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MOBILE COMMUNICATIONS DIVISION
CUSTOMER SERVICES
TS605 / TS2050
Technical Service
Manual
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CUSTOMER SERVICES
INDEX PAGE
1.0 GENERAL ADVICE 5
1.1 CUSTOMER CARE SOLUTIONS 6
1.2 ESD PROTECTION 7
2.0 HANDSET SPECIFICATION AND INTRODUCTION 8
2.1 HANDSET SPECIFICATION 9
2.1.1 HARDWARE 9
2.1.2 SOFTWARE 10
2.1.3 PHYSICAL 11
2.1.4 VIDEO 12
2.1.5 OTHERS 13
2.1.6 PRODUCT OVERVIEW 15
2.2 INTERFACES 16
2.2.1 SIM CARD INTERFACE 16
2.2.2 MEMORY CARD INTERFACE 18
2.2.3 BATTERY INTERFACE 20
2.2.4 CHARGING THE BATTERY 21
2.2.5 CHARGING INDICATOR 22
2.3 HANDSET USER INTERFACE 23
2.3.1 HANDSET DESCRIPTION 23
2.3.2 KEY FUNCTIONS 24
2.3.3 DISPLAY CONCEPT 26
2.3.4 MAIN MENU 27
2.4 MMI TEST 29
3.0 MECHANICAL CONCEPT 30
3.1 EXPLODED VIEW 31
3.2 MECHANICAL SPARE PARTS LIST 33
3.3 SPARE PARTS PHOTO 34
4.0 DISASSEMBLY AND REASSEMBLY PROCEDURE 35
4.1 DISASSEMBLY 36
4.2 REASSEMBLY 43
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INDEX PAGE
5.0 SOFTWARE DOWNLOAD 53
5.1 SOFTWARE DOWNLOAD 54
5.1.1 DOWNLOAD CABLES 54
5.1.2 DOWNLOAD TOOL 55
5.1.3 EQUIPMENT SETTING 56
5.1.4 MAIN PROGRAM INTERFACE 57
5.1.5 BACKUP TOOL 59
6.0 SYSTEM MODULE AND USER INTERFACE 60
6.1 TECHNICAL DESCRIPTION 61
6.1.1 RF OVERVIEW 61
6.1.2 RF FUNCTION BLOCK DIAGRAM 62
6.1.3 FREQUENCY PLAN 63
6.1.4 TRANSMITTER 64
6.1.5 RECEIVER 65
6.2 BASEBAND OVERVIEW 66
6.2.1 INTRODUCTION 67
6.2.2 CPU MEMORY 68
6.2.3 REAL TIME CLOCK (RTC) 68
6.2.4 LCD MODULE 68
6.2.5 CAMERA / BACKEND IC 68
6.3 SWITCHES 69
6.3.1 KEYPAD 69
6.3.2 POWER KEY 69
6.4 AUDIO SYSTEM 70
6.4.1 VOICE BAND CODEC 71
6.4.2 MICROPHONE 72
6.4.3 RECEIVER 72
6.4.4SPEAKER 73
6.5 POWER MANAGEMENT 73
6.5.1 POWER ON SEQUENCE 74
6.5.2 POWER SOURCE 75
6.5.3 REGULATOR CONTROL 75
6.5.4VOLTAGE REGULATION 75
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INDEX PAGE
7.0 TROUBLE SHOOTING 77
7.1 MAIN TROUBLE SHOOTING DIAGRAM 78
7.1.1 NO POWER UP 79
7.1.2 FLASH FAILED 80
7.1.3 WILL NOT READ SIM CARD 81
7.1.4 POOR SERVICE 82
7.1.5 WILL NOT CHARGE 83
7.1.6 LCD FAILURE 84
7.1.7 BUZZER FAULT 85
7.1.8 VIBRATOR FAULT 86
7.1.9 FAULTY KEYPAD 87
7.1.10 FAULTY RTC 88
7.1.11FAULTY MICROPHONE 89
7.1.12 LCD TESTING 90
7.1.13 FAULTY CAMERA 91
7.2 CONNECTIONS 92
7.2.1 CONNECTIONS ON BOARD 92
7.2.2 ACF CONNECTIONS 93
7.2.3 MAIN BASEBAND IC’S 94
7.2.4 MAIN RF IC’S 96
7.2.5 CONNECTORS ON KEYPAD PCB 97
7.3 ACF – ANISOTROPIC CONDUCTIVE FILM 98
7.4 LABEL SPECIFICATION 103
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1.0 GENERAL ADVICE
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1.1 CUSTOMER CARE SOLUTIONS
TECHNICAL DOCUMENTATION
Warnings
1- Care must be taken on installation in vehicles fitted with electronic
engine management systems and ABS. Under certain faulty conditions,
emitted RF energy can affect their operation.
2- The handset must not be operated in areas likely to contain potentially
explosive atmospheres, e.g. Petrol/Gas stations.
3- Operation of any radio transmitting equipment may interfere with the
functionality of inadequately protected medical equipment. All
electronic equipment may also be subject to interference.
4- All documentation within this service manual must remain confidential
and should not be shared with any unknown 3rd party, without written
consent from Toshiba MCD, UK.
Cautions
1- Servicing and alignment must be undertaken by qualified personnel
only.
2- Ensure all work is carried out at an ESD protected work station.
3- Ensure that the qualified technician is wearing all necessary ESD
protective clothing such as wrist straps and heel straps.
4- Ensure solder, wire and/or other foreign matter do not enter the
handset as damage may result.
5- Use only approved components as specified in the parts list.
6- Ensure all components are correctly refitted after servicing and
alignment. Ensure all mechanical fittings are reassembled correctly.
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1.2 ESD (Electro Static Discharge)PROTECTION
SERVICE REQUIRMENTS
1- Toshiba require that all TPSV’s ensure that the technicians work bench
has sufficient ESD protection.
2- Accessories such as batteries, chargers, multimedia cards and sim
cards can be replaced in normal conditions (Non ESD protected
environment).
3- A mobile handset contains many parts such as LCD’s and cameras.
These parts, along with more discreet components such as resistors
and capacitors are susceptible to ESD.
