home, company name, E-mail, office, fax, birthday,
picture, video, ringtone, group
Photo ID yes
Melody ID yes
Editing on PC no
Synchronization with PC no
Messages
SMS yes
EMS yes
MMS yes
Other functions
Autodial yes
Additional information 3.5mm jack, Dual-SIM support etc.
- 6 -
Packing
Memory card no
Battery yes,1pcs
Charger yes
Desktop charger no
USB cable yes
Earphones yes
CD no
Manual yes
TV out cable no
Warranty card (new black) yes
WAP advertising card yes
Certificate information card yes
Other
- 7 -
2. Decomposition diagram
- 8 -
3. Fly E175 Wi-Fi Circuit
3.1 MT6236 System Overview
3.FlyE175Wi-FiCircuit
- 9 -
- 10 -
- 11 -
- 12 -
- 13 -
Pin Description
- 14 -
- 15 -
- 16 -
- 17 -
- 18 -
- 19 -
3.2 RF transceiver
MT6140 RF transceiver
MT6140 is a highly integrated RF transceiver IC for Global Systems for
Mobile communication (GSM850, GSM900), Digital Cellular communication
Systems (DCS1800), and Personal Communication Services (PCS1900) quad
band cellular systems. It includes four LNA's, two RF quadrature mixers, a
channel filter, a programmable gain amplifier for the receiver, two high
precision I/Q modulators for the quad band transmitter, on-chip regulators, and
a fully programmable sigma-delta fractional-N synthesizer with an on-chip
LC-tank VCO. The MT6140 includes control circuits to implement different
operating modes. The device is housed in a 40-pin QFN SMD package with a
paddle for additional grounding.
- 20 -
- 21 -
- 22 -
SKY 77546 Rx-Tx Module
The SKY77546 is designed for dual-band cellular handsets comprising GSM900 and DCS1800
applications and offers a complete Transmit VCO-to-Antenna and Antenna-to-Receive SAW filter solution that
supports Class 12 General Packet Radio Service (GPRS) multi- slot operation and EDGE operation.
The module consists of a GSM900 PA block, a DCS1800 PA block, a Power Amplifier Control (PAC) block,
impedance-matching circuitry for 50Ω input and output impedances, Tx harmonics filtering, high linearity and
low insertion loss RF switches. A custom CMOS integrated circuit provides the internal PAC function, external
interface circuitry, and decoder circuitry to control the RF switches. The integrated PAC function provides
envelope amplitude control by reducing sensitivity to input drive, temperature, power supply, and process
variations. The output of each PA block and the outputs to the two receive pads are connected to the antenna
pad through a diplexer and SP2T switch.
Band selection (BS) and Tx and Rx RF signal flows are controlled five external control pads: BS selects
GSM or DCS modes; Tx_EN selects Rx or Tx mode of the respective RF switch (Tx = logic 1); SW_EN provides
improved isolation for control timing flexibility to meet the required time mask; MODE configures the amplifier for
GMSK operation (MODE = 0) or linear EDGE operation (MODE = 1). Proper logic timing and Analog Power
Control (APC) allows high isolation between antenna and Tx-VCO while VCO is tuned prior to the transmit burst.
The integrated PAC function provides envelope amplitude control and bias optimization for each operational
mode, reducing sensitivity to input drive, temperature, power supply, and process variation. Standby mode
provides a low-current consumption state. Low leakage current (6.5 A, typical) of the dual PA module
maximizes handset standby time.
- 23 -
- 24 -
3.3 S200 WiFi SIP module
Description
AcSiP Technology Corp. introduces a low-cost and low-power consumption WiFi SIP module. The
module is targeted to mobile devices including smart phone, PDA, WiFi phone, DSC, DVC which need
small WiFi module. The highly integrated module allows the usage of web browsing, VoIP application.
The wireless SiP module support IEEE 802.11b/g standard and it can provide up to 54Mbps for IEEE
802.11g, 11Mbps for 802.11b to connect your wireless LAN.
