Freescale 33976 Technical Data

Freescale Semiconductor
Advance Information
Dual Gauge Driver with
Document Number: MC33976
Rev 4.0, 1/2007
The 33976 is a single-packaged, Serial Peripheral Interface (SPI) controlled, dual step motor gauge driver integrated circuit (IC). This monolithic IC consists of four dual output H-Bridge coil drivers and the associated control logic. Each pair of H-Bridge dri ve rs is used to automatically control the speed, direction, and magnitude of current through the two coils of a two-phase instrumentation step motor, similar to an MMT-licensed AFIC
The 33976 is ideal for use in automotive instrumentation systems requiring distributed and flexible step motor gauge driving. The device also eases the transition to step motors from air core motors by emulating the air core pointer movement with little additional processor bandwidth utilization.
Features
•MMT-Licensed Two-Phase Step Motor Compatible
•Switec MS-X15.xxx Step Motor Compatible
•Minimal Processor Overhead Required
•Fully Integrated Pointer Movement and Position State Machine with Channel-Independent Configurable Pointer Movement
•4096 Possible Steady State Pointer Positions
•340° Maximum Pointer Sweep
•Maximum Acceleration of 4500°/s2
•Maximum Pointer Velocity of 400°/s
•Analog Microstepping (12 Steps/Degree of Pointer Movement)
•Pointer Calibration and Return to Zero (RTZ)
•SPI-Controlled 16-Bit Word
•Calibratable Internal Clock
•Low Sleep Mode Current
•Pb-Free Packaging Designated by Suffix Code EG
6405 or Switec MS-X15.xxx motor.
33976
CONFIGURABLE DUAL GAUGE DRIVER
DW SUFFIX
EG SUFFIX (PB-FREE)
98ASB42344B 24-PIN SOICW
ORDERING INFORMATION
Device
MC33976DW/R2
MCZ33976EG/R2
Temperature
Range (T
- 40°C to 125°C 24 SOICW
)
A
Package
V
PWR
33976
V
5.0 V
Regulator
DD
MCU

Figure 1. 33976 Simplified Application Diagram

* This document contains certain information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
VPWD
VDD
RTZ RST CS SCLK SI SO
SIN0+
SIN0-
Motor 0
COS0+
COS0-
SIN1+
SIN1-
Motor 1
COS1+
COS1-
GND

INTERNAL BLOCK DIAGRAM

INTERNAL BLOCK DIAGRAM
VPWR
VDD
CS
SCLK
SO
RST
INTERNAL
REGULATOR
COS0
SPI
SI
LOGIC
STATE
MACHINE
UNDER
-
AND
OVERVOLTAGE
DETECT
ILIM
OVERTEMPERATURE
DETECT
SIGMA-DELTA
ADC
SIN0
COS1
H-BRIDGE
AND
CONTROL
SIN1
MULTIPLEXER
COS0+ COS0-
SIN0+ SIN0-
COS1+ COS1-
SIN1+ SIN1-
VDD
OSCILLATOR
AGND
GND (8)
RTZ

