Fisher ControlWave Micro Distributed I/O System Manuals & Guides

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ControlWave® Micro Distributed I/O System
Instruction Manual
Part Number D301772X012
August 2015
Remote Automa tio n Solution
www.EmersonProcess.com/Remote
Be sure that these instructions are carefully read and understood before any operation is attempted. Improper use of this device in some applications may result in damage or injury. The user is urged to keep this book filed in a convenient location for future reference.
These instructions may not cover all details or variations in equipment or cover every possible situation to be met in connection with installation, operation or maintenance. Should problems arise that are not covered sufficiently in the text, the purchaser is advised to contact Emerson Process Management, Remote Automation Solutions for further information.
IMPORTANT! READ INSTRUCTIONS BEFORE STARTING!
EQUIPMENT APPLICATION WARNING
The customer should note that a failure of this instrument or system, for whatever reason, may leave an operating process without protection. Depending upon the application, this could result in possible damage to property or injury to persons. It is suggested that the purchaser review the need for additional backup equipment or provide alternate means of protection such as alarm devices, output limiting, fail-safe valves, relief valves, emergency shutoffs, emergency switches, etc. If additional information is required, the purchaser is advised to contact Remote Automation Solutions.
RETURNED EQUIPMENT WARNING
When returning any equipment to Remote Automation Solutions for repairs or evaluation, please note the following: The party sending such materials is responsible to ensure that the materials returned to Remote Automation Solutions are clean to safe levels, as such levels are defined and/or determined by applicable federal, state and/or local law regulations or codes. Such party agrees to indemnify Remote Automation Solutions and save Remote Automation Solutions harmless from any liability or damage which Remote Automation Solutions may incur or suffer due to such party's failure to so act.
ELECTRICAL GROUNDING
Metal enclosures and exposed metal parts of electrical instruments must be gr ounded in accordance with OSHA rules and regulations pertaining to "Design Safety Standards for Electrical Systems," 29 CFR, Part 1910, Subpart S, dated: April 16, 1981 (OSHA rulings are in agreement with the National Electrical Code).
The grounding requirement is also applicable to mechanical or pneumatic instruments that include electrically operated devices such as lights, switches, relays, alarms, or chart drives.
EQUIPMENT DAMAGE FROM ELECTROSTATIC DISCHARGE VOLTAGE
This product contains sensitive electronic components that can be damaged by exposure to an electrostatic discharge (ESD) voltage. Depending on the magnitude and duration of the ESD, this can result in erratic operation or complete failure of the equipment. Read supplemental document S14006 for proper care and handling of ESD-sensitive components.
ControlWave Micro Distributed I/O System Instruction Manual

Contents

Chapter 1 – Introduction 1-1
1.1Scope of the Manual ................................................................................................................. 1-2
1.2Physical Description .................................................................................................................. 1-2
1.3Housings ................................................................................................................................... 1-4
1.4CPU Module .............................................................................................................................. 1-4
1.5Power Supply/ Sequencer Module (PSSM) .............................................................................. 1-6
1.6Expansion Communications Modules ....................................................................................... 1-8
1.7I/O Modules ............................................................................................................................... 1-8
1.8Secure Gateway ...................................................................................................................... 1-10
Chapter 2 – Installation 2-1
2.1Site Considerations ................................................................................................................... 2-1
2.1.1Class I, Div 2 Installation Considerations ...................................................................... 2-2
2.2Installation Overview ................................................................................................................. 2-3
2.2.1Unpacking Components ................................................................................................ 2-3
2.2.2Mounting the Housing ................................................................................................... 2-8
2.2.3Grounding the Housing ............................................................................................... 2-10
2.3Power Supply/Sequencer Module (PSSM) ............................................................................. 2-11
2.3.1General Information about the PSSM ......................................................................... 2-11
2.3.2PSSM Installation Overview ........................................................................................ 2-13
2.3.3Setting Jumpers on the PSSM .................................................................................... 2-13
2.3.4General Wiring Guidelines .......................................................................................... 2-14
2.3.5Wiring a Bulk DC Power Supply to the PSSM ............................................................ 2-15
2.3.6Wiring an External Alarm or Annunciator to the Watchdog Connector (OPTIONAL) . 2-16
2.4CPU Module ............................................................................................................................ 2-18
2.4.1Setting Jumpers on the CPU Module .......................................................................... 2-19
2.4.2Setting DIP Switches on the CPU Module .................................................................. 2-20
2.4.3Connections to RS-232 Serial Port(s) on CPU or ECOM Modules ............................ 2-22
2.4.4Connections to RS-485 Serial Port(s) on CPU or ECOM Modules ............................ 2-26
2.4.5Connections to Ethernet Port(s) on the CPU Module ................................................. 2-28
2.5Expanded Communications Module (ECOM) ......................................................................... 2-30
2.5.1RS-232 Ports ............................................................................................................... 2-31
2.5.2RS-485 Ports ............................................................................................................... 2-31
2.5.3Modem Port (Type 1 ECOM only) ............................................................................... 2-32
2.6Bezels ...................................................................................................................................... 2-35
2.7Optional Display/Keypads ....................................................................................................... 2-36
Chapter 3 – I/O Modules 3-1
3.1Module Placement .................................................................................................................... 3-2
3.2Wiring ........................................................................................................................................ 3-2
3.2.1Local Termination .......................................................................................................... 3-3
3.2.2Remote Termination ...................................................................................................... 3-3
3.2.3Shielding and Grounding ............................................................................................... 3-4
3.3Isolated Digital Input (DI) Module .............................................................................................. 3-5
3.4Isolated Digital Output (DO) Module ....................................................................................... 3-10
3.5Non-isolated Digital Input/Output (DI/O) Module .................................................................... 3-14
3.6Non-isolated Analog Input/Output & Analog Input Module ..................................................... 3-17
3.7Non-isolated High Speed Counter (HSC) Input Module ......................................................... 3-21
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ControlWave Micro Distributed I/O System Instruction Manual
3.8Isolated Analog Input (AI) Module ........................................................................................... 3-25
3.9Isolated Analog Output (AO) Module ...................................................................................... 3-29
3.10Non-isolated Mixed I/O (MI/O) Module ................................................................................... 3-32
3.11Isolated Vac Digital Input Module ........................................................................................... 3-38
3.12Relay Isolated Vac/Vdc Digital Output Module ....................................................................... 3-40
3.13Isolated Digital Input/Output (DI/O) Module ............................................................................ 3-42
3.14Isolated Resistance Temperature Device (RTD) Input Module .............................................. 3-45
3.15Isolated Thermocouple Module ............................................................................................... 3-48
Chapter 4 – Operation 4-1
4.1Powering Up/Powering Down the ControlWave Micro Distributed I/O System ........................ 4-1
4.2Communicating with the ControlWave Micro Distributed I/O System ....................................... 4-2
4.2.1Default Comm Port Settings ......................................................................................... 4-2
4.2.2Changing Port Settings ................................................................................................. 4-3
Chapter 5 – Service and Troubleshooting 5-1
5.1Upgrading Firmware .................................................................................................................. 5-2
5.2Removing or Replacing Components ....................................................................................... 5-5
5.2.1Accessing Modules for Testing ..................................................................................... 5-5
5.2.2Removing/Replacing the Bezel ..................................................................................... 5-6
5.2.3Removing/Replacing the CPU Module ......................................................................... 5-6
5.2.4Removing/Replacing the PSSM .................................................................................... 5-6
5.2.5Removing/Replacing an I/O Module ............................................................................. 5-7
5.2.6Removing/Replacing the Backup Battery ..................................................................... 5-7
5.2.7Enabling / Disabling the Backup Battery ....................................................................... 5-9
5.3General Troubleshooting Procedures ....................................................................................... 5-9
5.3.1Checking LEDs ............................................................................................................. 5-9
5.3.2Checking Wiring/Signals ............................................................................................. 5-15
5.3.3Common Communication Configuration Problems ..................................................... 5-16
5.4WINDIAG Diagnostic Utility ..................................................................................................... 5-17
5.4.1Available Diagnostics .................................................................................................. 5-20
5.5Core Updump .......................................................................................................................... 5-24
Appendix A – Special Instructions for Class I, Division 2 Hazardous Locations A-1
Appendix B – Open MODBUS Interface B-1
Index IND-1
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ControlWave Micro Distributed I/O System Instruction Manual
Chapter 1 – Introduction
The ControlWave Micro Distributed I/O System (DIOS) provides additional I/O in a separately mounted rack for an existing ControlWave Micro process automation controller.
This manual focuses on the hardware aspects of the ControlWave Micro Distributed I/O System. For information about the software used, refer to the ControlWave Designer Programmer’s Handbook (D5125), and the online help in ControlWave Designer.
This chapter details the structure of this manual and provides an overview of the ControlWave Micro and its components.
In This Chapter
1.1Scope of the Manual ........................................................................ 1-2
1.2Physical Description ........................................................................ 1-2
1.3Housings .......................................................................................... 1-4
1.4CPU Module .................................................................................... 1-4
1.5Power Supply/ Sequencer Module (PSSM) .................................... 1-6
1.6Expansion Communications Modules ............................................. 1-8
1.7I/O Modules...................................................................................... 1-8
1.8Secure Gateway ............................................................................ 1-10
Features
ControlWave products have been designed and integrated as a highly adaptable, high performance distributed open controller family with exceptional networking capability that provides a complete process automation management solution for the natural gas, water, and wastewater industries. The ControlWave Micro Distributed I/O System was designed with an emphasis on providing high performance with low power consumption, scalability, and modularity.
ControlWave Micro Distributed I/O Systems have the following key features:
Exceptional performance and low power consumption through use
of the ARM microprocessor
Small size (enabling panel- or wall-mount installations) Two RS-232 and one RS-485 asynchronous serial communication
ports
One 10/100 MB Ethernet port Optional Expansion Communication modules (ECOMs) with
optional built-in modem and/or radio or additional ports.
3-, 4- and 8-slot base housings with 2-, 4-, or 8-slot I/O expansion
housings
Note: The 3-slot base housing does not include a plug-in connection to
any expansion housings.
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ControlWave Micro Distributed I/O System Instruction Manual
Wide operating temperature range: (–40 to +70C) (–40 to 158F) Variety of I/O modules (including mixed I/O) for cost-effective
small RTU applications
LED status indicators on the CPU, PSSM, and I/O modules Lithium coin cell battery (located on the CPU module) provides
battery backup for the real-time clock and the system’s static RAM (SRAM)
CE and Class I, Division 2 Hazardous Location approvals

