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FS554 Service_Manual
Contents
1.Overview
1.1 FS554- brief introduction................................................................................................. 2
1.2 Function diagram ............................................................................................................... 3
1.3 Mainboard component distribution diagram ...................................................................... 3
1.4 Main IC Names .................................................................................................................. 4
2. RF................................................................................................................................................. 5
2.1 RF Overview ...................................................................................................................... 5
2.2 RF circuit description......................................................................................................... 5
2.3 WiFi/BT/GPS Part.............................................................................................................. 9
3. Baseband section.......................................................................................................................... 9
3.1 Outline................................................................................................................................ 9
.......................................................... 12
3.2.1 Power failure Check.............................................................................................. 12
3.2.2 Audio faults ........................................................................................................... 13
3.2.4 LCD Fault ............................................................................................................. 16
3.2.5 FM......................................................................................................................... 18
3.2.5 Bluetooth............................................................................................................... 19
3.2.6 WIFI fault.............................................................................................................. 19
3.2.6 Camera fault .......................................................................................................... 20
3.2.7 SIM card failure .................................................................................................... 21
3.2.8 Motor test is invalid .............................................................................................. 22
3.2.9 Gravity Sensor....................................................................................................... 23
3.2.10 T-Flash fault ........................................................................................................ 24
3.2.11Touch Panel function............................................................................................ 25
3.2.13 Cannot boot failure.............................................................................................. 26
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1. FS554- overview
1.1 FS554- brief introduction
FS554-
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1.2 Function diagram
1.3 Mainboard component distribution diagram
Mainboard TOP
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Mainboard BOTTOM
1.4 Main IC Names
MTK_6737T
Baseband Chip
MT6737V/WT
eMMC+LPDDR3(16GB+16Gb,1.8/1.2V) KMQE10013M-B318007
eMMC+LPDDR3(16GB+16Gb)
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crystal
2. RF
2.1 RF Overview
a TWO-band 900/1800 and two-band B1/B8 WCDMA/HSPA and Three-band B3/B7/B20
FDD mobile phone. The transmitter operates in a half-duplex for GSM and full-duplex for
WCDMA/HSDPA and FDD.
The majority of the phone circuitry consists: the MT6737V/WT Application and Modem
Processor,MT6328V power manage IC,MT6169 RF Transceiver , GSM Ant: AIROHA
AP6710M-31 Antenna switch and AIROHA PAAP7219M-R95MOG for
Band3/Band7/Band20/DCS1800/PCS1900/GSM850/EGSM900. The Diversity Antenna: Nationz
NZ5704 Antenna switch. And MT6625LN/A for GPS/ WIFI/BT/FM radio.
2.2 RF circuit description
2.2.1 The circuit description of receiving part
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RF transceiver receiving ports
LTE PRX Antenna switch And 2G PA
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LTE DRX Antenna port
2.2.2 The circuit description of transmitting part
WCDMA Band1 Duplexer
WCDMA Band8 Duplexer
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3.1.3 Battery
Lithium ion polymer battery
3.1.4 32KHzCrystal
3.1.5 SIM Card
3.1.6 Audio frequency
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3.1.7 I/O Interface
3.1.8 Display
The main screen is 5.5-inch color screen 1776*1080 FHD
Before cutting board after the completion of the production line SMT X-RAY inspection,
according to the actual situation, X-RAY examination can not be found 100% badness, X-RAY
inspection may omissions some fault plate flow down. If found fault plate in the testing process,
the first step is to re-check of the X-RAY and carefully to see if there is even welding, lap welding,
Weld, if normal, analyze the situation following the positioning
3.2.1 Power failure Check
The failure phenomenon caused by a power failure: can not boot, shutdown leakage current
boot large current.
The main reason for the problem: Weld, electrical the original filtering or ESD device to
short-circuit, burning with the device is connected to a power source.
Positioning as well as steps to solve this type of problem is as follows
1 Troubleshoot and connected to the power supply components of the welding, Weld, or the
peripheral devices even tin
2 with a multimeter rule out whether there is power to short-circuit, and step by step to
troubleshoot the cause of the short (mainly: even tin, IC burned ESD protection device
breakdown, capacitor breakdown)
3 boot to test the power output is normal
If a power output value is not normal, whether the view filter capacitor welding problems,
whether the breakdown, filter capacitor is broken, replace; excluded one by one, and finally you
can navigate to the main chip damage
Each the power test position and the normal boot value is shown in the following table
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3.2.2 Audio faults
The FS554-
s speaker circuit is as follow
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