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FF245 Service Manual V1.0
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Contents
1.FF245 overview............................................................. 3
1.1 FF245 Basic Feature .................................................... 3
1.2 Function diagram .................................................... ３
1.3 Mainboard component distribution diagram ............................ ４
1.4 Main IC Names ....................................................... ４
2. RF ...................................................................... ５
2.1 RF Overview ......................................................... ５
2.2 RF circuit description .............................................. ６
2.3 BT/FM/ Part ......................................................... ７
3. Audio Module ............................................................. ８
3.1 Micphone Circuit．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．８
3.1.1 Receiver Circuit．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．９
3.1.2 Speaker Circuit．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．9
3.1.3 Download Module．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．9
3.1.4 LCM Module．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．9
3.1.5 CAMERA MODULE．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．10
3.1.6 KEYPAD interface．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．10
3.1.7 I/O Interface．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．11
3.2 Common Failure Analysis and Maintenance ............................. 12
3.2.1 Power failure Check ............................................... 12
3.2.2 Audio faults ...................................................... 12
3.2.3 LCD Fault ......................................................... 14
3.2.4 FM ................................................................ 15
3.2.5 Bluetooth ......................................................... 16
3.2.6 Camera fault ...................................................... 16
3.2.7 SIM card failure .................................................. 17
3.2.8 Motor test is invalid ............................................. 18
3.2.9 T-Flash fault ..................................................... 19
3.2.10 Cannot boot failure .............................................. 20
3.2.11 Charge circuit．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 21
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1. FF245 overview
1.1 Basic Feature
Table 1-1: Feature
Platform
MTK6261（M/D）
Band
GSM850/900，/DCS1800/PCS1900
LCM
CAMERA
30w
MCP Module
Built-in
BT Module
Built-in
FM RX Module
Built-in
Audio PA
extraposition AudiO (Class K)
SIM
Dual SIM
I/O
Micro USB 5PIN
Torch
Support
Keypad
23 key
1.2 Function diagram
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1.3 Mainboard component distribution diagram
Mainboard TOP
Mainboard BOTTOM
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1.4 Main IC Names
seril
number
serial number
specifications
position
code
1
IC,MTK6261,GSM/DCS/PCS BB+AP CHIP
MTK6261M/D
U1000
2
IC, AP5200, GSM/ DCS/PCS /GPRS Transceiver
AP5200
U601
3
IC，AW3605 charging valve
AW3605DNR
U203
4
IC，AW5007 EZ-FM
AW5007
U603
2. RF
2.1 RF Overview
The NOUDA AP5200 is a highly integrated RF cellular transceiver for multimode
(GPRS/GSM/DCS/PCS) and multiband (850/900/1800/ 1900) applications.
Auto-calibration routines run internal to the transceiver, Providing robust performance over
the life of the part and simplifying factory calibration. The highly integrated device is fabricated
using a 28nm digital CMOS process and packaged in a 3.2 mm*2.5 mm FBGA.
RF framework block diagram
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RF components placement
2.2 RF circuit description
2.2.1 The circuit description of receiving part
RF Front-end Module, type AP5200, item U601.
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RF PA is the probability of the most original failure, common faults are: no network, no signal,
the signal is weak, can dial emergency calls, etc., first replace the PA amplifier, verify failure
existence or not , PA front-end RF signal head can lead to bad signal
2.3 BT Module
Internal BT module ,this module built-in MTK6261-baseband chipset.
Bluetooth poor performance of the function, not active ,not find Bluetooth, next to match
the circuit in normal circumstances, poor bluetooth antenna can lead to poor.
AP5200
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2.3.1 FM Module
Internal FM module ,this module built-in MTK6261-baseband chipset..
FM poor performance of the function, not active , next to match the circuit in normal
circumstances, poor FM antenna can lead to poor.
3. Audio Module
3.1 Micphone Circuit
Figure 3.1: Micphone
If MICPHONE useless ,first you should check R307/R315/R321/R312 ok or not,use
multimeter measure connect or not ,if not connect that not good.
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3.1.1 Receiver Circuit
Figure 3.1.1: Receiver
The receiver is part with audio output,if receiver defet,it caused by B312/B313. should
measure these two parts ok or not
3.1.2 Speaker Circuit
extraposition AudiO PA(Class K) ,this module built-in AW8733 IC chipset.
If speaker volume issue. first check speaker and R403,R404,then check AW8733 IC
Figure 3.1.2: Speaker
3.1.3 Download Module
Download through USB port, program select download mode, when connect
UTXD1(pin D15 U0RTS) to GND.
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Figure 3.1.3: TP107 D/L Interface
3.1.4 LCM Module
Figure 3.1.4 LCM
LCM interface is a channel connecting the motherboard and the screen, generally will not be
bad, only when improper welding operation. Note that control iron welding temperature.
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3.1.5 CAMERA MODULE
Figure 3.1.5 CAMERA
CAMERA interface is connected to the motherboard and the camera position when welding
OK, then, will not cause camera failure Note that the temperature control soldering iron.
