The 17531A is a monolithic dual H-Bridge power IC ideal for
portable electronic applications containing bipolar step motors and/or
brush DC-motors (e.g., cameras and disk drive head positioners).
The 17531A operates from 2.0 V to 8.6 V using the internal charge
pump, with independent control of each H-Bridge via parallel MCU
interface. The device features built-in shoot-through current
protection and an undervoltage shutdown function.
The 17531A has four operating modes: Forward, Reverse, Brake,
and Tri-Stated (High Impedance). The 17531A has a low total
R
power dissipation owing to its low output resistance and high output
slew rates. The H-Bridge outputs can be independently pulse width
modulated (PWM’ed) at up to 200
control.
Features
of 1.2 Ω (max @ 25°C).
DS(ON)
The 17531A efficiently drives many types of micromotors with low
kHz for speed/torque and current
• Low Total RDS(ON) 0.8 W (Typ), 1.2 Ω (Max) @ 25°C
• Output Current 0.7 A (DC)
• Shoot-Through Current Protection Circuit
• PWM Control Input Frequency up to 200 kHz
• Built-In Charge Pump Circuit
• Low Power Consumption
• Undervoltage Detection and Shutdown Circuit
• Power Save Mode with Current Draw ≤ 2.0 µA
• Pb-Free Packaging Designated by Suffix Codes EV and EP
17531A
DUAL H-BRIDGE
VMFP SUFFIX
EV SUFFIX (PB-FREE)
98ASA10616D
20-TERMINAL VMFP
ORDERING INFORMATION
Device
MPC17531AEV/EL
MPC17531AEP/R224 QFN
Temperature
Range (T
-20°C to 65°C
QFN SUFFIX
EP SUFFIX (PB-FREE)
98ARL10577D
24-TERMINAL QFN
)
A
Package
20 VMFP
3.0 V5.0 V
17531A
VDD
C1L
C1H
MCU
C2L
C2H
CRES
IN1A
IN1B
IN2A
OUT1A
OUT1B
OUT2A
OUT2B
IN2B
PSAVE
GND
Figure 1. 17531A Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
A functional description of each terminal can be found in the Functional Terminal Description section beginning on page 10.
Terminal
Number
1VDDLogic Supply
2IN1ALogic Input Control 1A
3IN1BLogic Input Control 1B
4PSAVEPower Save
5
6PGND1Power Ground 1
7OUT1AH-Bridge Output 1A
8VM1Motor Drive Power Supply 1
9
10C2HCharge Pump 2H
11C1HCharge Pump 1H
12C1LCharge Pump 1L
13C2LCharge Pump 2L
14OUT1BH-Bridge Output 1B
15PGND2Power Ground 2
16OUT2BH-Bridge Output 2B
17VM2Motor Drive Power Supply 2
18IN2BLogic Input Control 2B
19IN2ALogic Input Control 2A
20LGNDLogic Ground
Terminal
Name
Formal NameDefinition
OUT2AH-Bridge Output 2A
CRES
Predriver Power Supply
Control circuit power supply terminal.
Logic input control of OUT1A (refer to Table 6, Truth Table, page 9).
Logic input control of OUT1B (refer to Table 6, Truth Table, page 9).
Logic input controlling power save mode.
Output A of H-Bridge channel 2.
High-current power ground 1.
Output A of H-Bridge channel 1.
Positive power source connection for H-Bridge 1 (Motor Drive Power Supply).
Internal triple charge pump output as predriver power supply.
Charge pump bucket capacitor 2 (positive pole).
Charge pump bucket capacitor 1 (positive pole).
Charge pump bucket capacitor 1 (negative pole).
Charge pump bucket capacitor 2 (negative pole).
Output B of H-Bridge channel 1.
High-current power ground 2.
Output B of H-Bridge channel 2.
Positive power source connection for H-Bridge 2 (Motor Drive Power Supply).
Logic input control of OUT2B (refer to Table 6, Truth Table, page 9).