4- Metallised protective bags must be used during any transportation of
ESD sensitive parts, including the PCB.
5- All repair actions other than accessory replacement, must be
conducted under ESD protection.
Should you require any further information on ESD please refer to
www.static-sol.com
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2.0 HANDSET
SPECIFICATION AND
INTRODUCTION
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2.1 HANDSET SPECIFICATION
2.2.1 HARDWARE
Item Description Remark
Frequency
Display
Camera
Bluetooth
FM Radio
IrDA
Multimedia Chip
Audio Codec
System Memory
EGSM-900(880MHz– 960MHz).
Three-band
GSM-1800(1710MHz– 880MHz)
PCS-1900(1850MHz– 990MHz)
1.93" 176X220 TFT Citizen
1.3 Mega CMOS
w/o Marco
V1.2
Power Class: Class 2 or 3
Max Size of data of phone
Vender: CSR
Chipset: BC3-ROM
Support: v1.2
memory : 350KB
with RDS Silicon Lab SI4701
N/A
AIT 811T Support MP3, 1.3 M, T-flash
Wolfson
256Mb(NOR) + 64Mb(SRAM) Study Nuro bit type
Built-In Memory
External Memory Card
Base Band
RF
Option
1024Mb Micro SD Flash
AD6527 + AD6537B
CX74117+CX77328
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2.1.2 SOFTWARE
Item Description Remark
WAP
MMS
DRM
IMPS
Java
Doja
KVM
JSR-75 PDA PIM & FC
JSR-120 WMA 1.1
JSR-135
JSR-205 WMA 2.0
JSR-234 Advanced
Multimedia Supplements
JSR-248 Mobile Service
Architecture for CLDC
JSR-185 JTWI
WAP 2.0
OMA 1.1
Ver. 1.0 Openwave
Ver. 1.2 Magic4
Yes Esmertec
N/A
yes JTWI 1.0
yes
Yes
Yes
Yes
N/A
N/A
Yes JTWI (Mandatory: JSR-30
CLDC 1.0 + JSR -120
Wireless Messaging API +
JSR-118 MIDP 2.0)
(Conditional: JSR-135
MMAPI (mobile multimedia
API) + JSR-139 CLDC 1.1)
Text Input
SynML DS
SynML DM
Email
QR code recognition
T9 Input 6.1.3 TBD, define by Toshiba
1.1.2 ExtendSI
N/A
POP3/SMTP
N/A TBD
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2.1.3 PHYSICAL SPECIFICATION
Item Description Remark
Detail Features
Air Link Protocol
GPRS
EDGE
Physical Features
Form Factor
Dimension
Weight
Display Features
Resolution
Dimension
LCD Technology
Reflective Type
Reflective Ratio
NTSC Ratio
Contrast Ratio
Brightness
Response Time
View Angle (Up/DL/Left/Right)
Class10
----
Candy Bar
113*47*10.3mm
84g (AL) ; 81g(Ma)
176X220 (w*h)
1.93"
TFT
Transmissive type w/o
Micro reflective
1.0%
>40%
200:1
150 cd/m2
Max 40msec
(15,65, 35,35)
Storage
Embedded SRAM
Embedded NOR Flash
External Memory Card Slot
Embedded User Storage
Camera Feature
Sensor Type
Resolution
Focus Type
Optical Zoom
Strobe Type
External Flash
Synchnoization
64M bit
32MByte
1024MB Micro SD Flash
7480KB (share W/NOR)
CMOS
1.3M
Fix Focus
N/A
N/A
N/A
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2.1.4 VIDEO SPECIFICATION
Item Description Remark
Video Codec Feature
Digital Zoom capability
Still image output format
Video Decode Capability
(MPEG4/H263)
Video Decode Capability
(H264/AAC)
Video Encode Capability
(MPEG4/AMR)
Video Phone (MPEG4/H263)
Streaming (Progressive
Download)
2 way Streaming
3G - H.324M
Pocket Video Player
RealPlayer
MS-Multimedia Player
Video Recording while Video
Playback
Dvix Support
Audio Codec Features
Audio Chip
Audio Encode Capability
Audio Decode Capability
FM Recording
Melody Support
Interface
MP3
MP3 ring tone
Battery standby time
Battery Voice talk time
Battery Capacity
X8
BMP, JPEG, GIF, PNG
CIF @ 15fps
N/A
CIF @ 15fps
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Wolfson WM8976
AMR
AMR/MP3(H/W)/AAC+
N/A
Poly40 (TBD)
I2S (MP3), ADI-AD6537
(ringtone)
Yes
Yes
> 150Hours
> 2.5hrs
700mAh Lishen
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2.1.5 OTHERS
Item
Description Remark
SIM
STK Release 98
STK Release 99
STK Class
SIM Lock
CPHS
USSD
Multimedia Message
WAP
SMS
SMS - Cell Broadcast
EMS
MMS
i-Mode
E-Mail
DRM
IMPS
Mobile QQ
PoC (Push to Talk)
Data Exchange
Yes
Yes
3
Yes
V. 4.2 (excluded IN &
CSP)
Phase 1 & 2
2.0
Yes
Yes
Yes
Yes OMA 1.1
N/A
POP3/SMTP
DRM 1.0
Yes V1.2
N/A N/A (need to purchase)
N/A
OBEX
SynML DS
SynML DM
FOTA
IrDA
Yes
1.1.2
N/A
N/A
N/A
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2.1.5 OTHERS CONTINUED
Item
Wifi
USB
Mass Storage
Java
Doja
KVM
JSR-75 PDA PIM & FC
JSR-82 Bluetooth API
JSR-120 WMA 1.0
JSR-184 3D (OpenGL)
JSR-205 WMA 2.0
JSR-234 Advanced
Multimedia Supplements
JSR-248 Mobile Service
Architecture for CLDC
JSR-185
Description Remark
N/A
Yes 1.1
Yes 7480KB for user memory
Yes
N/A
Yes JTWI 1.0
Yes
N/A
Yes
N/A
Yes Yes
N/A
N/A
Yes JTWI (Mandatory: JSR-30
CLDC 1.0 + JSR -120
Wireless Messaging API +
JSR-118 MIDP 2.0)
(Conditional: JSR-135
MMAPI (mobile multimedia
API) + JSR-139 CLDC 1.1)
Voice Recognition
Speaker Dependent
Speaker Independent
Text to Speech
USB Features
USB drive
Webcam
PC software
Others
Image Stabilization
Motion Detection
Digital TV Support
3D Capability
FM Radio
FM Transmitter
TV Output
Pic Bridge
Instant ON
Yes
N/A
N/A
Yes
Yes
Yes
N/A
N/A
N/A
N/A
With RDS
N/A
N/A
N/A
N/A
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2.1.6 PRODUCT OVERVIEW
The TS605/TS2050, is a slim and very stylish product that boast all of the
features that you would expect as standard. Although the product
incorporates a simple 1.3 mega pixel camera, the display really does show off
the high quality of images with excellent detail. Along with the many features,
the product is of the easiest to use and with the simple menu structure, even
people whom are new to phones will find this very easy to use. There is a slot
for a micro SD card, up to 1Gb and then you can really get in to the handset
features by downloading video clip and mp3’s that you can listen to either via
the loudspeaker or the Handsfree headphone.