Figure 2. 33976 Simplified Internal Block Diagram

33976
Analog Integrated Circuit Device Data
2 Freescale Semiconductor

PIN CONNECTIONS

PIN CONNECTIONS
COS0+
COS0-
SIN0+
SIN0-
GND GND GND GND
SCLK

Figure 3. 33976 Pin Connections

Table 1. 33976 Pin Definitions

Pin
Number
1 2 3 4
5 – 8,
17–
20
9 CS Input Chip Select
10 SCLK Input Serial Clock
11 SO Output Serial Output
12 SI Input Serial Input
13 RTZ Output Multiplexed Output
14 VDD Input Voltage 15 RST Input Reset 16 VPWR Input Battery Voltage
21 22 23 24
Pin
Name
(MS Motor Pin #)
Pin
Function
Output H-Bridge Outputs 0
COS0+ (MS #4) COS0
(MS #3) SIN0+(MS #1) SIN0
(MS #2)
GND Ground Ground
(MS Motor Pin #)
Output H-Bridge Outputs 1
SIN1− (MS #2) SIN1+
(MS #1)
COS1
(MS #3)
COS1+
(MS #4)
Formal Name Definition
CS
SO
1 2 3 4 5 6 7 8 9 10 11 12
SI
24
COS1+
23
COS1-
22
SIN1+
21
SIN1-
20
GND
19
GND
18
GND
17
GND
16
PWR
V
15
RST
14
VDD
13
RTZ
Each pin is the output pin of a half bridge, designed to source or sink current.
These pins serve as the ground for the source of the low-side output transistors as well as the logic portion of the device.
This pin is connected to a chip select output of a LSI IC. This pin is connected to the SCLK pin of the master device and acts
as a bit clock for the SPI port. This pin is connected to the SPI Serial Data Input pin of the master
device or to the SI pin of the next device in a daisy chain. This pin is connected to the SPI Serial Data Output pin of the master
device from which it receives output command data. This is a multiplexed output pin for the non-driven coil, during a Return
to Zero (RTZ) event. This SPI and logic power supply input will work with 5.0 V supplies. This input has an internal active pull-up. Power supply. Each of these pins is the output pin of a half bridge, designed to
source or sink current.
33976
Analog Integrated Circuit Device Data Freescale Semiconductor 3

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating Symbol Value Unit
Power Supply Voltage
Steady State
Input Pin Voltage
SIN +/- COS +/- Continuous Per Output Current
(1)
(2)
Storage Temperature
Operating Junction Temperature
Thermal Resistance
Junction to Ambient Junction to Lead
ESD Voltage
(3)
Human Body Model Machine Model
Peak Package Reflow Temperature During Reflow
(4), (5)
V
PWR(SUS)
V
IN
I
OUTMAX
T
STG
T
R
θJA
R
θJL
V
ESD1
V
ESD2
T
PPRT
V
-0.3 to 41
-0.3 to 7.0 V
40 mA
-55 to 150 °C
J
-40 to 150 °C
°C/W 60 20
V
±2000
±200
Note 5
°C
Notes
1. Exceeding voltage limits on Input pins may cause permanent damage to the device.
2. Output continuous output rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperature will require maximum output current computation using package thermal resistances.
3. ESD1 testing is performed in accordance with the Human Body Model (C accordance with the Machine Model (C
= 200 pF, R
ZAP
ZAP
= 0 Ω).
= 100 pF, R
ZAP
= 1500 ), ESD2 testing is performed in
ZAP
4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33976
Analog Integrated Circuit Device Data
4 Freescale Semiconductor
STATIC ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS

