1 VBat Battery Supply Pin
2 Battery ID Battery ID Resistor Pin 10Kohm
3 GND GND
Standard Battery 700mAh Li-Ion
Type: Lithium Ion Rechargeable Battery
Capacity 25°C: 700mAh
Standby time: up to 100 hours.
Talk time (1900MHZ): 30dBm: 2.5 hours 3 hours*
Charging time: 1½-2 hours approximately to full capacity.
Charge temperature: 0 to +45°C.
Discharge temperature: -20 °C to +60°C.
Cycle life 100% cap. to 80% cap. 500 cycles.
Energy Density 344Wh/I 150Wh/kg
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 4/5
Dimension (W x H x L): 4.70 T x 35.70W x 47.05 L mm.
Weight: about 15.0 g.
*Operating times depend on network and usage. Variability will occur. DTX +40% (included).
Storage temperature:
Short period <1 month: -20°C to +45°C.
Long period <1 year: -20°C to +25°C.
▪ I/O Connector layout : 18pin
Pin description
Pin 1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
EJ_Out_L Headset Receiver Left
EJ_Out_R Headset Receiver Right
GND GND
EJ_Mic Headset Mic Input
GND GND
EJ_GND Headset GND
NC NC
Headset Interrupt Headset Interrupt
Power_On_Off Power On Off
USB_DM USB D+ input / Output
USB_DP USB D- input / Output
RXD UART RX
TXD UART TX
Charger/USB Power USB Power / Charger
Charger/USB Power USB Power / Charger
NC Not connected
VBAT Battery Voltage +3.8V
VBAT Battery Voltage +3.8V
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 5/5
Standard charger
MASS 2 is supplied with a SMTP charger as standard. The charger is connected to the Power
management IC through the bottom port.
Charging of the battery can only be carried out when the battery is fitted to the phone. There are no
serviceable parts within the main plug.
Input parameter Type Value Unit
Input voltage min 90 V
nom 230 V
max 264 V
Input frequency min 47 Hz
nom 50 Hz
max 63 Hz
Input current max 200 mA
Efficiency min >55 %
Output parameter Type Value Unit
Output current(CV) min 0.650 A
max 0.800 A
(CC) min 0.000 A
max 0.650 A
Output voltage(CV) min 3.0 V
max 4.9 V
(CC) min 4.9 V
max 5.3 V
Connector 18pin Bottom Connector
Cable length 1.8 m.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 1/11
Disassembly
This section covers the assembly and disassembly of SLT100 phone. In order to carry out the
assembly or disassembly the following precautions should be taken:
1. A Plus screwdriver is required to remove the four retaining screws, which holds the two casings
together. Ensure that the screwdriver is narrow enough to reach the screws without causing
damage to the casing parts.
2. The phone should always be placed on a soft surface to minimise the risk of damage being
caused to the casing, window and keypad. If the PCB is to be removed, then care should be taken
not to stress or scratch the exposed LCD.
3. Observe anti-static precautions when handling the main PCB or any of its components.
4. Repairs carried out by unauthorised persons will result in the warranty on the unit becoming
void.
5. Do not use solvents to clean any of the casing parts or the LCD window.
Phone disassembly
1.Battery Cover Disassembly
A. Shove battery cover out along the direction of arrow and remove battery cover.
B. Push up battery along the direction of arrow and remove battery.
A. Remove SIM card
B. Remove TF card
C. Remove four caps and six screws. Carefully separate two covers
(C and D)
3. Main PCB & Main keypad & Cap IO Disassembly
Separate Main PCB manual ASS’Y and Main keypad ASS’Y from c cover.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 3/11
4. Front cover & Deco rail Disassembly
A. Unscrew four slide unit screws from c cover
B. Remove deco rail from front c cover.
5. Slide unit & Stopper & B cover Disassembly
A. Remove two caps and four screws and carefully separate two covers
(A and B)