Key Features
Small footprint : 9.0 mm X 9.0 mm X 1.4 mm
Host interface : SDIO / eHPI16 / eHPI8
Support Orthogonal Frequency Division Multiplexing(OFDM), Complementary Code
Keying(CCK),
and Direct Sequence Spread Spectrum(DSSS) to provide a variety of data rates
Support ad-hoc and infrastructure modes
IEEE 802.11g(OFDM 54Mbps) and IEEE 802.11b(DSSS 11Mbps)
Support Bluetooth co-existence
Support low power consumption sleep mode via 32 kHz clock
IEEE 802.11i(AES, TKIP, 802.1X) for advanced security
IEEE 802.11e QoS support for multimedia applications
Wakeup by specific packet(pattern search)
64/128-bit Wired Equivalent Privacy (WEP)
Shared clock, EEPROM, and full RF front ends integrated for WiFi
40MHz crystal embedded
RoHS compliant / Lead free
OS support WinCE/Win Mobile (V6.0/V6.1) and Linux
Specification
- 25 -
- 26 -
RF circuit
- 27 -
MT6236-Baseband circuit
- 28 -
- 29 -
Flash Memory circuit
- 30 -
MT6236-PMU circuit
MT6236-IMPUT circuit
- 31 -
Charging circuit
Vibrator circuit
- 32 -
Handset Mic circuit
Handset REC circuit
- 33 -
Earphone Mic circuit
Loud Speakers circuit
- 34 -
LCM circuit
Camera circuit
- 35 -
T-Card circuit
USB I/O circuit
- 36 -
SIM Card circuit
BT circuit
- 37 -
FM circuit
Wi-Fi circuit
- 38 -
4. Components Address Confirmation
- 39 -
- 40 -
5 Baseband Trouble
5.1Preparatory work for repair
5.2 Flash programming does not download
Analysis Process:
- 41 -
Not Download
NO
or VBAT
short circuit
and GND
No wave output
whether there is short
Download is mainly communications
Current>300mA
Slight large than normal
voltage (UTX,URX
VCHG
whether
VCORE( 1.2V) 、
AVDD( 2.8V ) 、
VDD( 2.8V ) 、
VTCXO( 2.8V) 、
VMEM(1.8V) 、
VRF(2.8V)
Check voltage
whetheris normal,
reverse Resistance
whether is normal,
circuit
between the CPU and FLASH,
including the line of control, address
lines and data lines. If check external
circuit no problem, CPU and
FLASH welding no problem,the final
issue may itself access to the
PCB,there are problems -
removed the CPU and FLASH, Trace
of the on-off
5.3 Phone does not "power on"
Check
current
YES
Check test point
is 2.8V)
YES
YES
Check 26MHz
YES
Little or no current
Check the
corresponding
signals in the
circuit-off
First check U200 whether
there is VCCRF output;
secondly,check welding of
the OSC100
Check VBAT
, VCHG
voltage
whether is
normal, If
there is no
voltage,
check welding
of the system
I/O
Power on principle of phone: When the power supply is connected with the phone, through internal
switching circuit in the boot it will form a trigger High-level, when press boot button long enough, the
boot high-level change to low-level because of connecting with GND, and the signal reaches PMU block,
PMU will activate the internal voltage regulator and output stable voltage, as a logical part of the core
CPU will gain power supply.
We know phone boot in three necessary conditions: Power Supply, clock and reset. Now power
- 42 -
supply has been provided, then Crystal will produce 26 MHz clock signal, on the one hand it will be
signal output
the CPU and
FLASH
NO
taken as a RF reference clock, on the other hand, it will be sent to logic to the clock signal. After the
clock signal reaches the microprocessor, the memory before need be cleared, therefore PMU will send
reset signal to it for initialization. After the initialization is finished, it outputs control commands to
memory, then memory will change to permit state, and then through address line to look up where boot
program is, after finding the boot program it will be sent to CPU internal DSP circuit through data lines.
