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DS150 Service Manual by Fly
DS150 Service Manual
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DS150 Service Manual by Fly
Content
1 INTRODUCTION TO BLOCK DIAGRAM................................................................................................3
2 ENGINEERING MODEL........................................................................................................................... 3
3 BLOCK DIAGRAM................................................................................................................................... 4
4 TECHNIQUE PARAMETER..................................................................................................................... 6
5 BASEBAND TROUBLE...........................................................................................................................9
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17 TF card trouble ........................................................................................................................ 26
Preparatory work for repair........................................................................................................ 9
Flash programming does not download
Phone does not “power on”
Sound trouble
Can not charge up
LCD trouble
Keyboard not function
Microphone trouble
Earphone part trouble
USB transmit trouble
Vibrator trouble
Receiver does not work
Camera trouble
FM circuit trouble
Bluetooth has not function
Phone can not access SIM card
................................................................... 11
............................................................... 13
.................................................................... 14
............................................................ 15
.............................................................. 16
............................................................ 17
............................................................. 18
................................................................. 18
................................................................. 20
................................................................22
....................................................... 10
.......................................................... 19
........................................................ 23
................................................... 24
.............................................. 9
6 RF TROUBLE.........................................................................................................................................26
6.1
6.2
6.3
6.4
7 MAINTENANCE TOOLS........................................................................................................................ 31
Principle of operation
AGC failure
AFC failure
APC Failure
............................................................ 26
..................................................................... 28
..................................................................... 28
.................................................................... 29
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1 Introduction to block diagram
■ Logic Part
D200 [CPU,MT6223C]
MT6223 is an entry level chipset solution with class 12 GPRS/GSM modem. It integrates only analog
baseband but also power management blocks into one chip and can greatly reduce the component
count and make smaller PCB size. Besides, MT6223 is capable of SAIC (Single Antenna Interference
Cancellation) and AMR speech. Based on 32 bit ARM7EJ-STM RISC processor, MT6223 provides an
unprecedented platform for high quality modem performance
MT6223 runs the ARM7EJ-STM RISC processor at up to 52Mhz, thus providing best trade-off
between system performance and power consumption.
G101 [VC-TCXO 26MHz]
Main Clock for Control Processor and RF Block, Subsystem
G201 [32.768 KHz Sleep Crystal]
32.768 KHz Clock for Sleep Mode Operation and RTC block.
■ RF Part
D102 [RF Transceiver MT6139BN]
MT6139 is a highly-integrated RF transceiver IC for the Global Systems for Mobile Communication
(GSM850/GSM900), Digital Cellular Communication Systems (DCS1800), and Personal
Communication Services (PCS1900) cellular systems. It includes four LNAs, two RF quadrature mixers,
a channel filter, a programmable-gain amplifier for the receiver, a high-precision I/Q modulator for the
transmitter, a 26 MHz VCXO reference, a fractional-N frequency
synthesizer with a fully-integrated LC-tank VCO and three built-in LDO regulators for VCO, VCXO and
SDM. It is housed in a 40-pin QFN package with a downset paddle for additional grounding.
U102 [PA RPF88130B]
• Small package : 5.5 × 5.5mm(typ) 1.2mm t max.
• Built-in closed loop APC circuit with power detector performs stable
TRP(Total Radiated Power) under load mismatch conditions.
• Built-in Antenna Switch
• High gain 3stage amplifier: +3dBm input typ.
• Built-in ESD protection: outstanding 8KV ESD at Antenna.
• Lead free soldering process available
• GPRS Class 12 compatible
• High efficiency:
41% Typ. for GSM900
35% Typ. for DCS1800
.