B. Unscrew six slide unit screws and remove slide unit
C. Remove slide unit
D. Pull off four stoppers from b cover
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 4/11
6. Lcd module & Keypad Disassembly
A. Remove LCD manual ASS’Y from a cover.
B. Remove keypad from a cover..
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 5/11
7. Main window Disassembly
A. Pull off main window from a cover.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 6/11
Phone Assembly
1.Top cover assembly
A. Attach the main window dt on the a cover
B. Attach the main window on the top cover.
2. LCD manual ASS’Y & slide keypad ASS’Y assembly
A. Group the slide keypad ASS’Y into the a cover.
B. Group the LCD bracket into the a cover
C. Group the LCD manual ASS’Y into the a cover
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 7/11
3. Slide unit & Stopper & B cover assembly
A. Thrust four stoppers in stopper hole.
B. Assemble the magnetic in magnetic position.
C. Assemble the slide unit with b cover.
D. Screw up four slide unit screws.
E. Attach the D/T decoration back cover.
F. Carefully group the b cover
G. Screw up four screws
H. Attach the two cap screws
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 8/11
4. C cover & Deco rail Assembly
A. Group the c cover with Deco rail.
B. Screw up four slide unit screws.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 9/11
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 10/11
5. Main PCB & Main keypad Assembly
A. Group the main keypad ASS’Y, shield can bb, key pcb and main PCB manual ASS’Y
with c cover.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 11/11
8. Sim card & screw & caps & d cover Assembly
A. Assemble the d cover.
B. Screw up six screws and put in four caps.
C. Put the TF card and SIM card in.
9. Battery Assembly
B. Put the battery back cover on in the arrow direction.
.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 1/59
Baseband section
This document provides a description of the baseband section of the MASS 2. Most design decisions are explained,
but no detailed calculations are included. Total chip solutions(MT6225, MT6318, MT6120) except for RF Power
Amplifier(RF3166) are from MediaTek, Taiwan.
I. MT6225 ( GSM/GPRS Baseband Processor )
1. System OverView
The MT6225 is a highly integrated single-Chip solution for GSM/GPRS mobile phone. Based on 32bit ARM7EJ-STM
RISC processor, MT6225 features not only high performance GPRS Class 12 MODEM but is also designed with
support for the wireless multi-media applications. But, the MEGA2 just supports GPRS Multi-slot Class 8 and GPRS
MODE CLASS B.
The Figure 1 is shown Typical Application for MT6225.
Figure 1 : Typical Application for MT6225
1.1 Platform Feature
zGeneral
-. Integrated voice-band, audio-band and base-band analog front ends.
-. Supports 8-bit or 16-bit memory components with maximum size of up to 64M bytes each.
-. Supports Mobile RAM and Cellular RAM
-. Supports Flash and SRAM/PSRAM with page mode or burst mode
-. Supports Pseudo SRAM
-. Industry standard Parallel LCD interface
-. Supports Multi-media companion chips with 8/16bits data width.
-. Flexible I/O voltage of 1.8V ~ 2.8V for memory interface.
zUser Interface
-. 6-row x 7-column keypad controller with hardware scanner.
-. Supports multiple key presses for gaming.
-. SIM/USIM controller with hardware T=0/T=1 protocol control.
-. Real Time Clock(RTC) operating with a separate power supply.
-. General Purpose I/Os (GPIOs)
-. 2sets of Pulse Width Modulation(PWM) output.
-. Alerter Output with enhanced PWM or PDM.
-. 4 ~ 10 external interrupt lines.
zSecurity
-. Supports security key for code protection
-. 143-bit unique/secret chip ID
zConnectivity
-. 3 UARTs with hardware flow control and speed up to 921600pbs.
-. IrDA modulator/Demodulator with hardware framer. Supports SIR/MIR/FIR operating Speeds.
-. Full speed USB 1.1 Device controller
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 3/59
-. Multi Media Card, Secure Digital Memory Card, Memory Stick, Memory Stick Pro Host Controller
-. Supports SDIO interface for SDIO peripherals as well as WIFI connectivity.
-. DAI/PCM and I2S interface for Audio application.
zPower Management
-. Power Down Mode for analog and digital circuits.
-. Processor Sleep Mode
-. Pause Mode of 32Khz clocking in Standby state
-. 7 channel Auxiliary 10bit A/D converter for charger and battery monitoring and photo sensing.
zTest and Debug
-. Built-in digital and analog loop back modes for both Audio and baseband front-end.
-. DAI port complying with GSM Rec.11.10
-. JTAG port for debugging embedded MCU.