The handset only has one external connector. This is used for the headset,
the charger and connectivity via the PC suite. The PC suite allows you to
connect your handset directly to the PC and transfer files to and from the
memory card and user memory. This enables a very quick transfer of the
many types of file the handset supports.
Another way to transfer files is by Bluetooth connection. Bluetooth will enable
you to connect to many different devices, such as headsets and other
handsets.
Also boasting in this small package is an FM radio with RDS (HF acts as
antenna).
There are many different features to the TS605/TS2050 and of course, it will
support all the features you would expect in a 2.5G handset such as,
messaging(MMS/SMS/Email), Java, WAP, GPRS.
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2.2 INTERFACES
2.2.1 SIM CARD INTERFACE
Your SIM card identifies your phone on the network and stores your details,
including your PIN, call history, and subscription information. It can also be
used to store some phone book data.
You should only remove your SIM card when absolutely necessary. If it is lost
or damaged, the information stored on it cannot be retrieved.
Inserting / Removing the SIM Card
Turn to the back of your phone to locate your battery room. To insert or
remove the SIM card (Step 1-5):
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2.2.2 MEMORY CARD INTERFACE
Your Phones supports a microSD card up to 1GB. The memory card slot is
located under the battery. The battery cover is located on the rear of the
phone.
Inserting / Removing the Memory slot
Turn to the back of your phone to locate your battery room. To insert or
remove the Memory card (Step 1-5):
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2.2.3 BATTERY INTERFACE
The battery included with your phone is not charged. Before you can switch
on your phone for the first time, you need to install the phone's battery and
charge it.
Inserting or Changing the Battery
To insert or change the battery:
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2.2.4 Charging the Battery
To charge a battery:
During charging, there will no indication on the phone screen.
Please keep the phone charge for a white before you disconnect the charger.
Disconnecting the charger
To disconnect the charger, grip it tightly and pull. You should disconnect the
charger from the power outlet before disconnecting the charger from the
phone.
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2.2.5 Charging Indicator
The first time you charge your battery, you should leave it charging for 8 hours.
The battery only achieves optimum performance after two or three complete
charges.
When the battery power is low, the phone starts beeping and "Battery Low"
will be displayed. When in use and during charging, the indicator shows the
following icons:
Icon Description Icon Description
Battery empty
Battery nearly full
Battery nearly empty
Battery full
Battery half
When the battery is fully discharged, the charging indicator is not displayed
and will not appear after the phone has recharged sufficiently.
Note1: Always turn off the phone before removing the battery.
Note2: Please note if the battery is fully empty and does not use for a couple
Of days ,when you charge again, there maybe no charging indication
Shown on the handset until after maximum half an hour.
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2.3 HANDSET UI
2.3.1 HANDSET DESCRIPTION
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2.3.2 KEY FUNCTIONALITY
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2.3.3 Display Concept – Main
No. Icon Description
1
2
3
4
5
6
7
8
Signal Strength (lower to high)
Roaming
Keypad lock
Appointments
Bluetooth (active/connecting)
Phone set to mute/Vibrate
Alarm Set
Message indicator
9
Battery level ( empty to full)
10
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Headset
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2.3.4 MAIN MENU
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Menu Structure
Key Main
Menu
Settings
Browser
Tools
Camera <View Finder>
Messages
2nd Level
General
Display
Sounds
Connectivity
Homepage
Bookmarks
Settings
Scheduler
Alarm
Appointments
Tasks
Notes
Voice Memo
Calculator
Unit Converter
Countdown
Create
Inbox
Outbox
Drafts
Templates
Messenger
Cell Info
Memory Status
Settings
Key Main Menu 2nd Level
Entertainment
Contacts
My Player
My data
Calls
STK* SIM related
Shortcuts
Games
Composer
View contacts
View groups
Special
numbers
Quick call
Advanced
Memory status
FM Radio
Tracks
Last Played
Playlists
Voice memo
Background
MP3
SIM card
Memory card
Call history
Clear history
Call Settings
functions
Fast keys
Hot keys
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2.4 MMI TEST
The MMI test application is provided to check or adjust the mobile workability.
Dial *#369#* to enter the test mode. Please notice the items 4,5,6 are for
production and for special purpose, don’t change the default value arbitrarily
or may cause mobile malfunction.
1. Contrast: Up& Down to adjust; Ok to save and exit.
2. Test baseband: Up& Down to chose item; Select to enter.
Illuminate: enter and see if the backlight on; OK to exit.
Buzzer: enter and listen if the speaker gives sound, OK to exit.
Vibrator: enter and check if the vibrator on, OK to exit.
Keypads: press each key to eliminate the indicators on screen. Long
press RSK to exit.
RTC status: enter and check the result of “RTC OK”; OK to exit.
Microphone speak test: talk to microphone and listen the sound from
receiver; OK to exit.
LCD Test: scroll up/down to sequentially display different colors.
Black/ White/ None/ Blue/ Green/ Red/ RGB/ W&B Mix
Any key to exit.