2 Engineering model
Automatic test mode command
■
Test list as follows:
: *#88#
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Test Station Flag Ver s ion LCM/Keypad LCD Receiver/MI C
FM Speaker
All test done
■
Separate test command
Ver s ion Resource BIN Echo loop Vib ra to r
LED Hea ds e t RTC
MTBF UART Mermory card Nand Flash FM Radio Camer a Bluetooth
Report
: *#32*#
LCD Charger
Key pa d
ADCLCD c ontr as t
Key pa d
Speaker/Vibrator/T-flashHea ds etCamera Battery FM Headset
Loud spk Ringtone
3 Block Diagram
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4 Technique Parameter
Item Description Character
1 Frequency GSM
TX：880~915Mhz
RX: 925~960Mhz
DCS
TX：1710~1785Mhz
RX：1805~1880Mhz
2 Phase Error RMS<5° Peak<20°
3 RX sensitive EGSM/DCS1800 -104dB
4 TX POWER GSM 2W(33dBm) /DCS 1W(30dBm)
5 Frequency Error <0.1ppm
6 POWER LEVEL
7 Spectrum due to
Modulation
EGSM DCS
Level Power Range Level Power Range
5 33dBm ±2dBm 0 30dBm ±2dBm
6 31dBm ±3dBm 1 28dBm ±2dBm
7 29dBm ±2dBm 2 26dBm ±2dBm
8 27dBm ±2dBm 3 24dBm ±2dBm
9 25dBm ±2dBm 4 22dBm ±2dBm
10 23dBm ±2dBm 5 20dBm ±2dBm
11 21dBm ±2dBm 6 18dBm ±2dBm
12 19dBm ±2dBm 7 16dBm ±2dBm
13 17dBm ±2dBm 8 14dBm ±2dBm
14 15dBm ±3dBm 9 12dBm ±3dBm
15 13dBm ±3dBm 10 10dBm ±3dBm
16 11dBm ±5dBm 11 8dBm ±5dBm
17 9dBm ±5dBm 12 6dBm ±5dBm
18 7dBm ±5dBm 13 4dBm ±5dBm
19 5dBm ±5dBm 14 2dBm ±5dBm
Carrier Wave offset(kHz) GSM (dBc) DCS (dBc)
100 ＋0.5 ＋0.5
200 －30 －30
300 －33 －33
400 －60 －60
600～1200 －60 －60
1200～1800 －60 －60
1800～3000 －63 －63
3000～6000 －65 －65
6000 －71 －73
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8 Spectrum due to
Switch
Carrier Wave offset（kHz）
400
600
1200
1800
GSM (dBm) DCS/PCS
(dBm)
－19
－21
－21
－24
-22
-24
-24
-27
9 BER EGSM/DCS1800
BER（II）<2%@－102dBm
11 RX Level Precision ±3dB
12 SLR 8±3dB
13 TX Response
Fre.(Hz)
100
MAX（dB）
－12
MIN (dB)
/
200 0 /
300 0
1000 0
2000 4
3000 4
3400 4
－12
－6
－6
－6
－9
4000 0 /
14 RLR 2±3dB
15 RX Response
Fre.(Hz)
100
MAX（dB）
－12
MIN(dB)
/
200 0 /
300 2
1000 *
2000 0
3000 2
3400 2
－7
－5
－5
－5
－10
4000 2
16 STMR 13±5dB
17 Distortion
TO ARL （dB） Grading ratio（dB）
－35
－30
－20
－10
17.5
22.5
30.7
33.3
0 33.7
7 31.7
10 25.5
18 Side tone
3 rank distortion<10％
distortion
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19 Ring Volume At least 85dB in the following.
Incoming tel. alert and message alert are rings
When testing distance is 10cm.
20 Charge Current <700mA
21 Antenna display
22 Battery status
23 Alarm Voltage 3.6±0.03V
24 Auto turn off
voltage
25 Battery type Li.Battery
26 Charger AC mode charger
Bar Number Power
5
4
3
2
1
0
Bar Voltage
0 3.62V
1
2
3
4
3.5±0.03V
Standard Voltage＝3.7V
The top voltage＝4.2V
Capacity：1000mAh
Import：100～240V，50Hz
Output：5V，600mA
－85dBm～－50dBm
－89dBm～－82dBm
－93dBm～－86dBm
－97dBm～－90dBm
－101dBm～－94dBm
－110dBm～－98dBm
3.73V～3.62V
3.8V～3.73V
3.91V～3.8V
3.91V～4.2V
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5 Baseband Trouble
5.1 Preparatory work for repair
5.2 Flash programming does not download
Analysis Process：
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Not Dow nload
Current>300mA
VCHG
or VBAT
whether
short circuit
and GND
Slightly larger than normal
VCO RE（1.8V
AVDD（ 2.8V
VDD（ 2.8V
VT CXO（2.8V
VRT C（1.5V
）、
）、
）、
）、
）、
VMEM( 2. 8V)
Check voltage
whetheris normal,
reverse Resistance
whether is normal
，
whether there is short
circuit
Check
current
YES
Check test point
voltage (UTX,URX
is 2. 8V)
YES
Che ck 26M Hz
Not wave output
YES
Dow nlo ad is mainly c ommun ic ations
betw een the CPU and FLASH
，
including the line of control, address lines
and data lines
。
If chec k external circuit
no problem，CP U ad n F LASH w elding
no problem,the final issue may itself
access to the PCB,there are problems removed the CPU and FLASH, Trace of
the on-off
Little or no current
NO
Chec k the
corresponding
signals in the
circuit-off
example:TP201
2,TP2013
（
For
）
First check
U111whether
there is VCCRF
output;secondly,
check welding of
the D102
Ch ec k VBAT
，
VCHG
voltage
whether is
normal，If
there is no
voltage,
c h ec k w elding
of the system
I/O
5.3 Phone does not “power on”
Power on principle of phone: When the power supply is connected with the phone, through internal
switching circuit in the boot it will form a trigger High-level, when press boot button long enough, the
boot high-level change to low-level because of connecting with GND, and the signal reaches PMU block,
PMU will activate the internal voltage regulator and output stable voltage, as a logical part of the core
CPU will gain power supply.
