-V regulator
— Supports an input voltage range from 3.3 V ± 5%
— Low-power mode capability
— Includes low-voltage reset (LVR) circuitry
•80-pin TQFP-EP or 112-pin LQFP package
— Up to 70 I/O pins with 3.3 V input and drive capability (112-pin package)
— Up to two dedicated 3.3 V input only lines (
IRQ, XIRQ)
•Development support
— Single-wire background debug™ mode (BDM)
— On-chip hardware breakpoints
— Enhanced DBG debug features
Introduction
1.1.2Modes of Operation
•Normal modes
— Normal single-chip mode
— Normal expanded wide mode
— Normal expanded narrow mode
— Emulation expanded wide mode
— Emulation expanded narrow mode
•Special operating modes
— Special single-chip mode with active background debug mode
•Each of the above modes of operation can be configured for three low-power submodes
— Stop mode
— Pseudo stop mode
— Wait mode
•Secure operation, preventing the unauthorized read and write of the memory contents
1.MEBI is available only in the 112-pin package and specified at a maximum speed of 16 MHz. If using MEBI from
2.5 MHz to 16 MHz, only 10BASE-T communication is available.
2.No security feature is absolutely secure. However, Freescale Semiconductor’s strategy is to make reading or copying
the FLASH difficult for unauthorized users.
1
1
1
1
2
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor47
Chapter 1 Device Overview
1.1.3Block Diagram
64K Byte FLASH EEPROM
8K Byte RAM
TEST
VDDX1,2
VDDR /
VREGEN
VDD1,2
VSS1,2
BKGD
XFC
VDDPLL
VSSPLL
EXTAL
XTAL
RESET
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
PK0
PK1
PK2
PK3
Single-wire Background
Clock and Reset
PTE
PTK
Voltage Regulator
Debug Module
Generator
XIRQ
IRQ
W
R/
LSTRB
ECLK
DDRE
MODA
MODB
NOACC
XADDR14
XADDR15
XADDR16
XADDR17
XADDR18PK4
DDRE
XADDR19PK5
XCSPK6
ECS/ROMCTLPK7
Debugger
Breakpoints
CPU12
Periodic Interrupt
COP Watchdog
Clock Monitor
Expanded Bus
Interface
Multiplexed Address/Data Bus
DDRADDRB
PTAPTB
PA 4
PA 3
PA 2
PA 1
ADDR11
ADDR10
ADDR9
DATA11
DATA10
DATA9
DATA3
DATA2
DATA1
PA 0
ADDR8
DATA8
DATA0
PB7
PB6
ADDR7
ADDR6
DATA7
DATA6
PB4
PB5
ADDR4
ADDR5
DATA4
DATA5
PHY_TXP
PHY_TXN
PHY_RXP
PHY_RXN
PB3
ADDR3
DATA3
Multiplexed
Wide Bus
Multiplexed
Narrow Bus
PA 7
PA 6
PA 5
ADDR15
ADDR14
ADDR13
DATA15
DATA14
DATA13
DATA7
DATA6
DATA5
ADDR12
DATA12
DATA4
Signals shown in Bold are not available on the 80-pin package
Figure 1-1. MC9S12NE64 Block Diagram
PB2
PB1
ADDR2
ADDR1
DATA2
DATA1
Analog-to-Digital
Converter
Timer
Serial Communication
Interface 0
Serial Communication
Interface 1
Serial Peripheral
Interface
IIC
MII_MDC
MII_MDIO
MII_CRS
MII_COL
MII_RXD0
MII_RXD1
MII_RXD2
MII_RXD3
MII_RXCLK
MII_RXDV
MII_RXER
EMAC
MII_TXD0
MII_TXD1
MII_TXD2
MII_TXD3
MII_TXCLK
MII_TXEN
MII_TXER
MII
PB0
10BASE-T/
ADDR0
100BASE-TX
Ethernet
Physical
Transceiver
DATA0
(EPHY)
SDA
SCL
VRH
VRL
VDDA
VSSA
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
IOC4
IOC5
IOC6
IOC7
RXD
TXD
RXD
TXD
MISO
MOSI
SCK
SS
KWJ6PJ6
KWJ7
KWJ0
KWJ1
KWJ2
KWJ3
KWG0
KWG1
KWG2
KWG3
KWG4
KWG5
KWG6
KWG7
KWH0
KWH1
KWH2
KWH3
KWH4
KWH5
KWH6
ACTLED
LNKLED
SPDLED
DUPLED
COLLED
PHY_RBIAS
DDRS
DDRJ
DDRG
DDRH
PAD
PTT
DDRT
PTS
PTJ
PTG
PTH
PTL
DDRL
PHY_VSSA
PHY_VDDA
PHY_VSSRX
PHY_VDDRX
PHY_VSSTX
PHY_VDDTX
VRH
VRL
VDDA
VSSA
PAD0
PAD1
PAD2
PAD3
PAD4
PAD5
PAD6
PAD7
PT4
PT5
PT6
PT7
PS0
PS1
PS2
PS3
PS4
PS5
PS6
PS7
PJ7
PJ0
PJ1
PJ2
PJ3
PG0
PG1
PG2
PG3
PG4
PG5
PG6
PG7
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PL0
PL1
PL2
PL3
PL4
PL5
PL6
MC9S12NE64 Data Sheet, Rev 1.0
48Freescale Semiconductor
Introduction
1.1.4Device Memory Map
Table 1-1 shows the device register map of the MC9S12NE64 after reset. Figure 1-1 illustrates the full
device memory map with FLASH and RAM.
Table 1-1. Device Register Map Overview
Address
$0000 – $0017
$0018 – $0019Reserved2
$001A – $001BDevice ID register (PARTID)2
$001C – $001FCORE (MEMSIZ,
$0020 – $002FCORE (DBG)16
$0030 – $0033CORE (PPAGE, Port K — MEBI, MMC)4
$0034 – $003FClock and Reset Generator (PLL, RTI, COP)12
$0140 – $016FEthernet Media Access Controller (EMAC)48
$0170 – $023FReserved208
$0240 – $026FPort Integration Module (PIM)48
$0270 – $03FFReserved400
1
Information about the HCS12 core can be found in the MMC, INT, MEBI, BDM, and DBG
block description chapters in this data sheet, and also in the HCS12 CPU Reference
Manual, S12CPUV2/D.
CORE (Ports A, B, E, Modes, Inits — MMC, INT,
MEBI)
Module
IRQ, HPRIO — INT, MMC)4
1
Size
(in Bytes)
24
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor49
Chapter 1 Device Overview
This figure shows a suggested map, which is not the map out of reset. After reset the map is:
Figure 1-2. MC9S12NE64 User Configurable Memory Map
1.1.5Detailed Register Map
The following tables show the register maps of the MC9S12NE64. For detailed information about register
functions, please see the appropriate block description chapter.
MC9S12NE64 Data Sheet, Rev 1.0
50Freescale Semiconductor
Introduction
$0000 - $000F Multiplexed External Bus Interface Module (MEBI) Map 1 of 3
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses $001A and $001B after
reset). The read-only value is a unique part ID for each revision of the MCU. Table 1-2 shows the assigned
part ID number.
Table 1-2. Assigned Part ID Numbers
DeviceMask Set Number
MC9S12NE640L19S$8200
MC9S12NE641L19S$8201
1
The coding is as follows:
Bit 15-12: Major family identifier
Bit 11-8: Minor family identifier
Bit 7-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor (or non full) mask set revision
Part ID
1
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor65
Chapter 1 Device Overview
The PRTIDH register is constructed of four hexadecimal digits (0xABCD) as follows:
Digit “A” = Family ID
Digit “B” = Memory ID (flash size)
Digit “C” = Major mask revision
Digit “D” = Minor mask revision
Currently, family IDs are:
0x0 = D family
0x1 = H family
0x2 = B family
0x3 = C family
0x4 = T family
0x5 = E family
0x6 = reserved
0x7 = reserved
0x8 = NE family
The major and minor mask revision increments from 0x0 as follows:
•Major mask increments on a complete (full/all layer) mask change.
•Minor mask increments on a single or smaller than full mask change.