Voice memo: test the voice recording function.
FM radio: test FM radio function.
3. Software Version: Check the current software version
4. DTM: For production test. Determine if DTMF function valid during calling.
5. Com port:
AT-DATA: set phone jack for special D/L port, ex: IMEI burning.
GENIE: for RD specific RF testing
Off: for endures in normal use
6. Mapping version: Check the current mapping version.
7. Language version: Check the current language version.
8. Auto answer
Camera
: activate camera function
: For production test. Valid setup when insert test SIM
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MECHANICAL
CONCEPT
3.0
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3.1 Exploded View
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EXPLODED VIEW CONTINUED
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3.2 SPARE PARTS LIST - MECHANICAL
Ref No Description Part Number
1 TOP CASE ASSY VI5 TBD
1.1 TOP CASE VI5 33VI5TC0I01
1.2 ANTENNA FPC DQ663196502
2 BASE CASE ASSY VI5 SILVER EAVI5002017
3 MIDDLE CASE ASSY VI5 36VI5MC0I06
4 RECEIVER (SPK 320OHM) DN1D109B002
5 SPEAKER 8 OHM 97DB(0.5W,DSH929-001) DNDSH929001
7 BATTERY COVER EAVI5003013
8 CABLE ASSY VI1 ANTENNA DD0VI1TH209
9 LCD SHIELD VI1 FBVI1008011
10 GLUE LCD SHIELD JXVI1016015
11 MAIN LCD LENS BLACK JXVI1001026
12 GLUE MAIN LCD LENS JXVI1003011
13 KEYSET VI5 BLACK ENG EEVI5001014
14 ANTENNA HOLDER VI5 EBVI5001011
15 MOTOR DC 3V 13500RPM(MVMF-A270J) AY010314311
16 SCREW M1.6*4.0 MS16040IKQ8
17 SCREW M1.6*2.0 MS16020IVJ0
18 CARKIT RUBBER GAVI5001011
19 GASKET CMOS GBVI1003010
20 CMOS LENS JXVI5002019
21 GLUE CMOS LENS JXVI5003015
22 MYLAR SPEAKER FCVI1008012
23 VI5 SPS MB/KB/LCD ASSY TBD
23.1 M/B 21VI1MB0022
23.2 K/B 22VI5KB0002
23.3 MYLAR1 LCD SUPPORT FCVI1001018
23.4 MYLAR2 LCD SUPPORT FCVI1002014
23.5 MYLAR3 LCD SUPPORT FCVI1003011
23.6 LCD SHIELD VI1 FBVI1008011
23.7 GLUE LCD SHIELD JXVI1016015
23.8 GASKET CMOS GBVI1003010
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3.3 SPARE PARTS - PHOTO
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DISASSEMBLY
4.0
AND
REASSEMBLY
PROCEDURE
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4.1 DISASSEMBLY
Purpose：Change defect mechanical parts
Tools: Black Sticker, T5 and Tweezers
T5
Tweezers
Black Sticker
Tools :T5 and Tweezers
and Black Sticker
Remove the Battery
Cover
Remove the Battery
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Take out Car kit rubber
Release 2 screws
Using Black Sticker to lift
up the Top Case from the
Base Case.
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Using Black Sticker to lift
up the Top Case form the
right side.
Using Black Sticker to lift
up the Top Case from the
left side.
(be care do not damage
the Bluetooth Antenna)
Let the Top Case upward.
And remove the Key Set.
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The Motor (vibrator) can
be pulled up when use
tweezers.
Remove the receiver
Release 2 screws of
middle case
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Separate Key PCB from
the Antenna Holder.
Separate the Antenna
Holder from Base case
Use Black Sticker to raise
the PCB module from the
Base Case.
Use Black Sticker to raise
the PCB module from the
Middle Case.
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tear off mylar of Speaker
Remove the speaker.
(Carefully not to damage
the SPK’s pin.)
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Detach the Key PCB
coaxial cable head from
the Key PCB & M/B
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4.2 REASSEMBLY
Assemble Middle Case
on Base Case
Make sure hook on the
position as shown
Assemble Antenna
Holder on Base Case
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Tear off paper of
speaker.
Place the Speaker on
the Base Case.
(remind:be care the
pins of speaker, don’t
damage)
Stick Mylar on Speaker
Stick Mylar on USB
Conn as shown
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Mount the Key PCB
coaxial cable head on
the Key PCB & M/B.
Tear off protect film of
CMOS
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Assemble USB into
Base Case then
assemble M/B to base
case as shown
Tear off tape paper of
base case as shown
then assemble K/B on
base case
Pls push the coaxial
(antenna) cable to the
bottom of M/B
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Tighten 2 screws on
middle case
(Torque: 0.5+/-
0.1kgsf/cm2)
Tear off tape paper of
Receiver then assemble
on Top Case
Tear off tape paper of
Motor then assemble on
Top Case as shown
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Place Keyset on Top
Case
Assemble the Top Case
with the Base Case as
shown.
(Be care the Motor line)
Take care and do not
damage Bluetooth
Antenna
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Position Top Case hook
as shown
Tighten 2 screws
(Torque: 0.5+/-
0.1kgsf/cm2)
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Tear off tape paper of
Main Lens Glue
Stick on the main Lens shielding
Clean the LCD and Main
Lens
Then assemble LCD
Main Lens
Tear Cmos lens tape
paper
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Stick CMOS Lens
Assemble Carkit Rubber
as shown
Install the Battery
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Position the Battery
Cover
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SOFTWARE
5.0
DOWNLOAD
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5.1 SOFTWARE DOWNLOAD
5.1.1 DOWNLOAD CABLES
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5.1.2 DOWNLOAD TOOL
Core Software
Download
Mapping
Language Pack
Header (encrypted)
Download Setting (Mem. address, FFS...),
PMC code
Agent
(Encrypted Raw Data)
Target
(Encrypted Raw Data)
MBF file
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5.1.3 EQUIPMENT SETTING
PC
D/L Cable
• Keep handset off before downloading software
• Endure that battery capacity is suitable for duration of download
procedure
Handset
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5.1.4 MAIN PROGRAM INTERFACE
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When you have connected the cable to the handset, switch it on and the USB
connection will detect automatically.
