Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application,Buyershallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
1
Revision History
Version
Number
V01.00
V01.01
V01.02
V01.03
V01.04
V01.05
Revision
Date
16 NOV
2001
18 FEB
2002
6 MAR
2002
4 June
2002
4 July
2002
30 July
2002
Effective
Date
19 NOV
2001
18 FEB
2002
6 MAR
2002
4 June
2002
4 July
2002
30 July
2002
AuthorDescription of Changes
Initial version based on MC9SDP256-2.09 Version.
In table 7 I/O Characteristics" of the electrical characteristics
Table "Oscillator Characteristics":removed "Oscillator start-up time
from POR or STOP" row
Table "5V I/O Characteristics": Updated
Partial Drive IOH = +–2mA and Full Drive IOH = –10mA
Table "ATD Operating Characteristics": Distinguish I
ATD blocks on
Table "ATD Electrical Characteristics": Update C
Table "Operating Conditions": Changed V
(min)
Removed Document number except from Cover Sheet
Updated Table "Document References"
Table "5V I/O Characteristics" : Corrected Input Capacitance to 6pF
Section: "Device Pinout" (112-pin and 80-pin): added in diagrams
RXCAN0 to PJ6 and TXCAN0 to PJ7
Table "PLL Characteristics": Updated parameters K
Figure "Basic PLL functional diagram": Inserted XFC pin in diagram
Enhanced section "XFC Component Selection"
Added to SectionsATD,ECT and PWM: freeze mode = active BDM
mode
Added 1L86D to Table "Assigned Part ID numbers"
Corrected MEMSIZ1 value in Table "Memory size registers"
Subsection "Device Memory Map: Removed Flash mapping from
$0000 to $3FFF.
Table "Signal Properties": Added column "Internal Pull Resistor".
Preface Table "Document References": Changed to full naming for
each block.
Table "Interrupt Vector Locations", Column "Local Enable":
Corrected several register and bit names.
Figure "Recommended PCB Layout for 80QFP: Corrected
VREGEN pin position
Thermal values for junction to board and package
BGND pin pull-up
Part Order Information
Global Register Table
Chip Configuration Summary
Modified mode of Operations chapter
Section "Printed Circuit Board Layout Proposals": added Pierce
Oscillator examples for 112LQFP and 80QFP
->Table "Supply Current Characteristics":
changed max Run IDD from 65mA to 50mA
changes max Wait IDD from 40mA to 30mA
changed max Stop IDD from 50uA to 100uA
Section HCS12 Core Block Description: mentioned alternate clock
of BDM to be equivalent to oscillator clock
Table "5V I/O Characteristics": Corrected Input Leakage Current to
+/- 1 uA
Section "Part ID assignment": Located on start of next page for
better readability
Added MC9S12A64 derivative to cover sheet and "Derivative
Differences" Table
Corrected in footnote of Table "PLL Characteristics": f
Renamed "Preface" section to "Derivative Differences and
Document references". Added details for derivatives missing CAN0
and/or BDLC
Table"ESD and Latch-upTest Conditions":changed pulse numbers
from 3 to 1
Table "ESD and Latch-Up Protection Characteristics": changed
parameter classification from C to T
Table "5V I/O Characteristics": removed foot note from "Input
Leakage Current"
Table " Supply Current Characteristics": updated Stop and Pseudo
Stop currents
Subsection "Detailed Register Map": Corrected several entries
Subsection "Unsecuring the Microcontroller": Added more details
Table "Operating Conditions": improved footnote 1 wording, applied
footnote 1 to PLL Supply Voltage.
Tables "SPI Master/Slave Mode Timing Characteristics: Corrected
Operating Frequency
Appendix ’NVM, Flash and EEPROM’: Replaced ’burst
programming’ by ’row programming
Table "Operating Conditions": corrected minimum bus frequency to
0.25MHz
Section "Feature List": ECT features changed to "Four pulse
accumulators ..."
Replaced references to HCS12 Core Guide by the individual
HCS12 Block guides
Table "Signal Properties" corrected pull resistor reset state for PE7
and PE4-PE2.
Table "Absolute Maximum Ratings" corrected footnote on clamp of
TEST pin.
Added cycle definition to "CPU 12 Block Description".
Added register reset values to MMC and MEBI block descriptions.
Diagram "Clock Connections": Connect Bus Clock to HCS12 Core
OSC
= 4MHz
3
MC9S12DJ64 Device User Guide — V01.17
Version
Number
V01.15
V01.16
V01.17
Revision
Date
22 July
2003
24 Feb.
2004
21 May
2004
Effective
Date
22 July
2003
24 Feb.
2004
21 May
2004
AuthorDescription of Changes
Mentioned "S12 LRAE" bootloader in Flash section
Section Document References: corrected S12 CPU document
reference
Added 3L86D maskset with corresponding Part ID
Table Oscillator Characteristics: Added more details for EXTAL pin
Added 4L86D maskset with corresponding Part ID
Table "MC9S12DJ64 Memory Mapout of Reset": corrected$1000 $3fff memory in single chip modes to "unimplemented".
The following items should be considered when using a derivative.
•Registers
–Do not write or read CAN0 registers (after reset: address range $0140 - $017F), if using a
derivative without CAN0 (see Table 0-1).
–Do not write or read BDLC registers (after reset: address range $00E8 - $00EF), if using a
derivative without BDLC (see Table 0-1).
•Interrupts
–Fill the four CAN0 interrupt vectors ($FFB0 - $FFB7) according to your coding policies for
unused interrupts, if using a derivative without CAN0 (see Table 0-1).
Temperature Options
C = -40˚C to85˚C
V = -40˚C to 105˚C
M = -40˚C to 125˚C
Package Options
FU = 80QFP
PV = 112LQFP
–Fill the BDLC interrupt vector ($FFC2, $FFC3) according to your coding policies for unused
interrupts, if using a derivative without BDLC (see Table 0-1).
•Ports
15
MC9S12DJ64 Device User Guide — V01.17
–The CAN0 pin functionality (TXCAN0, RXCAN0) is not available on port PJ7, PJ6, PM5,
PM4, PM3, PM2, PM1 and PM0, if using a derivative without CAN0 (see Table 0-1).
–The BDLC pin functionality (TXB, RXB) is not available on port PM1 and PM0, if using a
derivative without BDLC (see Table 0-1).
–Do not write MODRR1 and MODRR0 Bit of Module Routing Register (PIM_9DJ64 Block
User Guide), if using a derivative without CAN0 (see Table 0-1).
•Pins not available in 80 pin QFP package
–Port H
In order to avoid floating nodes the ports should be either configured as outputs by setting the
data direction register (DDRH at Base+$0262) to $FF, or enabling the pull resistors by writing
a $FF to the pull enable register (PERH at Base+$0264).
–Port J[1:0]
PortJpull-up resistors areenabled out ofreseton all fourpins(7:6 and1:0).Therefore care must
be taken not to disable the pull enables on PJ[1:0] by clearing the bits PERJ1 and PERJ0 at
Base+$026C.
–Port K
Port K pull-up resistors are enabled out of reset, i.e. Bit 7 = PUKE = 1 in the register PUCR at
Base+$000C. Therefor care must be taken not to clear this bit.
–Port M[7:6]
PM7:6 must be configured as outputs or their pull resistors must be enabled to avoid floating
inputs.
–Port P6
PP6 must be configured as output or its pull resistor must be enabled to avoid a floating input.
–Port S[7:4]
PS7:4 must be configured as outputs or their pull resistors must be enabled to avoid floating
inputs.
–PAD[15:8] (ATD1 channels)
Out ofresetthe ATD1 is disabledpreventingcurrent flows in the pins.Donot modify the ATD1
registers!
Document References
The Device User Guide providesinformationabouttheMC9S12DJ64 device made up of standard HCS12
blocks and the HCS12 processor core.
This document is part of the customer documentation. A complete set of device manuals also includes all
the individual Block Guides of the implemented modules. In a effort to reduce redundancy all module
specific information is located only in the respective Block Guide. If applicable, special implementation
details of the module are given in the block description sections of this document.
See Table 0-2 for names and versions of the referenced documents throughout the Device User Guide.