1.2 Model Feature
zRadio Interface and Baseband Front End
-. GMSK Modulator with analog I and Q channel outputs.
-. 10-bit D/A convert for Uplink baseband I and Q signals.
-. 14bit high resolution A/D converter for downlink baseband I and Q signals.
-. Calibration mechanism of offset and gain mismatch for baseband A/D converter and D/A converter.
-. 10bit D/A converter for Automatic Power Control(APC)
-. 13bit high resolution D/A converter for Automatic frequency Control(AFC)
-. Programmable Radio RX filter.
-. 2 channels Baseband Serial Interface(BSI) with 3-wire control.
-. 10 pin Baseband Parallel Interface(BPI) with programmable driving strength.
-.Multi-band Support (GSM850, GSM900, DCS1800, PCS1900)
zVoice and Model Codec
-. Dial tone Generation.
-. Voice memo
-. Noise reduction
-. Echo suppression
-. Advanced sidetone Oscillation Reduction.
-. Digital sidetone generator with programmable gain.
-.Two programmable acoustic compensation filters.
-. GSM/GPRS quad vocoders for adaptive multirate(AMR), enhanced full rate(EFR), full rate(FR) and half rate(HR).
-. FR error concealment
-. GSM channel coding, equalization and A5/1, A5/2 and A5/3 ciphering
-.GPRS GEA1, GEA2 and GEA3 ciphering.
-. Programmable GSM/GPRS modem
-. Packet Switched data with CS1/CS2/CS3/CS4 coding schemes.
-.GSM circuit switch data.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 4/59
-. GPRS Class 12.
zVoice Interface and Voice Front End.
-. Two microphone inputs sharing one low noise amplifier with programmable gain and automatic gain control(AGC)
mechanisms.
-. Voice power amplifier with programmable gain.
-. 2’nd order Sigma-Delta A/D converter for voice uplink path.
-. D/A Converter for Voice downlink path.
-. Supports Half-duplex hands-free operation.
-. Compliant with GSM 03.50.
1.3 Multimedia Feature
zLCD/NAND Flash Interface
-. 18-bit Parallel Interface supports 8/16 bit NAND flash and 8/9/16/18 bit Parallel LCD
-. 8/16 bit NAND Flash Controller with 1-bit ECC correction for mass storages
-. 2 Chip selects available for high – density NAND flash device
zLCD Controller
-. Supports simultaneous connection to up to 2 parallel LCD and 1 serial LCD modules.
-. Supports LCM format : RGB332, RGB444, RGB565, RGB666, RGB888.
-. Supports LCD Module with maximum resolution up to 800x600 at 16bpp.
-. Supports hardware display rotation
-. Accelerated Gamma correction with programmable table.
-. Capable of combining display memories with up to 4 blending layers.
zImage Signal Processor
-. 8 bit YUV format image input.
-. Capable of processing image of size up to VGA
-. Flexible I/O voltage of 1.8V ~ 2.8V
-. RGB thumbnail data output.
zAudio CODEC
-. Wavetable synthesis with up to 64 tones
-. Advanced wavetable synthesizer capable of generating simulated stereo
-. Wavetable including GM full set of 128 instruments and 47 sets of percussions
-. PCM Playback and Record
-. Digital Audio Playback
-. HE – ACC decode support
zAudio Interface and Audio Front End
-. Supports I2S interface
-. High resolution D/A Converters for Stereo Audio playback
-. Stereo analog input for stereo audio source
-. Analog multiplexer for stereo audio
-. Stereo to mono conversion
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 5/59
Figure 2 is shown the Block Diagram of MT6225 for detailed.
Figure 2 : Block Diagram of MT6225
2. Product Description
Pin Outs
One type of Package for this product, TFBGA 12x12mm, 264 balls, 0.65mm pitch package, is offered.
Pin outs and the top view are illustrated in Figure 3
-. Pin Out
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 6/59
-. Top and Bottom View
Figure 3 . MT6225 Pin Out.
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 7/59
Top Masking Definition
Figure 5. Top masking definition
Model MASS 2 Version V_1.0
Prepared by H/W Date 22/01/2008
Subject Technical Manual Page 8/59
Pin Description
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