1.1 Scope of the Manual

This manual contains the following chapters:
Chapter 1 Introduction
Chapter 2 Installation
Chapter 3 I/O Modules
Chapter 4 Operation
Chapter 5 Service and Troubleshooting

1.2 Physical Description

Each ControlWave Micro Distributed I/O System has a printed circuit board (PCB) backplane mounted in an aluminum housing, a Power Supply/Sequencer Module (PSSM), a CPU module, and—depending on the backplane and housing size—from zero to six I/O modules. See Figure 1-1. Expansion housings (in 2-, 4-, or 8-slot configurations) attach to the base housing and enable you to add up to eight more I/O modules.
Provides an overview of the hardware and general specifications for the ControlWave Micro Distributed I/O System.
Provides information on the base and expansion housings, the Power Supply/Sequencer module (PSSM), the CPU module, the Expanded Communications module (ECOM), and related peripherals such as the optional keypad.
Provides general information and wiring diagrams for the I/O modules.
Provides information on day-to-day operation of the ControlWave Micro Distributed I/O System.
Provides information on service and troubleshooting procedures.
You can insert optional expansion communication modules (ECOMs) in slots #3 and #4 of the base housing in place of I/O modules.
Refer to the following sections in this chapter or to other chapters in this manual for further information:
Base and expansion housings (chassis) with backplanes (see Section
1.3 and Chapter 2)
Power Supply/Sequencer module (PSSM) (see Section 1.5 and
Chapter 2)
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ControlWave Micro Distributed I/O System Instruction Manual
CPU module (see Section 1.4 and Chapter 2) One or more I/O modules (see Section 1.7 and Chapter 3) Optional Expansion Communication modules (ECOMs) (see Section
1.6 and Chapter 2)
Peripheral components (such as keypad) (see Chapter 2) Figure 1-1 shows an 8-slot base housing with PSSM and CPU modules
installed.
Figure 1-1. 8-slot Base Housing (without 6 I/O Modules
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ControlWave Micro Distributed I/O System Instruction Manual

1.3 Housings

ControlWave housings (whether base or expansion) are gold irridite­plated aluminum designed either for wall, DIN rail, or panel-mounting. They contain the printed circuit board (PCB) backplane that provides connections for the PSSM, the CPU module, any ECOMs, and any I/O modules.
Base
Expansion

1.4 CPU Module

Three base housings are available:
3-slot base backplane supports one PSSM, one CPU, and one I/O
module.
4-slot base backplane supports one PSSM, one CPU, and two I/O
modules.
8-slot base housing supports one PSSM, one CPU, and up to six I/O
modules.
You can substitute one or two ECOMs for I/O modules in slots 3 and 4 (if present) of the base housing.
Three optional expansion housings enable you to add an additional two, four, or eight I/O modules to either a 4-slot base or 8-slot base housing. However, you cannot install ECOMs in an expansion housing.
Note: For complete technical details on housings, refer to the
ControlWave Micro technical specification (CWM).
The CPU (central processing unit) module houses the multi-layer PCB, which contains the ControlWave Micro CPU, I/O monitor/control, memory, and communication functions.
The CPU module includes:
Sharp LH7A400 System-on-Chip ARM microprocessor with 32-bit
ARM9TDMI Reduced Instruction Set Computer (RISC) core, operating at 1.8V with a system clock speed of 33 MHz or 150 MHz.
Two RS-232 communication ports One RS-485 communication port One 10/100baseT Ethernet port 2 MB of battery backed Static RAM (SRAM), 64MB of Synchronous Dynamic RAM (SDRAM), 512KB boot/downloader Flash, 16MB simultaneous read/write Flash memory
transmit (TX) and receive (RX) LEDs for each communication port configuration DIP switches (described in Chapter 2.)
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ControlWave Micro Distributed I/O System Instruction Manual
Note: Do not confuse the CPU module (which has communication
components) with the Expansion Communication module (ECOM), which does not have a CPU component or a battery backup but does have additional communication components.
Figure 1-2. CPU Module with Three Serial Ports and One Ethernet Port
CPU Backup Battery
CPU Memory
CPU modules have a coin cell socket that accepts a 3.0V, 220 mA-hr lithium battery. This battery provides backup power for the real-time clock and the system’s Static RAM (SRAM).
There are several different types of memory used on the CPU module:
Boot/Downloader FLASH
Boot/download code is contained in a single 512 Kbyte FLASH chip. Boot FLASH also holds the value of soft switches, audit/archive file configurations, and user account and port information.
FLASH Memory
The CPU module contains 16 MB of FLASH memory. The FLASH memory holds the system firmware. The FLASH does not support hardware write protection.
System Memory (SRAM)
The CPU module has 2 MB of static random access memory (SRAM). During power loss periods, SRAM enters data retention mode (powered by a lithium backup battery). Critical system information that must be
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ControlWave Micro Distributed I/O System Instruction Manual
retained during power outages or when the system has been disabled for maintenance is stored here. This includes the last states of all I/O points, the values of any variables marked RETAIN and the values of any variables assigned to the static memory area.
SDRAM
The CPU module contains 64MB of synchronous dynamic random access memory (SDRAM). SDRAM holds a copy of system firmware and the current values of any variables not marked RETAIN or stored in the static memory area. This allows the system to run faster than it will from the SRAM memory. SDRAM is not battery-backed.