16
MC9S12DJ64 Device User Guide — V01.17
Table 0-2 Document References
User Guide
HCS12 CPU Reference ManualV02S12CPUV2/D
HCS12 Module Mapping Control (MMC) Block GuideV04S12MMCV4/D
HCS12 Multiplexed External Bus Interface (MEBI) Block GuideV03S12MEBIV3/D
Clock and Reset Generator (CRG) Block User GuideV04S12CRGV4/D
Oscillator (OSC) Block User GuideV02S12OSCV2/D
Enhanced Capture Timer 16 Bit 8 Channel (ECT_16B8C) Block User GuideV01S12ECT16B8CV1/D
Analog to Digital Converter 10 Bit 8 Channel (ATD_10B8C) Block User GuideV02S12ATD10B8CV2/D
Inter IC Bus (IIC) Block User GuideV02S12IICV2/D
Asynchronous Serial Interface (SCI) Block User GuideV02S12SCIV2/D
Serial Peripheral Interface (SPI) Block User GuideV02S12SPIV2/D
Pulse Width Modulator 8 Bit 8 Channel (PWM_8B8C) Block User GuideV01S12PWM8B8CV1/D
64K Byte Flash (FTS64K) Block User GuideV01S12FTS64KV1/D
1K Byte EEPROM (EETS1K) Block User GuideV01S12EETS1KV1/D
Byte Level Data Link Controller -J1850 (BDLC) Block User GuideV01S12BDLCV1/D
Motorola Scalable CAN (MSCAN) Block User GuideV02S12MSCANV2/D
Voltage Regulator (VREG) Block User GuideV01S12VREGV1/D
Port Integration Module (PIM_9DJ64) Block User GuideV01S12PIM9DJ64V1/D
Versi
on
Document Order Number
17
MC9S12DJ64 Device User Guide — V01.17
18
MC9S12DJ64 Device User Guide — V01.17
Section 1 Introduction
1.1 Overview
The MC9S12DJ64 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip
peripherals including a 16-bit central processing unit (HCS12 CPU), 64K bytes of Flash EEPROM, 4K
bytes of RAM, 1K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), one
serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, two 8-channel, 10-bit
analog-to-digital converters(ADC),an 8-channel pulse-width modulator(PWM),a digital Byte Data Link
Controller (BDLC), 29 discrete digital I/O channels (Port A, Port B, Port K and Port E), 20 discrete digital
I/O lines with interrupt and wakeup capability, a CAN 2.0 A, B software compatible modules
(MSCAN12), and an Inter-IC Bus. The MC9S12DJ64 has full 16-bit datapaths throughout. However, the
external bus can operate in an 8-bit narrow mode so single 8-bit wide memory can be interfaced for lower
cost systems. The inclusion of a PLL circuit allows power consumption and performance to be adjusted to
suit operational requirements.
1.2 Features
•HCS12 Core
–16-bit HCS12 CPU
i. Upward compatible with M68HC11 instruction set
ii. Interrupt stacking and programmer’s model identical to M68HC11
iii.Instruction queue
•1M bit per second, CAN 2.0 A, B software compatible module
–Five receive and three transmit buffers
–Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit or 8 x 8 bit
–Four separate interrupt channels for Rx, Tx, error and wake-up
–Low-pass filter wake-up function
–Loop-back for self test operation
•Enhanced Capture Timer
–16-bit main counter with 7-bit prescaler
–8 programmable input capture or output compare channels
–Four 8-bit or two 16-bit pulse accumulators
•8 PWM channels
–Programmable period and duty cycle
–8-bit 8-channel or 16-bit 4-channel
–Separate control for each pulse width and duty cycle
–Center-aligned or left-aligned outputs
–Programmable clock select logic with a wide range of frequencies
–Fast emergency shutdown input
–Usable as interrupt inputs
•Serial interfaces
–Two asynchronous Serial Communications Interfaces (SCI)
–Synchronous Serial Peripheral Interface (SPI)
•Byte Data Link Controller (BDLC)
–SAE J1850 Class B Data Communications Network Interface Compatible and ISO Compatible
for Low-Speed (<125 Kbps) Serial Data Communications in Automotive Applications
•Inter-IC Bus (IIC)
–Compatible with I2C Bus standard
–Multi-master operation
–Software programmable for one of 256 different serial clock frequencies
•112-Pin LQFP or 80 QFP package
20
–I/O lines with 5V input and drive capability
–5V A/D converter inputs
–Operation at 50MHz equivalent to 25MHz Bus Speed
–Development support
–Single-wire background debug™ mode (BDM)
–On-chip hardware breakpoints
•Special Operating Modes
–Special Single-Chip Mode with active Background Debug Mode
–Special Test Mode (Motorola use only)
–Special Peripheral Mode (Motorola use only)
Low power modes
•Stop Mode
•Pseudo Stop Mode
•Wait Mode
21
MC9S12DJ64 Device User Guide — V01.17
1.4 Block Diagram
Figure 1-1 shows a block diagram of the MC9S12DJ64 device.
22
MC9S12DJ64 Device User Guide — V01.17
Figure 1-1 MC9S12DJ64 Block Diagram
VDDR
VSSR
VREGEN
VDD1,2
VSS1,2
BKGD
XFC
VDDPLL
VSSPLL
EXTAL
XTAL
RESET
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
TEST
Multiplexed
Wide Bus
Multiplexed
Narrow Bus
Internal Logic 2.5V
VDD1,2
VSS1,2
PLL 2.5V
VDDPLL
VSSPLL
64K Byte Flash EEPROM
4K Byte RAM
1K Byte EEPROM
Voltage Regulator
Single-wire Background
Debug Module
Clock and
Reset
PLL
Generation
Module
XIRQ
IRQ
W
R/
LSTRB
DDRE
ECLK
MODA
MODB
NOACC/
XCLKS
PTE
Multiplexed Address/Data Bus
DDRADDRB
PTAPTB
PA4
PA3
PA2
PA1
ADDR11
ADDR10
ADDR9
DATA11
DATA10
DATA9
DATA3
DATA2
DATA1
PA0
ADDR8
DATA8
DATA0
PA7
PA6
PA5
ADDR15
ADDR14
ADDR13
DATA15
DATA14
DATA13
DATA7
DATA6
DATA5
ADDR12
DATA12
DATA4
I/O Driver 5V
VDDX
VSSX
A/D Converter 5V &
Voltage Regulator Reference
VDDA
VSSA
Voltage Regulator 5V & I/O
VDDR
VSSR
CPU12
Periodic Interrupt
COP Watchdog
Clock Monitor
Breakpoints
System
Integration
PB4
PB3
PB5
ADDR4
ADDR5
DATA4
DATA5
PB2
ADDR3
ADDR2
DATA3
DATA2
PB7
PB6
ADDR7
ADDR6
DATA7
DATA6
PB1
PB0
ADDR1
ADDR0
DATA1
DATA0
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
VRH
VRL
VDDA
VSSA
AD0
ATD0
PPAGE
Enhanced Capture
Timer
SCI0
SCI1
MISO
MOSI
SPI0
BDLC
(J1850)
CAN0
IIC
PWM
SCK
SS
RXB
TXB
RXCAN
TXCAN
SDA
SCL
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
PWM6
PWM7
ATD1
PAD00
PAD01
PAD02
PAD03
PAD04
PAD05
PAD06
PAD07
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
PIX0
PIX1
PIX2
PIX3
PIX4
PIX5
ECS
IOC0
IOC1
IOC2
IOC3
IOC4
IOC5
IOC6
IOC7
RXD
TXD
RXD
TXD
Module to Port Routing
KWJ0
KWJ1
KWJ6
KWJ7
KWP0
KWP1
KWP2
KWP3
KWP4
KWP5
KWP6
KWP7
KWH0
KWH1
KWH2
KWH3
KWH4
KWH5
KWH6
KWH7
VRH
VRL
VDDA
VSSA
DDRK
DDRT
DDRS
DDRM
DDRJ
DDRP
DDRH
AD1
PTK
PTT
PTS
PTM
PTJ
PTP
PTH
VRH
VRL
VDDA
VSSA
PAD08
PAD09
PAD10
PAD11
PAD12
PAD13
PAD14
PAD15
PK0
PK1
PK2
PK3
PK4
PK5
PK7
PT0
PT1
PT2
PT3
PT4
PT5
PT6
PT7
PS0
PS1
PS2
PS3
PS4
PS5
PS6
PS7
PM0
PM1
PM2
PM3
PM4
PM5
PM6
PM7
PJ0
PJ1
PJ6
PJ7
PP0
PP1
PP2
PP3
PP4
PP5
PP6
PP7
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PH7
XADDR14
XADDR15
XADDR16
XADDR17
XADDR18
XADDR19
ECS
Signals shown in Bold are not available on the 80 Pin Package
23
MC9S12DJ64 Device User Guide — V01.17
24
MC9S12DJ64 Device User Guide — V01.17
1.5 Device Memory Map
Table 1-1 and Figure 1-2 show the device memory map of the MC9S12DJ64 after reset. The 1K
EEPROM is mapped twice in a 2K address space. Note that after reset the bottom 1k of the EEPROM
($0000 - $03FF) are hidden by the register space, and the 1K $0400 - $07FF is hidden by the RAM.
