FLY E105 Service Manual

MEGA4 Technical Manual

1. Product Specification

2. Mechanical Construction

3. Circuit Description

4. IC Information

5. Spare Part List

6. Map

7. Schematic

8. Block diagram

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Section 1 – Product Specification

Contents Page

MEGA4 specifications ..……...…………..……………………………………..…… 1.1
Batteries …………………………..………………………………..……………………. 1.3
Standard charger………………………………..…………….………………………… 1.5

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Section 2 – Mechanical Construction

Contents Page

Disassembly ……………………………………………………………………………... 2.1
Phone disassembly …………………………..……………………………….……… ... 2.2
Phone Assembly ………………………………………………………………………… 2.11

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Section 3 – Circuit Description

Contents Page

Baseband section …………………………………………………....……… 3.1

I. MT6228 ( GSM/GPRS Baseband processor ) …………..……………….. 3.1
II. MT6318 ( GSM Power Management System ) …………………………... 3.49
III. HYC0UGE0MF1P ( NAND MCP) …………….………………………………..3.62

RF section .............................................................................. 3.67

I. MT6120 ( RF Transceiver IC ) ……………………………………………….… 3.67

II. RF3166 ( QUAD-BAND Power Amplifier Module ) …….……………....3.74

III. LMSP54HA-348TEMP ( Antenna Switch Module for Tri Band ) …. 3.77

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Section 4 – IC Information

Contents Page

Pin out for U 900 …………………………………………………………...……….….. 4.1
Pin out for U 201 …………………………………………………………...……….…… 4.2
Pin out for BAT 300 …………………………………………………………...……….. 4.3
Pin out for CON 300…………………………………………………………...……….. 4.4
Pin out for CON 380, CON 600 ……………………………………………...……… 4.5
Pin out for U 500 …………………………………………………………...……….… 4.6
Pin out for U 750……………………………………………………...……….………... 4.10

Pin out for U 400……..…………………………………………………...…………..... 4.11

Pin out for LED300~LED305……………………………………………...…...…… 4.12
Pin out for OSC100…………………………………………………………...……….… 4.13
Pin out for U300…………………………………………………….………...……….… 4.14
Pin out for D300,D401,D402………………………………………...………..…….. 4.17
Pin out for U302 …………………………………………………………………………..

4.18

Pin out for U301…………….. ………………………………………………………...……. 4.19

Pin out for ZD390,ZD391,ZD600 …….…………………………………….…….… 4.20
Pin out for ZD601,ZD602,ZD603 …………………………………………………… 4.21
Pin out for U702…………… …………………………………………………………….. 4.22

Pin out for U100……... ………………………………………..………………..…….... 4.23

Pin out for CON450 …….………..………………………………………………….….. 4.33

Pin out for CON750 ………………………………………………………………......... 4.34

Pin out for U200 ……………….…………………………………………………......... 4.35

Pin out for U521 …………………………………..………………………………......... 4.38

Pin out for MIC380 …………………………………………………………………...... 4.39

Pin out for CN90 ………….…...………………………………………………..…….... 4.40

Pin out for U700 ………….…...………………………………………………..…….... 4.41

Pin out for U735 ………….…...………………………………………………..……..... 4.42

Pin out for U600 ………….…...………………………………………………..…….... 4.43

Pin out for LED350 ………….…...………………………………………………..…... 4.44
Pin out for F440 ……………...…...………………………………………………..…... 4.45

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Section 5 – Spare Part List

Contents Page

MEGA4 Part List ………………………………………………………………………... 5.1

Section 6 – Map

Contents Page

MEGA4 Main Map ………………………………………………….………………... 6.1
MEGA4 Key Map ……………………………………………………………………... 6.5