1.5 Power Supply/ Sequencer Module (PSSM)

The Power Supply/Sequencer module (PSSM) takes power from an external bulk DC power supply and then provides power through the ControlWave Micro Distributed I/O housing/backplane to all installed modules.
The PSSM operates from +10.7 to +30 Vdc or from +21.7 to +30 Vdc. You configure the nominal input supply configuration (12V or 24V) using configuration jumper switches on the PSSM.
The PSSM includes:
a wide input range Vin to 3.3V DC to DC Converter 1200 msec good power detection circuitry Vin out-of-specifications detection circuitry Watchdog output connector Status LEDs Vin 12-bit serial analog to digital converter
Note: The two versions of the PSSM currently available for use with
the ControlWave Micro Distributed I/O System are identical to those used with the ControlWave Micro Process Automation Controller. One version has a watchdog connector (see Figure 1-
3) the other does not (see Figure 1-4).
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 1-3. PSSM (with watchdog connector)
Figure 1-4. PSSM (no watchdog connector)
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ControlWave Micro Distributed I/O System Instruction Manual
Board Fuse
The PSSM is fused to protect the entire system using a 5x20mm slow blow fuse F1 rated at 3 Amps.

1.6 Expansion Communications Modules

An optional Expansion Communications module (see Figure 1-5) provides two additional serial communications ports and optionally a piggy-backed dial-up modem. Two basic versions of the module are available. Both serial communication ports support speeds of up to
115.2 KB. The top communication port (labeled C1) supports RS-232 operation while the second port (labeled C2) supports RS-485 operation. Additionally, you can order the RS-485 port with isolation to 500 Vdc.
Figure 1-5. Expansion Communications (ECOM) Module

1.7 I/O Modules

The ControlWave Micro Distribution I/O System supports a wide array of factory-configured I/O modules including analog I/O, digital I/O, high speed counter, and several others for either local or remote field device wiring termination.
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ControlWave Micro Distributed I/O System Instruction Manual
Refer to Chapter 3 for information on specific I/O modules. Figure 1-6 shows a typical I/O module housing.
Configuration jumpers on I/O modules accommodate individual field I/O user configuration. Terminations are pluggable and accept a maximum wire size of #14 AWG. All I/O modules have surge protection that meets C37.90-1978 and IEC 801-5 specifications. Each I/O module connects to the backplane using a 36-pin male card-edge connector. All I/O modules are provided with two 10-point terminal block assemblies (for local termination) or two 14-pin mass Termination headers (for remote termination).
All digital (or discrete) I/O modules have individual point LED status indicators that you can enable either with a jumper on the module or through a software setting.
Figure 1-6. Two ControlWave Micro I/O Modules (with Bezel)
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ControlWave Micro Distributed I/O System Instruction Manual

1.8 Secure Gateway

For enhanced data security when using an IP/Ethernet connection, Emerson Remote Automation Solutions recommends adding an industrial router with VPN and firewall security. Recommended solutions include the MOXA EDR810, the Hirschman Eagle One, or the Phoenix mGuard rs4000 (or equivalents). An example of how to install one of these devices to the RTU can be found in the Emerson Remote Automation Solutions MOXA® Industrial Secure Router Installation Guide (part number D301766X012). For further information, contact your Local Business Partner or the individual vendor’s website.
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ControlWave Micro Distributed I/O System Instruction Manual
Chapter 2 – Installation
This chapter discusses the physical configuration of the ControlWave Micro Distributed I/O system, considerations for installation, and instructions for setting switches and jumpers on the CPU, PSSM, and ECOM modules.
In This Chapter
2.1Site Considerations .......................................................................... 2-1
2.1.1Class I, Div 2 Installation Considerations ............................. 2-2
2.2Installation Overview ........................................................................ 2-3
2.2.1Unpacking Components ....................................................... 2-3
2.2.2Mounting the Housing .......................................................... 2-8
2.2.3Grounding the Housing ...................................................... 2-10
2.3Power Supply/Sequencer Module (PSSM) ................................... 2-11
2.3.1General Information about the PSSM ................................ 2-11
2.3.2PSSM Installation Overview ............................................... 2-13
2.3.3Setting Jumpers on the PSSM ........................................... 2-13
2.3.4General Wiring Guidelines ................................................. 2-14
2.3.5Wiring a Bulk DC Power Supply to the PSSM ................... 2-15
2.3.6Wiring an External Alarm or Annunciator to the Watchdog
2.4CPU Module .................................................................................. 2-18
2.4.1Setting Jumpers on the CPU Module ................................. 2-19
2.4.2Setting DIP Switches on the CPU Module ......................... 2-20
2.4.3Connections to RS-232 Serial Port(s) on CPU or ECOM Modules
2.4.4Connections to RS-485 Serial Port(s) on CPU or ECOM Modules
2.4.5Connections to Ethernet Port(s) on the CPU Module ........ 2-28
2.5Expanded Communications Module (ECOM) ............................... 2-30
2.5.1RS-232 Ports ...................................................................... 2-31
2.5.2RS-485 Ports ...................................................................... 2-31
2.5.3Modem Port (Type 1 ECOM only) ...................................... 2-32
2.6Bezels ............................................................................................ 2-35
2.7Optional Display/Keypads.............................................................. 2-36
Connector (OPTIONAL) ................................................... 2-16
.......................................................................................... 2-22
.......................................................................................... 2-26

2.1 Site Considerations

When choosing an installation site, check all clearances. Ensure that the ControlWave Micro Distributed I/O System is accessible for wiring and service.
Caution
To ensure safe use of this product, please review and follow the instructions in the following supplemental documentation:
Supplement Guide - ControlWave Site Considerations for
ESDS Manual – Care and Handling of PC Boards and ESD
Revised Aug-2015 Installation 2-1
Equipment Installation, Grounding, and Wiring (S1400CW)
Sensitive Components (S14006)
ControlWave Micro Distributed I/O System Instruction Manual
Specifications
for Temperature,
Humidity and
Vibration
Caution

2.1.1 Class I, Div 2 Installation Considerations

See document CWMICRO available on our website for detailed
technical specifications for temperature, humidity, and vibration for the ControlWave Micro family (including the distributed I/O system). This document is available on our website at
http://www.emersonprocess.com/remote.
Ensure that the ambient temperature and humidity at the installation
site remains within these specifications. Operation beyond the specified ranges could cause output errors and erratic performance. Prolonged operation under extreme conditions could also result in failure of the unit.
Check the mounted enclosure, panel, or equipment rack for
mechanical vibrations. Make sure that the ControlWave Micro Distributed I/O system is not exposed to a level of vibration that exceeds that provided in the technical specifications.
Placement of the ControlWave Micro Distributed I/O System in Class 1, Division 2 (Group A, B, C, and D) hazardous locations requires that you select an appropriate enclosure that meets NEMA Type 3X or 4X specifications.
WARNING
Underwriters Laboratories (UL) lists the ControlWave Micro
Distributed I/O System as non-incendive and suitable only for use in
Class I, Division 2, Group A, B, C, and D hazardous locations and non-
hazardous locations. Read this chapter and Appendix A carefully before
you install a ControlWave Micro Distributed I/O System in a hazardous location.
Perform all power and I/O wiring in accordance with Class I, Division 2
wiring methods as defined in Article 501-4 (b) of the National Electrical Code, NFPA 70 (for installations within the United States) or as specified in Section 18-152 of the Canadian Electrical Code (for
installation in Canada).
EXPLOSION HAZARD Substitution of components may impair suitability for use in Class I,
Division 2 environments. When the ControlWave Micro Distributed I/O System is situated in a
hazardous location, turn off power before servicing or replacing the unit and before installing or removing I/O wiring.
Do not disconnect equipment unless the power is switched off or the area is known to be non-hazardous.
2-2 Installation Revised Aug-2015

2.2 Installation Overview

Installing a ControlWave Micro Distributed I/O System involves several general steps:
1. Unpacking, assembling, and configuring the hardware
2. Installing PC-based software (ControlWave Designer)
3. Establishing communications
4. Creating an application-specific control strategy (ControlWave
project) for the ControlWave Micro host controller that references
I/O modules in the distributed I/O system
5. Creating application-specific web pages (optional)
6. Adding the ControlWave Micro to an OpenBSI network
7. Downloading the application-specific ControlWave project into the
ControlWave Micro host controller
Note: Steps 2 through 7 require that you install and use ControlWave
ControlWave Micro Distributed I/O System Instruction Manual
Designer software on your PC. This manual focuses on hardware installation and preparation. Software installation and configuration is beyond the scope of this manual. Refer to the
ControlWave Micro Quick Setup Guide (D5124) for information related to software installation and use.