Table 3. Static Electrical Characteristics

Characteristics noted under conditions 4.75 V VDD 5.25 V, - 40°C ≤ T
Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
POWER INPUT
150°C, GND = 0 V unless otherwise noted.
J
Supply Voltage Range
Fully Operational Limited Operational
V
Supply Current
PWR
(6), (7)
Gauge 1 and 2 Outputs ON, No Output Loads
V
Supply Current (All Outputs Disabled)
PWR
Reset = Logic [0], VDD = 5.0 V Reset = Logic [0], VDD = 0 V
Overvoltage Detection Level
Undervoltage Detection Level
(8)
(9)
Logic Supply Voltage Range (5.0 V Nominal Supply)
Under VDD Logic Reset
VDD Supply Current
Sleep: Reset Logic [0] Outputs Enabled
POWER OUTPUTS
Microstep Output (Measured Across Coil Outputs) SIN0,1, ± (COS0,1, ±) (refer to Table 1) R
= 200 , PE6 = 0
OUT
Steps 6, 18 (0, 12) Steps 5, 7, 17, 19 (1, 11, 13, 23) Steps 4, 8, 16, 20 (2, 10, 14, 22) Steps 3, 9, 15, 21 (3, 9, 15, 21) Steps 2, 10, 14, 22 (4, 8,16, 20) Steps 1, 11, 13, 23 (5, 7, 17, 19) Steps 0, 12 (6, 18)
V
PWR
I
PWR(ON)
I
PWSLP1
I
PWRSLP2
V
PWROV
V
PWRUV
V
DD
V
DDUV
I
DD(OFF)
I
DD(ON)
V
ST6
V
ST5
V
ST4
V
ST3
V
ST2
V
ST1
V
ST0
6.5
4.0
– –
26 26
4.0 6.0
– –
42 15
60 25
26 32 38 V
5.0 5.6 6.2 V
4.5 5.0 5.5 V
4.5 V
– –
4.82
0.94 V
ST6
0.84 V
ST6
0.68 V
ST6
0.47 V
ST6
0.23 VST6
-0.1
40
1.0
5.3
0.97 V
0.87 V
0.71 V
0.50 V
0.26 V
65
1.8
6.0
ST6 ST6 ST6 ST6 ST6
0
1.0 V
0.96 V
0.8 V
0.57 V
0.31 V
0.1
ST6
ST6
ST6
ST6 ST6
V
mA
µA
µA
mA
V
Notes
6. Outputs and logic remain active; however, the larger coil voltage levels may be clipped. The reductio n in drive voltage may result in a loss of position control.
7. The logic will reset at some level below the specified Limited Operational minimum.
8. Outputs will disable and must be re-enabled via the PECCR command.
9. Outputs remain active; however, the reduction in drive voltage may result in a loss of position control.
33976
Analog Integrated Circuit Device Data Freescale Semiconductor 5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V VDD 5.25 V, - 40°C T
150°C, GND = 0 V unless otherwise noted.
J
Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
POWER OUTPUTS (CONTINUED)
Full Step Active Output (Measured Across Coil Outputs) SIN0, 1, ± (COS0, 1, ±) (see Figure 9, page 26)
Steps 1, 3 (0, 2)
Microstep, Full Step Output (Measured from Coil Low Side to Ground)
SIN0, 1, ± (COS0, 1, ±), I
Output Flyback Clamp
(11)
OUT
= 30 mA
Output Current Limit (Output = Vst6)
Overtemperature Shutdown
Overtemperature Hysteresis
(10)
(11)
CONTROL I/O
Input Logic High Voltage
Input Logic Low Voltage
Input Logic Voltage Hysteresis
(12)
(12)
(10)
Input Logic Pull Down Current (SI, SCLK)
Input Logic Pull-Up Current (CS, RST)
SO High-State Output Voltage (IOH = 1.0 mA)
SO Low-State Output Voltage (IOL = -1.6 mA)
SO Tri-State Leakage Current (CS 3.5 V)
Input Capacitance
SO Tri-State Capacitance
(13)
(13)
V
FS
V
LS
V
FB
I
LIM
OT
OT
HYST
V
V
V
IN(HYST)
I
DWN
I
UP
V
SOH
V
SOL
I
SOLK
C
C
SO
V
4.9 5.3 6.0
V
0 0.1 0.3
V
+ 0.5 V
ST6
+ 1.0 V
ST6
40 100 170 mA
SD
155 180 °C
8.0 16 °C
IH
IL
2.0 V
0.8 V
100 mV
3.0 20 µA
5.0 20 µA
0.8 V
DD
V
0.2 0.4 V
-5.0 0 5.0 µA
IN
4.0 12 pF
20 pF
ANALOG TO DIGITAL CONVERTER (RTZ ACCUMULATOR COUNT)
ADC Gain
(10), (14)
G
ADC
100 188 270 Counts/
V/ms
Notes
10. This parameter is guaranteed by design, but it is not production tested.
11. Not 100 percent tested.
12. VDD = 5.0 V.
13. Capacitance not measured. This parameter is guaranteed by design, but it is not production tested.
14. Reference RTZ Accumulator (Typical) on page 23
33976
Analog Integrated Circuit Device Data
6 Freescale Semiconductor
DYNAMIC ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS

Table 4. Dynamic Electrical Characteristics

Characteristics noted under conditions 4.75 V VDD 5.25 V, - 40°C ≤ T
Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Units
POWER OUTPUT AND CLOCK TIMINGS
150°C, GND = 0 V unless otherwise noted.
J
SIN0,1, ± (COS0,1, ±) Output Turn ON Delay Time (Time from Rising CS Enabling
Outputs to Steady State Coil Voltages and Currents)
SIN0,1, ± (COS0,1, ±) Output Turn OFF Delay Time (Time from Rising CS Disables Outputs to Steady State Coil Voltages and Currents)
(15)
(15)
Uncalibrated Oscillator Cycle Time
Calibrated Oscillator Cycle Time
Calibration Pulse = 8.0 µs, PECCR D4 = Logic [0] Calibration Pulse = 8.0 µs, PECCR D4 = Logic [1]
Maximum Pointer Speed
Maximum Pointer Acceleration
(16)
(16)
t
DLY (ON)
t
DLY (OFF)
t
CLU
t
CLC
V
MAX
A
MAX
1.0
1.0
0.65 1.0 1.7 µs
1.0
0.9
1.1
1.0
1.2
1.1
400 °/s
4500 °/s
Notes
15. Maximum specified time for the 33976 is the minimum guaranteed time needed from the microcontroller.
16. The minimum and maximum value will vary proportionally to the internal clock tolerance. These numbers are based on an ideally calibrated clock frequency of 1.0
MHz. These are not 100 percent tested.
ms
ms
µs
2
33976
Analog Integrated Circuit Device Data Freescale Semiconductor 7
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.75 V VDD 5.25 V, - 40°C T
150°C, GND = 0 V unless otherwise noted.
J
Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Units
SPI INTERFACE TIMING
(17)
Recommended Frequency of SPI Operation
Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)
Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)
SI to Falling Edge of SCLK (Required Setup Time)
Required High State Duration of SCLK (Required Setup Time
Required Low State Duration of SCLK (Required Setup Time
Falling Edge of SCLK to SI (Required Hold Time)
(18)
(18)
(18)
(18)
SO Rise Time
CL = 200 pF
SO Fall Time
CL = 200 pF
SI, CS, SCLK, Incoming Signal Rise Time
SI, CS, SCLK, Incoming Signal Fall Time
(19)
(19)
Falling Edge of RST to Rising Edge of RST (Required Setup Time)
Rising Edge of CS to Falling Edge of CS (Required Setup Time)
(18), (20)
Rising Edge of RST to Falling Edge of CS (Required Setup Time)
Time from Falling Edge of CS to SO Low Impedance
Time from Rising Edge of CS to SO High Impedance
Time from Rising Edge of SCLK to SO Data Valid
0.2 V
SO 0.8 VDD, CL = 200 pF
DD
(21)
(22)
(23)
(18)
(18)
(18)
(18)
t
t
t
SI
f
t
LEAD
t
LAG
t
S
SCLK
W
SCLK
W
(
HOLD)
t
R
SPI
ISU
H
L
SO
1.0 2.0 MHz
50 167 ns
50 167 ns
25 83 ns
167 ns
167 ns
25 83 ns
ns
25 50
t
SO
F
ns
25 50
t
SI
R
t
SI
F
t
RST
W
t
CS
t
EN
t
SO(EN)
t
SO(DIS)
t
VALID
50 ns
50 ns
3.0 µs
5.0 µs
5.0 µs
145 ns
1.3 4.0 µs
ns
90 150
Notes
17. The 33976 shall meet all SPI interface timing requirements specified in the SPI Interface Timing section of this table, over the specified temperature range. Digital interface timing is based on a symmetrical 50 percent duty cycle SCLK Clock Period of 333 ns. The device shall be fully functional for slower clock speeds. Reference
Figure 4 and 5.
18. The maximum setup time specified for the 33976 is the minimum time needed from the microcontroller to guarantee correct operation.
19. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
20. The value is for a 1.0 MHz calibrated internal clock. The value will change proportionally as the internal clock frequency changes.
21. Time required for output status data to be terminated at SO. 1.0 k load on SO
22. Time required for output status data to be available for use at SO. 1.0 k load on SO.
23. Time required to obtain valid data out from SO following the rise of SCLK.
33976
Analog Integrated Circuit Device Data
8 Freescale Semiconductor
RST
CS
SCLK
SI
t
WRST
0.7 V
0.2 V
DD
0.2 V
DD
t
EN
0.7 V
t
LEAD
DD
DD
0.7 V
0.2 V
DD
TIMING DIAGRAMS
t
WSCLKH
t
LEAD
DD
t
WSCLKL
t
SI(HOLD)
t
RSI
ELECTRICAL CHARACTERISTICS
0.7 V
DD
t
LAG
t
FSI
TIMING DIAGRAMS
t
CS
Don’t CareValidValid Don’t CareDon’t Care
V
IN
V
IL
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
SCLK
SO
Low-to-High
SO
High-to-Low