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C
and $001D after reset). Table 1-3 shows the read-only values of these registers. See the module mapping
and control (MMC) block description chapter for further details.
Table 1-3. Memory Size Registers
Register NameValue
MC9S12NE64MEMSIZ0$03
MC9S12NE64MEMSIZ1$80
1.2Signal Description
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals.
MC9S12NE64 Data Sheet, Rev 1.0
66Freescale Semiconductor
Signal Description
1.2.1Device Pinout
The MC9S12NE64 is available in a 112-pin low-profile quad flat pack (LQFP) and in an 80-pin quad flat
pack (TQFP-EP). Most pins perform two or more functions, as described in this section. Figure 1-3 and
Figure 1-3. Pin Assignments in 112-Pin LQFP for MC9S12NE64
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor67
Chapter 1 Device Overview
1.2.1.280-Pin TQFP-EP
The MEBI is not available in the 80-pin package. The 80-pin package features an exposed tab that is used
for enhanced thermal management. The exposed tab requires special PCB layout considerations as
described in Appendix B, “Schematic and PCB Layout Design Recommendations.”
Figure 1-4. Pin Assignments in 80-Pin TQFP-EP for MC9S12NE64
MC9S12NE64 Data Sheet, Rev 1.0
68Freescale Semiconductor
1.2.2Signal Properties Summary
Table 1-4. Signal Properties (Sheet 1 of 4)
Signal Description
Pin
orig. order
2811PH6KWH6MII_TXERVDDX
2922PH5KWH5MII_TXENVDDX
3033PH4KWH4
3144PH3KWH3MII_TXD3VDDX
3255PH2KWH2MII_TXD2VDDX
3366PH1KWH1MII_TXD1VDDX
3477PH0KWH0MII_TXD0VDDX
4088PJ0KWJ0MII_MDCVDDX
3999PJ1KWJ1MII_MDIOVDDX
15—
621014VDDX1——See Table 1-5
631115VSSX1——See Table 1-5
381220PJ2KWJ2MII_CRSVDDX
371321PJ3KWJ3MII_COLVDDX
271422PG0KWG0MII_RXD0VDDX
261523PG1KWG1MII_RXD1VDDX
80 Pin
No.
112 Pin
No.
10–13
16–19
Name
Function
1
PB[7:0]
Pin
Name
Function
2
ADDR[7:0]
/
DATA[7:0]
Pin
Name
Function
3
MII_TXCLK
—VDDXPUCR Disabled
Power
Domain
VDDX
Internal Pull
Resistor
CTRL
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERJ/
PPSJ
PERJ/
PPSJ
PERJ/
PPSJ
PERJ/
PPSJ
PERG/
PPSG
PERG/
PPSG
Reset
State
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Port H I/O pin;
EMAC MII transmit
error; interrupt
Port H I/O pin;
EMAC MII transmit
enable; interrupt
Port H I/O pin;
EMAC MII transmit
clock; interrupt
Port H I/O pin;
EMAC MII transmit
data; interrupt
Port H I/O pin;
EMAC MII transmit
data; interrupt
Port H I/O pin;
EMAC MII transmit
data; interrupt
Port H I/O pin;
EMAC MII transmit
data; interrupt
Port J I/O pin; EMAC
MII management
data clock; interrupt
Port J I/O pin; EMAC
MII management
data I/O; interrupt
Port B I/O pin;
multiplexed
address/data
Port J I/O pin; EMAC
MII carrier sense;
interrupt
Port J I/O pin; EMAC
MII collision;
interrupt
Port G I/O pin;
EMAC MII receive
data; interrupt
Port G I/O pin;
EMAC MII receive
data; interrupt
Description
Reset
State
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor69
Chapter 1 Device Overview
Table 1-4. Signal Properties (Sheet 2 of 4)
Pin
orig. order
251624PG2KWG2MII_RXD2VDDX
241725PG3KWG3MII_RXD3VDDX
231826PG4KWG4MII_RXCLKVDDX
221927PG5KWG5MII_RXDVVDDX
212028PG6KWG6MII_RXERVDDX
20—29PG7KWG7—VDDX
552130PS0SCI0_RXD—VDDX
542231PS1SCI0_TXD—VDDX
532332PS2SCI1_RXD—VDDX
522433PS3SCI1_TXD—VDDX
512534PS4SPI_MISO—VDDX
502635PS5SPI_MOSI—VDDX
492736PS6SPI_SCK—VDDX
482837PS7SPI_
6—38PE7NOACC—VDDXPUCRUp
7—39PE6IPIPE1MODBVDDX
8—40PE5IPIPE0MODAVDDX
92941PE4ECLK—VDDXPUCRUp
643042VSSX2——See Table 1-5
653143VDDX2——See Table 1-5
80 Pin
No.
112 Pin
No.
Name
Function
1
Pin
Name
Function
2
SS—VDDX
Pin
Name
Function
3
Power
Domain
Internal Pull
Resistor
CTRL
PERG/
PPSG
PERG/
PPSG
PERG/
PPSG
PERG/
PPSG
PERG/
PPSG
PERG/
PPSG
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
While
pin is low: Down
While RESET
pin is low: Down
Reset
State
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
RESET
Port G I/O pin;
EMAC MII receive
data; interrupt
Port G I/O pin;
EMAC MII receive
data; interrupt
Port G I/O pin;
EMAC MII receive
clock; interrupt
Port G I/O pin;
EMAC MII receive
data valid; interrupt
Port G I/O pin;
EMAC MII receive
error; interrupt
Port G I/O pin;
interrupt
Port S I/O pin; SCI0
receive signal
Port S I/O pin; SCI0
transmit signal
Port S I/O pin; SCI1
receive signal
Port S I/O pin; SCI1
transmit signal
Port S I/O pin; SPI
MISO signal
Port S I/O pin; SPI
MOSI signal
Port S I/O pin; SPI
SCK signal
Port S I/O pin; SPI
SS signal
Port E I/O pin;
access
Port E I/O pin; pipe
status; mode
selection
Port E I/O pin; pipe
status; mode
selection
Port E I/O pin; bus
clock output
Description
Reset
State
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
MC9S12NE64 Data Sheet, Rev 1.0
70Freescale Semiconductor
Table 1-4. Signal Properties (Sheet 3 of 4)
Signal Description
Internal Pull
Resistor
CTRL
Reset
Description
State
orig. order
80 Pin
No.
43244
112 Pin
No.
Pin
Name
Function
1
Pin
Name
Function
2
Pin
Name
Function
3
Power
Domain
RESET——VDDXNoneNoneExternal reset pinInput
663345VDDPLL——See Table 1-5
33446XFC——VDDPLLNANAPLL filter pin
673547VSSPLL——See Table 1-5
13648EXTAL——VDDPLLNANA
23749XTAL——VDDPLLNANAOutput
Oscillator pins
683850TEST——VDDXNoneNone Must be groundedInput
41—51PL6——VDDX
42—52PL5——VDDX
PERL/
PPSL
PERL/
PPSL
Disabled Port L I/O pinInput
Disabled Port L I/O pinInput
Port E I/O pin; low
10—53PE3
TAGLOLSTRBVDDXPUCRUp
strobe; tag signal
low
Port E I/O pin; R/
11—54PE2R/
W—VDDXPUCRUp
in expanded
modes
123955PE1
IRQ—VDDXPUCRUp
Port E input; external
interrupt pin
Port E input;
134056PE0
XIRQ—VDDXPUCRUp
non-maskable
interrupt pin
Background debug;
54157BKGDMODCTAGHIVDDXNoneUp
mode pin; tag signal
high
434258PL4COLLED—VDDX
444359PL3DUPLED—VDDX
14—
60–63
77–80
PA[7:0]
ADDR[15:8]/
DATA[15:8]
—VDDXPUCR Disabled
PERL/
PPSL
PERL/
PPSL
Disabled
Disabled
Port L I/O pin; EPHY
collision LED
Port L I/O pin; EPHY
full duplex LED
Port A I/O pin;
multiplexed
address/data
694464VSS2——See Table 1-5
704565VDD2——See Table 1-5
Bias control:1.0%
614666PHY_RBIAS——
PHY_
VSSA
NANA
external resistor
(see the Electricals
Chapter for R
Bias
)
714767PHY_VSSA——See Table 1-5
724868PHY_VDDA——See Table 1-5
734969PHY_VDDTX——See Table 1-5
585070PHY_TXP——
PHY_
VDDTX
NANATwisted pair output +
Reset
State
Input
Input
W
Input
Input
Input
Input
Input
Input
Input
Analog
Input
Analog
Output
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor71
Chapter 1 Device Overview
Table 1-4. Signal Properties (Sheet 4 of 4)
Pin
orig. order
575171PHY_TXN——
745272PHY_VSSTX——See Table 1-5
605373PHY_RXP——
595474PHY_RXN——
755575PHY_VDDRX——See Table 1-5
765676PHY_VSSRX——See Table 1-5
455781PL2SPDLED—VDDX
775882
465983PL1LNKLED—VDDX
476084PL0ACTLED—VDDX
1661–6885–92PAD[7:0]AN[7:0]—VDDANoneNone
786993VDDA——See Table 1-5
797094VRH——See Table 1-5
807195VRL——See Table 1-5
817296VSSA——See Table 1-5
19—
8273101VSS1——See Table 1-5
8374102VDD1——See Table 1-5
18—105PK[6]
17—106PK[7]
5675–78 107–110PT[7:4]
3579111PJ7KWJ7IIC_SCLVDDX
3680112PJ6KWJ6IIC_SDAVDDX
80 Pin
No.