2.2.1 Unpacking Components

Packaging
Depending upon how you order it, the ControlWave Micro Distributed I/O System may arrive pre-assembled, or in a number of separate boxes. If you did not order it pre-assembled, you must identify, unpack, and assemble the components. Unless otherwise noted, you can place modules in any slot in a base or expansion housing.
Note: Do not install modules in the base or expansion housings until
you have mounted and grounded those housings at the
designated installation site.
Delivered boxes may include:
Housing assemblies (3-, 4- or 8-slot base housings and 2-, 4-, or 8-
slot expansion housings)
Power Supply/Sequencer module (PSSM)
Note: The PSSM must reside in slot #1 in the base housing.
CPU module
Note: The CPU module must reside in slot #2 in the base housing.
Expansion Communication Module (ECOM).
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ControlWave Micro Distributed I/O System Instruction Manual
Note: The first ECOM must reside in slot #3 in the base housing; a
second ECOM can reside in slot #4 in the base housing.
I/O Modules
Note: There are many different types of I/O modules available.
Chapter 3 contains detailed instructions on each I/O module.
One or more bezel assemblies; each bezel covers two I/O modules.
Housing
The base housing (or chassis) for the ControlWave Micro Distributed I/O System is an open-faced aluminum assembly. In use, you install a blue plastic cover (“bezel”) over each pair of installed I/O modules, as
shown in Figure 2-1.).
Figure 2-1. 8-Slot Base Housing with Bezel
Keyed cutouts in the housing’s rear wall (see Figure 2-2 through Figure 2-7) permit wall or panel mounting. The base housing has the following
components:
Built-in guides on the top and bottom of the housing permit easy
installation and removal of modules
Built-in ground lug (on right bottom corner of housing) Printed circuit board (PCB) attached to interior back of housing
provide seating and electrical interface for modules
Built-in interface connector (available only on 4-slot and 8-slot
housings) for expansion housings
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ControlWave Micro Distributed I/O System Instruction Manual
Composed of aluminum (plated with gold irridite), the base housing has three configurations (3-slot, 4-slot, or 8-slot backplane). Optional I/O expansion housings (also gold irridite-plated aluminum) accommodate additional I/O modules in three configurations (2-slot, 4-slot, or 8-slot backplanes), and can be either wall- or panel-mounted or rack mounted
with a DIN-rail. Refer to Figure 2-2 through Figure 2-7 for dimensional drawings of the three base housings and three expansion housings.
Figure 2-2. 3-Slot Base Housing
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 2-3. 4-Slot Base Housing
Figure 2-4. 8-Slot Base Housing
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Figure 2-5. 2-Slot Expansion Housing
Figure 2-6. 4-Slot Expansion Housing
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 2-7. 8-Slot Expansion Housing

2.2.2 Mounting the Housing

You can mount base or expansion housings to a panel or a wall. When mounting one of these units to a panel or wall, place it according to the following guidelines:
Ensure that the front of the ControlWave Micro Distributed I/O
System is visible and accessible for service (for example, so you can easily install or remove modules).
Use the mounting holes provided in the base and expansion
housings (see Figure 2-2 through Figure 2-7).
Remove the base housing and any applicable expansion housings from their cartons and install them at the assigned work site.
Note: If you are attaching an expansion housing to a 4-slot or 8-slot
base housing, remove the three bus terminators JP2, JP3, and
JP4 (see Figure 2-8) from the backplane on the 4-slot or 8-slot
base housings. You also may need to remove the paper label
over the connector on the right back edge of the base housing.
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ControlWave Micro Distributed I/O System Instruction Manual
JP2, JP3, & JP4 jumpers
Figure 2-8. JP2, JP3, and JP4 Jumpers on Base Housing
Face the housings and mount the base housing on the left and the expansion housing on the right so that the connector on the right back edge of the base housing (P10) seats firmly with the connector on the left back edge of the expansion housing (P9).
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ControlWave Micro Distributed I/O System Instruction Manual

2.2.3 Grounding the Housing

Caution
Do not install any modules in the base or expansion housings until you have mounted and grounded those housings at the designated installation site.
Base housings have a ground lug (see Figure 2-2 through Figure 2-7)
that accommodates up to a #4 AWG wire size. Once you have installed the base and any expansion housings, you must run a ground wire between the base housing ground lug and a known good earth ground.
Note: After you install the PSSM in the base housing, as an added
precaution we recommend that you run a #14 AWG wire from the TB1-3 power connection (Ground) to the same known good
earth ground.
Additional grounding guidelines include:
Use stranded copper wire (#4 AWG) for the base housing to earth
ground, and keep the length as short as possible.
Clamp or braze the ground wire to the ground bed conductor
(typically a stranded copper AWG 0000 cable installed vertically or horizontally).
Tin the wire ends with solder (using a high-wattage soldering iron)
prior to inserting the wire into the base housing ground lug.
Run the ground wire so that any routing bend in the cable has a
minimum radius of 12-inches below ground and 8-inches above ground.
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ControlWave Micro Distributed I/O System Instruction Manual

2.3 Power Supply/Sequencer Module (PSSM)

Before we actually configure the PSSM and install it in the housing, we’re going to discuss some general information about how it works.

2.3.1 General Information about the PSSM

The Power Supply/Sequencer module (PSSM) plugs into slot #1 (first slot from the left) on the ControlWave Micro Distributed I/O System’s backplane using connector P1, a 44-pin female non-keyed header (see
Figure 2-2, Figure 2-3 and Figure 2-4).
Currently, we offer the PSSM in two configurations:
PSSM with Display Interface and Watchdog output (model 396657-
01-0, Revision A and above) (see Figure 2-9)
PSSM with Mode Switch SW1 & Display Interface (model 396657-
02-8 without Watchdog output, Revision A and above) (see Figure
2-10)
Figure 2-9. PSSM with Run/Remote/Local Switch, Display Interface, and Watchdog Connector
Revised Aug-2015 Installation 2-11
ControlWave Micro Distributed I/O System Instruction Manual
Figure 2-10. PSSM Module with Mode Switch, Display Interface, and without Watchdog Connector
Two terminal blocks (see Figure 2-9) provide external input power and
watchdog connector switch connections. Two red LEDs on the PSSM’s front panel enable you to monitor the status of the watchdog (WD) and Idle (IDLE) circuits.
Note: The Idle LED is usually on, indicating when the CPU has free
time at the end of its execution cycle. If the LED is off, it
indicates the CPU has no free time and may be overloading.
Six additional LEDs provide system status codes (see Chapter 5).
PSSMs contain a DC-to-DC converter that generates a +3.3 Vdc supply for the entire unit (that is, the CPU and various I/O modules that plug into the backplane).
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ControlWave Micro Distributed I/O System Instruction Manual
Power
Supply
An auxiliary +5 Vdc regulator powers low power detection circuitry and sequencer timing circuitry.
The power supply operates from +10.7 to +30 Vdc or from +21.7 to +30 Vdc. You can configure the nominal input supply configuration (12V or 24V) using configuration jumper switches on the PSSM PCB. See
Figure 2-9 and Figure 2-10.
Watchdog
Switch
PSSMs optionally include a watchdog metal oxide semiconductor field­effect transistor (MOSFET) switch connector. The purpose of the watchdog connector is to trigger an external alarm or annunciator if the ControlWave Distributed I/O System enters a “watchdog” condition in which the CPU cannot control the I/O. This occurs on power-up before the ControlWave project starts, if the unit is reset, or if the system loses
power. See Section 2.3.6.