Section 7 – Schematic

Contents Page

MEGA4 Schematic …………………………………………………...………………... 7.1

Section 8 – Block diagram

Contents Page

MEGA4 Block diagram …………………………………………...…………………... 8.1

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Model MEGA4 Version V_1.0

Prepared by H/W Date 16/06/2008

Subject Technical Manual Page 1/5

▪ MEGA4 Specifications

General specification Tri Band GSM 900 Class 4, DCS Class 1,

PCS Class 1 handheld cellular telephone
Type approval No. MEGA4
Radiated emissions Complies with I-ETS300020-1
GSM 11.10

Dimensions (mm): Including 750mAh Li-Ion battery

Weight: Including 750mAh Li-Ion battery

Display type Main LCD

Display capacity 240x320 dots,260K color, full graphical
Display icons Soft icons: Signal, Battery, Message

Normal operating temperature
Keyboard Touch panel and 12 keys comprising:
POWER (END), SEND

Ring tones 30 user selectable tones and off

Standard: 96.4x52.4x12 mm

Standard: about 86 grames

2.4 Inch 260K TFT color graphics

display

Vibration, Alarm, Call divert & barring, ,

Broadcast

-20°C to +60°C

2 Soft-Key,(YES/NO)

5 Navigation-Key

Camera, 2Volume(UP/DOWN)

including LED backlight

Battery types Standard:750 mAh Li-Ion

Talk time: 750 mAh Li-Ion battery 4 hours approximately

Standby time: 750 mAh Li-Ion battery

Note²: Measured on DCS1800 with power level 15

200 hours approximately

The talk and standby times are subject to

network conditions

Battery rapid charging time: 750 mAh Li – Ion(standard) 1~1½ hours to >90% of full capacity

Charging Voltage 5.0V

Nominal battery voltage: 750mAh Li - Ion 3.8V

Battery charging CC and CV Mode

Antenna type Internal Antenna
Features supported
(Camera Module) 3.2M Sensor
(Blue Tooth) BT Version 1.2,.

Model MEGA4 Version V_1.0

Prepared by H/W Date 16/06/2008

Subject Technical Manual Page 2/5

-. 9 Profiles

(subject to network implementation) 16X16,10X12,8X8 Numeral display

External interface connections RS232, USB
Number of channels GSM900 : 124 channels
DCS1800 : 374 channels.
PCS1900 : 299 channels

Operating Frequency Range GSM900 TX : 880~915Mhz
GSM900 RX : 925~960Mhz
DCS1800 TX : 1710~1785Mhz
DCS1800 RX : 1805~1880Mhz
PCS1900 TX : 1900~1910Mhz
PCS1900 RX : 1930~1990Mhz

HSP, HFP, GAVDP, A2DP,AVRCP,
FTP, OPP, DUN, SPP

8x8,10x10,11x11,12x12,13x14 Roman

display

Support Phase 2 plus Feature

64 Poly stereo sounds

Graphics and animated icons

Phone memory location (200

numbers)

Dynamic text display

Easy text input (Tegic 9)

SIM application tool kit

▪ Battery

Model MEGA4 Version V_1.0

Prepared by H/W Date 16/06/2008

Subject Technical Manual Page 3/5

①② ③

Function Description

1 VBat Battery Supply Pin
2 Battery ID Battery ID Resistor Pin 10Kohm
3 GND GND

Standard Battery 750mAh Li-Ion

Type: Lithium Ion Rechargeable Battery
Capacity 25°C: 750mAh
Standby time: up to 200 hours.
Talk time (1900MHZ): 30dBm: 2.5 hours 4 hours*
Charging time: 1½-2 hours approximately to full capacity.
Charge temperature: 0 to +45°C.
Discharge temperature: -20 °C to +60°C.
Cycle life 100% cap. to 80% cap. 500 cycles.
Energy Density 344Wh/I 150Wh/kg
Dimension (W x H x L): 4.80 T x 37.90 W x 44.85 L mm.
Weight: about 17g .

*Operating times depend on network and usage. Variability will occur. DTX +40% (included).
Storage temperature:
Short period <1 month: -20°C to +45°C.
Long period <1 year: -20°C to +25°C.