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses $001A and $001B after
reset). The read-only value is a uniquepartIDforeachrevision of the chip. Table 1-3showstheassigned
part ID number.
Table 1-3 Assigned Part ID Numbers
DeviceMask Set Number
MC9S12DJ640L86D$0200
MC9S12DJ641L86D$0201
MC9S12DJ642L86D
MC9S12DJ643L86D$0203
MC9S12DJ644L86D$0204
NOTES:
1. The coding is as follows:
Bit 15-12: Major family identifier
Bit 11-8: Minor family identifier
Bit 7-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor - non full - mask set revision
2. 1L86D is identical to 2L86D except improved ESD performance on 2L86D
Part ID
$0201
1
2
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C
and $001D after reset). Table 1-4 shows the read-only values of these registers. Refer to HCS12 Module
Mapping Control (MMC) Block Guide for further details.
Table 1-4 Memory size registers
Register nameValue
MEMSIZ0$11
MEMSIZ1$80
47
MC9S12DJ64 Device User Guide — V01.17
48
MC9S12DJ64 Device User Guide — V01.17
Section 2 Signal Description
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals. It is built from the signal description sections of the Block
Guides of the individual IP blocks on the device.
2.1 Device Pinout
The MC9S12DJ64 is available in a 112-pin low profile quad flat pack (LQFP) and in a 80-pin quad flat
pack (QFP). Most pins perform two or more functions, as described in the Signal Descriptions. Figure2-1 and Figure 2-2 show the pin assignments.
Figure 2-2 Pin Assignments in 80-pin QFP for MC9S12DJ64
2.2 Signal Properties Summary
Table 2-1 summarizes the pin functionality. Signals shown in bold are not available in the 80 pin
package.
51
MC9S12DJ64 Device User Guide — V01.17
Table 2-1 Signal Properties
Internal Pull
Pin Name
Function1
EXTAL———
XTAL———
RESET———VDDRExternal Reset
TEST———N.A.Test Input
VREGEN———VDDXVoltage Regulator Enable Input
XFC———VDDPLLPLL Loop Filter
BKGD
PAD15AN15ETRIG1—
PAD[14:08]AN[14:08]——
PAD07AN07ETRIG0—
PAD[06:00]AN[06:00]——
PA[7:0]
PB[7:0]
PE7NOACC
PE6IPIPE1MODB—While
PE5IPIPE0MODA—Port E I/O, Pipe Status, Mode Input
PE4ECLK——
PE3
PE2R/
PE1
PE0
PH7KWH7——
PH6KWH6——Port H I/O, Interrupt
PH5KWH5——Port H I/O, Interrupt
PH4KWH4——Port H I/O, Interrupt
PH3KWH3——Port H I/O, Interrupt
PH2KWH2——Port H I/O, Interrupt
PH1KWH1——Port H I/O, Interrupt
PH0KWH0——Port H I/O, Interrupt
Pin Name
Function2
TAGHIMODC—VDDR
ADDR[15:8]/
DATA[15:8]
ADDR[7:0]/
DATA[7:0]
LSTRBTAGLO—Port E I/O, Byte Strobe, Tag Low
W——Port E I/O, R/W in expanded modes
IRQ——
XIRQ——Port E Input, Non Maskable Interrupt
Pin Name
Function3
——
——
XCLKS—
Pin Name
Function4
Powered
by
VDDPLL
VDDANoneNone
VDDR
Resistor
CTRL
NoneNone
Always
Up
PUCR/
PUPAE
PUCR/
PUPBE
PUCR/
PUPEE
PUCR/
PUPEE
PERH/
PPSH
Reset
State
Disabled
Mode
depen-
dant
RESET pin is
low:
Down
Mode
depen-
dant
Disabled
Up
Up
Description
Oscillator Pins
Background Debug, Tag High, Mode
Input
Port AD Input, Analog Input AN7 of
ATD1, External Trigger Input of
ATD1
Port AD Inputs, Analog Inputs
AN[6:0] of ATD1
Port AD Input, Analog Input AN7 of
ATD0, External Trigger Input of ATD0
Port AD Inputs, Analog Inputs AN[6:0]
of ATD0
Port A I/O, Multiplexed Address/Data
Port B I/O, Multiplexed Address/Data
Port E I/O, Access, Clock Select
1
Port E I/O, Pipe Status, Mode Input
Port E I/O, Bus Clock Output
1
Port E Input, Maskable Interrupt
Port H I/O, Interrupt
52
MC9S12DJ64 Device User Guide — V01.17
Internal Pull
Pin Name
Function1
PJ7KWJ7SCLTXCAN0
PJ6KWJ6SDARXCAN0
PJ[1:0]KWJ[1:0]——Port J I/O, Interrupts
PK7
PK[5:0]XADDR[19:14]——Port K I/O, Extended Addresses
PM7———
PM6———Port M I/O
PM5TXCAN0SCK—Port M I/O, TX of CAN0, SCK of SPI0
PM4RXCAN0MOSI—Port M I/O, RX of CAN0, MOSI of SPI0
PM3TXCAN0
PM2RXCAN0MISO0—Port M I/O,RX of CAN0, MISO of SPI0
PM1TXCAN0TXB—Port M I/O, TX of CAN0, RX of BDLC
PM0RXCAN0RXB—Port M I/O, RX of CAN0, RX of BDLC
PP7KWP7PWM7—
PP6KWP6PWM6—Port P I/O,Interrupt, PWM Channel 6
PP5KWP5PWM5—Port P I/O, Interrupt, PWM Channel 5
PP4KWP4PWM4—Port P I/O, Interrupt, PWM Channel 4
PP3KWP3PWM3—Port P I/O, Interrupt, PWM Channel 3
PP2KWP2PWM2—Port P I/O, Interrupt, PWM Channel 2
PP1KWP1PWM1—Port P I/O, Interrupt, PWM Channel 1
PP0KWP0PWM0—Port P I/O, Interrupt, PWM Channel 0
PS7
PS6SCK0——Port S I/O, SCK of SPI0
PS5MOSI0——Port S I/O, MOSI of SPI0
PS4MISO0——Port S I/O, MISO of SPI0
PS3TXD1——Port S I/O, TXD of SCI1
PS2RXD1——Port S I/O, RXD of SCI1
PS1TXD0——Port S I/O, TXD of SCI0
PS0RXD0——Port S I/O, RXD of SCI0
PT[7:0]IOC[7:0]——
NOTES:
1. Refer to PEAR register description in HCS12 Multiplexed External Bus Interface (MEBI) Block Guide
Pin Name
Function2
ECSROMCTL—
SS0——
Pin Name
Function3
SS0—Port M I/O, TX of CAN0, SS of SPI0
Pin Name
Function4
Powered
by
VDDX
VDDX
Resistor
CTRL
PERJ/
PPSJ
PUCR/
PUPKE
PERM/
PPSM
PERP/
PPSP
PERS/
PPSS
PERT/
PPST
Reset
State
Port J I/O, Interrupt, SCL of IIC, TX of
CAN0
Up
Up
Disabled
Up
Disabled Port T I/O, Timer channels
Port J I/O, Interrupt, SDA of IIC, RX of
CAN0
Port K I/O, Emulation Chip Select,
ROM On Enable
Port M I/O
Port P I/O, Interrupt, Channel 7 of
PWM
Port S I/O, SS of SPI0
Description
53
MC9S12DJ64 Device User Guide — V01.17
2.3 Detailed Signal Descriptions
2.3.1 EXTAL, XTAL — Oscillator Pins
EXTAL andXTALare the crystal driver and externalclockpins.On reset all the deviceclocksarederived
from the EXTAL input frequency. XTAL is the crystal output.
2.3.2 RESET — External Reset Pin
An active low bidirectional control signal, it acts as an input to initialize the MCU to a known start-up
state, and an output when an internal MCU function causes a reset.
2.3.3 TEST — Test Pin
This input only pin is reserved for test.
NOTE:
The TEST pin must be tied to VSS in all applications.
2.3.4 VREGEN — Voltage Regulator Enable Pin
This input only pin enables or disables the on-chip voltage regulator.
2.3.5 XFC — PLL Loop Filter Pin
PLL loop filter. Please ask your Motorola representative for the interactive application note to compute
PLL loop filter elements. Any current leakage on this pin must be avoided.