2.3.2 PSSM Installation Overview

There are several steps you need to follow when you install the PSSM.
1. Identify the carton holding the PSSM and remove it from that carton.
See Section 2.2.1.
2. Set jumpers on the PSSM based on whether your external DC bulk
power supply provides +12V or +24V. See Section 2.3.3.
3. Slide the PSSM into slot #1 of the housing.
4. Unplug terminal block connector TB1 from the PSSM and wire it to
an external bulk DC power supply. See Section 2.3.5.
5. If you want to use the watchdog connector TB2, unplug it from the
PSSM and wire it to an external annunciator or similar device
according to instructions in Section 2.3.6.
6. After you configure and install the CPU module in slot #2 re-connect
terminal blocks to their connectors to apply power to the unit.

2.3.3 Setting Jumpers on the PSSM

The PSSM has three jumpers which you set based on whether your
bulk DC power supply will provide +12V or +24V. See Figure 2-9 or Figure 2-10 to locate the jumpers on your version of the PSSM.
JP2: Three-position Power Fail Trip Point Selection Jumper:
o 1-to-2 Installed = Choose this to select +12V Bulk Supply
Power Fail Trip Point
o 2-to-3 Installed = Choose this to select +24V Bulk Supply
Power Fail Trip Point (default)
JP4: Three-position Power Supply Shutdown Trip Point Selection
Jumper:
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ControlWave Micro Distributed I/O System Instruction Manual
o 1-to-2 Installed = Choose this to select +12V Bulk Supply
Shutdown Trip Point.
o 2-to-3 Installed = Choose this to select +24V Bulk Supply
Shutdown Trip Point. (default)
JP5: Three-position Field Voltage Shutdown Trip Point Selection
Jumper
o 1-to-2 Installed = +12V Bulk Supply Field Voltage Shutdown
Trip Point Selected
o 2-to-3 Installed = +24V Bulk Supply Field Voltage Shutdown
Trip Point Selected. (default)

2.3.4 General Wiring Guidelines

ControlWave Micro Distributed I/O System PSSMs use
compression-type terminals that accommodate up to #14 AWG wire. When making a connection, insert the bare end of the wire (approx
¼” max) into the clamp adjacent to the screw and secure the wire. To prevent shorts, ensure that no bare wire is exposed. If using
standard wire, tin the bare end with solder to prevent flattening and improve conductivity.
Allow some slack in the wire while making terminal connections.
Slack makes the wires more manageable and helps minimize mechanical strain on the terminal blocks.
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ControlWave Micro Distributed I/O System Instruction Manual

2.3.5 Wiring a Bulk DC Power Supply to the PSSM

Caution
At this time you can also connect power and watchdog wiring. However; for safety reasons and to prevent accidental damage to the your bulk DC power supply, do not connect the pluggable terminal block connectors TB1 and TB2 to the PSSM until after you install, wire, and configure the CPU module.
Follow the instructions in Section 2.3.4 General Wiring Guidelines when wiring connections.
You can connect one bulk DC power supply (nominally either +12 Vdc or +24 Vdc) to the PSSM. The PSSM then converts, regulates, and filters the power to +3.3 Vdc. For safety, the PSSM circuit has a 3A fuse.
The ControlWave Micro Distributed I/O System PSSM’s operating range is +10.7 to +30.0 Vdc (with nominal +12Vdc input source) or +21.7 to +30.0 Vdc (with a nominal +24Vdc input source).
Use the following formula to determine the maximum current required for the +12 Vdc or +24 Vdc bulk power used with a particular ControlWave Micro Distributed I/O System:
Bulk + 12/24 Vdc Supply Current = CPU* + Sum of all ECOM modules and I/O modules.
Refer to Table 2-1 for ControlWave Micro Distributed I/O System bulk
power requirements.
Table 2-1. Bulk Power Requirements
Component
CPU, backplane, and PSSM (with Ethernet)
Any backplane 2 mA 4 mA PSSM 3.2 mA 6.4 mA Non-isolated AI/AO Module 2.8 mA + (47.2 mA – VEXT) 5.6 mA + (47.2 mA – VEXT) Isolated DI Module 104 mA 208 mA Isolated DO Module 13 mA 26 mA Non-isolated DI/DO Module 12 mA 24 mA Non-isolated HSC Module 5 mA 10 mA Isolate5.3 mA d AI Module 113 mA + (24.5 mA/loop) 192 mA + (49 mA/loop) Isolated AO Module 10 mA + (22.5 mA/I loop) or
10 mA + (5.3 mA/E loop @ 5 mA)
Non-isolated Mixed I/O module (with optional AO)
Isolated VAC DI module 5 A 10 mA Isolated VAC/DC DO module 10 mA 20 mA Isolated DI/DO module 83.1 mA 166.2 mA Isolated RTD module 13.5 mA 27 mA
8.3 mA + (24.3 mA – VEXT) 16.67 mA + (24.3 mA – VEXT)
Bulk 24 Vdc
Power Supply
50 mA 100 mA
19 mA + (10.5 mA/E loop @ 5 mA)
Bulk 12 Vdc
Power Supply
19 mA + (45 mA/I loop) or
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ControlWave Micro Distributed I/O System Instruction Manual
Component
Isolated LLAI module 26.3 mA 52.5 mA ECOM without modem/radio 22 mA 45 mA ECOM with modem 56 mA 112 mA
ECOM with FreeWave radio* ECOM with modem and FreeWave
radio
*
Bulk 24 Vdc
Power Supply
272 mA 545 mA 306 mA 612 mA
Bulk 12 Vdc
Power Supply
* FreeWave radio no longer available
Terminal Block Connector TB1
Unplug removable connector TB1 from the PSSM and wire DC power
to the connector. We recommend you do not plug the connector back
into the PSSM until the CPU module is already installed in the housing.
TB1 provides three input connections for bulk power:
TB1-1: (+VIN) (+10.7V to +30V dc for +12V supply) (+21.7V to
+30V dc for +24V supply)
TB1-2 = (-VIN) (Supply Ground - PSGND) TB1-3 = Chassis Ground - CHASSIS ( )
Figure 2-11 shows the typical wiring at the PSSM’s TB1 block.
Figure 2-11. PSSM TB1 Wiring
Note
: As an added precaution, we recommend that you run a #14
AWG wire from the TB1-3 power connection (Ground) to the
same known good earth ground used for the base housing.
2.3.6 Wiring an External Alarm or Annunciator to the Watchdog Connector (OPTIONAL)
Caution
At this time you can also connect power and watchdog wiring. However; for safety reasons and to prevent accidental damage to the your bulk DC power supply, do not connect the pluggable terminal block connectors TB1 and TB2 to the PSSM until after you install, wire, and configure the CPU module.
Follow the instructions in Section 2.3.4 General Wiring Guidelines when wiring connections.
The version of the PSSM shown in Figure 2-9 includes an optional
watchdog connector. The purpose of the watchdog connector is to trigger an external alarm or annunciator if the ControlWave Micro Distributed I/O System enters a “watchdog” condition in which the CPU cannot control your I/O.
2-16 Installation Revised Aug-2015
Terminal Block
Connector TB2
ControlWave Micro Distributed I/O System Instruction Manual
A watchdog condition occurs when:
A watchdog timer expires. This occurs due to a reset of power
failure.
The CPU module detects that the regulated 3.3 Vdc or 1.8 Vdc
supplies are out of specification.
A MOSFET switch activates the watchdog connector whenever a watchdog condition occurs.
You must power the watchdog connector (TB2) from an external power supply. Unplug removable connector TB2 from the PSSM and wire
power to the connector. We recommend you do not plug the connector
back into the PSSM until the CPU module is already installed in the housing.
TB2 provides two watchdog MOSFET switch connections:
TB2-1 = VI - Watchdog MOSFET Switch Input TB2-2 = VO - Watchdog MOSFET Switch Output
The VI input on TB2 powers the watchdog switch; its switched output connects to the VO output on the same terminal block. You must reference the external power source connected to the VI terminal to the return point of the input source powering the PSSM (which is either –
VIN or PSGND on TB2). See Figure 2-12.
Figure 2-12. Watchdog MOSFET Switch Wiring
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ControlWave Micro Distributed I/O System Instruction Manual