Figure 4. Input Timing Switching Characteristics

0.7 V
0.2 V
DD
t
FSI
1.0 V
DD
3.5 V
0.2 V
0.7 V
t
SO(EN)
DD
t
DD
t
SO(DIS)
t
RSI
VALID
50%
t
t
rSO
fSO
V
OH
V
OL
V
OH
V
OL
V
OH
V
OL

Figure 5. Valid Data Delay Time and Valid Time Waveforms

33976
Analog Integrated Circuit Device Data Freescale Semiconductor 9

FUNCTIONAL DESCRIPTION

INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
This 33976 is a single-packaged, Serial Peripheral Interface (SPI) controlled, dual step motor gauge driver integrated circuit (IC). This monolithic IC consists of four dual output H-Bridge coil drivers and the associated control logic. Each pair of H-Bridge drivers is used to automatically control the speed, direction, and magnitude of current through the two coils of a two-phase instrumentation step motor, similar
FUNCTIONAL PIN DESCRIPTION
H-BRIDGE OUTPUTS 0 (COS0+, COS0-, SIN0+, SIN0-)
Each pin is the output pin of a half bridge, designed to source or sink current. The H-Bridge pins linearly drive the sine and cosine coils of two separate step motors to provide four-quadrant operation.
GROUND (GND)
These pins serve as the ground for the source of the low­side output transistors as well as the logic portion of the device. They also help dissipate heat from the device.
CHIP SELECT (CS)
The CS pin enables communication with the master device. When this pin is in a logic [0] state, the 33976 is capable of transferring information to, and receiving information from, the master. The 33976 latches data in from the Input Shift registers to the addressed registers on the rising edge of
CS is logic [0]. When CS is logic high, signals at the
when SCLK and SI pins are ignored and the SO pin is tri-stated (high impedance). state to a logic internal pull-up (l section of the Static Electrical Characteristics table entitled
CONTROL I/O, which is found on page 6.
CS. The output driver on the SO pin is enabled
CS will only be transitioned from a logic [1]
[0] state when SCLK is a logic [0]. CS has an
) connected to the pin, as specified in the
UP
to an MMT-licensed AFIC motor.
The 33976 is ideal for use in automotive instrumentation systems requiring distributed and flexible step motor gauge driving. The device also eases the transition to step motors from air core motors by emulating the air core pointer movement with little additional processor bandwidth utilization.
and SO is tri-stated (high impedance). Refer to the data transfer timing diagrams in Figure 6 and Figure 7 on page 12.
6405 or a Switec MS-X15.xxx
SERIAL OUTPUT (SO)
The SO data pin is a tri-stateable output from the Shift register. The Status register bits are the first 16 bits shifted out. Those bits are followed by the message bits clocked in FIFO, when the device is in a daisy chain connection or being sent words that are multiples of 16 bits. Data is shifted on the rising edge of the SCLK signal. The SO pin will remain in a high impedance state until the state.
CS pin is put into a logic low
SERIAL INPUT (SI)
The SI pin is the input of the SPI. Serial input information is read on the falling edge of SCLK. A 16-bit stream of serial data is required on the SI pin, beginning with the most significant bit (MSB). Messages that are not multiples of 16 bits (e.g., daisy chained device messages) are ignored. After transmitting a 16-bit word, the (logic [1]) before transmitting a new word. SI information is ignored when
CS is in a logic high state.
CS pin must be de-asserted
MULTIPLEXED OUTPUT (RTZ)
This is a multiplexed output pin for the non-driven coil, during a Return to Zero (RTZ) event.
SERIAL CLOCK (SCLK)
SCLK clocks the Internal Shift registers of the 33976 device. The SI pin accepts data into the Input Shift register on the falling edge of the SCLK signal, while the Serial Output pin (SO) shifts data information out of the SO Line Driver on the rising edge of the SCLK signal. It is important that the SCLK pin be in a logic [0] state whenever the transition. SCLK has an internal pull down (l specified in the section of the Static Electrical Characteristics table entitled
CS is logic [1], signals at the SCLK and SI pins are ignored
33976
10 Freescale Semiconductor
CONTROL I/O, which is found on page 6. When
CS makes any
), as
DWN
VOLTAGE (VDD)
This SPI and logic power supply input will work with 5.0 V
supplies.
RESET (RST)
If the master decides to reset the device or place it into a
sleep state, the RST pin is driven to a logic
RST pin will force all internal logic to the known default
the state. This input has an internal active pull-up.
Analog Integrated Circuit Device Data
[0]. A logic [0] on
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
BATTERY VOLTAGE (V
Power supply.
PWR
)
H-BRIDGE OUTPUTS 1 (SIN1-, SIN1+, COS1-, COS1+)
Each of these pins is the output pin of a half bridge, designed to source or sink current. The H-Bridge pins linearly drive the sine and cosine coils of two separate step motors to provide four-quadrant operation.
33976
Analog Integrated Circuit Device Data Freescale Semiconductor 11