112 Pin
No.
97–100
103–104
Name
Function
1
VDDR/
VREGEN
PK[5:0]
Pin
Name
Function
2
——See Table 1-5
XADDR
[19:14]
XCS—VDDXPUCRUp
ECSROMCTLVDDXPUCRUp
TIM_IOC
[7:4]
Pin
Name
Function
3
—VDDXPUCRUp
—VDDX
Power
Domain
PHY_
VDDTX
PHY_
VDDRX
PHY_
VDDRX
Internal Pull
Resistor
CTRL
NANATwisted pair output –
NANATwisted pair input +
NANATwisted pair input –
PERL/
PPSL
PERL/
PPSL
PERL/
PPSL
PERT/
PPST
PERJ/
PPSJ
PERJ/
PPSJ
Reset
State
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Port L I/O pin; EPHY
100 Mbps LED
Port L I/O pin; EPHY
valid link LED
Port L I/O pin; EPHY
transmit or receive
LED
Port AD input pins;
ATD inputs
Port K I/O pins;
extended
addresses
Port K I/O pin;
external chip select
Port K I/O pin;
emulation chip
select;
Port T I/O pins; timer
TIM input cap.
output compare
Port J I/O pin; IIC
SCL; interrupt
Port J I/O pin; IIC
SDA; interrupt
Description
Reset
State
Analog
Output
Analog
Input
Analog
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
MC9S12NE64 Data Sheet, Rev 1.0
72Freescale Semiconductor
Signal Description
NOTE
Signals shown in bold are not available in the 80-pin package.
NOTE
If the port pins are not bonded out in the chosen package, the user must
initialize the registers to be inputs with enabled pull resistance to avoid
excess current consumption. This applies to the following pins:
(80-Pin TQFP-EP): Port A[7:0], Port B[7:0], Port E[7,6,5,3,2], Port K[7:0];
Port G[7]; Port L[6:5]
1.2.3Detailed Signal Descriptions
1.2.3.1EXTAL, XTAL — Oscillator Pins
EXTAL and XTAL are the external clock and crystal driver pins. Upon reset, all the device clocks are
derived from the EXTAL input frequency. XTAL is the crystal output.
1.2.3.2RESET — External Reset Pin
RESET is an active-low bidirectional control signal that acts as an input to initialize the MCU to a known
start-up state. It also acts as an open-drain output to indicate that an internal failure has been detected in
either the clock monitor or COP watchdog circuit. External circuitry connected to the
RESET pin must not
include a large capacitance that would interfere with the ability of this signal to rise to a valid logic one
within 32 ECLK cycles after the low drive is released. Upon detection of any reset, an internal circuit
drives the
processing. The
RESET pin low and a clocked reset sequence controls when the MCU can begin normal
RESET pin includes an internal pull-up device.
1.2.3.3XFC — PLL Loop Filter Pin
Dedicated pin used to create the PLL filter. See A.12.3.1, “XFC Component Selection,” and the CRG block
description chapter for more detailed information.
1.2.3.4BKGD / MODC / TAGHI — Background Debug / Tag High / Mode Pin
The BKGD / MODC / TAGHI pin is used as a pseudo-open-drain pin for background debug
communication. It is used as an MCU operating mode select pin during reset. The state of this pin is
latched to the MODC bit at the rising edge of
RESET. In MCU expanded modes of operation, while
instruction tagging is on, an input low on this pin during the falling edge of E-clock tags the high half of
the instruction word being read into the instruction queue. This pin always has an internal pull-up.
1.2.3.5PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA[7:0] are general-purpose I/O pins. In MCU expanded modes of operation, these pins are used for the
multiplexed external address and data bus. PA[7:0] pins are not available in the 80-pin package version.
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor73
Chapter 1 Device Overview
1.2.3.6PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB[7:0] are general-purpose I/O pins. In MCU expanded modes of operation, these pins are used for the
multiplexed external address and data bus. PB[7:0] pins are not available in the 80-pin package version.
1.2.3.7PE7 / NOACC — Port E I/O Pin 7
PE7 is a general-purpose I/O pin. During MCU expanded modes of operation, the NOACC signal, while
enabled, is used to indicate that the current bus cycle is an unused or free cycle. This signal will assert when
the CPU is not using the bus.
1.2.3.8PE6 / IPIPE1/ MODB — Port E I/O Pin 6
PE6 is a general-purpose I/O pin. It is used as an MCU operating mode select pin during reset. The state
of this pin is latched to the MODB bit at the rising edge of
queue tracking signal IPIPE1. PE6 is an input with a pulldown device that is active only while
RESET. This pin is shared with the instruction
RESET is
low. PE6 is not available in the 80-pin package version.
1.2.3.9PE5 / IPIPE0 / MODA — Port E I/O Pin 5
PE5 is a general-purpose I/O pin. It is used as an MCU operating mode select pin during reset. The state
of this pin is latched to the MODA bit at the rising edge of
queue tracking signal IPIPE0. This pin is an input with a pull-down device that is only active while
is low. PE5 is not available in the 80-pin package version.
RESET. This pin is shared with the instruction
RESET
1.2.3.10PE4 / ECLK— Port E I/O Pin 4 / E-Clock Output
PE4 is a general-purpose I/O pin. In normal single chip mode, PE4 is configured with an active pull-up
while in reset and immediately out of reset. The pull-up can be turned off by clearing PUPEE in the PUCR
register. In all modes except normal single chip mode, the PE4 pin is initially configured as the output
connection for the internal bus clock (ECLK). ECLK is used as a timing reference and to demultiplex the
address and data in expanded modes. The ECLK frequency is equal to 1/2 the crystal frequency out of
reset. The ECLK output function depends upon the settings of the NECLK bit in the PEAR register, the
IVIS bit in the MODE register, and the ESTR bit in the EBICTL register. All clocks, including the ECLK,
are halted while the MCU is in stop mode. It is possible to configure the MCU to interface to slow external
memory. ECLK can be stretched for such accesses. The PE4 pin is initially configured as ECLK output
with stretch in all expanded modes. See the MISC register (EXSTR[1:0] bits) for more information. In
normal expanded narrow mode, the ECLK is available for use in external select decode logic or as a
constant speed clock for use in the external application system.
MC9S12NE64 Data Sheet, Rev 1.0
74Freescale Semiconductor
Signal Description
1.2.3.11PE3 / TAGLO / LSTRB — Port E I/O Pin 3 / Low-Byte Strobe (LSTRB)
PE3 can be used as a general-purpose I/O in all modes and is an input with an active pull-up out of reset.