2.4 CPU Module

The CPU module, which controls the ControlWave Micro Distributed I/O System and handles memory and communication functions, can only be installed in Slot #2 of the backplane.
Note: Do not confuse the CPU module (which has communication
components) with the Expansion Communication module
(ECOM), which does not have a CPU component or a battery backup but does have additional communication components.
Identify the carton holding the CPU module and remove it from that carton. The CPU module has two RS-232 serial ports, one RS-485
serial port, and one Ethernet port (see Figure 2-13).
Figure 2-13. CPU Module with Three Serial Ports and One Ethernet Port
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ControlWave Micro Distributed I/O System Instruction Manual

2.4.1 Setting Jumpers on the CPU Module

Each CPU module contains a number of jumpers (labeled with JPn) when n in the jumper number. See Figure 2-13 to locate the jumpers.
Note: When present, jumpers 1, 2, 3, 5, 6, and 9 (JP1, JP2, JP3, JP5,
JP6, and JP9) are reserved for factory use only. Do not alter these jumpers from their factory settings.
Jumper 4 (JP4) enables the Idle and Status LEDs on the PSSM. It
comes enabled from the factory. (We recommend you leave these LEDs enabled during initial installation and setup. If power conservation is an issue, you can disable these LEDs by removing the jumper.)
Jumper 7 (JP7) enables the Communication Port Status LEDs on the
CPU module. It comes enabled from the factory. We recommend you leave these LEDs enabled during initial installation and setup. If power conservation is an issue, you can disable these LEDs by removing the jumper.
Note: For maximum shelf life, the CPU module ships from the
factory with the installed lithium backup battery disabled. You must enable it when you install the CPU module by placing JP8 on pins 1-2.
Jumper 8 (JP8) enables/disables the lithium backup battery on the
CPU module.
Pins 1-2: Enables the CPU module’s backup battery.
Pins 2-3: Disables the CPU module’s backup battery (Factory
default)
Jumper 10 (JP10) specifies how COM1 is enabled.
Pins 1-2: Enables COM1 whenever DCD is active. (Factory
default)
Pins 2-3: Enables COM1 whenever you connect a cable to the
port.
Jumper 11 (JP11) when present, specifies how COM2 is enabled.
Pins 1-2: Enables COM2 whenever DTR is ON. (Factory
default)
Pins 2-3: Port is always enabled. This setting can be used to
control external radios that feature DTR sleep modes.
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ControlWave Micro Distributed I/O System Instruction Manual

