FX200USB KEYBOARD FULL SPEC
VERSION 1.0
DSGD
G.H BANG Y.H YEO Y.H KIM H.S PARK
CIO CTO CEO
2003.02
FLEXIS
DSGD APPD CHKD Audit
G.H Bang Y.H Kim Y.H Kim 2003.02
model Title
FX-200 USB Product Specification
Contents
1. Application
2. General Terms
3. Quick Spec
4. General SPEC
5. Environmental Condition
6. Reliability Condition
7. Material Test(Mechanic)
8. Part List
Attachment 1 : Key Pad Dimension
Attachment 2 : Exterior Limit Approval
Attachment 3 : Key Pad Design
Attachment 4 : Carrying Case
Attachment 5 : Blister Packing
Attachment 6 : PCB Schematic
DSGD APPD CHKD Audit
G.H Bang Y.H Kim Y.H Kim 2003.02
model Title
FX-200 USB Product Specification
1. Application
The specification applies to the audit of Whitelite FX100 Flexible Keyboard.
2. General Terms
Any changes of part’s spec, structure, material, manufacture and production
flows need additional approval.
3. Quick Spec
3-1. Keypad Printing: There should have no misprint, omission, blot and
erase on the keypad, and printed skin should be distinct and clear.
3-2. Case: There should have no crack, chop, spot, burr and contraction on
the Case-Top, Case-Bottom
3-3. Keypad: All the sizes, tooling, marking, coating should be exactly same
as the drawing apparently.
3-4. The interval between case-top and case-bottom should be under 2mm
and the screws should not skid on the case-bottom.
3-5. There should have no omission of electronic and mechanical parts.
DSGD APPD CHKD Audit
G.H Bang Y.H Kim Y.H Kim 2003.02
model Title
FX-200 USB Product Specification
4. General SPEC
4-1. Hardware Character
Input Voltage 5.0V
Power Consumption 10mA (Normal)
Contents Condition
Temp. Variation
4-2. Software Character
VER. USB 1.1
DRIVER HID Keyboard
Contents Condition
5.Environmental Condition
±0.3%
Humidity
Storage in High Temp
Storage in Low Temp
Thermal Cycling
168HR in Temp. 45℃±2℃ and moisture 90~95 %
48HR/ 1HR in 85℃±2℃
6HR/ 1HR in -40℃±2℃
1HR/1HR in -40℃ ~ 85℃ by 15Cycle
DSGD APPD CHKD Audit
G.H Bang Y.H Kim Y.H Kim 2003.02
model Title
FX-200 USB Product Specification
6. Reliability Condition
6-1. Key Pad
6-1-1. Button’s motion and life test: After 300k times of the condition of
hiiting,the item should not be stuck.
6-1-2. Contacting Resistance: After pressing key in the weight of 500g,the
item’s persistence should be under 500Ω
6-2. Pad Set
6-2-1. Rolling test A: After Rolling 3.5 times under the condition of 50 , ℃
85% for 72 hours, the item should work.
6-2-2. Rolling test B: After rolling 10,000 times while holding one side of
the item, the item should work.
6-2-3. Eraser test: After rubbing 1,500times with an eraser(500g), the
item's print material shouldn't be erased.
6-2-4. Alcohol test: After scrubbing 250times with Methyl alcohol(99.3%) in
the weight of 500g, the item's print material shouldn't be erased.
6-2-5. Heat test: After keeping under the condition of -40 and +85℃℃ for
an hour and repeat the same test 15 times, the item should work.
6-2-6. Bending test: After bending 10,000 times at the angle of 180°, the
items should work.
6-2-7. Rubber stretching test: After stretching for 1 minute in the weight of
3Kg, the item should satisfy all Spec conditions.
DSGD APPD CHKD Audit
G.H Bang Y.H Kim Y.H Kim 2003.02
model Title
FX-200 USB Product Specification
7. Material Test(Mechanic)
No. Name PCS Class Std. Remarks
1 CASE TOP 1
2 CASE BOTTOM 1
3 SCREW 5
4 PAD ASS’Y 1
5 USB WIRE JACK 1 Customized
6 PCB ASS’Y 1
DSGD APPD CHKD Audit
G.H Bang Y.H Kim Y.H Kim 2003.2
model Title
FX-200 USB Product Specification
8. Part List (Schematic)
No. Name PCS Class Std. Remarks
1 CHIP RESISTOR 1 7.5K –J-1608
2 CHIP RESISTOR 1 240K-J-1608
3 CHIP RESISTOR 1 470K-J-1608
4 CHIP CONDENSER 1 0.1uF-J-1608
5 CHIP CONDENSER 1 4.7uF-J-1608
6 RESONATOR 1 6MHz
7 COIL 2
121JV
8 PCB 1 FR4, t=1.0
9 MICOM 1 CY763413
HB-IM1608-
Attachment 1: Key Pad Dimension
11.0mm±0.2
2.7mm
±0.2
Attachment 2 : Exterior Limit Approval
Attachment 3 : Key Pad Design
Attachment 4 : Carrying Case
Attachment 5 : Blister Packing
Attachment 6 : PCB Schematic
6-1 Schematic
6-2 PCB
a.FX200USB PCB
b. Part List
No. Name Std. PCS Remarks
L1,L2 COIL 2
R1 CHIP-RESISTOR 7.5K 1
R2 CHIP-RESISTOR 240K 1
R3 CHIP-RESISTOR 470K 1
R4~R9 CHIP-RESISTOR No Operation 1
C1 CHIP-
4.7uF 1
CONDENSER
C2 CHIP-
0.1uF 1
CONDENSER
X-TAL RESONATOR 6MHz 1
MICOM MICOM CY763413 1
PCB PCB 1
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