The pull-up can be turned off by clearing PUPEE in the PUCR register. PE3 can also be configured as a
Low-Byte Strobe (
not be possible until this function is enabled.
register. In expanded wide and emulation narrow modes, and while BDM tagging is enabled, the
function is multiplexed with the
LSTRB). The LSTRB signal is used in write operations, so external low byte writes will
LSTRB can be enabled by setting the LSTRE bit in the PEAR
LSTRB
TAGLO function. While enabled, a logic zero on the TAGLO pin at the
falling edge of ECLK will tag the low byte of an instruction word being read into the instruction queue.
PE3 is not available in the 80-pin package version.
1.2.3.12PE2 / R/W — Port E I/O Pin 2 / Read/Write
PE2 can be used as a general-purpose I/O in all modes and is configured as an input with an active pull-up
out of reset. The pull-up can be turned off by clearing PUPEE in the PUCR register. If the read/write
function is required, it must be enabled by setting the RDWE bit in the PEAR register. External writes will
not be possible until the read/write function is enabled. The PE2 pin is not available in the 80-pin package
version.
1.2.3.13PE1 / IRQ — Port E Input Pin 1 / Maskable Interrupt Pin
PE1 is always an input and can be read anytime. The PE1 pin is also the IRQ input used for requesting an
asynchronous interrupt to the MCU. During reset, the I bit in the condition code register (CCR) is set and
IRQ interrupt is masked until the I bit is cleared. The IRQ is software programmable to either
any
falling-edge-sensitive triggering or level-sensitive triggering based on the setting of the IRQE bit in the
IRQCR register. The
IRQ is always enabled and configured to level-sensitive triggering out of reset. It can
be disabled by clearing IRQEN bit in the IRQCR register. There is an active pull-up on this pin while in
reset and immediately out of reset. The pull-up can be turned off by clearing PUPEE in the PUCR register.
1.2.3.14PE0 / XIRQ — Port E input Pin 0 / Non-Maskable Interrupt Pin
PE0 is always an input and can be read anytime. The PE0 pin is also the XIRQ input for requesting a
non-maskable asynchronous interrupt to the MCU. During reset, the X bit in the condition code register
(CCR) is set and any
XIRQ interrupt is masked until the X bit is cleared. Because the XIRQ input is level
sensitive triggered, it can be connected to a multiple-source wired-OR network. There is an active pull-up
on this pin while in reset and immediately out of reset. The pull-up can be turned off by clearing PUPEE
in the PUCR register.
1.2.3.15PK7 / ECS / ROMCTL — Port K I/O Pin 7
PK7 is a general-purpose I/O pin. During MCU expanded modes of operation, while the EMK bit in the
MODE register is set to 1, this pin is used as the emulation chip select output (
the PK7 pin can be used to determine the reset state of the ROMON bit in the MISC register. At the rising
edge of
RESET, the state of the PK7 pin is latched to the ROMON bit. There is an active pull-up on this
pin while in reset and immediately out of reset. The pull-up can be turned off by clearing PUPKE in the
PUCR register. PK7 is not available in the 80-pin package version.
ECS). In expanded modes,
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor75
Chapter 1 Device Overview
1.2.3.16PK6 / XCS — Port K I/O Pin 6
PK6 is a general-purpose I/O pin. During MCU expanded modes of operation, while the EMK bit in the
MODE register is set to 1, this pin is used as an external chip select signal for most external accesses that
are not selected by ECS. There is an active pull-up on this pin while in reset and immediately out of reset.
The pull-up can be turned off by clearing PUPKE in the PUCR register. See the multiplexed external bus
interface (MEBI) block description chapter for further details. PK6 is not available in the 80-pin package
version.
1.2.3.17PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0]
PK[5:0] are general-purpose I/O pins. In MCU expanded modes of operation, when the EMK bit in the
MODE register is set to 1, PK[5:0] provide the expanded address XADDR[19:14] for the external bus.
There are active pull-ups on PK[5:0] pins while in reset and immediately out of reset. The pull-up can be
turned off by clearing PUPKE in the PUCR register. See multiplexed external bus interface (MEBI) block
description chapter for further details. PK[5:0] are not available in the 80-pin package version.
1.2.3.18PAD[7:0] / AN[7:0] — Port AD Input Pins [7:0]
PAD[7:0] are the analog inputs for the analog-to-digital converter (ATD). They can also be configured as
general-purpose digital input. See the port integration module (PIM) PIM_9NE64 block description
chapter and the ATD_10B8C block description chapter for information about pin configurations.
1.2.3.19PG7 / KWG7 — Port G I/O Pin 7
PG7 is a general-purpose I/O pin. It can be configured to generate an interrupt (KWG7) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PG7 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
for information about pin configurations.
1.2.3.20PG6 / KWG6 / MII_RXER — Port G I/O Pin 6
PG6 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
receive error (MII_RXER) signal. It can be configured to generate an interrupt (KWG6) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PG6 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.21PG5 / KWG5 / MII_RXDV — Port G I/O Pin 5
PG5 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
receive data valid (MII_RXDV) signal. It can be configured to generate an interrupt (KWG5) causing the
MCU to exit stop or wait mode. While in reset and immediately out of reset, the PG5 pin is configured as
a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
MC9S12NE64 Data Sheet, Rev 1.0
76Freescale Semiconductor
Signal Description
1.2.3.22PG4 / KWG4 / MII_RXCLK — Port G I/O Pin 4
PG4 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
receive clock (MII_RXCLK) signal. It can be configured to generate an interrupt (KWG4) causing the
MCU to exit stop or wait mode. While in reset and immediately out of reset, the PG4 pin is configured as
a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.23PG3 / KWG3 / MII_RXD3 — Port G I/O Pin 3
PG3 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
receive data (MII_RXD3) signal. It can be configured to generate an interrupt (KWG3) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PG3 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.24PG2 / KWG2 / MII_RXD2 — Port G I/O Pin 2
PG2 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
receive data (MII_RXD2) signal. It can be configured to generate an interrupt (KWG2) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PG2 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.25PG1 / KWG1 / MII_RXD1 — Port G I/O Pin 1
PG1 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
receive data (MII_RXD1) signal. It can be configured to generate an interrupt (KWG1) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PG1 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.26PG0 / KWG0 / MII_RXD0 — Port G I/O Pin 0
PG0 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
receive data (MII_RXD0) signal. It can be configured to generate an interrupt (KWG0) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PG0 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.27PH6 / KWH6 / MII_TXER — Port H I/O Pin 6
PH6 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
transmit error (MII_TXER) signal. It can be configured to generate an interrupt (KWH6) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PH6 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor77
Chapter 1 Device Overview
1.2.3.28PH5 / KWH5 / MII_TXEN — Port H I/O Pin 5
PH5 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
transmit enabled (MII_TXEN) signal. It can be configured to generate an interrupt (KWH5) causing the
MCU to exit stop or wait mode. While in reset and immediately out of reset, the PH5 pin is configured as
a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.29PH4 / KWH4 / MII_TXCLK — Port H I/O Pin 4
PH4 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
transmit Clock (MII_TXCLK) signal. It can be configured to generate an interrupt (KWH4) causing the
MCU to exit stop or wait mode. While in reset and immediately out of reset, the PH4 pin is configured as
a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.30PH3 / KWH3 / MII_TXD3 — Port H I/O Pin 3
PH3 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
transmit data (MII_TXD3) signal. It can be configured to generate an interrupt (KWH3) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PH3 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.31PH2 / KWH2 / MII_TXD2 — Port H I/O Pin 2
PH2 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
transmit data (MII_TXD2) signal. It can be configured to generate an interrupt (KWH2) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PH2 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.32PH1 / KWH1 / MII_TXD1 — Port H I/O Pin 1
PH1 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
transmit data (MII_TXD1) signal. It can be configured to generate an interrupt (KWH1) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PH1 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.33PH0 / KWH0 / MII_TXD0 — Port H I/O Pin 0
PH0 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
transmit data (MII_TXD0) signal. It can be configured to generate an interrupt (KWH0) causing the MCU
to exit stop or wait mode. While in reset and immediately out of reset, the PH0 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
MC9S12NE64 Data Sheet, Rev 1.0
78Freescale Semiconductor
Signal Description
1.2.3.34PJ7 / KWJ7 / IIC_SCL — Port J I/O Pin 7
PJ7 is a general-purpose I/O pin. When the IIC module is enabled, it becomes the serial clock line
(IIC_SCL) for the IIC module (IIC). It can be configured to generate an interrupt (KWJ7) causing the
MCU to exit stop or wait mode. While in reset and immediately out of reset, the PJ7 pin is configured as
a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the IIC block description chapter for information about pin configurations.