XFC
R
MCU
0
C
S
C
P
VDDPLLVDDPLL
Figure 2-3 PLL Loop Filter Connections
2.3.6 BKGD / TAGHI / MODC — Background Debug, Tag High, and Mode Pin
The BKGD/TAGHI/MODC pin is used as a pseudo-open-drain pin for the background debug
communication. In MCU expanded modes of operation when instruction tagging is on, an input low on
this pin during the falling edge of E-clock tags the high half of the instruction word being read into the
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MC9S12DJ64 Device User Guide — V01.17
instruction queue. It is used as a MCU operating mode select pin during reset. The state of this pin is
latched to the MODC bit at the rising edge of
RESET. This pin has a permanently enabled pull-up device.
2.3.7 PAD15 / AN15 / ETRIG1 — Port AD Input Pin of ATD1
PAD15 is a general purpose input pin and analog input AN7 of the analog to digital converter ATD1. It
can act as an external trigger input for the ATD1.
2.3.8 PAD[14:08] / AN[14:08] — Port AD Input Pins ATD1
PAD14 - PAD08 are general purpose input pins and analog inputs AN[6:0] of the analog to digital
converter ATD1.
2.3.9 PAD07 / AN07 / ETRIG0 — Port AD Input Pin of ATD0
PAD07 is a general purpose input pin and analog input AN0 of the analog to digital converter ATD0. It
can act as an external trigger input for the ATD0.
2.3.10 PAD[06:00] / AN[06:00] — Port AD Input Pins of ATD0
PAD06 - PAD00 are general purpose input pins and analog inputs AN[6:0] of the analog to digital
converter ATD0.
2.3.11 PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA7-PA0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.12 PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB7-PB0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.13 PE7 / NOACC / XCLKS — Port E I/O Pin 7
PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC
signal, when enabled, is used to indicate that the current bus cycle is an unused or “free” cycle. This signal
will assert when the CPU is not using the bus.
XCLKS is an input signal which controls whether a crystal in combination with the internal Colpitts
The
(low power) oscillator isusedorwhether Pierce oscillator/external clock circuitry is used. The state of this
pin is latched at the rising edge of
external clock drive or a Pierce Oscillator.If input is a logic high a Colpitts oscillator circuit is configured
on EXTAL and XTAL. Since this pin is an input with a pull-up device during reset, if the pin is left
floating, the default configuration is a Colpitts oscillator circuit on EXTAL and XTAL.
RESET. If the input is a logic low the EXTAL pin is configured for an
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MC9S12DJ64 Device User Guide — V01.17
EXTAL
MCU
XTAL
* Due to the nature of a translated ground Colpitts oscillator a
DC voltage bias is applied to the crystal
Please contact the crystal manufacturer for crystal DC
* Rs can be zero (shorted) when used with higher frequency crystals.
Refer to manufacturer’s data.
Figure 2-5 Pierce Oscillator Connections (PE7=0)
MCU
EXTAL
XTAL
not connected
CMOS-COMPATIBLE
EXTERNAL OSCILLATO
(V
DDPLL
-Level)
R
56
Figure 2-6 External Clock Connections (PE7=0)
MC9S12DJ64 Device User Guide — V01.17
2.3.14 PE6 / MODB / IPIPE1 — Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODB bit at the rising edge of
instruction queue tracking signalIPIPE1.Thispin is an input with a pull-down device which is only active
RESET is low.
when
RESET. This pin is shared with the
2.3.15 PE5 / MODA / IPIPE0 — Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODA bit at the rising edge of
instruction queue tracking signalIPIPE0.Thispin is an input with a pull-down device which is only active
RESET is low.
when
RESET. This pin is shared with the
2.3.16 PE4 / ECLK — Port E I/O Pin 4
PE4 is a general purpose input or output pin. It can be configured to drive the internal bus clock ECLK.
ECLK can be used as a timing reference.
2.3.17 PE3 / LSTRB / TAGLO — Port E I/O Pin 3
PE3 is a general purpose input or output pin. In MCU expanded modes of operation, LSTRB can be used
for the low-byte strobe function to indicate the type of bus access and when instruction tagging is on,
TAGLO is used to tag the low half of the instruction word being read into the instruction queue.
2.3.18 PE2 / R/W—Port E I/O Pin 2
PE2 is a general purpose input or output pin. In MCU expanded modes of operations, this pin drives the
read/write output signal for the external bus. It indicates the direction of data on the external bus.
2.3.19 PE1 / IRQ — Port E Input Pin 1
PE1 is a general purpose input pin and the maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.20 PE0 / XIRQ — Port E Input Pin 0
PE0 is a general purpose input pin and the non-maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.21 PH7 / KWH7 — Port H I/O Pin 7
PH7isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
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2.3.22 PH6 / KWH6 — Port H I/O Pin 6
PH6isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.23 PH5 / KWH5 — Port H I/O Pin 5
PH5isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.24 PH4 / KWH4 — Port H I/O Pin 2
PH4isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.25 PH3 / KWH3 — Port H I/O Pin 3
PH3isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.26 PH2 / KWH2 — Port H I/O Pin 2
PH2isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.27 PH1 / KWH1 — Port H I/O Pin 1
PH1isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
2.3.28 PH0 / KWH0 — Port H I/O Pin 0
PH0isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode.
PJ7 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causing theMCU
to exit STOP or WAIT mode. It can be configured as the serial clock pin SCL of the IIC module. It can be
configured as the transmit pin TXCAN of the Motorola Scalable Controller Area Network controller 0
(CAN0).
PJ6 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causing theMCU
to exit STOP or WAIT mode. It can be configured as the serial data pin SDA of the IIC module. It can be
configured as the receive pin RXCAN of the Motorola Scalable Controller Area Network controller 0
(CAN0).
2.3.31 PJ[1:0] / KWJ[1:0] — Port J I/O Pins [1:0]
PJ1 and PJ0 are general purpose input or output pins. They can be configured to generate an interrupt
causing the MCU to exit STOP or WAIT mode.
2.3.32 PK7 / ECS / ROMCTL — Port K I/O Pin 7
PK7 is a general purpose input or output pin. During MCU expanded modes of operation, this pin is used
as the emulation chip select output (
enable the Flash EEPROM memory in the memory map (ROMCTL). At the rising edge of
stateofthis pin islatchedto the ROMONbit. For a completelist of modesreferto 4.2 ChipConfigurationSummary.
ECS). During MCU expanded modes of operation, this pin is used to
RESET, the
2.3.33 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0]
PK5-PK0 are general purpose input or output pins. In MCU expanded modes of operation, these pins
provide the expanded address XADDR[19:14] for the external bus.
2.3.34 PM7 — Port M I/O Pin 7
PM7 is a general purpose input or output pin.
2.3.35 PM6 — Port M I/O Pin 6
PM6 is a general purpose input or output pin.
2.3.36 PM5 / TXCAN0 / SCK0 — Port M I/O Pin 5
PM5 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the serial clock
pin SCK of the Serial Peripheral Interface 0 (SPI0).
2.3.37 PM4 / RXCAN0 / MOSI0 — Port M I/O Pin 4
PM4 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
MotorolaScalableController Area Networkcontroller0 (CAN0). Itcan be configuredasthe master output
(during master mode) or slave input pin (during slave mode) MOSI
(SPI0).
for the Serial Peripheral Interface 0
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MC9S12DJ64 Device User Guide — V01.17
2.3.38 PM3 / TXCAN0 / SS0 — Port M I/O Pin 3
PM3 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the slave select
SS of the Serial Peripheral Interface 0 (SPI0).
pin
2.3.39 PM2 / RXCAN0 / MISO0 — Port M I/O Pin 2
PM2 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured asthemaster input
(during master mode) or slave output pin (during slave mode) MISO
(SPI0).
for the Serial Peripheral Interface 0
2.3.40 PM1 / TXCAN0 / TXB — Port M I/O Pin 1
PM1 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the transmit pin
TXB of the BDLC.
2.3.41 PM0 / RXCAN0 / RXB — Port M I/O Pin 0
PM0 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the receive pin
RXB of the BDLC.
2.3.42 PP7 / KWP7 / PWM7 — Port P I/O Pin 7
PP7 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 7 output.
2.3.43 PP6 / KWP6 / PWM6 — Port P I/O Pin 6
PP6 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 6 output.
2.3.44 PP5 / KWP5 / PWM5 — Port P I/O Pin 5
PP5 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 5 output.
2.3.45 PP4 / KWP4 / PWM4 — Port P I/O Pin 4
PP4 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 4 output.
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MC9S12DJ64 Device User Guide — V01.17
2.3.46 PP3 / KWP3 / PWM3 — Port P I/O Pin 3
PP3 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 3 output.
2.3.47 PP2 / KWP2 / PWM2 — Port P I/O Pin 2
PP2 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 2 output.
2.3.48 PP1 / KWP1 / PWM1 — Port P I/O Pin 1
PP1 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 1 output.