1 – Load the specific configuration file and check the configuration
2 – Wait until “Press Power is showing
3 – Long press mobile power key and follow the indication on screen
4 – Click Reset when finished
5 – Disconnect the download cable from the mobile
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5.1.5 BACKUP TOOL
Program Functions
- Clear: Erase all user data
- Backup: Copy the user data to PC. The data is saved as an encrypted
file with a .mot extension, under the tool installed directory
- Restore: restore user data to handset
Backup Tool Procedure
1 – Insert download cable and keep mobile power off
2 – Execute the Backup Tool Program from the Start menu
3 – Select your required function (clear/backup/restore)
4 – Press power key of the handset to start the process
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6.0
SYSTEM MODULE
AND
USER INTERFACE
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6.1 TECHNICAL DESCRIPTION
6.1.1 RF OVERVIEW INTRODUCTION
General Specifications
The telephone is a Tri-Band product. The transmit and receive bands for the
mobile are given in the table below:
TX RX
E-GSM 900 880-915 MHz 925-960 MHz
GSM 1800 1710-1785 MHz 1805-1880 MHz
PCS 1900 1850-1910 MHz 1930-1990 MHz
Other salient technical features are as follows:
E-GSM 900 GSM 1800 PCS 1900
RX Bandwidth 35 MHz 75 MHz 60 MHz
TX Bandwidth 35 MHz 75 MHz 60 MHz
Number of Channels 174 374 299
AFRCN (Channel
Numbers)
1st TX Channel
Last TX Channel
1st RX Channel
Last RX Channel
Maximum TX Power
Minimum TX Power
124
975-1023
880.2 MHz
(Ch 975)
914.8 MHz
(Ch 124)
925.2 MHz
(Ch 975)
959.8 MHz
(Ch 124)
33.0 dBm
(Class 4)(PL 5)
5.0 dBm
(PL 19)
512-885 512-810
1710.2 MHz
(Ch 512)
1784.8 MHz
(Ch 885)
1805.2 MHz
(Ch 885)
1879.8 MHz
(Ch 885)
30.0 dBm
(Class 1)(PL 0)
0.0 dBm
(PL 15)
1850.2 MHz
(Ch 512)
1909.8 MHz
(Ch 810)
1930.2 MHz
(Ch 512)
1989.8 MHz
(Ch 810)
30.0 dBm
(Class 1)(PL 0)
0.0 dBm
(PL 15)
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6.1.2 RF FUNCTION BLOCK DIAGRAM
SKY77328
SKY74117
26MHz
XTAL
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6.1.3 FREQUENCY PLAN
The TX frequency plan is shown below
TX frequency
plan
TX frequency TX IF TX RF LO
EGSM 900 880.2-914.8MHz 88.46-114.35MHz
GSM 1800
PCS 1900
1710.2-
1784.8MHz
1850.2-
1909.8MHz
90.316-
104.776MHz
97.379-
112.341MHz
1459.59-
1543.725MHz
1354.737-
1414.482MHz
1460.684-
1516.606MHz
Figure Receiver block frequency plan
General
RF circuit design is built based on SKYWORKS-74117 direction
conversion transceiver IC integrated by SAW filters, power amplifier with
control circuit, and Transmitter/receiver switch.
RF LO always requires 26MHz for reference provided with external XTAL
and internal oscillator circuits. And LO frequency is periodically re-tuning to
synchronize with cell or network.
Antenna
TS10‘s antenna is designed for embedded type and this design is fabricated
on a FPC. It supports triple band applications.
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6.1.4 TRANSMITTER
SKY77328
SKY74117
Figure Transmitter block diagram
TX path is a translation loop architecture consisting of an IQ modulator,
integrated high power VCO, offset mixer, programmable divider, PFD,
charge pump, and power amplifier with its control circuit. The device consists
of an In-phase and Quadrate (I/Q) modulator within a frequency translation
loop designed to perform frequency up-conversion with high output spectral
purity. Clock source is an external 26MHz XTAL with internal oscillator
circuits instead of VCTCXO function block active.
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6.1.5 RECEIVER
GSM
DCS
PCS
Figure Receiver block diagram
RX path is a direction down conversion architecture that eliminates the need
for Intermediate Frequency (IF) components. The device includes three
bands integrated LNAS, a quadrate demodulator, baseband amplifier circuit
with I/Q outputs and three stages of DC-offset correction. The DCOC
correction loop ensures DC-offsets, generated in SKY74117, do not overload
baseband chain. The receiver can be calibrated to optimize IP2 performance,
which ensures limited baseband interfering signal amplitude. The SKY74117
also features an integrated, fully programmable, sigma-delta fraction-N
synthesizer suitable for GPRS multi-slot operation.
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6.2 BASEBAND OVERVIEW
6.2.1 INTRODUCTION
The baseband block of the handset performs the following functions:
Equalization
Channel coding / decoding
Speech coding / decoding
Data Encryption
Layer 1, 2 and 3 software tasks
Man Machine interface (MMI)
System Interface
SIM Interface and Management
Audio and Tone Generation
Power supply and battery management
RF power control
Synchronization
Real time clock
The baseband block is built from a GSM solution platform developed by
Advanced Devices Inc. The solution platform contains two main chips. One
chip (AD6527B) carries out signal processing functionality with integrated
DSP and CPU; the other chip (AD6537B) contains analogue interfaces and
power management circuitry. Both of them are very powerful and efficient
due to its highly integrated nature of technology.
Figure Baseband block diagram
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Digital Baseband Processor
GSM processor ADI AD6527B
Package 204 -Ball CSPBGA
Features
Complete single chip GSM Programmable Digital Baseband Processor
divided into three main subsystems:
1.Control processor subsystem including
32-bit MCU ARM7TDMI control processor
58.5 MHz operations at 1.8V
1Mb on-chip System SRAM Memory
2. DSP subsystem including
16-bit Fixed-out DSP Processor
91 MIPS at 1.8V
Data and Program SRAM
Program Instruction Cache
Enhanced full rate and Half Rate Speech Encoding / De coding
Capable of Supporting PDC,AMR Speech Algorithms
3. Peripheral Subsystem including
Shared Peripheral Bus and Interface Peripherals
Figure AD6527B Functional Block Diagram
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6.2.2 CPU MEMORY
To reduce component space, the phone uses a BGA package with Dual
operation Flash memory and SRAM MCP.