After the successful operation, the CPU output signal to PMU, the power supply will continuously output
voltage to complete booting.
After phone powers on, the CPU calls RF parameters from flash, through radio BCCH to receive
the signal intensity in the area, if your phone has a SIM card or UIM cards, Mobile phone will send the
information in SIM card to the BS, and receives information from the BS, thus achieve network
connections.
After being connected with networks, mobile phones will be in a idle mode, but also mobile phones
through SACCH periodically exchange some information with base stations, such as signal strength
and frequency synchronization, receiving level, and receiving quality
Analysis Process:
Download ok, but
No power on
YES
Re-download
NO
Measure whether
there is 32KHz
YES
Check communications
between the CPU and
YES
END
Software problem
NO
Measure VRTC whether there is
2.8V voltage output,or else
re-welding or change X200
Communications between the CPU and
FLASH,including the line of control,
address lines and data lines.If check
external circuit no problem, CPU and
FLASH welding no problem,the final
issue may itself access to the PCB,there
are problems - removed
FLASH, Trace of the on-off
- 43 -
5.4
Sound trouble
software
Analysis Process:
Sound trouble :
Ringtone/MP3
Check SPK
Re-download
Check welding of
U400 (Audio PA)
NO
Re-welding or change
U200(CPU)
END
Reference circuit as follows:
YES
Re-welding or change SPK
NO
Check welding of the SPK
peripheral circuits
NO
YES
- 44 -
5.5 Can not charge up
software
Charging principle introduce:
When the charger inserted, Charge for the PMU module provides voltage Charge,As long as the
PMU of the BATDET pin grounding can start charging module,at this time will result in a charge
interrupt signal to CPU,to inform the CPU has entered a state-of-charge now. PMIC will then generate
an interrupt to the CPU,CPU Started as follows module:
1. ADC sampling, mainly collected Vchrg, Vbat and the output from the MOSFET drain voltage Vbat
and the adoption of Vd (MOSFET drain) and Rsense value, you can calculate the charge current!
That is, we *#94683538# in ADC display options Icharg, Vchrg, Vbat, and other information!
2. Send a message to the MMI layer, it shows that state-of-charge and some sample data
3. Testing battery voltage whether more than protection voltage and battery voltage connection is
correct,If there is any problem you can cut off the charging circuit through CHRCTRL!
Analysis Process:
Can not charge up
Re-download
Measure VCHG
whether is 5V
YES
YES
NO
Check welding of CON508 and
connect of the charger
Check the battery voltage
is below 4.2 v
NO
Battery power saturation
Check welding of
MOSFET(U310 U301)
YES
NO
Re-welding or change U310 and U200
END
Reference circuit as follows:
- 45 -
5.6 LCD trouble
LCD backlight driver circuit:
- 46 -
No Display
No Blacklight
No No
No
No
No
Analysis Process:
CheckU505
LCD Trouble
Check EMI part
welding of the U500 U501
U502 U503 U504
Re-welding or change
Check FPC
Check FPC
welding
welding
Yes
Check LCD
module
Re-welding or change
Change LCD module
Yes
Re-download
software
END
Re-welding or change CPU
- 47 -
No
Value whether
is 1K
No
5.7 Keyboard not function
Analysis Process:
KEY not function
,R206,R208,R209,R210,R21
1,R221,R222,
Re-download
5.8 Microphone trouble
Reference circuit as follows:
Yes
Check part
Yes
software
Yes
END
Whether insufficient Solder
Re-welding or change CPU
- 48 -
No
No
No
Analysis Process:
MIC not function
Yes
Check MIC
Yes
Check mic external
circuit
Yes
Re-download
software
Yes
END
5.9 Earphone part trouble
1、Bias voltage:MICBIASP(2.2V);