2.3.49 PP0 / KWP0 / PWM0 — Port P I/O Pin 0
PP0 isageneral purpose input or outputpin.It can be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 0 output.
2.3.50 PS7 / SS0 — Port S I/O Pin 7
PS6 is a general purpose input or output pin. It can be configured as the slave select pin SS of the Serial
Peripheral Interface 0 (SPI0).
2.3.51 PS6 / SCK0 — Port S I/O Pin 6
PS6 is a general purpose input or output pin. It can be configured as the serial clock pin SCK of the Serial
Peripheral Interface 0 (SPI0).
2.3.52 PS5 / MOSI0 — Port S I/O Pin 5
PS5 is a general purpose input or output pin. It can be configured as master output (during master mode)
or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.53 PS4 / MISO0 — Port S I/O Pin 4
PS4 is a general purpose input or output pin. It can be configured as master input (during master mode) or
slave output pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.54 PS3 / TXD1 — Port S I/O Pin 3
PS3 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 1 (SCI1).
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MC9S12DJ64 Device User Guide — V01.17
2.3.55 PS2 / RXD1 — Port S I/O Pin 2
PS2 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 1 (SCI1).
2.3.56 PS1 / TXD0 — Port S I/O Pin 1
PS1 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 0 (SCI0).
2.3.57 PS0 / RXD0 — Port S I/O Pin 0
PS0 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 0 (SCI0).
2.3.58 PT[7:0] / IOC[7:0] — Port T I/O Pins [7:0]
PT7-PT0 are general purpose input or output pins. They can be configured as input capture or output
compare pins IOC7-IOC0 of the Enhanced Capture Timer (ECT).
2.4 Power Supply Pins
MC9S12DJ64 power and ground pins are described below.
NOTE:
Mnemonic
VDD1, 213, 652.5V
VSS1, 214, 660V
VDDR415.0V
VSSR400V
VDDX1075.0V
VSSX1060V
VDDA835.0VOperating voltage and ground for the analog-to-digital
VSSA860V
VRL850V
VRH845.0V
All VSS pins must be connected together in the application.
Table 2-2 MC9S12DJ64 Power and Ground Connection Summary
Pin Number
112-pin QFP
Nominal
Voltage
Internal power and ground generated by internal regulator
External power and ground, supply to pin drivers and internal
voltage regulator.
External power and ground, supply to pin drivers.
converters and the reference for the internal voltageregulator,
allows the supply voltage to the A/D to be bypassed
independently.
Reference voltages for the analog-to-digital converter.
Description
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MC9S12DJ64 Device User Guide — V01.17
Mnemonic
Pin Number
112-pin QFP
VDDPLL432.5VProvides operating voltage and ground for the Phased-Locked
VSSPLL450V
VREGEN975.0VInternal Voltage Regulator enable/disable
Nominal
Voltage
Description
Loop. This allows the supply voltage to the PLL to be
bypassed independently. Internal power and ground
generated by internal regulator.
2.4.1 VDDX, VSSX — Power & Ground Pins for I/O Drivers
External power and ground for I/O drivers. Because fast signal transitions place high, short-duration
current demandsonthepower supply, use bypass capacitors withhigh-frequencycharacteristics and place
them as close to the MCU as possible. Bypass requirements depend on how heavily the MCU pins are
loaded.
VDDX and VSSX are the supplies for Ports J, K, M, P, T and S.
2.4.2 VDDR, VSSR — Power & Ground Pins for I/O Drivers & for Internal
Voltage Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Because fast signal
transitions place high, short-duration current demands on the power supply, use bypass capacitors with
high-frequency characteristics and place them as close to the MCU as possible. Bypass requirements
depend on how heavily the MCU pins are loaded.
VDDR and VSSR are the supplies for Ports A, B, E and H.
Power is supplied to the MCU through VDD and VSS. Because fast signal transitions place high,
short-duration current demands on the power supply, use bypass capacitors with high-frequency
characteristics and place them as close to the MCU as possible. This 2.5V supply is derived from the
internal voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is
turned off, if VREGEN is tied to ground.
NOTE:
No load allowed except for bypass capacitors.
2.4.4 VDDA, VSSA — Power Supply Pins for ATD0/ATD1 and VREG
VDDA, VSSA are the power supply and ground input pins for the voltage regulator and the two analog to
digital converters. It also provides the reference for the internal voltage regulator. This allows the supply
voltage to ATD0/ATD1 and the reference voltage to be bypassed independently.
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MC9S12DJ64 Device User Guide — V01.17
2.4.5 VRH, VRL — ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog to digital converter.
2.4.6 VDDPLL, VSSPLL — Power Supply Pins for PLL
Provides operating voltage and ground for the Oscillator and the Phased-Locked Loop. This allows the
supply voltage to the Oscillator and PLL to be bypassed independently.This 2.5V voltage is generated by
the internal voltage regulator.
NOTE:
No load allowed except for bypass capacitors.
2.4.7 VREGEN — On Chip Voltage Regulator Enable
Enables the internal 5V to 2.5V voltage regulator. If this pin is tied low, VDD1,2 and VDDPLL must be
supplied externally.
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MC9S12DJ64 Device User Guide — V01.17
Section 3 System Clock Description
3.1 Overview
The Clock and Reset Generator provides the internal clock signals for the HCS12 Core and all peripheral
modules. Figure 3-1 shows the clock connections from the CRG to all modules.
Consult the CRG Block User Guide and OSC Block User Guide for details on clock generation.
HCS12 CORE
BDM
CPU
Core Clock
MEBIMMC
INTBKP
Flash
RAM
EXTAL
XTAL
OSC
CRG
Bus Clock
Oscillator Clock
Figure 3-1 Clock Connections
EEPROM
ECT
ATD0, 1
PWM
SCI0, SCI1
SPI0
CAN0
IIC
BDLC
PIM
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Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12DJ64. Each mode has an
associated default memory map and external bus configuration.
Three low power modes exist for the device.
4.2 Chip Configuration Summary
The operatingmode out of resetisdetermined by the statesof the MODC, MODB,andMODA pins during
reset (Table4-1).TheMODC,MODB, and MODA bits intheMODE register show the currentoperating
modeandprovide limited modeswitchingduring operation. Thestates of theMODC,MODB, and MODA
pinsarelatched into thesebitson the risingedge of theresetsignal. The ROMCTLsignalallows the setting
of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the
memory map. ROMON = 1 mean the Flash is visible in the memory map. The state of the ROMCTL pin
is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
Table 4-1 Mode Selection
BKGD =
MODC
000X1
001
010X0Special Test (Expanded Wide), BDM allowed
011
100X1Normal Single Chip, BDM allowed
101
110X1
111
PE6 =
MODB
PE5 =
MODA
PK7 =
ROMCTL
01
10
01
10
00
11
00
11
ROMON
Bit
Mode Description
Special Single Chip, BDM allowed and ACTIVE. BDM is
allowed in all other modes but a serial command is
required to make BDM active.
Emulation Expanded Narrow, BDM allowed
Emulation Expanded Wide, BDM allowed
Normal Expanded Narrow, BDM allowed
Peripheral; BDM allowed but bus operations would cause
bus conflicts (must not be used)
Normal Expanded Wide, BDM allowed
For further explanation on the modes refer to the HCS12 Multiplexed External Bus Interface Block Guide.
Table 4-2 Clock Selection Based on PE7
PE7 = XCLKSDescription
1Colpitts Oscillator selected
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MC9S12DJ64 Device User Guide — V01.17
Table 4-2 Clock Selection Based on PE7
PE7 = XCLKSDescription
0Pierce Oscillator/external clock selected
Table 4-3 Voltage Regulator VREGEN
VREGENDescription
1Internal Voltage Regulator enabled
0
Internal Voltage Regulator disabled, VDD1,2 and
VDDPLL must be supplied externally with 2.5V
4.3 Security
The device will make available a security feature preventing the unauthorized read and write of the
memory contents. This feature allows:
•Protection of the contents of FLASH,
•Protection of the contents of EEPROM,
•Operation in single-chip mode,
•Operation from external memory with internal FLASH and EEPROM disabled.
The user must be reminded that part of the security must lie with the user’s code. An extreme example
would be user’s code that dumps the contents of theinternalprogram. This code would defeat the purpose
of security. At the same time the user may also wish to put a back door in the user’s program. An example
of this is the user downloads a key through the SCI which allows access to a programming routine that
updates parameters stored in EEPROM.
4.3.1 Securing the Microcontroller
Once the user has programmed the FLASH and EEPROM (if desired), the part can be secured by
programming the security bits located in the FLASH module. These non-volatile bits will keep the part
secured through resetting the part and through powering down the part.
The security byte resides in a portion of the Flash array.