3.1.6 KEYPAD interface
Figure 3.1.6 KEYAPD4 Fault Maintenance
3.1.7 I/O Interface
I/O Connector MICRO USB interface standard. Mainly used for software, download
picture messages。
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3.2 Common Failure Analysis and Maintenance
Before cutting board after the completion of the production line SMT X-RAY inspection,
according to the actual situation, X-RAY examination can not be found 100% badness, X-RAY
inspection may omissions some fault plate flow down. If found fault plate in the testing process,
the first step is to re-check of the X-RAY and carefully to see if there is even welding, lap welding,
Weld, if normal, analyze the situation following the positioning。
3.2.1 Power failure Check
The failure phenomenon caused by a power failure: can not boot, shutdown leakage current
boot large current.
The main reason for the problem: Weld, electrical the original filtering or ESD device to
short-circuit, burning with the device is connected to a power source.
Positioning as well as steps to solve this type of problem is as follows：
1， Troubleshoot and connected to the power supply components of the welding, Weld, or the
peripheral devices even tin。
2， with a multimeter rule out whether there is power to short-circuit, and step by step to
troubleshoot the cause of the short (mainly: even tin, IC burned ESD protection device
breakdown, capacitor breakdown)。
3， boot to test the power output is normal。
If a power output value is not normal, whether the view filter capacitor welding problems,
whether the breakdown, filter capacitor is broken, replace; excluded one by one, and finally you
can navigate to the main chip damage。
Each the power test position and the normal boot value is shown in the following table
VIO18
1.8V
VIO28
2.8V
VRTC
2.8V
TCXO_1V8
1.8V
VRTC
2.8V
SCL28
2.8V
VBAT
3.0V
3.2.2 Audio faults
The audio part has main four parts including the speaker, receiver, mic and
headphone. First undesirable phenomena distinguish what part of the problem, and
then analyzed according to the following respective module.
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（1）Speaker loop
The FF245 phone’s speaker circuit is as follow
Speaker Loop
Speaker Common faults and reasons：
1： SPK Ringtones reasons: 1) light board, SPK itself is bad, or the connection FPC problem,
the whole observation board board PFC Cartridge is skew, not in place 2) relevant
component there is dry welding 3 ) software problems
2: SPK ringtones or murmur: 1) software volume settings 2) SPK ontology reasons
3. Switch machine ringtones, but engineering tests SPK OK: 1) scene mode is set to switch
machine ringer off 2) software problems, itself boot ringtones;
(2) Receiver circuit
FF245 phone receiver is embedded in the mobile phone front shell through shrapnel and
motherboard connection. Mainly used for the call. Receiver circuit diagram as shown below.
Receive Loop
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Receiver Common faults and reasons：
1, Receiver without sound: 1) Receiver assembly adverse, the shrapnel and board
poor contact 2) Receive ontology bad 3) the volume settings or software
problems
2, Receiver noise or volume: 1) Receiver incoming material, whether caused by
pad short circuit 2) relevant components have solder skips 3) software
problems
(3) Mic loop
The MT6261 contains two MIC circuits, the main MIC and headphone MIC. The
main MIC was inserted needle. Loop schematic diagram as following:
Main MIC common faults and causes
1 MIC unable to send words or recording: 1) MIC poor welding 2) MIC body
bad
2 MIC noise or sound: 1) MIC ontology bad 2) software problems.
Main MIC
（4）Headphone loop
FF245 phone use headphones with a standard 3.5mm headphone. Its circuit diagram is as
follows:
Headphones common faults and reasons:
1, headphones only one channel sound: 1) the headset is not inserted in place 2) Relevant
component Weld. 3) Relevant component breakdown shorted to ground;
2 headphone left and right channels are no sound: 1) the headset is not inserted in place 2)
Relevant component breakdown on the short circuit;
3, unplug the headphones bank borrowing does not recognize: 1) Relevant component Weld;
2) whether headphones Block shrapnel and motherboard good contact 3) software reasons
4 headset MIC no transmitter: 1) the headset is not inserted in place 2) Relevant component
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Weld 3) Relevant component breakdown on short-circuit;
Headset MIC
3.5mmHeadphone jack circuit
3.2.3 LCD Fault
The part of the circuit schematic as shown below. Common problems and causes of the LCD
module:
1, LCD screen is blank. 1) LCD is not installed or and fixture poor contact)
LCD backlight circuit is bad, check backlight so that the foot is pulled, check
whether the welding problems, backlight IC whether Weld or shorted to ground.
3) LCD itself fault.