Logic input control of OUT2A (refer to Table 6, Truth Table, page 9).
Low-current logic signal ground.
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor3
TERMINAL CONNECTIONS
Transparent Top View of Package
NC
PSAVE
OUT2A
PGND1
OUT1A
NC
LGND
IN1B
1
2
3
4
5
6
789101112
VDD
IN1A
MPC17530EP
IN2A
IN2B
192021222324
18
17
16
15
14
13
VM2
NC
OUT2B
PGND2
OUT1B
C2L
NC
VM1
C2H
CRES
C1L
C1H
Figure 4. 17531A, 24-Terminal QFN Connections
Table 2. 17531A, 24-Terminal QFN Definitions
A functional description of each terminal can be found in the Functional Terminal Description section beginning on page 10.
Terminal
Number
1VDDLogic Supply
2IN1ALogic Input Control 1A
3IN1BLogic Input Control 1B
4PSAVEPower Save
5
6PGND1Power Ground 1
7OUT1AH-Bridge Output 1A
8VM1Motor Drive Power Supply 1
9
10C2HCharge Pump 2H
11C1HCharge Pump 1H
12C1LCharge Pump 1L
13C2LCharge Pump 2L
14OUT1BH-Bridge Output 1B
15PGND2Power Ground 2
16OUT2BH-Bridge Output 2B
17VM2Motor Drive Power Supply 2
18IN2BLogic Input Control 2B
19IN2ALogic Input Control 2A
20LGNDLogic Ground
Terminal
Name
Formal NameDefinition
OUT2AH-Bridge Output 2A
CRES
Predriver Power Supply
Control circuit power supply terminal.
Logic input control of OUT1A (refer to Table 6, Truth Table, page 9).
Logic input control of OUT1B (refer to Table 6, Truth Table, page 9).
Logic input controlling power save mode.
Output A of H-Bridge channel 2.
High-current power ground 1.
Output A of H-Bridge channel 1.
Positive power source connection for H-Bridge 1 (Motor Drive Power Supply).
Internal triple charge pump output as predriver power supply.
Charge pump bucket capacitor 2 (positive pole).
Charge pump bucket capacitor 1 (positive pole).
Charge pump bucket capacitor 1 (negative pole).
Charge pump bucket capacitor 2 (negative pole).
Output B of H-Bridge channel 1.
High-current power ground 2.
Output B of H-Bridge channel 2.
Positive power source connection for H-Bridge 2 (Motor Drive Power Supply).
Logic input control of OUT2B (refer to Table 6, Truth Table, page 9).
Logic input control of OUT2A (refer to Table 6, Truth Table, page 9).
Low-current logic signal ground.
17531A
Analog Integrated Circuit Device Data
4Freescale Semiconductor
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
RatingsSymbolValueUnit
Motor Supply VoltageV
Charge Pump Output Voltage
V
Logic Supply Voltage
Signal Input Voltage
Driver Output Current
Continuous
Peak
(1)
I
ESD Voltage
Human Body Model
Machine Model
(3)
(2)
V
V
Operating Junction Temperature
Operating Ambient Temperature
Storage Temperature Range
Thermal Resistance
Power Dissipation
(4)
(5)
T
R
WMFP
QFN
Terminal Soldering Temperature
(6)
T
SOLDER
M
C
RES
V
DD
V
IN
I
O
OPK
ESD1
ESD2
T
T
A
STG
θ
P
D
J
JA
-0.5 to 11.0V
-0.5 to 14.0V
-0.5 to 5.0V
-0.5 to V
+ 0.5V
DD
0.7
1.4
±1200
± 150
-20 to 150°C
-20 to 65°C
-65 to 150°C
50°C/W
1.0
2.5
260°C
A
V
W
Notes
1. TA = 25°C. Pulse width = 10 ms at 200 ms intervals.
2. ESD1 testing is performed in accordance with the Human Body Model (C
3. ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 100 pF, R
ZAP
= 200 pF, R
ZAP
= 1500 Ω).