1.Re-welding or change
2.Check PCB mic pad whether short-circuit
1 .Check whether there is part miss
2. Check whether there is part unconnected solder
3. Measure signal in the circuit show
Re-welding or change CPU
2、Headphone detection signal: HEAD_DET: When insert earphone, due to XMP3_R
connection with speaker,HEAD_DET signal grounding,Trigger interrupt to the CPU,Will show "Insert
headphone";
3、Headset to hang up signal detection:AUX_IN5_EARPHONE:This signal is used to detect whether the
headphones of the hang up button Press,when the headset hang up button is pressed, XMICP signal
will be shorted, AUX_IN5_EARPHONEwill be shorted at one time;
- 49 -
5.10 USB transmit trouble
Reference circuit as follows:
USB Circuit Working Principle:
1、Phone through the USB data line and computer connection, charge signal trigger phone auto power on
2、External power supply (USB_PWR)connect to mobile phone, USB ADC signal voltage will be low to
the high jump, trigger bring interrupted signal;
3、CPU implementation USB interrupt;
4、CPU and computer through the USB interface for data transfer;
- 50 -
No
2.Check headset whether inserted in the
end
N
3.Change
CON508
No
Analysis Process:
USB transmit trouble
YES
Check USB
connect
Yes
Check USB jack
Yes
Check PC driver
whether correct install
YES
END
1.To confirm the correct use of usb cable line
o
1.Check CON508 PIN whether un-connect
solder
2.Check CON508 whether internal damage
Re-welding or change CPU
- 51 -
No vibration
whether
No
No
5.11 Vibrator trouble
Reference circuit as follows:
Analysis Process:
Open vib ,measure
VIBRATOR
there is low level
Re-download
software
END
Yes
Yes
Re-welding or change Vibrator
Re-welding or change CPU
- 52 -
5.12 Receiver does not work
there is a wave
output
No No
external circuit
No
Reference circuit as follows:
Analysis Process:
Receiver Trouble
Engineer model, open
receiver , scilloscope
measurements whether
Yes
Yes
1 Check receiver whether the good contacts with
the PAD
2. Clean PCB PAD
3. Change receiver
Check receiver
Re-download
software
END
5.13 Camera trouble
Reference circuit as follows:
Yes
Check red mark part in the circuit show
Re-welding or change CPU
- 53 -
Analysis Process:
sensor
No
FPCB
No
sensor
No
No
Camera trouble
Yes
Check the
condition of the
Camera module, LDO
Yes
Check the soldering
Condition of
CON503& Tail
Yes
Check camera
Check camera
Yes
Re-download
software
END
Check the solder condition of U706
Change new camera sensor
Re-welding or change CPU
Re-welding or replace it
- 54 -
5.14 Bluetooth has not function
No
No
No
Reference circuit as follows:
Analysis Process:
BT trouble
Check BT headphones
Yes
Check BT external circuit
Yes
Check the soldering
condition of U700
Re-download
Yes
software
Yes
END
1.Power support :VBT
2.Check clock:26M
Re-welding or replace it
Re-welding or change CPU
- 55 -
5.15 Motion sensor trouble
Reference circuit as follows:
- 56 -
No
No
No
Analysis Process:
Motion sensor
trouble
open motion sensor function
Measure VDD whether is 2.8v
Yes
Measure
GPIO61_SENSOR_SDA
GPIO60_SENSOR_SCL
whether is 2.8v
Yes
Re-download
software
END
Re-welding or change U200
Re-welding or change U200
Re-welding or change CPU
- 57 -
5.16 FM trouble
Reference circuit as follows:
- 58 -
No
No
No
No
Analysis Process:
FM trouble
Yes
Check headphones
Yes
Check FM external
circuit
Yes
Check the soldering
condition of U702
Yes
Re-download
software
END
Re-welding or change CPU
1.Check headphones whether inserted in the end
2.Check headphones jack whether unconnected solder
1.Power support :VDD
2.Check RTC:32.768KHz
3.Check external whether there is missing and unconnected solder