▪ I/O Connector layout : 18pin

Model MEGA4 Version V_1.0

Prepared by H/W Date 16/06/2008

Subject Technical Manual Page 4/5

Pin description

Pin 1

2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18

EJ_Out_L Headset Receiver Left
EJ_Out_R Headset Receiver Right

GND GND

EJ_Mic Headset Mic Input

GND GND

EJ_GND Headset GND

NC NC

Headset Interrupt Headset Interrupt

Power_On_Off Power On Off

USB_DM USB D+ input / Output

USB_DP USB D- input / Output

RXD UART RX

TXD UART TX
Charger/USB Power USB Power / Charger
Charger/USB Power USB Power / Charger

NC Not connected
VBAT Battery Voltage +3.8V
VBAT Battery Voltage +3.8V

Standard charger

MEGA4 is supplied with a SMTP charger as standard. The charger is connected to the Power
management IC through the bottom port.

Model MEGA4 Version V_1.0

Prepared by H/W Date 16/06/2008

Subject Technical Manual Page 5/5

Charging of the battery can only be carried out when the battery is fitted to the phone. There are no
serviceable parts within the main plug.

Input parameter Type Value Unit
Input voltage min 90 V
nom 230 V
max 264 V
Input frequency min 47 Hz
nom 50 Hz
max 63 Hz
Input current max 200 mA
Efficiency min >55 %

Output parameter Type Value Unit
Output current(CV) min 0.650 A
max 0.800 A

(CC) min 0.000 A
max 0.650 A
Output voltage(CV) min 3.0 V
max 4.9 V

(CC) min 4.9 V

max 5.3 V

Connector 18pin Bottom Connector
Cable length 1.5 m.

Model MEGA4 Version V_

Prepared by H/W Date 2008.05.20

Subject Technical Manual Page 1/21

Disassembly

This section covers the assembly and disassembly for MEGA4 phone. In order to carry out the
assembly or disassembly the following precautions should be taken:

1. A Plus screwdriver is required to remove the screw which holds the two casings together.

Ensure that the screwdriver is narrow enough to reach the screws without causing damage to
the casing parts.

2. The phone should always be placed on a soft surface to minimise the risk of damage being

caused to the casing, window and keypad. If the PCB is to be removed, then care should be
taken not to stress or scratch the exposed LCD and touch window.

3. Observe anti-static precautions when handling the main PCB or any of its components.

4. Repairs carried out by unauthorised persons will result in the warranty on the unit becoming

void.

5. Do not use solvents to clean any of the casing parts or the LCD window.

Model MEGA4 Version V_

Prepared by H/W Date 2008.05.20

Subject Technical Manual Page 2/21

Phone disassembly

1. Battery Cover Disassembly

A. Push the Lock and remove battery cover along the remove direction.

2. Battery & SIM card & TF card Disassembly

A. Hold the handle of the battery and remove it along the arrow direction
B. Remove SIM card
C. Remove TF card

Model MEGA4 Version V_

Prepared by H/W Date 2008.05.20

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3. Battery cover Sub Ass’y Disassembly

A. Refer to the explode view. Can not remove as bellow after join them

4. C cover Disassembly

A. Remove RF cap and six of screws. Carefully separate two covers

(C cover Ass’y and B cover)

Model MEGA4 Version V_

Prepared by H/W Date 2008.05.20

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5. C cover Sub Ass’y Disassembly

A. Refer to the explode view as bellow.

6. PCB ASS’Y & B cover Disassembly

Model MEGA4 Version V_

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A. unconnect the LCD FPCB along the direction A as right view
B. Remove the camera module
C. Remove the PCB Ass’y
D. Unconnect the main FPCB along the direction B
E. Remove a screw
F. Remove a speaker

7. PCB Disassembly

Model MEGA4 Version V_

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Subject Technical Manual Page 6/21

A. unconnect the vibrator
B. Remove the B cover Ass’y

8. B cover Sub Ass’y Disassembly

Model MEGA4 Version V_

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A. Remove the volume key ass’y & camera key ass’y