We know phone boot in three necessary conditions: Power Supply, clock and reset. Now power
supply has been provided, then Crystal will produce 26 MHz clock signal, on the one hand it will be
taken as a RF reference clock, on the other hand, it will be sent to logic to the clock signal. After the
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clock signal reaches the microprocessor, the memory before need be cleared, therefore PMU will send
reset signal to it for initialization. After the initialization is finished, it outputs control commands to
memory, then memory will change to permit state, and then through address line to look up where boot
program is, after finding the boot program it will be sent to CPU internal DSP circuit through data lines.
After the successful operation, the CPU output signal to PMU, the power supply will continuously output
voltage to complete booting.
After phone powers on, the CPU calls RF parameters from flash, through radio BCCH to receive
the signal intensity in the area, if your phone has a SIM card or UIM cards, Mobile phone will send the
information in SIM card to the BS, and receives information from the BS, thus achieve network
connections.
After being connected with networks, mobile phones will be in a idle mode, but also mobile phones
through SACCH periodically exchange some information with base stations, such as signal strength
and frequency synchronization, receiving level, and receiving quality
Analysis Process：
Download ok
but no power on
Re-download
Measure whether
ther e is 3 2 KHz
signal output
Check communications
betw een the CPU and
FLASH
，
NO
YES
NO
YES
Sortware porblem
NO
Measure VRTC whether there is 2.8V
voltage output,or else re-w elding or
change D200
Communications between the CPU and
FLASH
including the line of control, address lines
NO
and data lines。If check external circuit
no problem，CPU adn FLASH welding no
problem,the final issue may itself access
to the PCB,there are problems - removed
the C P U a nd F LAS H, T rac e o f t h e o n - o f f
，
5.4 Sound trouble
Analysis Process：
END
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Sound
trouble:Ring
tone/MP3
Chec k SPK
NO
Re-download
software
NO
Check welding of
U511(Audio PA)
NO
Meas ure
GP I O31 _AUD IO _P A_
ON whether is 2.8V
YES
END
Reference circuit as follows：
YES
NO
Re-welding or change SPK
Check welding of the Audio
peripheral circuits
Re-welding or
change U504
NO
Re-welding or
change D200(CPU)
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5.5 Can not charge up
Charging principle introduce:
When the charger inserted, Charge for the PMU module provides voltage Charge，As long as the
PMU of the BATDET pin grounding can start charging module，at this time will result in a charge
interrupt signal to CPU，to inform the CPU has entered a state-of-charge now。PMIC will then generate
an interrupt to the CPU，CPU Started as follows module：
1. ADC sampling, mainly collected Vchrg, Vbat and the output from the MOSFET drain voltage Vbat
and the adoption of Vd (MOSFET drain) and Rsense value, you can calculate the charge current!
That is, we * # 32 * # in ADC display options Icharg, Vchrg, Vbat, and other information!
2. Send a message to the MMI layer, it shows that state-of-charge and some sample data
3. Testing battery voltage whether more than protection voltage and battery voltage connection is
correct，If there is any problem you can cut off the charging circuit through CHRCTRL
!