ZAP
= 0 Ω).
4. For QFN only, mounted on 37 x 50 Cu area (1.6 mm FR-4 PCB).
5. TA = 25°C.
6. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor5
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions TA = 25°C, VDD = 3.0 V, VM = 5.0 V, GND = 0 V unless otherwise noted. Typical values
noted reflect the approximate parameter means at T
CharacteristicSymbolMinTypMaxUnit
POWER INPUT
Motor Supply Voltage (Using Internal Charge Pump)
V
Motor Supply Voltage (
Gate Drive Voltage
- Motor Supply Voltage (
Logic Supply Voltage
Driver Quiescent Supply Current
No Signal Input
Power Save Mode
Logic Quiescent Supply Current
No Signal Input
(10)
Power Save Mode
Operating Power Supply Current
Logic Supply Current
Charge Pump Circuit Supply Current
Low V
Detection Voltage
DD
Driver Output ON Resistance
GATE DRIVE
Gate Drive Voltage
(12)
No Current Load
Gate Drive Ability (Internally Supplied)
I
C
= -1.0 mA
RES
Recommended External Capacitance (C1L – C1H, C2L – C2H, C
Notes
7. Gate drive voltage VC
8. No internal charge pump used. VC
9. R
10.
11.
12. At f
is not guaranteed if VC
DS(ON)
I
Q
includes the current to pre-driver circuit.
VDD
I
VDD includes the current to predriver circuit at f
= 20 kHz.
IN
13. Detection voltage is defined as when the output becomes high-impedance after VDD drops below the detection threshold. VC
applied from an external source. 2 x V
14. IO = 0.7 A source + sink.
Applied Externally)
CRES
V
CRES
(11)
(12)
(13)
(14)
is applied from an external source. 2 x VDD + VM must be < VC
RES
is applied from an external source.
RES
- VM < 5.0 V. Also, function is not guaranteed if VC
RES
+ VM must be < VC
DD
= 25°C under nominal conditions unless otherwise noted.
Characteristics noted under conditions TA = 25°C, VDD = 3.0 V, VM = 5.0 V, GND = 0 V unless otherwise noted. Typical values
noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
CharacteristicSymbolMinTypMaxUnit
CONTROL LOGIC
Logic Input Voltage
Logic Inputs (2.7 V < V
High-Level Input Voltage
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
Terminal Input Current Low
PSAVE
< 3.3 V)
DD
V
IN
V
IH
V
IL
I
IH
I
IL
IIL- PSAVE
0–
V
x 0.7
DD
–
–
-1.0
–
–
–
–
–
50
V
DD
–
V
x 0.3
DD
1.0
–
100
V
V
V
µA
µA
µA
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor7
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions TA = 25°C, VDD = 3.0 V, VM = 5.0 V, GND = 0 Vunless otherwise noted. Typical values
noted reflect the approximate parameter means at T
CharacteristicSymbolMinTypMaxUnit
INPUT
Pulse Input Frequency
Input Pulse Rise Time
Input Pulse Fall Time
OUTPUT
Propagation Delay Time
Turn-ON Time
Turn-OFF Time
Charge Pump Wake-Up Time
Low-Voltage Detection Time
Notes
15. Time is defined between 10% and 90%.
16. That is, the input waveform slope must be steeper than this.
17. Time is defined between 90% and 10%.
18. Output load is 8.0 Ω DC.
19. CCP = 0.1 µF.
(15)
(17)
(18)
(19)
= 25°C under nominal conditions unless otherwise noted.