Check the Flash Block User Guide for more details on the security configuration.
4.3.2 Operation of the Secured Microcontroller
4.3.2.1 Normal Single Chip Mode
This will bethemostcommon usage of the secured part. Everything will appear thesameasif the part was
not secured with the exception of BDM operation. The BDM operation will be blocked.
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4.3.2.2 Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH and EEPROM will be disabled. BDM
operations will be blocked.
4.3.3 Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH and EEPROM must be erased. This can be
done through an external program in expanded mode or via a sequence of BDM commands. Unsecuring
is also possible via the Backdoor Key Access. Refer to Flash Block Guide for details.
Once the user has erased the FLASH and EEPROM, the part can be reset into special single chip mode.
This invokes a program that verifies the erasure of the internal FLASH and EEPROM. Once this program
completes,theuser can eraseandprogram the FLASHsecurity bits totheunsecured state. Thisisgenerally
done through the BDM, but the user could also change to expanded mode (by writing the mode bits
through the BDM) and jumping to an external program (again through BDM commands). Note that if the
part goes through a reset before the security bits are reprogrammed to the unsecure state, the part will be
secured again.
4.4 Low Power Modes
The microcontroller features three main low power modes. Consult the respective Block User Guide for
information on the module behavior in Stop, Pseudo Stop, and Wait Mode. An important source of
information about the clock system is the Clock and Reset Generator User Guide (CRG).
4.4.1 Stop
Executing the CPU STOP instruction stops all clocks andthe oscillator thus putting the chip in fully static
mode. Wake up from this mode can be done via reset or external interrupts.
4.4.2 Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running
and the Real Time Interrupt (RTI) or Watchdog (COP) sub module can stay active. Other peripherals are
turned off. This mode consumes more current than the full STOP mode, but the wake up time from this
mode is significantly shorter.
4.4.3 Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute
instructions. The internal CPU signals (address and data bus) will be fully static. All peripherals stay
active. For further power consumption the peripherals can individually turn off their local clocks.
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MC9S12DJ64 Device User Guide — V01.17
4.4.4 Run
Although this is not a low power mode, unused peripheral modules should not be enabled in order to save
power.
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Section 5 Resets and Interrupts
5.1 Overview
Consult the Exception Processing section of the CPU12 Reference Manual for information on resets and
interrupts.
5.2 Vectors
5.2.1 Vector Table
Table 5-1 lists interrupt sources and vectors in default order of priority.
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the
respective module Block User Guides for register reset states.
5.3.1 I/O pins
Refer to the HCS12 Multiplexed External Bus Interface (MEBI) Block Guide for mode dependent pin
configuration of port A, B, E and K out of reset.
Refer to the PIM Block User Guide for reset configurations of all peripheral module ports.
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MC9S12DJ64 Device User Guide — V01.17
NOTE:
For devices assembled in 80-pin QFP packages all non-bonded out pins should be
configured as outputs after reset in order to avoid current drawn from floating
inputs. Refer to
Table 2-1
for affected pins.
5.3.2 Memory
Refer to Table 1-1 for locations of the memories depending on the operating mode after reset.
The RAM array is not automatically initialized out of reset.
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Section 6 HCS12 Core Block Description
6.1 CPU12 Block Description
Consult the CPU12 Reference Manual for information on the CPU.
6.1.1 Device-specific information
When the CPU12 Reference Manual refers to cycles this is equivalent to Bus Clock periods.
So 1 cycle is equivalent to 1 Bus Clock period.
6.2 HCS12 Module Mapping Control (MMC) Block Description
Consult the MMC Block Guide for information on the HCS12 Module Mapping Control module.
6.2.1 Device-specific information
•INITEE
–Reset state: $01
–Bits EE11-EE15 are "Write once in Normal and Emulation modes and write anytime in Special
modes".
•PPAGE
–Reset state: $00
–Register is "Write anytime in all modes"
•MEMSIZ0
–Reset state: $11
•MEMSIZ1
–Reset state: $80
6.3 HCS12 Multiplexed External Bus Interface (MEBI) Block
Description
Consult the MEBI Block Guide for information on HCS12 Multiplexed External Bus Interface module.
6.3.1 Device-specific information
•PUCR
–Reset state: $90
75
MC9S12DJ64 Device User Guide — V01.17
6.4 HCS12 Interrupt (INT) Block Description
Consult the INT Block Guide for information on the HCS12 Interrupt module.
Consult the ECT_16B8C Block User Guide for information about the Enhanced Capture Timer module.
When the ECT_16B8C Block User Guide refers to freeze mode this is equivalent to active BDM mode.
76
MC9S12DJ64 Device User Guide — V01.17
Section 10 Analog to Digital Converter (ATD) Block
Description
There are two Analog to Digital Converters (ATD1 and ATD0) implemented on the MC9S12DJ64.
Consult the ATD_10B8C Block User Guide for information about each Analog to Digital Converter
module. When the ATD_10B8C Block User Guide refers to freeze mode this is equivalent to active BDMmode.
Section 11 Inter-IC Bus (IIC) Block Description
Consult the IIC Block User Guide for information about the Inter-IC Bus module.
Section 12 Serial Communications Interface (SCI) Block
Description
There are two Serial Communications Interfaces (SCI1 and SCI0) implemented on the MC9S12DJ64
device. Consult the SCI Block User Guide for information about each Serial Communications Interface
module.
Section 13 Serial Peripheral Interface (SPI) Block
Description
Consult the SPI Block User Guide for information about each Serial Peripheral Interface module.
Section 14 J1850 (BDLC) Block Description
Consult the BDLC Block User Guide for information about the J1850 module.
Consult the PWM_8B8C Block User Guide for information about the Pulse Width Modulator module.
When the PWM_8B8C Block User Guide refers to freeze mode this is equivalent to active BDM mode.
Section 16 Flash EEPROM 64K Block Description
77
MC9S12DJ64 Device User Guide — V01.17
Consult the FTS64K Block User Guide for information about the flash module.
The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into
the flash memory of this device during manufacture. This LRAE program will provide greater
programming flexibility to the end users by allowing the device to be programmed directly using CAN or
SCI after it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and,
if not required, it must simply be erased prior to flash programming. For more details of the S12 LRAE
and its implementation, please see the S12 LREA Application Note (AN2546/D).
It isplanned that most HC9S12devicesmanufactured after Q1 of2004 will be shippedwiththe S12 LRAE
programmed in the Flash . Exact details of the changeover (ieblank to programmed) for each product will
be communicated in advance via GPCN and will be traceable by the customer via datecode marking on
the device.
Please contact Motorola SPS Sales if you have any additional questions.
Section 17 EEPROM 1K Block Description
Consult the EETS1K Block User Guide for information about the EEPROM module.
Section 18 RAM Block Description
This module supports single-cycle misaligned word accesses.
Section 19 MSCAN Block Description
Consult the MSCAN Block User Guide for information about the Motorola Scalable CAN Module.
Section 20 Port Integration Module (PIM) Block Description
Consult the PIM_9DJ64 Block User Guide for information about the Port Integration Module.
Section 21 Voltage Regulator (VREG) Block Description
Consult the VREG Block User Guide for information about the dual output linear voltage regulator.
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the
MCU itself. The following rules must be observed:
•Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins(C1 - C6).
•Central point of the ground star should be the VSSR pin.
•Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
•VSSPLL must be directly connected to VSSR.
•Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7,
C8, C11 and Q1 as small as possible.
•Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the
connection area to the MCU.
•Central power input should be fed in at the VDDA/VSSA pins.
Figure 22-2 Recommended PCB Layout for 80QFP Colpitts Oscillator
VDDX
C6
VSSX
VDD1
C1
VSS1
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
C4
C9
R1
C5
C10
C8
C11
VSSPLL
VDDPLL
C7
Q1
81
MC9S12DJ64 Device User Guide — V01.17
Figure 22-3 Recommended PCB Layout for 112LQFP Pierce Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
VDDPLL
C4
C9
R1
C5
C10
C8
R2
Q1
R3
VSSPLL
C7
82
MC9S12DJ64 Device User Guide — V01.17
Figure 22-4 Recommended PCB Layout for 80QFP Pierce Oscillator
VDDX
C6
VSSX
VDD1
C1
VSS1
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
C4
C9
R1
C5
C10
R2
Q1
C8
VSSPLL
VDDPLL
VSSPLL
R3
C7
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MC9S12DJ64 Device User Guide — V01.17
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MC9S12DJ64 Device User Guide — V01.17
Appendix A Electrical Characteristics
A.1 General
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
A.1.1 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
NOTE:
P:
Those parameters are guaranteed during production testing on each individual device.
C:
Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations.
