The 33999 is a 16-output low-side switch with a 24-bit serial input
control. It is designed for a variety of applications including inductive,
incandescent, and LED loads. The Serial Peripheral Interface (SPI)
provides both input control and diagnostic readout. Eight parallel inputs
are also provided for direct Pulse Width Modulation (PWM) control of
eight dedicated outputs. Additionally, an output-programmable PWM
input provides PWM of any combination of outputs. A dedicated reset
input provides the ability to clear all internal registers and turn all
outputs off.
The 33999 directly interfaces with microcontrollers and is
compatible with both 3.3
in effect, serves as a bus expander and buffer with fault management
features that reduces the MCU’s fault management burden.
Features
• Designed to Operate 5.0 V < V
• 24-Bit SPI for Control and Fault reporting, 3.3 V/5.0 V Compatible
• Outputs Are Current Limited (0.9 A to 2.5 A) to Drive
Incandescent Lamps
• Output Voltage Clamp of +50 V During Inductive Switching
• On/Off Control of Open Load Detect Current (LED Application)
•V
•R
Standby Current < 10 µA
PWR
of 0.55 Ω at 25°C Typical
DS(ON)
• Independent Overtemperature Protection
• Output Selectable for PWM Control
• Output ON Short-to-V
• 54-Pin Exposed Pad Package for Thermal Performance
• Pb-Free Packaging Designated by Suffix Code EK
V and 5.0 V CMOS logic levels. The 33999,
< 27 V
PWR
and OFF Short-to-Ground /Open Detection
BAT
3.3 V/5.0 V
33999
33999
POWER DUAL OCTAL SERIAL SWITCH WITH
SERIAL PERIPHERAL INTERFACE I/O
EK SUFFIX (PB-FREE)
98ASA10506D
Temperature
Range (T
-40°C to 125°C54 SOICW-EP
V
BAT
)
A
Package
ORDERING INFORMATION
Device
MC33999EK/R2
MCZ33999EK/R2
V
PWR
54-PIN SOICW EXPOSED PAD
VDD
MCU
SCLK
CS
MISO
MOSI
PWM
RST
SOPWR
SCLK
CS
SI
SO
PWM
RST
PWM0
PWM1
PWM6
PWM7
PWM8
PWM9
PWM14
PWM15
Figure 1. 33999 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
Parallel PWM control Input pins. Allows direct PWM control of
eight outputs.
Low-side driver outputs.
Power supply pin to the SO output driver.
Battery supply input pin.
These pins have no connection.
Ground for logic, analog, and power output devices.
System Clock for internal shift registers of the 33999.
SPI control chip select input pin from MCU to 33999.
Serial data input pin to the 33999.
Serial data output pin.
Active low reset input pin.
PWM control input pin. Supports PWM on any combination of
outputs.
33999
Analog Integrated Circuit Device Data
Freescale Semiconductor3
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
RatingsSymbolValueUnit
ELECTRICAL RATINGS
VPWR Supply Voltage
SPI Interface Logic Supply Voltage
SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST, PWMn)
Output Drain Voltage
Frequency of SPI Operation
Output Clamp Energy
ESD Voltage
(4)
Human Body Model
Machine Model
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
Storage Temperature
Power Dissipation (TA = 25°C)
Peak Package Reflow Temperature During Reflow
Thermal Resistance
Junction-to-Ambient
Junction- to-Lead
Junction-to-Flag
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. This parameter is guaranteed by design but not production tested.
3. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.
4. ESD data is available upon request. ESD testing is performed in accordance with the Human Body Model (C
Ω) and the Machine Model (C
5. Maximum power dissipation with no heat sink used.
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
8. Tested per JEDEC test JESD52-2 (single-layer PWB).
9. Tested per JEDEC test JESD51-8 (two-layer PWB).
(1)
(1)
(1)
(2)
(3)
(5)
(6), (7)
V
SO
V
V
f
E
CLAMP
V
ESD1
V
ESD2
T
T
PPRT
PWR
PWR
IN
DS
SPI
T
A
T
J
T
C
STG
P
D
-1.5 to 50V
-0.3 to 7.0V
-0.3 to 7.0V
-0.3 to 45
6.0
MHz
50mJ
±2000
±200
-40 to 125
-40 to 150
-40 to 125
-55 to 150°C
1.7 W
Note 7
°C/W
(8)
(9)
= 200 pF, R
ZAP
ZAP
= 0 Ω).
R
JA
θ
R
JL
θ
R
JC
θ
75
8.0
1.2
= 100 pF, R
ZAP
ZAP
V
V
°C
°C
= 1500
33999
Analog Integrated Circuit Device Data
4Freescale Semiconductor
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 3.1 V ≤ SO
noted. Typical values noted reflect the approximate parameter means at V
unless otherwise noted.