The following memory configuration is used:
256Mbits Flash memory organized as 16M * 16bits
64Mbits Pseudo RAM organized as 4M * 16 bits
6.2.3 REAL TIME CLOCK (RTC)
Real Time Clock function is provided by a RTC block module embedded in
AD6527B. The module is synchronized to an external 32.768 kHz crystal and
has a backup power source using an external RTC battery. AD6527B also
provide clock auto compensation function if clock frequency drifts with
temperature change, frequency drift can be compensated by writing
compensation registers. This functionality allows the application software to
implement standard, calendar, or organizer functions such as:
Time and date display
Programmable alarm
Programmable mobile activation
The RTC interrupt is routed through the IRQ-controller to the MCU or the
DSP, as defined by software in interrupt configuration registers.
6.2.4 LCD MODULE
The LCD module (panel: 176*220, TFT), white LED backlight module and
driver chip. Driver chip is connected to the main PCB via a flexible PCB strip.
The LCD driver is controlled by setting the command register from the
AD6527 u-wire interface, signals then bypassed through camera backend IC
(AIT811) to LCD driver. An I/O line (H_LCD_A0) is used to distinguish
transferring command or data.
6.2.5 CAMERA AND BACKEND IC
A powerful camera backend IC (AIT811) is used for camera signal
processing, the on-chip processor implements versatile features of digital still
camera like AE (Auto Exposure), AWB (Auto White Balance), digital room
and some image special effects. The maximum supported resolution is VGA
(640*480).
AIT811 also contains many features, which are suitable for mobile phone
camera applications including hardware JPEG coding/encoding, 2D graphic
engine and hardware color DSP.
The camera module is consisted by lens, CMOS sensor, mechanical hosing
and a flexible PCB strip. The maximum resolution of CMOS sensor is also
640*480.
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6.3 SWITCHES
6.3.1 KEYPAD
The keypad matrix contains 4 rows and 5 columns, allowing 20 keys to be
scanned. When a key is pressed, a keypad interrupt is generated. Then
system scans each column in turn and reads which row is active to
determine which key is pressed. Because of key bounce, the key press is
confirmed twice at approximately 40-60 ms intervals.
Figure Keypad Connections
6.3.2 POWER KEY
The two terminals of POWER key are connected to ground and
POWER_KEY pin of AD6537B. POWER_KEY pin is connected to high
voltage through internal resistor of AD6537B. When user presses the
POWER key, POWER_KEY pin is pulled low and a key interrupt is
generated. System will be booted-up unless key press longer than 2 seconds
to prevent user mis-pressing the POWER key.
Figure Power Key Connections
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6.4 AUDIO SYSTEM
Figure Audio system block diagram
AD6537B is a complete mixed-signal baseband processor that combines all of
the data converters and power supply regulators required for GSM 900 /GSM
850 /DCS 1800 / PCS 1900 mobile on a single device, including HSCSD and
GPRS. The AD6537B auxiliary section provides a voltage reference, an
automatic frequency controller, an auxiliary ADC, and light controllers. It also
provides three differential Voiceband input and output ports. Voiceband
output1 is used in normal receiver mode, while output3 is used as earpiece
receiver mode or loud speaker mode by analog switch. About input ports,
Voiceband input1 is used for microphone and input2 is design for earpiece
microphone.
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6.4.1 VOICE BAND CODEC
Chipset ADI AD6537B
Package 148-Ball LFBGA
Baseband Transmit Section
GMSK Modulator
channel & Q-channel Transmit DACs and Filters
Power Ramping DAC
Baseband Receive Section
channel and Q-channel Receive ADCs and Filters
Auxiliary Section
Voltage Reference
Automatic Frequency Control DAC
Auxiliary ADC
Light Controllers
Audio Section
8 kHz & 16 kHz Voiceband Codec
48 kHz Monophonic DAC
Power Amplifiers
Power Management Section
Voltage Regulators
Battery Charger
Battery Protection
Digital Processor Interface
Control, Baseband, and Audio Serial Ports
Figure AD6537B Functional Block Diagram
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About handset power management, AD6537B is designed to supply all the
required power in the platform. It provides seven regulator outputs, including
VCORE (1.8V), VMEM (2.93V), VEXT (2.93V), VABB (2.45V), VRTC (1.8V),
VCTCXO (2.75V), VSIM (2.85V), and VMIC (2.75V). VCORE and VMEM
supply the power of all digital signals and VABB supplies all the analog power.
VRTC is used to charge the RTC battery for real time clock module, and
VCTCXO is the power source of the system clock. A hardware-reset pin can
reset all the registers and power supply when system is booted-up. The
following is the detailed description:
6.4.2 MICROPHONE
This handset uses SMD type microphone for better mechanical flexibility.
Their noise canceling mechanisms also provide improved speech pick-up,
noise immunity and reduced echo. The GSM standard requires the
transmitter audio frequency response must fit within a mask as shown in
Figure 5.11, there is no need of frequency response modification when using
the SMD microphone.
Figure Handheld GSM Transmit Audio Frequency Response Mask
6.4.3 RECEIVER
The GSM Standard requires that the receiver audio frequency response
must fit within the mask shown below
Figure Handheld GSM Receive Audio Frequency Response
The frequency response of receiver is adjusted by DSP filter to the meet
requirements of a type 3.2L artificial ear.
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6.4.4 SPEAKER
A second speaker is housed in the back case for melodies and ring tones.