1.2.3.35PJ6 / KWJ6 / IIC_SDA — Port J I/O Pin 6
PJ6 is a general-purpose I/O pin. When the IIC module is enabled, it becomes the serial data line
(IIC_SDL) for the IIC module (IIC). It can be configured to generate an interrupt (KWJ6) causing the
MCU to exit stop or wait mode. While in reset and immediately out of reset, the PJ6 pin is configured as
a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the IIC block description chapter for information about pin configurations.
1.2.3.36PJ3 / KWJ3 / MII_COL — Port J I/O Pin 3
PJ3 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
collision (MII_COL) signal. It can be configured to generate an interrupt (KWJ3) causing the MCU to exit
stop or wait mode. While in reset and immediately out of reset, the PJ3 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.37PJ2 / KWJ2 / MII_CRS /— Port J I/O Pin 2
PJ2 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the carrier
sense (MII_CRS) signal. It can be configured to generate an interrupt (KWJ2) causing the MCU to exit
stop or wait mode. While in reset and immediately out of reset, the PJ2 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the EMAC block description chapter for information about pin configurations.
1.2.3.38PJ1 / KWJ1 / MII_MDIO — Port J I/O Pin 1
PJ1 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
Management Data I/O (MII_MDIO) signal. It can be configured to generate an interrupt (KWH1) causing
the MCU to exit stop or wait mode. While in reset and immediately out of reset, the PJ1 pin is configured
as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description
chapter and the EMAC block description chapter for information about pin configurations.
1.2.3.39PJ0 / KWJ0 / MII_MDC — Port J I/O Pin 0
PJ0 is a general-purpose I/O pin. When the EMAC MII external interface is enabled, it becomes the
management data clock (MII_MDC) signal. It can be configured to generate an interrupt (KWJ0) causing
the MCU to exit stop or wait mode. While in reset and immediately out of reset, the PJ0 pin is configured
as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description
chapter and the EMAC block description chapter for information about pin configurations.
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor79
Chapter 1 Device Overview
1.2.3.40PL6 — Port L I/O Pin 6
PL6 is a general-purpose I/O pin. While in reset and immediately out of reset, the PL6 pin is configured
as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description
chapter for information about pin configurations.
1.2.3.41PL5 — Port L I/O Pin 5
PL5 is a general-purpose I/O pin. While in reset and immediately out of reset, the PL5 pin is configured
as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description
chapter for information about pin configurations.
1.2.3.42PL4 / COLLED — Port L I/O Pin 4
PL4 is a general-purpose I/O pin. When the internal Ethernet physical transceiver (EPHY) is enabled with
the EPHYCTL0 LEDEN bit set, it becomes the collision status signal (COLLED). While in reset and
immediately out of reset the PL4 pin is configured as a high-impedance input pin. See the port integration
module (PIM) PIM_9NE64 block description chapter and the EPHY block description chapter for
information about pin configurations.
1.2.3.43PL3 / DUPLED — Port L I/O Pin 3
PL3 is a general-purpose I/O pin. When the internal Ethernet physical transceiver (EPHY) is enabled with
the EPHYCTL0 LEDEN bit set, it becomes the duplex status signal (DUPLED). While in reset and
immediately out of reset, the PL3 pin is configured as a high-impedance input pin. See the port integration
module (PIM) PIM_9NE64 block description chapter and the EPHY block description chapter for
information about pin configurations.
1.2.3.44PL2 / SPDLED — Port L I/O Pin 2
PL2 is a general-purpose I/O pin. When the internal Ethernet physical transceiver (EPHY) is enabled with
the EPHYCTL0 LEDEN bit set, it becomes the speed status signal (SPDLED). While in reset and
immediately out of reset, the PL2 pin is configured as a high-impedance input pin. See the port integration
module (PIM) PIM_9NE64 block description chapter and the EPHY block description chapter for
information about pin configurations.
1.2.3.45PL1 / LNKLED — Port L I/O Pin 1
PL1 is a general-purpose I/O pin. When the internal Ethernet physical transceiver (EPHY) is enabled with
the EPHYCTL0 LEDEN bit set, it becomes the link status signal (LNKLED). While in reset and
immediately out of reset, the PL1 pin is configured as a high-impedance input pin. See the port integration
module (PIM) PIM_9NE64 block description chapter and the EPHY block description chapter for
information about pin configurations.
MC9S12NE64 Data Sheet, Rev 1.0
80Freescale Semiconductor
Signal Description
1.2.3.46PL0 / ACTLED — Port L I/O Pin 0
PL0 is a general-purpose I/O pin. When the internal Ethernet physical transceiver (EPHY) is enabled with
the EPHYCTL0 LEDEN bit set, it becomes the active status signal (ACTLED). While in reset and
immediately out of reset, the PL0 pin is configured as a high-impedance input pin. See the port integration
module (PIM) PIM_9NE64 block description chapter and the EPHY block description chapter for
information about pin configurations.
1.2.3.47PS7 / SPI_SS — Port S I/O Pin 7
PS7 is a general-purpose I/O. When the serial peripheral interface (SPI) is enabled, PS7 becomes the slave
select pin
SS. While in reset and immediately out of reset, the PS7 pin is configured as a high-impedance
input pin. See the port integration module (PIM) PIM_9NE64 block description chapter and the SPI block
description chapter for information about pin configurations.
1.2.3.48PS6 / SPI_SCK — Port S I/O Pin 6
PS6 is a general-purpose I/O pin. When the serial peripheral interface (SPI) is enabled, PS6 becomes the
serial clock pin, SCK. While in reset and immediately out of reset, the PS6 pin is configured as a
high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block description chapter
and the SPI block description chapter for information about pin configurations.
1.2.3.49PS5 / SPI_MOSI — Port S I/O Pin 5
PS5 is a general-purpose I/O pin. When the serial peripheral interface (SPI) is enabled, PS5 becomes the
master output (during master mode) or slave input (during slave mode) pin. While in reset and immediately
out of reset, the PS5 pin is configured as a high-impedance input pin. See the port integration module
(PIM) PIM_9NE64 block description chapter and the SPI block description chapter for information about
pin configurations.
1.2.3.50PS4 / SPI_MISO — Port S I/O Pin 4
PS4 is a general-purpose I/O pin. When the serial peripheral interface (SPI) is enabled, PS4 becomes the
master input (during master mode) or slave output (during slave mode) pin. While in reset and immediately
out of reset, the PS4 pin is configured as a high-impedance input pin. See the port integration module
(PIM) PIM_9NE64 block description chapter and the SPI block description chapter for information about
pin configurations.
1.2.3.51PS3 / SCI1_TXD — Port S I/O Pin 3
PS3 is a general-purpose I/O. When the serial communications interface 1 (SCI1) transmitter is enabled,
PS3 becomes the transmit pin, TXD, of SCI1. While in reset and immediately out of reset, the PS3 pin is
configured as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block
description chapter and the SCI block description chapter for information about pin configurations.
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor81
Chapter 1 Device Overview
1.2.3.52PS2 / SCI1_RXD — Port S I/O Pin 2
PS2 is a general-purpose I/O. When the serial communications interface 1 (SCI1) receiver is enabled, PS2
becomes the receive pin RXD of SCI1. While in reset and immediately out of reset, the PS2 pin is
configured as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block
description chapter and the SCI block description chapter for information about pin configurations.
1.2.3.53PS1 / SCI0_TXD — Port S I/O Pin 1
PS1 is a general-purpose I/O. When the serial communications interface 0 (SCI0) transmitter is enabled,
PS1 becomes the transmit pin, TXD, of SCI0. While in reset and immediately out of reset, the PS1 pin is
configured as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block
description chapter and the SCI block description chapter for information about pin configurations.