A
f
IN
t
R
t
F
t
PLH
t
PHL
t
VGON
t
VDDDET
––200kHz
––1.0
––1.0
–
–
0.1
0.1
–1.03.0ms
––10ms
(16)
(16)
0.5
0.5
µs
µs
µs
17531A
Analog Integrated Circuit Device Data
8Freescale Semiconductor
TIMING DIAGRAMS
TIMING DIAGRAMS
IN1,
IN2,
PSAVE
OUTA,
OUTB
50%
t
PLH
90%
10%
Figure 5. t
PLH
, t
PHL
, and t
PZH
tVGON
11 V
Figure 7. Charge Pump Timing
t
PHL
Timing
V
DD
0.8 V
V
DDDETon
t
VDDDET
2.5 V
50%
V
DDDEToff
t
VDDDET
90%
I
M
0%
(<1.0 µA)
Figure 6. Low-Voltage Detection Timing
V
DD
V
C
RES
Table 6. Truth Table
INPUTOUTPUTCharge Pump and Low
PSAVEIN1A
IN2A
IN1B
IN2B
OUT1A
OUT2A
OUT1B
OUT2B
LLLLLRUN
LH L H L RUN
LL H L H RUN
LH H Z Z RUN
HX XZZ STOP
H = High.
L = Low.
Z = High impedance.
X = Don’t care.
PSAVE terminal is pulled up to V
with internal resistance.
DD
Voltage Detector
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor9
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 17531A is a monolithic dual H-Bridge ideal for
portable electronic applications to control bipolar step motors
and brush DC motors such as those found in camera len
assemblies, camera shutters, and optical disk drives. The
device features an on-board charge pump, as well as built-in
shoot-through current protection and undervoltage
shutdown.
FUNCTIONAL TERMINAL DESCRIPTION
LOGIC SUPPLY (VDD)
The VDD terminal carries the logic supply voltage and
current into the logic sections of the IC. VDD has an
undervoltage threshold. If the supply voltage drops below the
undervoltage threshold, the output power stage switches to a
tri-state condition. When the supply voltage returns to a level
that is above the threshold, the power stage automatically
resumes normal operation according to the established
condition of the input terminals.
LOGIC INPUT CONTROL (IN1A, IN1B, IN2A, AND
IN2B)
These logic input terminals control each H-Bridge output.
IN1A logic HIGH = OUT1A HIGH. However, if all inputs are
taken HIGH, the outputs bridges are both tri-stated (refer to
Table 6, Truth Table, page 9).
POWER SAVE (PSAVE)
The PSAVE terminal is a HIGH = TRUE power save mode
input. When PSAVE = HIGH, all H-Bridge outputs (OUT1A,
OUT1B, OUT2A, and OUT2B) are tri-stated (High-Z),
regardless of logic inputs (IN1A, IN1B, IN2A, and IN2B)
states, and the internal charge pump and low voltage
detection current are shut off to save power.
H-BRIDGE OUTPUT (OUT1A, OUT1B, OUT2A, AND
OUT2B)
These terminals provide connection to the outputs of each
of the internal H-Bridges (see
Internal Block Diagram, page 2).
Figure 2, 17531A Simplified
The 17531A has four operating modes: Forward, Reverse,
Brake, and Tri-Stated (High Impedance). The MOSFETs
comprising the output bridge have a total source
R
motors or one bipolar step motor. The drivers are designed to
be PWM’ed at frequencies up to 200
≤ 1.2 Ω.
DS(ON)
The 17531A can simultaneously drive two brush DC
kHz.
+ sink
MOTOR DRIVE POWER SUPPLY (VM1 AND VM2)
The VM terminals carry the main supply voltage and
current into the power sections of the IC. This supply then
becomes controlled and/or modulated by the IC as it delivers
the power to the loads attached between the OUTput
terminals. All VM terminals must be connected together on
the printed circuit board.
CHARGE PUMP (C1L AND C1H, C2L AND C2H)
These two pairs of terminals, the C1L and C1H and the
C2L and C2H, connect to the external bucket capacitors
required by the internal charge pump. The typical value for
the bucket capacitors is 0.1
µF.
PREDRIVER POWER SUPPLY (CRES)
The CRES terminal is the output of the internal charge
pump. Its output voltage is approximately three times of VDD
voltage. The VCRES voltage is power supply for the internal
predriver circuit of H-Bridges.