B. Remove the volume key rubber and camera key rubber

9. A cover & Key PCB & LCD Disassembly

Model MEGA4 Version V_

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A. Remove the main FPCB.
B. Remove the GND tape key PCB
C. Remove LCD module

10. KeyPCB Disassembly

Model MEGA4 Version V_

Prepared by H/W Date 2008.05.20

Subject Technical Manual Page 9/21

A. Remove Cap MIC.

11. A cover Sub Ass’y Disassembly

Model MEGA4 Version V_

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Subject Technical Manual Page 10/21

Model MEGA4 Version V_

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Phone Assembly

1. A cover Sub Ass’y assembly

A. Put the 2 of “finger a deco” in the a cover
B. Attach the “dt a cover deco” on the a cover
C. Join the “a cover” deco with “a cover”
D. Attach the “ dt spk deco” & “spk deco” in side of a cover
E. Attach the “GND tape LCD frame” at the right finger of a cover deco
F. Attach the “GND cushion LCD frame” on the “GND tape LCD frame”
G. Put the “LCD frame” in the hole of “A cover”
H. Attach the “cushion LCD” in the “LCD frame”

Model MEGA4 Version V_

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Subject Technical Manual Page 12/21

2. Key PCB assembly

A. Solder the “camera FPCB module” on the rear side of the “KeyPCB”.
B. Attach the “dome sheet” on the front side of the “ keyPCB”
C. Put the “cap MIC” on the out side of the MIC

3. A cover ASS’Y & LCD & KeyPCB assembly

A. Put the “keypad” in the “a cover”.
B. Put the “KeyPCB” in the “a cover”.
C. Connect “Main FPCB” with connector on the rear side of the “key PCB”
D. Put the “LCD module” in the “a cover”
E. Put the “Cap SPK” in the “a cover”
F. Attach the “GND tape keyPCB” inside of the silk line on the “LCD” and “KeyPCB”

Model MEGA4 Version V_

Prepared by H/W Date 2008.05.20

Subject Technical Manual Page 13/21

4. B cover Sub Ass’y assembly

A. Put the “volume key rubber” in the “volume key”.
B. Put the “camera key rubber” in the “camera key”.

Model MEGA4 Version V_

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C. Put the “finger shield can” in the pole and Hot melt.
D. Attach the “cushion btob main” on the front side and rear side.
E. Attach the “cushion spk”
F. Put the “volume key” and “camera key” in the each hole

---- attention insertion direction
G. Attach the vibrator

Model MEGA4 Version V_

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5. PCB ASS’Y Assembly

A. Solder the “volume key FPCB module”
B. Attach the “cushion RF chip”
C. Insert 2 of shield can on the front and rear side
D. Attach the “cushion touch zip conn”
E. Insert antenna

Model MEGA4 Version V_

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6. B cover assembly

A. Join the “b cover” with “A cover”
B. Connect vibrator with connector
C. Connect “ Touch window” with connector

Model MEGA4 Version V_

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7. PCB assembly

A. Drive a screw
B. Insert speaker
C. Attach the “GND cushion batt terminal”
D. Connect PCB with main FPCB along the direction B
E. Join the PCB with B cover
F. Connect LCD connector with PCB along the direction A
G. Connect Camera module with zip connector and insert to hole

Model MEGA4 Version V_

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8. C cover SUB Ass’y assembly

A. Insert “flash LED guide” in the 4 of poles and hot melt 4 of poles
B. Attach the almost parts as bellow
C. Join the “C cover frame” with C cove

9. C cover ASS’Y Assembly

Model MEGA4 Version V_

Prepared by H/W Date 2008.05.20

Subject Technical Manual Page 19/21

A. Join the C cover assy with B cover
B. Drive 6 of screws
C. Attach the “cap rf”

10. Battery cover SUB Ass’y assembly

A. Insert “battery spring” to “Locker battery cover” and join them with “Battery cover”
B. Attach the “DT batter cover deco” on the “battery cover”
C. Join the “battery cover deco” with “battery cover” and hot melt 3 of poles

11. SIM Card & TF card & Battery assembly