1.2.3.54PS0 / SCI0_RXD — Port S I/O Pin 0
PS0 is a general-purpose I/O. When the serial communications interface 0 (SCI0) receiver is enabled, PS0
becomes the receive pin RXD0 of SCI0. While in reset and immediately out of reset, the PS0 pin is
configured as a high-impedance input pin. See the port integration module (PIM) PIM_9NE64 block
description chapter and the SCI block description chapter for information about pin configurations.
1.2.3.55PT[7:4] / IOC1[7:4] — Port T I/O Pins [7:4]
PT[7:4] are general-purpose I/O pins. While the timer system 1 (TIM1) is enabled, these pins can also be
configured as the TIM1 input capture or output compare pins IOC1[7-4]. While in reset and immediately
out of reset, the PT[7:4] pins are configured as a high-impedance input pins. See the port integration
module (PIM) PIM_9NE64 block description chapter and the TIM_16B4C block description chapter for
information about pin configurations.
1.2.3.56PHY_TXP — EPHY Twisted Pair Output +
Ethernet twisted pair output pin. This pin is hi-z out of reset.
1.2.3.57PHY_TXN — EPHY Twisted Pair Output –
Ethernet twisted pair output pin. This pin is hi-z out of reset.
1.2.3.58PHY_RXP — EPHY Twisted Pair Input +
Ethernet twisted pair input pin. This pin is hi-z out of reset.
1.2.3.59PHY_RXN — EPHY Twisted Pair Input –
Ethernet twisted pair input pin. This pin is hi-z out of reset.
MC9S12NE64 Data Sheet, Rev 1.0
82Freescale Semiconductor
Signal Description
1.2.3.60PHY_RBIAS — EPHY Bias Control Resistor
Connect a 1.0% external resistor, RBIAS, between PHY_RBIAS pin and PHY_VSSA. This resistor must
be placed as near as possible to the chip pin. Stray capacitance must be kept to less than 10 pF (> 50 pF
may cause instability). No high-speed signals are allowed in the region of RBIAS.
1.2.4Power Supply Pins
1.2.4.1V
DDX1
, V
DDX2
, V
SSX1
, V
— Power & Ground Pins for I/O & Internal
SSX2
Voltage Regulator
External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are
loaded.
1.2.4.2V
DDR/VREGEN
— Power Pin for Internal Voltage Regulator
External power for internal voltage regulator.
1.2.4.3V
DD1
, V
DD2
, V
SS1
, V
— Core Power Pins
SS2
Power is supplied to the MCU through VDD and VSS. This 2.5V supply is derived from the internal
voltage regulator. No static load is allowed on these pins. The internal voltage regulator is turned off, if
VDDR/VREGEN is tied to ground.
1.2.4.4V
DDA
, V
— Power Supply Pins for ATD and VREG_PHY
SSA
VDDA and VSSA are the power supply and ground input pins for the voltage regulator and the
analog-to-digital converter.
1.2.4.5PHY_VDDA, PHY_VSSA — Power Supply Pins for EPHY Analog
Power is supplied to the Ethernet physical transceiver (EPHY) PLLs through PHY_VDDA and
PHY_VSSA. This 2.5V supply is derived from the internal voltage regulator. No static load is allowed on
these pins. The internal voltage regulator is turned off, if VDDR/VREGEN is tied to ground.
1.2.4.6PHY_VDDRX, PHY_VSSRX — Power Supply Pins for EPHY Receiver
Power is supplied to the Ethernet physical transceiver (EPHY) receiver through PHY_VDDRX and
PHY_VSSRX. This 2.5V supply is derived from the internal voltage regulator. No static load is allowed
on these pins. The internal voltage regulator is turned off, if VDDR/VREGEN is tied to ground.
1.2.4.7PHY_VDDTX, PHY_VSSTX — Power Supply Pins for EPHY Transmitter
External power is supplied to the Ethernet physical transceiver (EPHY) transmitter through PHY_VDDTX
and PHY_VSSTX. This 2.5 V supply is derived from the internal voltage regulator. No static load is
allowed on these pins. The internal voltage regulator is turned off, if V
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor83
DDR/VREGEN
is tied to ground.
Chapter 1 Device Overview
1.2.4.8VRH, VRL — ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog-to-digital converter.
1.2.4.9V
DDPLL
, V
SSPLL
— Power Supply Pins for PLL
Provides operating voltage and ground for the oscillator and the phase-locked loop. This allows the supply
voltage to the oscillator and PLL to be bypassed independently. This 2.5 V voltage is generated by the
internal voltage regulator. The internal voltage regulator is turned off, if V
Table 1-5. MC9S12NE64 Power and Ground Connection Summary
Mnemonic
V
DDR/VREGEN
V
DDX1
V
DDX2
V
SSX1
V
SSX2
V
DDA
V
SSA
V
RH
V
RL
PHY_VDDTX
PHY_VDDRX
PHY_VDDA
PHY_VSSTX
PHY_VSSRX
PHY_VSSA
V
DD1
V
DD2
V
SS1
V
SS2
V
DDPLL
V
SSPLL
Nominal
Voltage
3.3 V
3.3 V
0 V
3.3 VOperating voltage and ground for the analog-to-digital converter, the
0 V
3.3 VReference voltage high for the analog-to-digital converter.
0 VReference voltage low for the analog-to-digital converter.
2.5 V
0V
2.5 V
0 V
2.5 VProvide operating voltage and ground for the phase-locked loop. This
0 V
External power and ground, supply to internal voltage regulator.
To disable voltage regulator attach V
External power and ground, supply to pin drivers.
reference for the internal voltage regulator and the digital-to-analog
converters, allows the supply voltage to the A/D to be bypassed
independently.
Internal power and ground generated by internal regulator for internal
Ethernet Physical Transceiver (EPHY). These also allow an external
source to supply the EPHY voltages and bypass the internal voltage
regulator.
Internal power and ground generated by internal regulator. These also
allow an external source to supply the core V
bypass the internal voltage regulator.
allows the supply voltage to the PLL to be bypassed independently.
Internal power and ground generated by internal regulator.
Description
REGEN
DDR/VREGEN
to V
SSX
DD/VSS
.
voltages and
is tied to ground.
NOTE
All V
pins must be connected together in the application. Because fast
SS
signal transitions place high, short-duration current demands on the power
supply, use bypass capacitors with high-frequency characteristics and place
them as near to the MCU as possible. Bypass requirements depend on MCU
pin load.
MC9S12NE64 Data Sheet, Rev 1.0
84Freescale Semiconductor
System Clock Description
1.3System Clock Description
The clock and reset generator provides the internal clock signals for the core and all peripheral modules.
Figure 1-5 shows the clock connections from the CRG to all modules. See the CRG block description
chapter for details on clock generation.
EXTAL
XTAL
CRG
bus clock
oscillator clock
core clock
S12_CORE
FLASH
RAM
TIM
ATD
PIM
SCI
SPI
IIC
EMAC
EPHY
VREG_PHY
Figure 1-5. Clock Connections
1.4Modes of Operation
There are eight possible modes of operation available on the MC9S12NE64. Each mode has an associated
default memory map and external bus configuration.
1.4.1Chip Configuration Summary
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA pins during
reset. The MODC, MODB, and MODA bits in the MODE register show the current operating mode and
provide limited mode switching during operation. The states of the MODC, MODB, and MODA pins are
latched into these bits on the rising edge of the
the ROMON bit in the MISC register thus controlling whether the internal FLASH is visible in the memory
map. ROMON = 1 means the FLASH is visible in the memory map. The state of the ROMCTL pin is
latched into the ROMON bit in the MISC register on the rising edge of the
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor85
RESET signal. The ROMCTL signal allows the setting of
RESET signal.
Chapter 1 Device Overview
Table 1-6. Mode Selection
BKGD =
MODC
000X1
001
010X0Special Test (Expanded Wide), BDM allowed.
011
100X1Normal Single Chip, BDM allowed.
101
110X1
111
PE6 =
MODB
PE5 =
MODA
PP6 =
ROMCTL
01
10
01
10
00
11
00
11
ROMON
Bit
Mode Description
Special Single Chip, BDM allowed and ACTIVE. BDM
is allowed in all other modes but a serial command is
required to make BDM active.
Emulation Expanded Narrow, BDM allowed.
Emulation Expanded Wide, BDM allowed.
Normal Expanded Narrow, BDM allowed.