Reference circuit as follows：
Charge input signal
PMOS driver signal
PMU
D200
Analysis Process：
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Can not charge up
Re-download
software
YES
Measure VCHG
whether is 5V
YES
Check t he batter y
voltage is below 4.2 v
YES
Chec k w eld ing o f
MOSFET(D304)
END
5.6 LCD trouble
LCD backlight driver circuit:
NO
NO
NO
Check welding of P601 and
connect of the charger
Battery power saturation
Re-weding or change D304 and
D200
Analysis Process：
GPIO40_LCM_BL_EN Signal
By adjusting the waveform duty cycle to
achieve Adjust the brightness of the main
screen;
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LCD Trouble
No Blacklight No Display
Chec k
U802
NO
Keyboard not function
5.7
Check FPC
w eldin g
Check LCD
module
Re-download
software
END
YES
YES
NO
NO
NO
Re-welding or
change
Change LCD
module
Re-welding or
change CPU
Analysis Process:
Key not function
Chec k KB
Check part
R221~R229
Re-download
software
YES
board
YES
END
YES
YES
NO
NO
NO
Change dome
Check key pad whether short-circuit
Whether insufficient Solder
Value w het he r is 1 KΩ
Re-welding or change CPU
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5.8 Microphone trouble
Reference circuit as follows：
Provide positive
bias voltage for MIC
2.2v
From to CPU
0.3v
Analysis Process：
MIC not function
Check mic external
Provide negative
bias voltage for MIC
YES
Check MIC
YES
circuit
NO
1.Re-welding or change
2.Check PCB mic pad whether short-circuit
1.Check whether there is part miss
NO
2.Check whether there is part unconnect s older
3.Measure signal in the circuit show
YES
Re-download
software
YES
END
NO
Re-welding or change CPU
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5.9 Earphone part trouble
1、Bias voltage：MICBIASP（2.2V）；
2、Headphone detection signal: HEAD_DET: When insert earphone, due to XMP3_R
connection with speaker，HEAD_DET signal grounding，Trigger interrupt to the CPU，Will show "Insert
headphone";
3、Headset to hang up signal detection：ADC5_HP_MIC：This signal is used to detect whether the
headphones of the hang up button Press，when the headset hang up button is pressed, XMICP signal
will be shorted, ADC5_HP_MIC will be shorted at one time;
Bias voltage
Analysis Process：
Earphone not
function
Check Headset
I/O(P601)
Re-download
software
YES
YES
Chec k
YES
YES
END
NO
1.To c onfirm the corr ect use of headset
2.Chec k heads et w hether inserted in the end
1.Re-welding or change
NO
2.Check red mark part in the circuit show
3.Measure signal in the circuit show
NO
Re-welding or change CPU
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5.10 USB transmit trouble
Reference circuit as follows：
URXD&UTXD:SW download、
Board Test、IMEI Write
USB Circuit Working Principle：
1、Phone through the USB data line and computer connection, charge signal trigger phone auto power
on
2、External power supply (USB_PWR)connect to mobile phone, USB ADC signal voltage will be low to
the high jump, trigger bring interrupted signal;
3、CPU implementation USB interrupt, output USB Power Supply drive signals : GPIO73_USB_EN,
open U601, output USB power supply VUSB (3.3V );
4、CPU and computer through the USB interface for data transfer；
5.11 Vibrator trouble
Reference circuit as follows：
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Analysis Process
whether there is high
：
No vibration
YES
Measure VIBR_ON
level
NO
Re-download
software
END
NO
YES
.Re-welding or change vibrator
Re-welding or change CPU
5.12 Receiver does not work
Reference circuit as follows：
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Analysis Process：
Receiver trouble
YES
Engineer model,open
re ce iver ,s cillo sc ope
measurements w hether
there is a w ave output
NO
Chec k receiver
external circuit
YES
Re-download
software
END
NO
1.Check receiver whether the good
YES
NO
Re-welding or change CPU
Check red mark part in the circuit
contacts with the PAD
2.Clean PCB PAD
3.Change receiver
show
5.13
Camera trouble
Reference circuit as follows：
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Analysis Process：
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camera trouble
YES
Check the condition
of the
camera module,LDO
YES
Check the soldering
condition of P802&
Tail
FPCB
YES
Chec k c amera
sensor
YES
Re-download
software
NO
NO
NO
Check the solder condition of D801
NO
Change it with a new camera
Re-welding or change CPU
Try to re-welding or replace it
sensor
END
5.14 FM circuit trouble
Reference circuit as follows：
Analysis Process：
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FM trouble
YES
Check headset
YES
Check t FM
external circuit
YES
Chec k the
solder ing
condition of D903
YES
Re-download
software
NO
NO
NO
1.Check headphones whether inserted in the end
2.Check headphones jack whether unconnected
solder
1.Power support :VDD
2.Check RTC:32.768KHz
3.Check external whether there is missing and
unconnected solder
NO
Try to re-welding or replace it
Re-welding or change CPU
END
5.15 Bluetooth has not function
Reference circuit as follows：
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Analysis Process：
Blutooth trouble
Chec k power
support for U704
Check clock c ircuit
Chec k w eld ing o f
the D901
Re-download
software
YES
YES
YES
YES
YES
NO
NO
NO
NO
Measure t he voltage BT_2.8V and
VDD _1 .8 V
1. Me asu re D902 whe ther th ere is 32MHz ou tpu t
2.Me asu re th e c loc k 32.768KHz
Check the soldering condition at of D901
Try to re-welding or replace it
Re-welding or change CPU
END
5.16
Phone can not access SIM card
Reference circuit as follows：
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Principle explain：
SIM cards signal Description:
SIM_IO: data signals;
SIM_RST: SIM card reset signal;
SIM_CLK: SIM card clock signal；
VSIM: SIM card power supply;
Boot process, Vsim power supply through the SIM card I / O port from the CPU detection SIM card,
such as card not detected, the software will soon be closed Vsim.