FUNCTIONAL DEVICE OPERATION

OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
SPI PROTOCOL DESCRIPTION
The SPI interface has a full-duplex, three-wire synchronous, 16-bit serial synchronous interface data transfer and four I/O lines associated with it: Chip Select ( Serial Clock (SCLK), Serial Input (SI), and Serial Output
TIMING DESCRIPTION
This section provides a description of the 33976 SPI behavior. To follow the explanations below, refer to Table 5 and to the timing diagrams shown in Figure 6 and Figure 7.

Table 5. Data Transfer Timing

Pin Description
CS),
(SO). The SI/SO pins of the 33976 follow a first in/first out (D15/D0) protocol with both input and output words transferring the most significant bit first. All inputs are compatible with 5.0 V CMOS logic levels.
CS (1-to-0) CS (0-to-1)
SO
SI
SO pin is enabled. 33976 configuration and desired output states are transferred and executed according to the data
in the Shift registers. Will change state on the rising edge of the SCLK pin signal. Will accept data on the falling edge of the SCLK pin signal.
CS
SCLK
SI
SO
Note SO is tri-stated when CS is logic [1].
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1
OD15 OD14 OD13 OD12 OD11 OD10 OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1
Output shift register is loaded here.

Figure 6. Single 16-Bit Word SPI Communication

CS
SCLK
D0
OD0
D0
SI
SO
1. SO is tri-stated when
Notes
2. D15, D14, D13, ..., and D0 refer to the first 16 bits of data into the 33976.
3. D15*, D14*, D13*, ..., and D0* refer to the most recent entry of program data into the 33976.
4. OD15, OD14, OD13, ..., and OD0 refer to the first 16 bits of fault and status data out of the 33976.
D15 D14 D13 D12 D11 D2 D1 D0 D15*D14*D13*D4 D3 D2*D1
OD15 OD14 OD13 OD12 OD11 OD2 OD1 OD0 D15 D14 D13 OD4 OD3 D2 D1
CS is logic [1].
*
*
D0