Peripheral; BDM allowed but bus operations would
cause bus conflicts (must not be used).
Normal Expanded Wide, BDM allowed.
For further explanation on the modes, see the MEBI block description chapter.
1.4.2Security
The MC9S12NE64 provides a security feature that prevents the unauthorized read and write of the
memory contents
1
. This feature allows:
•Protection of the contents of FLASH
•Operation in single-chip mode
•Operation from external memory with internal FLASH disabled
On-chip security can be compromised by user code. An extreme example would be user code that dumps
the contents of the internal program. This code would defeat the purpose of security. At the same time the
user may also wish to put a back door in the user program. An example of this would be the user
downloading a key through the SCI, which would allow access to a programming routine that could update
parameters.
1.4.2.1Securing the Microcontroller
After the user has programmed the FLASH, the MCU can be secured by programming the security bits
located in the FLASH module. These nonvolatile bits will keep the MCU secured through resetting the
MCU and through powering down the MCU.
The security byte resides in a portion of the FLASH array.
See the FLASH block description chapter for more details on the security configuration.
1.No security feature is absolutely secure. However, Freescale Semiconductor’s strategy is to make reading or copying
the FLASH difficult for unauthorized users.
MC9S12NE64 Data Sheet, Rev 1.0
86Freescale Semiconductor
Low-Power Modes
1.4.2.2Operation of the Secured Microcontroller
1.4.2.2.1Normal Single Chip Mode
This will be the most common usage of the secured MCU. Everything will appear the same as if the MCU
were not secured, with the exception of BDM operation. The BDM operation will be blocked.
1.4.2.2.2Executing from External Memory
The user may wish to execute from external memory with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH will be disabled. BDM operations will be
blocked.
1.4.2.3Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH must be erased. This can be performed
through an external program in expanded mode.
After the user has erased the FLASH, the MCU can be reset into special single chip mode. This invokes a
program that verifies the erasure of the internal FLASH. After this program completes, the user can erase
and program the FLASH security bits to the unsecured state. This is generally performed through the
BDM, but the user could also change to expanded mode (by writing the mode bits through the BDM) and
jumping to an external program (again through BDM commands). Note that if the MCU goes through a
reset before the security bits are reprogrammed to the unsecure state, the MCU will be secured again.
1.5Low-Power Modes
The microcontroller features three main low-power modes. See the respective block description chapter
for information on the module behavior in stop, pseudo stop, and wait mode. An important source of
information about the clock system is the clock and reset generator (CRG) block description chapter.
1.5.1Stop
Executing the CPU STOP instruction stops all clocks and the oscillator thus putting the chip in fully static
mode. Wakeup from this mode can be performed via reset or external interrupts.
1.5.2Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode, the oscillator stays running
and the real-time interrupt (RTI) or watchdog (COP) sub module can stay active. Other peripherals are
turned off. This mode consumes more current than the full stop mode, but the wakeup time from this mode
is significantly shorter.
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor87
Chapter 1 Device Overview
1.5.3Wait
This mode is entered by executing the CPU WAI instruction. In this mode, the CPU will not execute
instructions. The internal CPU signals (address and databus) will be fully static. All peripherals stay active.
For further power consumption, the peripherals can individually turn off their local clocks.
1.5.4Run
Although this is not a low-power mode, unused peripheral modules must not be enabled in order to save
power.
1.6Resets and Interrupts
See the exception processing section of the CPU12 reference manual for information on resets and
interrupts. System resets can be generated through external control of the
and reset generator module (CRG), or through the low-voltage reset (LVR) generator of the voltage
regulator module. See the CRG and VREG_PHY block description sections for detailed information on
reset generation.
1.6.1Vectors
RESET pin, through the clock
Table 1-7 lists interrupt sources and vectors in default order of priority.
Resets are a subset of the interrupts featured inTable 1-7. The different sources capable of generating a
system reset are summarized in Table 1-8.
1.6.2.1Reset Summary Table
Table 1-8. Reset Summary
ResetPrioritySourceVector
Power-on reset1CRG module$FFFE, $FFFF
External reset1
Low-voltage reset1VREG_PHY module$FFFE, $FFFF
Clock monitor reset2CRG module$FFFC, $FFFD
COP watchdog reset3CRG module$FFFA, $FFFB
1.6.2.2Effects of Reset
When a reset occurs, MCU registers and control bits are changed to known start-up states. See the
respective module block description chapter for register reset states. See the MEBI block description
chapter for mode-dependent pin configuration of port A, B, E, and K out of reset.
RESET pin$FFFE, $FFFF
See the PIM block description chapter for reset configurations of all peripheral module ports.
See Table 1-1 for locations of the memories depending on the operating mode after reset.
The RAM array is not automatically initialized out of reset.
1.7Block Configuration for MC9S12NE64
This section contains information regarding how the modules are implemented on the MC9S12NE64
device.
1.7.1V
On the MC9S12NE64, the V
regulator. If this pin is tied low, then V
PHY_VDDA must be supplied externally.
1.7.2V
In both the 112-pin LQFP and the 80-pin TQFP-EP package versions, both internal VDD and VSS of the
2.5 V domain are bonded out on two sides of the device as two pin pairs (V
and V
V
DD1
allows systems to employ better supply routing and further decoupling.
DDR/VREGEN
DDR/VREGEN
DD1
, V
DD1
are connected together internally. V
DD2
DD2
, V
SS1
, V
SS2
pin is used to enable or disable the internal voltage 3.3V to 2.5V
See the CRG block description chapter for information about the clock and reset generator module. The
CRG is part of the IPBus domain. For the MC9S12NE64, only the Pierce circuitry is available for the
oscillator.
The low-voltage reset feature uses the low-voltage reset signal from the VREG_PHY module as an input
to the CRG module. When the regulator output voltage supply to the internal chip logic falls below a
specified threshold, the LVR signal from the VREG_PHY module causes the CRG module to generate a
reset. See the VREG_PHY block description chapter for voltage level specifications.
1.7.3.1XCLKS
The XCLKS input signal is not available on the MC9S12NE64. The signal is internally tied low to select
the Pierce oscillator or external clock configuration.
1.7.4Ethernet Media Access Controller (EMAC)
See the EMAC block description chapter for information about the Ethernet media access controller
module. The EMAC is part of the IPBus domain.
1.7.4.1EMAC MII External Pin Configuration
When the EMAC is configured for and external Ethernet physical transceiver internal pull-ups and
pull-downs are not automatically configured on the MII inputs. Any internal pull-up or pull-down resistors,
which may be required, must be configured by setting the appropriate pull control registers in the port
integration module (PIM). This implementation allows the use of external pull-up and pull-down resistors.
1.7.4.2EMAC Internal PHY Configuration
When the EXTPHY bit (in the EMAC NETCTL register) is set to 1, the EMAC is configured to work with
the internal EPHY block. Please see 1.7.5, “Ethernet Physical Transceiver (EPHY),” for more information
regarding the EPHY block.
1.7.4.3Low-Power Operation
Special care must be taken when executing STOP and WAIT instructions while using the EMAC, or
undesired operation may result.
1.7.4.3.1Wait
Transmit and receive operations are not possible in wait mode if the CWAI bit is set in the CLKSEL
register because the clocks to the transmit and receive buffers are stopped. It is recommended that the
EMAC ESWAI bit be set if wait mode is entered with the CWAI set.
MC9S12NE64 Data Sheet, Rev 1.0
Freescale Semiconductor91
Chapter 1 Device Overview
1.7.4.3.2Stop
During system low-power stop mode, the EMAC is immediately disabled. Any receive in progress is
dropped and any PAUSE time-out is cleared. The user must not to enter low-power stop mode when
TXACT or BUSY are set.
1.7.5 Ethernet Physical Transceiver (EPHY)
See the EPHY block description chapter for information about the Ethernet physical transceiver module.
The EPHY is part of the IPBus domain. The EPHY also has MII register space which is not part of the
MCU address space and not accessible via the IP bus. The MII registers can be accessed using the MDIO
functions of the EMAC when the EMAC is configured for internal PHY operation.
The MII pins of the EPHY are not externally accessible. All communication and management of the EPHY
must be performed using the EMAC.