2.4.2 Setting DIP Switches on the CPU Module

Before you install the CPU module, you must determine the settings for
three banks of DIP switches. Refer to Figure 2-13 for the location of the DIP switch banks on each CPU module. Refer to Tables 2-2 through 2-4 for DIP switch setting values.
Note: Examine each bank of DIP switches carefully to note the switch
direction for ON or OFF.
Table 2-2. CPU Module Switch SW1
SW1 Setting Function Mode
1 2 3
4
N/A Not currently used. N/A Not currently used. Force
Recovery Mode
N/A Not currently used.
Enables recovery mode. Values are:
ON (enables recovery mode) OFF (disables recovery mode). – This is the factory default.
Table 2-3. CPU Module Switch SW2
SW2 Setting Function Mode
1
2
3
4
Watchdog Enable
Lock/Unlock Soft Switches
Use/Ignore Soft Switches
Core Updump Causes the ControlWave Micro Distributed I/O System to
Controls whether the system enters a watchdog state when a crash or system hangup occurs and automatically restarts. Values are:
ON (Enables watchdog circuit; factory default) OFF (Disables watchdog circuit and prevents automatic
restart) Controls the ability to modify soft switches, other
configurations, and flash files. Values are:
ON (Unlocks soft switches and flash files; factory default). OFF (Locks soft switches, configurations, and flash files)
Controls the use of soft switches. Values are: ON (Enable user-defined soft switches configured in flash memory; factory default) OFF (Disable soft switch configuration and use factory defaults)
Note: Setting both switch 3 and switch 8 to OFF (closed)
perform a core updump, provided you have set the PSSM mode switch to Recovery mode or properly sequenced the Run/Remote/Local switch on the PSSM. Values are:
sets all serial communication ports to 9600 bps operation. All serial communication ports must be set at 9600 bps before WINDIAG can perform communication tests.
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ControlWave Micro Distributed I/O System Instruction Manual
SW2 Setting Function Mode
ON (Disables core updump; factory default) OFF (Core updump via PSSM Run/Remote/Local switch
or PSSM mode switch SW1)
5
6
7 8
SRAM Control Manages SRAM contents following a low power situation
or a power outage. Values are:
ON (Retain values in SRAM during restarts; factory default) OFF (Reinitialize SRAM) – Data in SRAM lost during
power outage or re-start.
System Firmware
N/A Not currently used. Enable
WINDIAG
Allows a remote download of system firmware (on units equipped with boot PROM version 4.7 or higher and system PROM version 4.7 and higher). Values are:
ON (Enable remote download of system firmware; factory default) OFF (Disable remote download of system firmware)
Suspends normal operation and allows diagnostic routines. Values are: ON (Permits normal system operation, including the boot project, and disables the WINDIAG diagnostics from running; factory default) OFF (Allow WINDIAG to run test; disable boot project and normal system operation.)
Note: Setting both switch 8 and switch 3 to OFF (closed)
sets all communication ports to 9600 bps operation. All serial communication ports must be set at 9600 bps before WINDIAG can perform communication tests.
Switch Setting
1 2 3 4
Notes:
Table 2-4 describes switch settings for the RS-485 port. You may
want to review Section 2.4.4 Connections to RS-485 Serial Port(s)
before you set these switches.
Table 2-4 applies to the following switches:
o SW3 on CPU Module – controls COM3
o SW1 on Type 1 ECOM Module – controls COM5/COM9
o SW1 on Type 2 ECOM Module – controls COM6/COM10
o SW2 on Type 2 ECOM Module – controls COM7/COM11
Table 2-4. RS-485 Configuration Switch
Function Mode
TX+ to RX+ Loopback TX- to RX- Loopback 100 Ohm RX+ Termination 100 Ohm RX- Termination
ON (only for diagnostics or 2-wire) ON (only for diagnostics or 2-wire) ON (End nodes only) ON (End nodes only)
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ControlWave Micro Distributed I/O System Instruction Manual
Switch
Setting
5 6
7 8
Function Mode
N/A Not currently used Slew Rate (ISO485 Only)
RX+ Bias (End Node) RX- Bias (End Node)
ON (Slow rate enabled) OFF (Fast rate enabled)
Note: On CPU module, not currently used. ON (End nodes only)
ON (End nodes only)
After you configure the jumpers and DIP switches, slide the CPU module into slot #2 (the second slot from the left) of the base housing
(see Figure 2-2, Figure 2-3 or Figure 2-4).
2.4.3 Connections to RS-232 Serial Port(s) on CPU or ECOM
Modules
An RS-232 port provides point-to-point, half-duplex and full-duplex communications (for a maximum of 20 feet using data quality cable).
Your CPU module includes either one or two RS-232 ports.
If you require additional RS-232 ports, you can purchase an optional expansion communication module that can include either one (ECOM Type 1) or two (ECOM Type 2) RS-232 ports. The ControlWave Micro Distributed I/O System can support up to two expansion communication modules, for a total of up to four additional RS-232 ports beyond those on the CPU module. Expansion communication modules reside in slot #3 and slot #4.
RS-232 COM
Port Names and
RS-232 COM ports are assigned names based on their location in the ControlWave Micro Distributed I/O System.
Connectors
Table 2-5. RS-232 Connectors on CPU
Connector Name # Pins Function Notes
J3 COM1 9-pin 9-pin male D-sub (RS-232)
J4 COM2 9-pin 9-pin male D-sub (RS-232) See Figure 2-13 Figure 2-14 &
See Figure 2-13
Table 2-7
Table 2-7
, Figure 2-14 &
If you have an ECOM module with one RS-232 port, this is COM4
if the module is in slot #3 or COM8 if the module is in slot #4.
If you have an ECOM module with two RS-232 ports, those ports
are COM4 and COM5, respectively, if the ECOM module is in slot #3, or COM8 and COM9, respectively, if the ECOM module is in slot #4.
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ControlWave Micro Distributed I/O System Instruction Manual
Table 2-6. RS-232 Connectors on Expansion Communications Modules
Connector Name #
Pins
J4 COM4 (when in slot 3)
COM8 (when in slot 4)
J5 COM5 (when in slot 3)
COM9 (when in slot 4)
9-pin 9-pin male D-sub (RS-
9-pin 9-pin male D-sub (RS-
RS-232 COM
Port Cables
For the ControlWave Micro Distributed I/O System, half-duplex communications use Modbus or BSAP protocol, while full-duplex communications use point-to-point protocol (PPP). RS-232 ports use a
“null modem” cable (see Figure 2-15) to connect with other devices
(such as a PC, a printer, another ControlWave [except the CW_10/30/35]) when the ControlWave Micro DIOS uses the full­duplex PPP protocol.
Note: You can configure the ControlWave Micro Distributed I/O
System as either a master or slave node on a Modbus or BSAP
network.
Function Notes
See Figure 2-14, Figure 2-21,
232)
232)
Figure 2-22 & Table 2-7 See Figure 2-14, Figure 2-22 &
Table 2-7 Only available on ECOM Type
2 models.
Figure 2-14 illustrates the CPU module’s male 9-pin D-type connector. Use the content provided in Table 2-7 to determine pin assignments for
the COM1 and COM2 ports and the expansion communication ports COM4/5 and COM8/9.
Figure 2-14. Male DB9 9-Pin Connector
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ControlWave Micro Distributed I/O System Instruction Manual
Table 2-7. RS-232 Port Connector Pin Assignment
Pin
1 DCD Data Carrier Detect Input 2 RXD Receive Data Input 3 TXD Transmit Data Output 4 DTR Data Terminal Ready Output 5 GND Signal/Power Ground 6 DSR Data Set Ready Input 7 RTS Request to Send Output 8 CTS Clear to Send Input 9 N/A
RS-232
Signal
RS-232 Description
Use the “null modem” cable for full-duplex (PPP protocol) communications when connecting a ControlWave Micro to a PC. (See
top part of Figure 2-15.)
Figure 2-15. Full-duplex and Half-duplex Cable
Use the half-duplex cable (shown in the bottom part of Figure 2-15)
when connecting the ControlWave Micro Distributed I/O System to another ControlWave series unit (again, with the exception of the CW_10/30/35).
When communicating with a Network 3000 series RTU 3305, RTU 3310, DPC 3330, or DPC 3335 or CW_10/30/35, you must use one of
the cables shown in Figure 2-16.
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ControlWave Micro Distributed I/O System Instruction Manual
)
(
)
3305/3310/3330/3335/CW_10/30/35
9-Pin Male
“D” Connector
P1
1 = DTR
6 = CTS
5 = RTS
2 = TXD 7 = DCD
4 = RXD 9= GND
To P2 Pin-1 To P2 Pin-2
To P2 Pin-4
To P2 Pin-3 To P2 Pin-5
3305/3310/3330/3335/CW_10/30/35
9-Pin Male
“D” Connector
P1
1 = DTR
6 = CTS
7 = DCD
5 = RTS
2 = TXD
4 = RXD 9 = GND
To P2 Pin-2
To P2 Pin-3 To P2 Pin-5
CW Micro
9-Pin Female
“D” Connector
P2
1 = DCD
2 = RXD 3 = TXD 4 = DTR 5 = GND
CW Micro
9-Pin Female
“D” Connector
P2
2 = RXD 3 = TXD
5 = GND
7 = RTS 8 = CTS
1 = DCD
7 = RTS
8 = CTS
4 = DTR
Full-duplex
Cable
(PPP Protocol
Half-duplex
Cable
Figure 2-16. Full-duplex and Half-duplex Cable
When interfacing to the COM3 port of a ControlWave, or the COM5 or
COM6 port a ControlWaveEXP unit, use the cable presented in Figure 2-17 along with the cable shown in Figure 2-15 or Figure 2-16.
P1
CW
(COM3)
or
CWEXP
(COM5/6)
(Looking into Connector Intf. Side of P1)
8-Pin
RJ45 Plug
Pin 1 (Wht/Grn Stripe) to P in 1 = DCD Pin 2 ( Wht/Blu Stripe) to Pin 6 = DSR/RX+ Pin 3 (Blu/Wht Stripe) to Pin 2 = RXD/RX­Pin 4 (Grn/Wht Stripe) to Pin 7 = RTS Pin 5 ( Wht/Org Stri pe) to Pin 3 = TXD/TX­Pin 6 (Wht/Brn Stripe) to Pin 8 = CTS Pin 7 (Orn/Wht Stripe) to Pin 4 = DTR/TX+ Pin 8 (Brn/Wht Stripe) to Pin 5 = GND
Looking into Wire Terminal Side of P2
P2
9-Pin Male
“D” Connector
Figure 2-17. Full-duplex and Half-duplex Cable
RS-232 Cable
Guidelines
Observe the following guidelines when constructing RS-232 communication cables:
Ensure that DCD is high to transmit (except when dialing a modem) Verify that each RS-232 transceiver has one active receiver while
disabled (in power down mode); connect the DCD signal to the active receiver.
Set CTS to high to transmit. If the port is set for full-duplex operation, RTS is always ON. Ensure that DTR is always high when port is active; DTR enables
RS-232 transceivers.
Note: Control DTR using the PORTCONTROL function block and
the _Pn_AUTO_DTR system variable in your ControlWave
project. If you turn DTR off through these mechanisms, the
port remains off, even though hardware is fully configured.
When port is set for half-duplex operation, CTS must go low after
RTS goes low.
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ControlWave Micro Distributed I/O System Instruction Manual
All RS-232 comm ports support RTS, DTR, CTS, DCD, and DSR
control signals.
All RS-232 comm port I/O signals are protected by surge protectors.
2.4.4 Connections to RS-485 Serial Port(s) on CPU or ECOM
Modules
The RS-485 port supports local network communications to multiple nodes up to 4000 feet away.
Your CPU module includes one RS-485 port.
If you require additional RS-485 ports, you can purchase an optional expansion communication module that includes one or two RS-485 ports. The ControlWave Micro Distributed I/O System can support up to two expansion communication modules, for a total of up to four additional RS-485 ports beyond the one on the CPU module. Expansion communication modules reside in slot #3 and slot #4.
RS-485 COM
Port Names and
RS-485 COM ports are assigned names based on their location in the ControlWave Micro Distributed I/O System.
Connectors
The CPU module’s RS-485 port is COM3. If you have a Type 1 ECOM module in slot #3, its RS-485 port is
COM5. If you have a Type 1 ECOM module in slot #4, its RS-485 port is COM9.
If you have a Type 2 ECOM module in slot #3, its RS-485 ports are
COM6 and COM7. If you have a Type 2 ECOM module in slot #4, its RS-485 ports are COM10 and COM11.
Table 2-8 provides the connector assignments for CPU port COM3; Table 2-9 shows the assignments for ECOM1 port COM5/9; and Table 2-10 shows assignments for ECOM2 ports COM6/10 and 7/11.
Table 2-8. RS-485 Connectors on CPU
Connector Name # Pins Function Notes
J5 COM3 9-pin 9-pin male D-sub (RS-485) See Figure 2-13 and Table 2-
11.
Table 2-9. RS-485 Connectors on Type 1 Expansion Communications Modules
Connector Name # Pins Function Notes
J5 COM5 (when in slot 3)
COM9 (when in slot 4)
9-pin 9-pin male D-sub
(RS-485)
See Figure 2-21 & Table 2-11
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ControlWave Micro Distributed I/O System Instruction Manual
Table 2-10. RS-485 Connectors on Type 2 Expansion Communications Modules
Connector Name # Pins Function Notes
J6 COM6 (when in slot 3)
COM10 (when in slot
4)
J7 COM7 (when in slot 3)
COM11 (when in slot
4)
9-pin 9-pin male D-sub
(RS-485)
9-pin 9-pin male D-sub
(RS-485)
See Figure 2-22 & Table 2-11
See Figure 2-22 & Table 2-11
RS-485 COM
Port Cables
Figure 2-14 illustrates the CPU module’s male 9-pin D-type connector. Use the content provided in Table 2-11 to determine pin assignments for
the COM3 port on the CPU, and COM5/9, COM6/10, and COM7/11 expansion communication ports.
Table 2-11. RS-485 Port Connector Pin Assignment
Pin RS-485 Signal RS-485 Description
1 N/A 2 RXD– Receive Data – Input 3 TXD– Transmit Data – Output 4 TXD+ Transmit Data + Output 5 GND/
ISOGND 6 RXD+ Receive Data + Input 7 N/A 8 N/A 9 N/A
Ground/Isolated Ground
Since the RS-485 port is intended for network communications, refer to
Table 2-12 for the appropriate connections for wiring the master, first slave, and nth slave.
Essentially, the master and the first slave transmit and receive data on
opposite lines; all slaves (from the first to the nth) are paralleled (daisy-
chained) across the same lines. Wire the master node to one end of the RS-485 cable run using a 24-gauge paired conductor cable (such as a Belden 9843).
Note: ControlWave Micro DIOS supports only half-duplex RS-485
networks.
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ControlWave Micro Distributed I/O System Instruction Manual
Table 2-12. RS-485 Network Connections
From Master To First Slave To nth Slave
TXD+ RXD+ RXD+ TXD– RXD– RXD– RXD+ TXD+ TXD+ RXD– TXD– TXD–
GND/ISOGND GND/ISOGND GND/ISOGND
To ensure that the “Receive Data” lines are in a proper state during inactive transmission periods, you must maintain certain bias voltage levels at the master and most distant slave units (end nodes). These end nodes also require the insertion of 100 terminating resistors to properly balance the network.
You must also configure switches at each node to establish proper network performance. Accomplish this by configuring switches listed so that the 100 termination resistors and biasing networks are installed at the end nodes and are removed at all other nodes on the network. You enable receiver biasing and termination (as well as 2-wire or 4-wire selection) using an 8-position DIP switch located on the CPU and
ECOM modules. See Table 2-4 in Section 2.4.2 Setting DIP Switches on the CPU Modules for information on RS-485 termination and loopback
control switch settings.
2.4.5 Connections to Ethernet Port(s) on the CPU Module
Caution
The RJ45 Ethernet ports are located on the CPU module. The PSSM also has one RJ45 port for the optional Display/Keypad. Never connect Ethernet to the Display/Keypad port or damage to the PSSM will result.
ControlWave Micro Distibuted I/O Systems support one Ethernet port. It uses a 10/100Base-T RJ-45 modular connector that provides a shielded twisted pair interface to an Ethernet hub. Two LEDs provide transmit and receive status indications:
Port assignments are:
Ethernet Port 1: CPU Bd. J6, 8-Pin RJ-45 - Shielded Twisted Pair A
typical Ethernet hub provides eight 10/100Base-T RJ-45 ports (with port 8 having the capability to link either to another hub or to an Ethernet communications port). Both ends of the Ethernet twisted pair cable are equipped with modular RJ-45 connectors.
18
Looking into
receptacle
Figure 2-18. RJ-45 Ethernet Connector
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ControlWave Micro Distributed I/O System Instruction Manual
These cables have a one-to-one wiring configuration as shown in Figure 2-19. Table 2-13 provides the assignment and definitions of the 8-pin
10/100Base-T connectors.
Figure 2-19. Standard 10/100Base-T Ethernet Cable (CPU Module to Hub)
Table 2-13. Ethernet 10/100Base-T CPU Module Pin Assignments
Pin Description
1 Transmit Data+ (Output) 2 Transmit Data– (Output) 3 Receive Data+ (Input) 4 Not connected 5 Not connected 6 Receive Data– (Input) 7 Not connected 8 Not connected
Note: You can swap TX and RX at the hub.
You can connect two nodes in a point-to-point configuration without using a hub. However, you must configure the cable so that the TX+/­Data pins connect to the RX+/- Data pins (swapped) at the opposite
ends of the cable (see Figure 2-20).
Figure 2-20. Point-to-Point 10/100Base T Ethernet Cable
The maximum length of one segment (CPU to hub) is 100 meters (328 feet). The use of Category 5 shielded cable is recommended.
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ControlWave Micro Distributed I/O System Instruction Manual