2, LCD blurred screen and white screen. Description LCD backlight circuit OK, just
shows abnormal. The cause of the malfunction is usually: 1) LCD connector poor
contact, poor welding and fixture poor contact 2) related components Weld or even
tin short circuit 3) software problems
3. LCD black spots, bright spots, black lines, stripes Failure: LCD ontology bad.
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3.2.4 FM
The CPU controls FM IC working condition through the I2C signal, when FM is
working, should insert headphone as its antenna. FM outputs audio signal to the CPU
Codec, amplify playing or record. FM common faults and causes:
1, FM cannot search frequency or less frequency reason: 1) headphone without
inserting or not insert good 2) surrounding environment is bad, such as plant, garage, etc.
FM signals itself is weak or no FM signals source 3) FM antenna circuit exists poor
soldering or short circuit, lead to unable to receive FM signals or FM signals leak 4)
software reason
2，FM without sound reasons or murmur 1) this FM radio frequency is invalid 2) FM
weak signal 3）related component bad-welding 4) headphone was not put in place; 5)
whether headphone socket shrapnel contacts with the mainboard well 6) whether headphone
socket welding is OK
3，FM module operation failed. 1）Check whether the I2C and CLK signal are normal
or not 2）Software fault
3.2.5 Bluetooth
Data transfer interface and audio interface are directly connected to the CPU.
Common failures are:
1, Bluetooth function failure, you need to check the Bluetooth is turned on, the
Bluetooth Visibility settings are correct. The Bluetooth power supply and clock circuit
the existence of the phenomenon of short circuit or Weld.
2, Bluetooth effective distance is short, easily disconnected. Need to check whether
Bluetooth antenna circuit soldered or short circuit, Bluetooth antenna and
motherboard contact well.
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3.2.6 Camera fault
Connect with the CPU through a dedicated Camera IF port. Camera control is done through
the I2C bus. Camera common fault and why:
1, Camera initialization failed, could not enter the Camera the main interface. 1) Camera poor
welding or poor contact 2) the Camera Ontology failure 3) Camera Power supply is not
normal (Weld, or short-circuit led to) 4) related components welding problems
2, Camera Preview shows blurred screen or color is not normal. 1) Camera poor welding or
poor contact. 2) related components welding 3) restore the factory settings after restart
3, Camera other problems, please replace the Camera try to confirm whether the Camera
body has problems.
3.2.7 SIM card failure
FF245 SIM card module circuit is connected directly with PMIC through eight-path signal
from SUIM slot. The major failure of the module does not know the card, the reason usually: 1)
USIM card GSM card and USIM deck poor contact 2) poor USIM card socket welding 3)
software problem cause the phone to pick a card, change the card to confirm. 4) SIM card holder
exist Weld; 5) card exceeds the itinerary or inserted upside.
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SIM card circuit
3.2.8 Motor test is invalid
FF245 adopts flat motor, with simple circuit. As shown below. Common motor failures and
the reasons are:
1, the motor without vibration 1) motor and motherboard contacted poor 2) motor body bad 3)
L701 L702 bad 4) whether the FPC installed partial
2, the motor was felt as weak 1) motor ontology bad) the cause of the software settings
3 motor vibration sometimes 1) motor and motherboard poor contact
3.2.9 T-Flash fault
FF245 T - Flash circuit is connected with CPU through the special SDIO bus, circuit
diagram shown below. T - Flash the common faults and reasons are:
1, T–Flash read-write test is failure. 1) T - flash for fault card or and T kaka seat have had no
contact with good 2) below the resistance there may be short circuit, or virtual welding
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phenomenon. Capacitance may on short circuit. (using a multimeter to test whether T card
signal and ground and VMCH short circuit can eliminate) 3) software reason
2, T card not to know card: T holder PIN feet virtual welding, on MLV welding reverse and
capacitance breakdown
3, T - Flash can't through the USB for transmission. 1) T - Flash itself, speaking, reading and
writing test failure fault 2) software fault 3) USB fault
T card circuit
3.2.10 Cannot boot failure
Can't boot failure is the phone fault with highest probability of occurrence. Software
problems, welding problem, device failure is the main factor causing failing to boot. Maintenance
process can cooperate with LCD and startup current, as well as the keyboard and so on to orientate
approximately.
1, Power off leak current is large. The main failure reason is VBAT connected components
had to earth short circuit problem. Usually radio frequency PA burned or welding problem
cause. The simpler method is looking for is a hot devices, general such devices have larger
may on short circuit.
2, Boot without current, LCD no display, keyboard, etc not bright. 1) boot key SMT bad 2)
battery connector bad contact (through the plug charging machines)
3, Crashed when boot, 1）can try to re-download the software, 2）replace CPU
4, Current is large when boot. LCD displays normally, even can enter the IDIE interface,
single board is very hot 1) The individual power circuit short circuit to ground
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phenomenon exists in the phone, which is usually the problem that ESD protective devices
of module circuit breakdown short circuit to ground or weld problems.
3.2.11 Charge circuit
While inserting charger or USB line, voltage battery sensor (CPU) detects battery
voltage. If battery voltage is less than 4.2v, CPU switches on U202,
and charger charges Battery through U202; If voltage is over 4.2V, CPU
switches off U303, and charge stops.
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