CharacteristicSymbolMinTypMaxUnit
POWER INPUT
Supply Voltage Range
Fully Operational
Supply Current
All Outputs ON, I
Sleep State Supply Current at RST≤ 0.2 SO
Overvoltage Shutdown
Overvoltage Shutdown Hysteresis
VPWR Undervoltage Shutdown
SPI Interface Logic Supply Voltage
SPI Interface Logic Supply Current (RST Pin High)
SPI Interface Logic Supply Current (RST Pin Low)
SPI Interface Logic Supply Undervoltage Lockout Threshold
10. Output Fault Detect Thresholds with outputs programmed OFF. Output Fault Detect Thresholds are the same for output open and shorts.
11. Output OFF Open Load Detect Current is the current required to flow through the load for the purpose of detecting the existence of an
open load condition when the specific output is commanded to be OFF.
12. This parameter is guaranteed by design but is not production tested.
33999
Analog Integrated Circuit Device Data
Freescale Semiconductor5
noted. Typical values noted reflect the approximate parameter means at V
≤ 5.5 V, 5.0 V ≤ V
PWR
≤ 18 V, -40°C ≤ TC ≤ 125°C unless otherwise
PWR
= 13 V, TA = 25°C under nominal conditions
PWR
unless otherwise noted.
CharacteristicSymbolMinTypMaxUnit
DIGITAL INTERFACE
Input Logic Voltage Thresholds
Input Logic Voltage Thresholds for RST
SI Pulldown Current
SI = 5.0 V
CS Pullup Current
CS = 0 V
SCLK Pulldown Current
SCLK = 5.0 V
RST Pulldown Current
RST = 5.0 V
PWM and PWMn Pulldown Current
SO High-State Output Voltage
I
= -1.6 mA
SO-high
SO Low-State Output Voltage
I
= 1.6 mA
SO-
low
Input Capacitance on SCLK, SI, Tri-State SO, RST
Notes
13. Upper and lower logic threshold voltage levels apply to SI, CS, SCLK, PWM, and PWMn.
14. This parameter is guaranteed by design but is not production tested.
(13)
(14)
V
INLOGIC
V
INRST
I
I
I
SCLK
I
RST
I
PWM
V
SOH
V
C
SI
CS
SOL
IN
0.8–2.2V
0.8–2.2V
2.01030
-30-10-2.0
2.01030
5.02550
2.01030µA
SO
-
SO
PWR
0.4
PWR
0.2
-
–V
––0.4
––20pF
µA
µA
µA
µA
V
33999
Analog Integrated Circuit Device Data
6Freescale Semiconductor
DYNAMIC ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 3.1 V ≤ SO
noted. Typical values noted reflect the approximate parameter means at V
unless otherwise noted.
CharacteristicSymbolMinTypMaxUnit
POWER OUTPUT TIMING
Output Slew Rate
RL = 60 Ω
Output Turn ON Delay Time
Output Turn OFF Delay Time
Output ON Short Fault Disable Report Delay
Output OFF Open Fault Delay Time
Output PWM Frequency
DIGITAL INTERFACE TIMING
Required Low State Duration on V
V
PWR
Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)
Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)
SI to Falling Edge of SCLK (Required Setup Time)
Falling Edge of SCLK to SI (Required Setup Time)
SI, CS, SCLK Signal Rise Time
SI, CS, SCLK Signal Fall Time
Time from Falling Edge of CS to SO Low Impedance
Time from Rising Edge of CS to SO High Impedance
Time from Rising Edge of SCLK to SO Data Valid
Notes
15. Output slew rate measured across a 60 Ω resistive load.
16. Output turn ON and OFF delay time measured from 50% rising edge of CS to 80% and 20% of initial voltage.
17. Duration of fault before fault bit is set. Duration between access times must be greater than 450 µs to read faults.
18. This parameter is guaranteed by design but is not production tested.
19. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
20. Time required for valid output status data to be available on SO pin.
21. Time required for output status data to be terminated at SO pin.
22. Time required to obtain valid data out from SO following the rise of SCLK with 200 pF load.
23. This parameter is guaranteed by design. Production test equipment used 4.16 MHz, 5.5 V/3.1 V SPI Interface.
(15)
≤ 0.2 V
(18)
(16)
(16)
(23)
(19)
(19)
(17)
PWR
(17)
for Reset
(20)
(21)
(22)
≤ 5.25 V, 9.0 V ≤ V
PWR
≤ 16 V, -40°C ≤ TC ≤ 125°C unless otherwise
PWR
= 13 V, TA = 25°C under nominal conditions
PWR
SR
1.02.010
T
(ON)
DLY
T
DLY(OFF
T
DLY(SHORT)
T
(
DLY
OPEN
T
FREQ
T
RST
1.02.010µs
1.04.010µs
)
100–450µs
100–450µs
)
––2.0kHz
––10
T
T SI
T SI
T R
T SO
T SO
T
LEAD
T
LAG
(SU)
(
HOLD
(SI)
T F
(SI)
(EN)
(
VALID
DIS
100––ns
50––ns
16––ns
20––ns
)
–5.0–ns
–5.0–ns
––50ns
)
––50ns
–2580ns
V/µs
µs
33999
Analog Integrated Circuit Device Data
Freescale Semiconductor7
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