The organization unique identifier (OUI) for the MC9S12NE64 is 00-60-11 (hex).
1.7.5.1Low-Power Operation
Special care must be taken when executing STOP and WAIT instructions while using the EPHY or
undesired operation may result.
1.7.5.1.1Wait
Transmit and receive operations are not possible in wait mode if the CWAI bit is set in the CLKSEL
register because the clocks to the internal MII interface are stopped.
1.7.5.1.2Stop
During system low-power stop mode, the EPHY is immediately reset and powered down. Upon exiting
stop mode, the a start-up delay is required prior to initiating MDIO communications with the EPHY. See
A.14, “EPHY Electrical Characteristics” for details.
It is not possible to use an EPHY interrupt to wake the system from stop mode.
1.7.6RAM 8K Block Description
This module supports single-cycle misaligned word accesses without wait states. The RAM is part of the
HCS12 Bus domain.
In addition to operating as the CPU storage, the 8K system RAM also functions as the Ethernet buffer
while the EMAC module is enabled. While the EMAC is enabled, the Ethernet buffer will occupy 0.375K
to 4.5K of RAM with physical addresses starting at $0000 and ending at $017F up to $11FF, depending
on the setting of the BUFMAP bits in the EMAC Ethernet buffer configuration register (BUFCFG). The
relative RAM address, which are controlled by settings in the internal RAM position register (INTRM),
must be tracked in software.
MC9S12NE64 Data Sheet, Rev 1.0
92Freescale Semiconductor
Block Configuration for MC9S12NE64
The Ethernet buffer operation of the RAM is independent of the CPU and allows same cycle read/write
access from the CPU and the EMAC. No hardware blocking mechanism is implemented to prevent the
CPU from accessing the Ethernet RAM space, so care must be taken to ensure that the CPU does not
corrupt the RAM Ethernet contents.
This document describes the FTS64K module which is a 64K byte Flash (nonvolatile) memory. The Flash
array is organized as 1 block of 64K bytes organized as 1024 rows of 64 bytes. The Flash block’s erase
sector size is 8 rows (512 bytes).
The Flash memory may be read as either bytes, aligned words or misaligned words. Read access time is
one bus cycle for byte and aligned word, and two bus cycles for misaligned words.
Program and erase functions are controlled by a command driven interface. Both sector erase and mass
erase of the entire 64K byte Flash block are supported. An erased bit reads 1 and a programmed bit reads 0.
The high voltage required to program and erase is generated internally by on-chip charge pumps.
It is not possible to read from the Flash block while it is being erased or programmed.
The Flash block is ideal for program and data storage for single-supply applications allowing for field
reprogramming without requiring external programming voltage sources.
NOTE
A word must be erased before being programmed. Cumulative
programming of bits within a word is not allowed.
2.1.1Glossary
Command Sequence — A three-step MCU instruction sequence to program, erase, or erase verify a Flash
block.
2.1.2Features
•64K bytes of Flash memory
•Automated program and erase algorithm
•Interrupts on Flash command completion and command buffer empty
•Fast sector erase and word program operation
•2-stage command pipeline
•Flexible protection scheme for protection against accidental program or erase
•Single power supply program and erase
•Security feature
2.1.3Modes of Operation
•Program and erase operation (please refer to Section 2.4.1, “Program and Erase Operation,” for
details).
Figure 2-1 shows a block diagram of the FTS64K module.
FTS64K
Command
Interface
Command
Complete
Interrupt
Registers
Command Pipeline
Flash Array
32K * 16 Bits
row0
row1
Command
Buffer Empty
Interrupt
Oscillator
Clock
comm2
addr2
data2
Protection
Security
comm1
addr1
data1
Clock
Divider
Figure 2-1. Module Block Diagram
FCLK
row1023
2.2External Signal Description
The FTS64K module contains no signals that connect off-chip.
2.3Memory Map and Register Descriptions
This section describes the FTS64K memory maps and registers.
MC9S12NE64 Data Sheet, Rev 1.0
96Freescale Semiconductor
Memory Map and Register Descriptions
2.3.1Module Memory Map
Figure 2-2 shows the FTS64K memory map. The HCS12 architecture places the Flash memory address
between $4000 and $FFFF, which corresponds to three 16-Kbyte pages. The content of the HCS12 core
PPAGE register is used to map the logical middle page ranging from address $8000 to $BFFF to any
physical 16K byte page in the physical memory
field, described in Table 2-1, and user defined Flash protected sectors, described in Table 2-2.
The FPOPEN bit in the FPROT register (see Section 2.3.2.5, “Flash Protection Register (FPROT)”) can
globally protect the entire Flash array. However, two protected areas, one starting from the Flash page $3E
starting address (called lower) towards higher addresses and the other one growing downward from the
Flash page $3F end address (called higher) can be activated. The latter is mainly targeted to hold the boot
loader code because it covers the vector space. All the other areas may be used to keep critical parameters.
Security information that allows the MCU to prevent intrusive access to the Flash module is stored in the
Flash protection/options field described in Table 2-1.
Table 2-1. Flash Protection/Options Field
1
. Shown within the pages are the Flash protection/options
Array Address
$FF00 - $FF078Backdoor comparison keys
$FF08 - $FF0C5Reserved
$FF0D1Flash protection byte
$FF0E1Reserved
$FF0F1Flash Options/Security byte
Size
(bytes)
Description
Refer to Section 2.3.2.5, “Flash
Protection Register (FPROT)”
Refer to Section 2.3.2.2, “Flash
Security Register (FSEC)”
1.By placing $3F/$3E in the HCS12 Core PPAGE register, the bottom /top “fixed” 16-Kbyte pages can be seen twice
Flash Protected High Sectors
2K, 4K, 8K, 16K bytes
$FF00 - $FF0F, Flash Protection/Security Field
Note: $3C-$3F correspond to the PPAGE register content
Figure 2-2. Flash Memory Map
MC9S12NE64 Data Sheet, Rev 1.0
98Freescale Semiconductor
Memory Map and Register Descriptions
Table 2-2. Flash Module Memory Map Summary
MCU Address
Range
PPAGE
$4000-$7FFFUnpaged
($3E)
ProtectableLow
Range
ProtectableHigh
Range
Block Relative
Address
$4000-$41FFN.A.$8000-$BFFF
$4000-$43FF
$4000-$47FF
$4000-$4FFF
$8000-$BFFF$3CN.A.N.A.$0000-$3FFF
$3DN.A.N.A.$4000-$7FFF
$3E$8000-$81FFN.A.$8000-$BFFF
$8000-$83FF
$8000-$87FF
$8000-$8FFF
$3FN.A.$B800-$BFFF$C000-$FFFF
$B000-$BFFF
$A000-$BFFF
$8000-$BFFF
$C000-$FFFFUnpaged
($3F)
N.A.$F800-$FFFF$C000-$FFFF
$F000-$FFFF
$E000-$FFFF
$C000-$FFFF
1
Inside Flash block.
1
The Flash module also contains a set of 16 control and status registers located in address space register
base + $100 to register base + $10F. A summary of these registers is given in Table 2-3.
Register address = register base address +$100 + address offset, where the
register base address is defined by the HCS12 core INITRG register and the
address offset is defined by the Flash module.
2.3.2Register Descriptions
2.3.2.1Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable.
FDIVLD — Clock Divider Loaded.
1 = Register has been written to since the last reset.
0 = Register has not been written.
PRDIV8 — Enable Prescaler by 8.
1 = Enables a prescaler by 8, to divide the Flash module input oscillator clock before feeding into
the CLKDIV divider.
0 = The input oscillator clock is directly fed into the FCLKDIV divider.
FDIV[5:0] — Clock Divider Bits.
The combination of PRDIV8 and FDIV[5:0] effectively divides the Flash module input oscillator
clock down to a frequency of 150 kHz - 200 kHz. The maximum divide ratio is 512. Please refer to
Section 2.4.1.1, “Writing the FCLKDIV Register,” for more information.
2.3.2.2Flash Security Register (FSEC)
This FSEC register holds all bits associated with the security of the MCU.
MC9S12NE64 Data Sheet, Rev 1.0
100Freescale Semiconductor
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