6.5 POWER MANAGEMENT
The block diagram of power management sub-system is shown below:
LCD Memory
VMEM
Power on detection
and latching
NReset
RTC
Circuit
26MHz
VRTC
Power
Management
part of
AD6537
AD6527
VBAT
SIMVCC
VCORE
VMEM
VCORE
VABB
VMEM
Battery
Charging
Circuit
SIM
Circuit
Figure Power Management Subsystem Block Diagram
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6.5.1 POWER ON SEQUENCE
When the user presses the power key, KEYON pin of AD6537B is pulled low; all
the LDOs required for system boot will be turned on at the same time. Then
AD6537B pull low the KEYROW4 pin of AD6527B by KEYOUT pin, and system
monitors this pin for 2 seconds to make sure the key event is not a key mispressing. After 2 seconds, PWRON pin of AD6527B will trigger DBBON pin of
AD6537B and system is booted up successfully, AD6527B also turns RF block /
key LEDs / LCD backlight on at the same time, then boot procedure is completed.
User Press Power Key
AD6537B
KEYON
LDOs
VCORE / VMEM /
VEXT / VTCXO
ON
KEYOUT
DBBON
AD6527B
KEYROW4
> 2 seconds
PWRON
CLKON
RF Block ON / Key LED ON / LCD Backlight ON / System ON
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6.5.2 POWER SOURCE
The battery used is a single Lithium-Ion (Li-Ion) cell with a nominal voltage of 3.7
V and 700-mAh capacity. T Li-Ion type of battery has an advantage in weight and
size over Nickel Metal Hydride (NiMH) cells.
6.5.3 REGULATOR CONTROL
The voltage regulators are enabled or disabled based on the remaining capacity
of the battery. If the AD6537B is in Deep Discharge Lockout (DDLO), UnderVoltage Lockout (UVLO) or Thermal Shutdown Mode, only the Real-Time Clock
regulator is active. If the battery is not in Deep Discharge Lockout, Under-Voltage
Lockout, or Thermal Shutdown, the Real-Time Clock regulator and the voltage
reference regulator are always enabled. Other regulators are enabled or disabled
based on the input of the user or software. If user presses the power-on key
(KEYON pin of AD6537B),or a charger is plugged(CHGDET pin of AD6537B), the
regulators required to boot the system are enabled. If the software asserts the
DBBON signal, the regulators required to maintain the software state are enabled.
The VCXOEN signal enables the VCXO regulator for system clock power supply.
The analog regulator (VABB) can be enabled or disabled by writing registers.
6.5.4 VOLTAGE REGULATION
Following is the description of each power sources:
Digital Core Regulator (VCORE): 1.8 V
The digital core regulator supplies the baseband digital circuitry in the handset
(baseband processor and baseband converter). The regulator has been
optimized for very low quiescent current at light load since this regulator is always
turned-on whenever the handset is switched on.
Memory Regulator (VMEM): 2.8 V
The memory regulator supplies the system memory as well as the sub-systems of
the baseband processor including memory IO, and display interfaces. It is
capable of delivering up to
150 mA of current and is available for either 1.8 V or 3 V based systems. The
regulator has also been optimized for low quiescent current and its turn on timing
is the same time as the core regulator.
Analogue Baseband Regulator (VABB): 2.45 V
This regulator has the same features as the memory regulator. It has been further
optimized for better low frequency ripple rejection for use with the baseband
converter sections in order to reject the ripple coming from the RF power amplifier.
VABB is rated to 170 mA, which is sufficient to supply the analog section of the
baseband converter such as the AD6537B.
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TCXO Regulator (VTCXO): 2.8 V
The TCXO regulator is intended as a supply for a temperature compensated
crystal oscillator, which needs power supply with ultra-low noise. VTCXO is rated
to 20 mA output current and is turned on when TCXOEN is asserted.
RTC Regulator (VRTC): 1.8 V
The RTC regulator is used to charge the RTC backup battery needed by real-time
clock module. It also provide the power source directly to the RTC module. In
addition, it features a very low quiescent current since this regulator is running all
the time, even when the handset is switched off. It also has reverse current
protection with very low leakage current. When the main battery is removed, the
backup battery can supply RTC module when RTC regulator is unavailable.
Microphone Regulator (VMIC): 2.5 V
The Microphone regulator generates 2.5V power needed by microphone. It is
rated for 1 mA of supply current. This regulator is optimized for extremely high
rejection to power source noise around 217Hz frequency, which is easily
generated by RF power amplifier.
SIM Regulator (VSIM): 2.8 V
The SIM regulator generates the voltage needed by 1.8V or 3V SIM card. It is
rated to 20 mA of supply current and can be controlled independently from the
other regulators.
Applying a low to SIMEN shuts down the SIM regulator. A discharge circuit is
active when SIMEN is low. This pulls the SIM regulator output to low state when
the regulator is disabled. SIMVSEL allows the SIM regulator to be programmed
for either 1.8 V or 2.8V. Asserting a high on SIMVSEL sets the output to 2.8 V.
SIMEN and SIMVSEL allow the baseband processor to properly sequence the
SIM supply when determining which type of SIM card is inserted.
Peripheral Regulator(VEXT) : 2.8V
The external Interface regulator supplies the Radio digital interface and the high
voltage (>1.8V) interface between the digital baseband processor and various
peripherals, such as the LED indicators and the LCD display.
In this model, VEXT also supplies the power of AIT811 external interface, CMOS
module external interface and LCD module. Power loading of VMEM is highly
reduced by using VEXT instead, preventing the power instable of VMEM when
it's load is high.
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TROUBLESHOOTING
7.0
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7.1 MAIN TROUBLESHOOTING DIAGRAM
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7.1.1 NO POWER UP
Cause : PCB dead or Part jammed Phone
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7.1.2 FLASH FAILED
Cause : PCB dead or Min. USB has broken
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7.1.3 WILL NOT READ SIMCARD
Cause : PCB dead or SIM card holder has broken
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7.1.4 LOW / NO SERVICE
Cause : PCB dead or Antenna has broken
Low Receiving
Signal or can not
connect Network
Service Provider
Yes
NO
Check SIM card setting right? Refer to (Phone can not read SIM card)
Yes
NO
Check Antenna touching
correct ?
(1) Modify antenna location.
(2) Change (AN1101) antenna of PCBA
(3) Change or Clean the antenna of
Base rear case
Yes
Check Car kit being OK ?