POWER GROUND (PGND)
Power ground terminals. They must be tied together on the
PCB.
LOGIC GROUND (LGND)
Logic ground terminal.
17531A
Analog Integrated Circuit Device Data
10Freescale Semiconductor
TYPICAL APPLICATIONS
FUNCTIONAL TERMINAL DESCRIPTION
TYPICAL APPLICATIONS
Figure 8 shows a typical application for the 17531A. When
applying the gate voltage to the CRES terminal from an
external source, be sure to connect it via a resistor equal to,
or greater than, R
V
=
C
RES
V
C
/ 0.02 Ω.
< 14 V
RES
NC
NC
G
NC
R
> VC
G
/0.02 Ω
RES
R
G
NC
0.01 µF
MCU
NC = No Connect
The internal charge pump of this device is generated from
the VDD supply; therefore, care must be taken to provide
sufficient gate-source voltage for the high-side MOSFETs
when V
>> VDD (e.g., VM = 5.0 V, V
M
= 3.3 V), in order to
DD
ensure full enhancement of the high-side MOSFET channels.
3.3 V
5.0 V
17531A
VDD
C1L
C1H
C2L
VM
OUT1A
C2H
C
RES
OUT1B
IN1A
OUT2A
IN1B
IN2A
IN2B
OUT2B
PSAVE
GND
Figure 8. 17531A Typical Application Diagram
CEMF SNUBBING TECHNIQUES
Care must be taken to protect the IC from potentially
damaging CEMF spikes induced when commutating currents
in inductive loads. Typical practice is to provide snubbing of
voltage transients via placing a capacitor or zener at the
supply terminal (VM) (see
Figure 9).
3.3 V
17531A
VDD
C1L
C1H
C2L
C2H
CRES
GND
5.0 V
VM
OUT
OUT
Figure 9. CEMF Snubbing Techniques
PCB LAYOUT
When designing the printed circuit board (PCB), connect
sufficient capacitance between power supply and ground
terminals to ensure proper filtering from transients. For all
high-current paths, use wide copper traces and shortest
possible distances.
3.3 V
VDD
C1L
C1H
C2L
C2H
CRES
5.0 V
17531A
VM
OUT
OUT
GND
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor11
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” drawing number listed below.
EV (Pb-FREE) SUFFIX
20-LEAD VMFP
PLASTIC PACKAGE
CASE 1569-01
ISSUE A
17531A
Analog Integrated Circuit Device Data
12Freescale Semiconductor
EV (Pb-FREE) SUFFIX
20-LEAD VMFP
PLASTIC PACKAGE
CASE 1569-01
ISSUE A
PACKAGE DIMENSIONS
PACKAGING
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor13
PACKAGING
PACKAGE DIMENSIONS
EV (Pb-FREE) SUFFIX
20-LEAD VMFP
PLASTIC PACKAGE
CASE 1569-01
ISSUE A
17531A
Analog Integrated Circuit Device Data
14Freescale Semiconductor
EP (Pb-FREE) SUFFIX
24-LEAD QFN
PLASTIC PACKAGE
CASE 1508-01
ISSUE A
PACKAGE DIMENSIONS
PACKAGING
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor15
PACKAGING
PACKAGE DIMENSIONS
EP (Pb-FREE) SUFFIX
24-LEAD QFN
PLASTIC PACKAGE
CASE 1508-01
ISSUE A
17531A
Analog Integrated Circuit Device Data
16Freescale Semiconductor
EP (Pb-FREE) SUFFIX
24-LEAD QFN
PLASTIC PACKAGE
CASE 1508-01
ISSUE A
PACKAGE DIMENSIONS
PACKAGING
17531A
Analog Integrated Circuit Device Data
Freescale Semiconductor17
REVISION HISTORY
REVISION HISTORY
RevisionDateDescription of Changes
Internal
Version 2.0
9/2005
• Implemented Revision History page
• Converted to Freescale format
17531A
Analog Integrated Circuit Device Data
18Freescale Semiconductor
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