Figure 7. Multiple 16-Bit Word SPI Communication

33976
Analog Integrated Circuit Device Data
12 Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
DATA INPUT
The Input Shift register captures data at the falling edge of the SCLK clock. The SCLK clock pulses exactly 16
times only inside the transmission windows (CS in a logic [0] state). By the time the CS signal goes to logic [1] again, the contents of the Input Shift register are transferred to the appropriate internal register addressed in bits 15:13. The minimum time
CS should be kept high depends on the internal clock speed,
specified in the SPI INTERFACE TIMING
(17)
section of the
Static Electrical Characteristics, found on page 6. It must be long enough so the internal clock is able to capture the data
LOGIC COMMANDS AND REGISTERS

COMMUNICATION MEMORY MAPS AND REGISTER DESCRIPTIONS

The 33976 device is capable of interfacing directly with a microcontroller via the 16-bit SPI protocol specified below. The device is controlled by the microprocessor and reports back status information via the SPI. This section provides a detailed description of all registers accessible via serial interface. The various registers control the behavior of this device.
A message is transmitted by the master beginning with the MSB (D15) and ending with the LSB (D0). Multiple messages can be transmitted in succession to accommodate those applications where daisy chaining is desirable, or to confirm transmitted data, as long as the messages are all multiples of
bits. Data is transferred through daisy-chained devices, as
16 illustrated in Figure 7, page 12. If an attempt is made to latch in a message smaller than 16 bits wide, it is ignored.
Table 6 lists the seven registers the 33976 uses to
configure the device, control the state of the four H-bridge outputs, and determine the type of status information that is clocked back to the master. The registers are addressed via D15:D13 of the incoming SPI word.

Table 6. Module Memory Map

Address
[15:13]
000 Power, Enable, Calibration,
and Configuration Register 001 Maximum Velocity Register VELR Page 15 010 Gauge 0 Position Register POS0R Page 16 011 Gauge 1 Position Register POS1R Page 16 100 Return to 0 Register RTZR Page 16 101 Return to 0
110 Ramp Selection Register RMPSELR Page 19 111 Reserved for Test
Register Name See Page
Configuration
Register
PECCR Page 13
RTZCR Page 17
from the Input Shift register and transfer it to the internal registers.
DATA OUTPUT
At the first rising edge of the SCLK clock, with CS at logic [0], the contents of the selected Status Word register are transferred to the Output Shift register. The first 16
bits clocked out are the status bits. If data continues to clock in before the
CS transitions to a logic [1], the device begins to
shift out the data previously clocked in FIFO after the CS first transitioned to logic [0].
MODULE MEMORY MAP
Various registers of the 33976 SPI module are addressed by the three MSBs of the 16-bit word received serially. Functions to be controlled include:
• Individual gauge drive enabling
• Power-up/down
• Internal clock calibration
• Gauge pointer position and velocity
• Gauge pointer zeroing
• Air core motor movement emulation
• Status information
Status reporting includes:
• Individual gauge overtemperature condition
• Battery overvoltage
• Battery undervoltage
• Pointer zeroing status
• Internal clock status
• Confirmation of coil output changes that should result in pointer movement
• Real time pointer position information
• Real time pointer velocity step information
• Pointer movement direction
• Command pointer position status
• RTZ accumulator value
REGISTER DESCRIPTIONS
The following section describes the registers, their
addresses, and their impact on device operation.
Address 000 — Power, Enable, Calibration, and Configuration Register (PECCR)
The Power, Enable, Calibration, and Configuration Register is illustrated in 33976 using this register allows the master to
independently enable or disable the output drivers of the
(1) two-gauge controllers, (2) (3)
disable the air core emulation, (4) select the direction of the pointer movement during pointer positioning and zeroing,
configure the device for the desired status information to
(5)
Table 7, page 14. A write to the
calibrate the internal clock,
33976
Analog Integrated Circuit Device Data Freescale Semiconductor 13
Loading...
+ 28 hidden pages