Analysis Process
：
SIM trouble
Check SIM Car d
base
YES
Check Dual SIM
controller(U302)
NO
NO
Whether unconnect s older
SIM card w hether true insert
1.Re-welding or change it
2.Check C343 C345 C347 value whether is 1UF
3.Check peripheral circuit whether there is part
miss
YES
Re-download
software
END
NO
Re-welding or replace CPU
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LTD.
5.17
TF card trouble
Principle explain：
Multi-media card primarily is used to expand data storage capacity, relatively simple interface
circuits, including power signals, clock signals and data signals.
Repair inspection contact pin of the welding, and the existence of foot subsidence;
Multimeter measurements reverse protect the voltage drop to determine the existence of
disconnected lines, ruled out after the above-mentioned problems of the measures taken to
replace the CPU.
Analysis Process
Can not access
Check TF c ard
：
T-flash card
YES
base
YES
NO
Try to re-welding or replace it
Re-download
software
YES
END
NO
Re-welding or change CPU
6 RF Trouble
6.1 Principle of operation
Signal TX processes:
Acquisition voice - Amplification - ADC - filter - Speech Code - Complect - encryption - Channel
Equalization - GMSK modulation -- ( into RF part) IQ modulation (IQ modulator) - filter -- Frequency
phase (phase frequency) - filter - TX_VCO mixer (Mixer Mixer) - power amplifier (PA) - duplex --
Antenna matching circuit - antenna TX
Signal RX process:
Antenna RX - antenna matching circuit – duplex Filter - SAW filter - LAN - RX_VCO mixer -
Amplification - filter - IQ demodulation (IQ Modulator) - GMSK demodulator - Channel Equalization -
decrypt – Cutting Complect - voice codec’s - filter -- DAC - Amplification - voice output
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Typical signal waveform:
67.7K IQ signal:( collected from U0603 –PIN30,31,32,33)
Band selection signals (collected from PA-pin2 BS)
VAPC（PCL=19） and PA-ENABLE（PCL=19）
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6.2 AGC failure
Analysis Process:
control META in a state of
continuous RX
Check L106&C105
pin1 signal whether
Check L112&L113
two-terminal signal
whether is nomal?
AGC F ailu r e
YES
YES
is no r mal?
YES
NO
YES
Re-welding or replace U102
YES
NO
Re-welding or change U105
MT6139(D102)
Pin33,Pin34,Pin35,Pin
36 whether there is
I/Q signal input?
Re-download software
6.3 AFC failure
Analysis Process:
YES
RF IC
NO
YES
Re-welding or change CPU
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AFC F a ilure
Re-download software,clean
test data
YES
Us e repair
tools open TX
YES
Chec k TX I,Q
signal output
whether is normal
?
YES
Check VAFC signal
(No rma l:1.2v )
High-power Current loss
NO
NO
Check PA circuit
Modulator (D102)
w eldin g failu r e o r
function failure
Re-welding or
replace D200
Confirm 26MHz
signal fine-tuning
whether is normal?
Check RX circuit
6.4 APC Failure
END
YES
YES
NO
NO
In the RX mode, change RSSI
parameters
Reference AGC failure analyse
Analysis Process:
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APC Failure
control META in a state of
continuous TX
YES
Oscilloscope check D102
Pin33,Pin34,Pin35,Pin36
whether there is I/Q
signal output?
YES
Check L100/L106
terminal signal
whether is nomal?
NO
NO
YES
Re-welding or replace CPU
YES
Re-welding or change D201
YES
Chec k C120
terminal signal
whether is nomal?
YES
END
YES
NO
Re-welding or replace U102
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7 Maintenance tools
6.1 RF Test Apparatus Agilent 8960 or CMU200
6.2 Oscilloscope
6.3 DC Power Supply
6.4 MultiMate
6.5 Iron
6.6 Hot wind gun
6.7 RF test cable
6.8 USB downloads cable
6.9 Screwdriver, nippers, etc.
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