T:
Those parameters are achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted. All values shown in the typical column are within
this category.
D:
Those parameters are derived mainly from simulations.
This classification is shown in the column labeled “C” in the parameter tables
where appropriate.
A.1.2 Power Supply
The MC9S12DJ64 utilizes several pins to supply power to the I/O ports, A/D converter, oscillator, PLL
and internal logic.
The VDDA, VSSA pairsuppliestheA/D converter and the resistor ladder of the internal voltage regulator.
The VDDX, VSSX, VDDR and VSSR pairs supply the I/O pins, VDDR supplies also the internal voltage
regulator.
VDD1, VSS1, VDD2 and VSS2 are the supply pins for the digital logic, VDDPLL, VSSPLL supply the
oscillator and the PLL.
VSS1 and VSS2 are internally connected by metal.
85
MC9S12DJ64 Device User Guide — V01.17
VDDA, VDDX, VDDR as well as VSSA, VSSX, VSSR are connected by anti-parallel diodes for ESD
protection.
NOTE:
In the following context VDD5 is used for either VDDA, VDDR and VDDX; VSS5
is used for either VSSA, VSSR and VSSX unless otherwise noted.
IDD5 denotes the sum of the currents flowing into the VDDA, VDDX and VDDR
pins.
VDD is used for VDD1, VDD2 and VDDPLL, VSS is used for VSS1, VSS2 and
VSSPLL.
IDD is used for the sum of the currents flowing into VDD1 and VDD2.
A.1.3 Pins
There are four groups of functional pins.
A.1.3.1 5V I/O pins
Those I/O pins have a nominal level of 5V. This class of pins is comprised of all port I/O pins, the analog
inputs, BKGD and the RESET pins.The internal structure of all those pins is identical, however some of
the functionality may be disabled. E.g. for the analog inputs the output drivers, pull-up and pull-down
resistors are disabled permanently.
A.1.3.2 Analog Reference
This group is made up by the VRH and VRL pins.
A.1.3.3 Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied
by VDDPLL.
A.1.3.4 TEST
This pin is used for production testing only.
A.1.3.5 VREGEN
This pin is used to enable the on chip voltage regulator.
A.1.4 Current Injection
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
injection current may flowoutofVDD5and could result in external power supply going out of regulation.
Ensure external VDD5 load will shunt current greater than maximum injection current. This will be the
greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is
very low which would reduce overall power consumption.
or VDD range during instantaneous and
DD5
in
>V
) is greater than I
DD5
DD5
, the
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MC9S12DJ64 Device User Guide — V01.17
A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
SS5
or V
DD5
).
Table A-1 Absolute Maximum Ratings
1
NumRatingSymbolMinMaxUnit
1I/O, Regulator and Analog Supply Voltage
2
Digital Logic Supply Voltage
3
PLL Supply Voltage
2
2
4Voltage difference VDDX to VDDR and VDDA
5Voltage difference VSSX to VSSR and VSSA
6Digital I/O Input Voltage
7Analog Reference
8XFC, EXTAL, XTAL inputs
9TEST input
Instantaneous Maximum Current
10
Single pin limit for all digital I/O pins
Instantaneous Maximum Current
11
Single pin limit for XFC, EXTAL, XTAL
Instantaneous Maximum Current
12
Single pin limit for TEST
5
3
4
13Storage Temperature Range
NOTES:
1. Beyond absolute maximum ratings device might be damaged.
2. The device contains an internal voltage regulator to generatethe logic and PLL supply out of the I/O supply.
The absolute maximum ratings apply when the device is powered from an external source.
3. All digital I/O pins are internally clamped to V
4. Those pins are internally clamped to V
5. This pin is clamped low to V
SSR
SSPLL
, but not clamped high. This pin must be tied low in applications.
and V
SSX
and V
DDX
DDPLL
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
V
IN
V
RH,VRL
V
ILV
V
TEST
I
D
I
DL
I
DT
T
stg
, V
and V
SSR
.
-0.36.0V
-0.33.0V
-0.33.0V
-0.30.3V
-0.30.3V
-0.36.0V
-0.36.0V
-0.33.0V
-0.310.0V
-25+25mA
-25+25mA
-0.250mA
– 65155°C
DDR
or V
SSA
and V
DDA
.
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MC9S12DJ64 Device User Guide — V01.17
A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM), the Machine Model (MM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-2 ESD and Latch-up Test Conditions
ModelDescriptionSymbolValueUnit
Series ResistanceR11500Ohm
Storage CapacitanceC100pF
Human Body
Number of Pulse per pin
positive
negative
Series ResistanceR10Ohm
-
1
1
Storage CapacitanceC200pF
Machine
Latch-up
Number of Pulse per pin
positive
negative
Minimum input voltage limit-2.5V
Maximum input voltage limit7.5V
-
3
3
Table A-3 ESD and Latch-Up Protection Characteristics
Num CRatingSymbolMinMaxUnit
1T Human Body Model (HBM)
2T Machine Model (MM)
3T Charge Device Model (CDM)
Latch-up Current at TA = 125°C
4T
5T
positive
negative
Latch-up Current at T
positive
negative
= 27°C
A
V
V
V
HBM
MM
CDM
I
LAT
I
LAT
2000-V
200-V
500-V
+100
-100
+200
-200
-mA
-mA
A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
88
MC9S12DJ64 Device User Guide — V01.17
NOTE:
Please refer to the temperature rating of the device (C, V, M) with regards to the
ambient temperature T
and the junction temperature TJ. For power dissipation
A
calculations refer to Section A.1.8 Power Dissipation and ThermalCharacteristics.
Table A-4 Operating Conditions
RatingSymbolMinTypMaxUnit
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
MC9S12DJ64C
Operating Ambient Temperature Range
MC9S12DJ64V
1
Operating Junction Temperature Range
1
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
f
osc
f
bus
T
J
3
T
A
4.555.25V
2.352.52.75V
2.352.52.75V
-0.100.1V
-0.100.1V
0.5-16MHz
2
0.25
-40-100°C
-402785°C
-25MHz
Operating Junction Temperature Range
Operating Ambient Temperature Range
MC9S12DJ64M
Operating Junction Temperature Range
Operating Ambient Temperature Range
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
given operating rangeapplies when this regulator isdisabled and the device ispowered from an external source.
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
3. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the relation between ambient temperature T
and device junction temperature TJ.
A
T
J
3
T
A
T
J
3
T
A
-40-120°C
-4027105°C
-40-140°C
-4027125°C
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T
T
J
A
P
D
ΘJA•()+=
)in°C can be
J
T
Junction Temperature, [°C]=
J
89
MC9S12DJ64 Device User Guide — V01.17
T
P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Ambient Temperature, [°C]=
A
Total Chip Power Dissipation, [W]=
D
JA
INT
1.Internal Voltage Regulator disabled
Package Thermal Resistance, [°C/W]=
Chip Internal Power Dissipation, [W]=
P
INT
I
⋅I
DDVDD
P
P
IO
P
D
INT
DDPLLVDDPLL
R
∑
DSON
i
PIO+=
⋅I
⋅=
+V
2
I
IO
i
DDA
⋅+=
DDA
P
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
IO
For R
respectively
2.Internal voltage regulator enabled
is the current shown in Table A-7 and not the overall current flowing into VDDR, which
I
DDR
additionally contains the current flowing into the external loads with output high.
PIO is the sum of all output currents on I/O ports associated with VDDX and VDDR.
DSON
is valid:
R
DSON
R
DSON
P
INT
V
OL
------------ for outputs driven low;=
I
OL
P
V
------------------------------------ for outputs driven high;=
3T Junction to Board LQFP112
4T Junction to Case LQFP112
5T Junction to Package Top LQFP112
6T Thermal Resistance QFP 80, single sided PCB
7T
Thermal Resistance QFP 80, doublesided PCB with
2 internal planes
8T Junction to Board QFP80
9T Junction to Case QFP80
10T Junction to Package Top QFP80
2
θ
JA
θ
JA
θ
JB
θ
JC
Ψ
JT
θ
JA
θ
JA
θ
JB
θ
JC
Ψ
JT
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
––54
––41
––31
––11
––2
––51
––41
––27
––14
––3
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
91
MC9S12DJ64 Device User Guide — V01.17
Table A-6 5V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P Input High Voltage
2P Input Low Voltage
3C Input Hysteresis
Input Leakage Current (pins in high impedance input
4P
mode)
V
= V
in
DD5
or V
SS5
Output High Voltage (pins in output mode)
5P
Partial Drive IOH= –2mA
Full Drive IOH= –10mA
Output Low Voltage (pins in output mode)
6P
Partial Drive IOL= +2mA
Full Drive IOL= +10mA
7P
8C
9P
10C
Internal Pull Up Device Current,
tested at V
Max.