NO
(1) Clean Car Kit (J1101) of PCBA
(2) Change Car Kit (J1101) of PCBA
Yes
NO
Re-Download
Refer to (Updating program is failed)
RF calibration again
Yes
NO
PCBA dead
(1) Check RF cable being right?
(2) Check Calibration setting being
correct ?
Yes
NO
(1) Change or Clean RF cable
(2) Re-setting Calibration
parameter
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7.1.5 WILL NOT CHARGE
Cause: PCB dead or Mini. USB has broken
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7.1.6 FAULTY LCD
Cause: PCB dead or LCD module has broken
Illumination
Testing
Restore factory setting
Fail
Re-Download
Yes
Check LCD FPC ACF ?
Yes
Check LCD FPC with U403
Connecting?
Yes
NO
Refer to (Updating program is failed)
NO
(1) Repair LCD FPC
(2) Change LCD
NO
(1) Repair U403
PCBA dead
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7.1.7 FAULTY BUZZER
Cause: PCB dead or Buzzer/Receiver has broken
Buzzer
Testing
Restore factory
setting
Fail
Re-Download
NO
Yes
Check the SPK/Receiver
Component ?
Yes
PCBA dead
Refer to (Updating program is failed)
NO
(1) Change Component
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7.1.8 FAULTY VIBRA MOTOR
Cause: PCB dead or Vibrator has broken
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7.1.9 FAULTY KEYPAD
Cause: PCB dead or Keypads has broken
Keypads
Testing
Restore factory setting
Fail
Re-Download
Yes
Check keyset being
OK ?
Yes
Check key metal dome
being OK ?
Yes
NO
NO
NO
Refer to (Updating program is failed)
(1) Clean and Re-assemble Keyset
(2) Change Keyset
Change Key metal dome
Check B2B FPC connecting
OK ?
repair ACF B2B FPC
Yes
PCBA dead
NO
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7.1.10 RTC FAULTY
Cause: PCB dead or RTC battery has broken
RTC
status
Restore factory setting
Testing
Fail
NO
Re-Download
Refer to (Updating program is failed)
Yes
Check (BAT101) of
PCBA
0.8 v
NO
Change (BAT101) of PCBA
Yes
PCBA dead
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7.1.11 MIC AND SPEAKER FAULTY
Cause: PCB dead or Microphone / Speaker has broken
Microphone
Speaker Testing
Earphone Fail ,
check Mini. USB port
Refer to (Charging can
not work)
Restore factory setting
Fail
NO
Re-Download Refer to (Updating program is failed)
Yes
Check B2B FPC connecting
OK ?
NO
repair ACF B2B FPC
Yes
NO
Check receiver assembling?
Re-assemble receiver component
Yes
NO
Check receiver being OK?
Change Receiver
Yes
PCBA dead
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7.1.12 LCD ERROR
Cause: PCB dead or LCD module has broken
LCD
Testing
Restore factory setting
Fail
No
Re-Download
Yes
Check LCD FPC and PCBA being connected
OK ?
Yes
Check LCD module being
OK ?
Refer to (Updating program is failed)
No
(1) repair ACF LCD FPC
No
(1) repair ACF LCD FPC
(2) Change LCD module
Yes
PCBA dead
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7.1.13 CAMERA FAULTY
Cause: PCB dead or CMOS has broken
Camera
Testing
Restore factory setting
Fail
Re-Download Refer to (Updating program is failed)
Yes
Check CMOS FPC and (J401)PCBA being
connected OK ?
Yes
Check Camera module being OK
No
No
No
Repair ACF CMOS FPC
(1) Repair ACF CMOS FPC
(2)change Camera module
Yes
PCBA dead
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7.2 CONNECTORS
7.2.1 Connectors on Board I
USB Connector
J500
RTC
BAT 101
Battery
Connector
J201
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7.2.2 ACF CONNECTIONS
LCD
Connector
J402
KEY FPC Conn
J302
CMOS
Connector
J401
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7.2.3 MAIN BASEBAND IC ON PCB
Backend IC
(AIT811)
U403
Memory
256+64mb
U102
GSM Processor
ADI 6527
U101
Power Controller
ADI6538B
U201
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MAIN BASEBAND IC’s continued:
Melody
IC
U503
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7.2.4 MAIN RF IC’s ON PCB
BlueTooth
IC
U1002
PA
(SKY77328)
U1101
Transceiver
(SKY74117)
U1201
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7.2.5 CONNECTORS ON KEYPAD MODULE
SIM HOLDER
J600
FLASH CARD
HOLDER
J1
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7.3 ACF – ANISOTROPIC CONDUCTIVE FILM
ACF is a reliable, cheap and efficient way of bonding. On the TS608 ACF
Technology has been used to bond the following components to the PCB
LCD Module
CMOS / Camera Module
Keypad Module
MP3 FPC Module
In order to replace such components, it must be understood the exact
requirements and exactly what is required.
Due to the high reliability accompanied by ACF technology it should be a
rare occurrence that means a replacement.
Consider the following diagrams to understand the actual bond.
As you can see, there are many particles spread across the PCB and FPC,
some are bonded and some are not. Because of the many particles, an open
circuit (dry joint) is unlikely as, if one particle goes open there are many more
to secure the connection. This same type of bonding has been used for
years on technologies such as Laptop’s. How many LCD’s have you seen go
blank on a phone and how many on a Laptop?
There are 2 ways of bonding. You can use ACF Tape and Shown below:
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The bonding particles are the small white dots that you can see on the clear
tape. Or you can use ACP or Anisotropic Conductive Paste.
There is a very much set process when it come to replacing ACF Parts.
There is a cheap way, which is highly unreliable and not authorised and
there is the correct way.
You must consider the type of environment that is required for ACF
replacement.
ESD
Dust, Ionized Atmosphere
Correct Tape or paste
Temperature controlled spot Heater
ESD Tools
ACF Hot Bar Machine
Handset Specific Jig
All of these Items are essential. Please consider the following Pictures:
ACF Hot Bar Machine
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Handset Specific Jig
Paste
This equipment along with the correct materials and procedures MUST be
used for ACF parts replacement.
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