IL
Internal Pull Up Device Current,
tested at V
IH
Min.
Internal Pull Down Device Current,
tested at V
IH
Min.
Internal Pull Down Device Current,
tested at V
Max.
IL
11D Input Capacitance
1
12T
Injection current
Single Pin limit
Total Device Limit. Sum of all injected currents
13P
14P
Port H, J, P Interrupt Input Pulse filtered
Port H, J, P Interrupt Input Pulse passed
2
2
NOTES:
1. Refer to Section A.1.4 Current Injection, for more details
2. Parameter only applies in STOP or Pseudo STOP mode.
V
V
V
V
V
I
I
PUH
I
PDH
I
C
I
I
t
t
IH
IL
HYS
I
in
OH
OL
PUL
PDL
in
ICS
ICP
pign
pval
0.65*V
V
SS5
DD5
- 0.3
-
-
V
DD5
0.35*V
+ 0.3
DD5
250mV
–1-1µA
V
DD5
– 0.8
--V
--0.8V
-- –130µA
-10--µA
--130µA
10--µA
6-pF
-2.5
-25
-2.5
25
3µs
10µs
V
V
mA
A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
92
MC9S12DJ64 Device User Guide — V01.17
A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single
chip mode, internal voltage regulator enabled and at 25MHz bus frequency using a 4MHz oscillator in
Colpitts mode. Production testing is performed using a square wave signal at the EXTAL input.
A.1.10.2 Additional Remarks
In expanded modesthecurrents flowing in the system are highly dependentonthe load at the address, data
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be
given. A very good estimate is to take the single chip currents and add the currents due to the external
loads.
Table A-7 Supply Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P
2P
3
4
5
Run supply currents
Wait Supply current
P
Pseudo Stop Current (RTI and COP disabled)
C
P
C
C
P
C
P
C
P
Pseudo Stop Current (RTI and COP enabled)
C
C
C
C
C
C
C
Stop Current
C
P
C
C
P
C
P
C
P
Single Chip, Internal regulator enabled
All modules enabled, PLL on
only RTI enabled
1, 2
-40°C
27°C
70°C
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
1, 2
-40°C
27°C
70°C
85°C
105°C
125°C
140°C
2
-40°C
27°C
70°C
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
I
DD5
I
DDW
1
370
400
450
I
DDPS
I
DDPS
I
DDS
550
600
650
800
850
1200
570
600
650
750
850
1200
1500
12
25
100
130
160
200
350
400
600
50
30
5
500
1600
2100
5000
100
1200
1700
5000
mA
mA
µA
µA
µA
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MC9S12DJ64 Device User Guide — V01.17
NOTES:
1. PLL off
2. At those low power dissipation levels T
= TA can be assumed
J
94
MC9S12DJ64 Device User Guide — V01.17
A.2 ATD Characteristics
This section describes the characteristics of the analog to digital converter.
A.2.1 ATD Operating Characteristics
The Table A-8 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results:
V
≤ VRL≤ VIN≤ VRH≤ V
SSA
beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively
be clipped.
Table A-8 ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
Reference Potential
1D
2C
3D ATD Clock Frequency
4D
5D
6D
7P Reference Supply current 2 ATD blocks on
8P Reference Supply current 1 ATD block on
NOTES:
1. Full accuracy is not guaranteed when differential voltage is less than 4.50V
2. The minimumtime assumes a final sample periodof 2 ATD clocks cycles whilethe maximum time assumes a finalsample
Differential Reference Voltage
ATD 10-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
ATD 8-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
Recovery Time (V
period of 16 ATD clocks.
=5.0 Volts)
DDA
. This constraint exists since the sample buffer amplifier can not drive
DDA
Low
High
1
Clock Cycles
ATDCLK
Clock Cycles
ATDCLK
2
2
V
RL
V
RH
VRH-V
f
ATDCLK
N
CONV10
T
CONV10
N
CONV8
T
CONV8
t
REC
I
REF
I
REF
RL
V
V
DDA
SSA
/2
V
DDA
V
DDA
/2
4.505.005.25V
0.52.0MHz
14
7
12
6
28
14
26
13
20µs
0.750mA
0.375mA
V
V
Cycles
µs
Cycles
µs
A.2.2 Factors influencing accuracy
Three factors - source resistance, source capacitance and current injection - have an influence on the
accuracy of the ATD.
A.2.2.1 Source Resistance:
Due to the input pin leakage current as specified in Table A-6 in conjunction with the source resistance
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
S
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MC9S12DJ64 Device User Guide — V01.17
specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or
operatingconditionsare less thanworstcase or leakage-inducederror is acceptable,largervalues of source
resistance is allowed.
A.2.2.2 Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, C
≥ 1024 * (C
f
INS
- C
INN
).
A.2.2.3 Current Injection
There are two cases to consider.
1.A current is injected into the channel being converted. The channel being stressed has conversion
values of$3FF($FF in 8-bit mode) for analoginputsgreater than V
unless the current is higher than specified as disruptive condition.
V
RL
and $000forvalues less than
RH
2.Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as V
I
INJ
, with I
being the sum of the currents injected into the two pins adjacent to the converted
INJ
=K*RS*
ERR
channel.
Table A-9 ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1C Max input Source Resistance
Total Input Capacitance
2T
3C Disruptive Analog Input Current
4C Coupling Ratio positive current injection
5C Coupling Ratio negative current injection
Non Sampling
Sampling
R
S
C
INN
C
INS
I
NA
K
p
K
n
--1KΩ
10
22
-2.52.5mA
-4
10
-2
10
pF
A/A
A/A
96
MC9S12DJ64 Device User Guide — V01.17
A.2.3 ATD accuracy
Table A-10 specifies the ATD conversion performance excluding any errors due to current injection,
input capacitance and source resistance.
Table A-10 ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
V
= VRH - VRL = 5.12V. Resulting to one 8 bit count = 20mV and one 10 bit count = 5mV
shows only definitions, for specification values refer to
Table A-10
2
8-Bit Resolution
1
Vin
mV
.
98
A.3 NVM, Flash and EEPROM
MC9S12DJ64 Device User Guide — V01.17
NOTE:
Unless otherwise noted the abbreviation NVM (Non Volatile Memory) is used for
both Flash and EEPROM.
A.3.1 NVM timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency f
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
The Flash and EEPROM program and erase operations are timed using a clock derived fromtheoscillator
using the FCLKDIV and ECLKDIV registers respectively. Thefrequency of this clock must be set within
the limits specified as f
The minimum program and erase times shown in Table A-11 are calculated for maximum f
maximum f
A.3.1.1 Single Word Programming
. The maximum times are calculated for minimum f
bus
NVMOSC
NVMOP
is required for performing program or erase operations. The NVM modules
.
and
NVMOP
and a f
of 2MHz.
bus
NVMOP
The programming time for single word programming is dependant on the bus frequency as a well as on
the frequency f
A.3.1.2 Row Programming
This applies onlytothe Flash where up to 32 wordsinarow can be programmed consecutively by keeping
the command pipeline filled. The time to program a consecutive word can be calculated as:
The time to program a whole row is:
Row programming is more than 2 times faster than single word programming.
A.3.1.3 Sector Erase
NVMOP
and can be calculated according to the following formula.
t
swpgm
t
bwpgm
t
brpgm
9
⋅25
--------------------f
NVMOP
1
4
⋅9
--------------------f
NVMOP
1
t
swpgm
31 t
⋅+=
1
⋅+=
---------f
bus
1
⋅+=
---------f
bus
bwpgm
Erasing a 512 byte Flash sector or a 4 byte EEPROM sector takes:
99
MC9S12DJ64 Device User Guide — V01.17
t
era
The setup time can be ignored for this operation.
A.3.1.4 Mass Erase
Erasing a NVM block takes:
4000
⋅≈
--------------------f
NVMOP
1
1
t
mass
The setup time can be ignored for this operation.
A.3.1.5 Blank Check
The time it takes to perform a blank check on the Flash or EEPROM is dependant on the location of the
first non-blank word starting at relative address zero. Ittakes one bus cycle per word to verify plus a setup
of the command.
t
check
Table A-11 NVM Timing Characteristics
20000
location t
⋅≈
--------------------f
NVMOP
cyc
10 t
⋅+⋅≈
cyc
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1D External Oscillator Clock
2D Bus frequency for Programming or Erase Operations
3D Operating Frequency
4P Single Word Programming Time
5D
6D
7P Sector Erase Time
8P Mass Erase Time
9D Blank Check Time Flash per block
10D Blank Check Time EEPROM per block
NOTES:
1. Restrictions for oscillator in crystal mode apply!