2.5 Expanded Communications Module (ECOM)

ControlWave Micro Distributed I/O Systems can support up to two optional expanded communications modules (ECOMs) which you can
install only in slots #3 or #4 (in place of I/O modules). ECOMSs do not
have a CPU component.
Two Types of
ECOM Modules
There are two types of ECOM module:
Type 1 Expansion Communications Module (ECOM1) with one RS-
232 port, one RS-485 serial port, and an optional modem port (see
Figure 2-21)
Type 2 Expansion Communications Module (ECOM2) with two
RS-232 serial ports and two RS-485 serial ports (see Figure 2-22)
Identify the carton holding the ECOM module(s) and remove the module from that carton.
Figure 2-21. Type 1 ECOM with Two Serial Ports and a Modem
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ControlWave Micro Distributed I/O System Instruction Manual
g
T
LED
Re c eive LEDs
Comm. Port 4/8
Comm. Port 4/8
RS-232
Comm. Port 5/9
Comm. Port 5/9
RS-232
Comm. Port 6/1 0
Comm. Port /10
6
RS-485
Comm. Port 7/11
rans mit
CR1
J4
CR2
J5
CR3
J6
CR4
s
1-2 Installed = LEDs Enabled
W1
2-3 installed = LEDs Disabled
1
W1
W2
&
W3
1
Comm. Port 6/10 RS-485 Network
Configuration
W2 for Comm. Port 4/8
1
1-2 Installed = Loopback Disabled 2-3 installed = RTS/CTS Loopback
W3 for Comm. Port 5/9
- for Factory Use ONLY
J2
N
O
12345678
SW1
P1
T1
Isolation
Transformers
Isolated RS-485
T2
for
2
Comm. Port /11
7
RS-485
If In Slot #3 - Comm. Port Assignments = 4, 5, 6 & 7 If in Slot #4 - Comm. Port Assi
Figure 2-22. Type 2 ECOM with Two RS-232 and Two RS-485 Ports
Detailed Technical
Specifications

2.5.1 RS-232 Ports

2.5.2 RS-485 Ports

N
J7
nments = 8, 9, 10 & 11
O
12345 678
SW2 Comm. Port 7/11 RS-485 Network
Configuration
For detailed technical specifications, please see document CWMICRO:COM available on our website http://www.emersonprocess.com/remote.
Type 1 ECOMs include one RS-232 port. Type 2 ECOMs include two RS-232 ports. For information on connecting to these ports, including
cabling information, see Section 2.4.3.
Type 1 ECOMs include one RS-485 port. Type 2 ECOMs include two RS-485 ports. For information on connecting to these ports, including
cabling information, see Section 2.4.4.
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ControlWave Micro Distributed I/O System Instruction Manual
When connecting a ControlWave Micro Distributed I/O System to an
external modem, use the cable configuration in Figure 2-23.
Figure 2-23. Full-duplex and Half-duplex Cable
Figure 2-24. ECOM Modem Installation

2.5.3 Modem Port (Type 1 ECOM only)

You can mount an optional 56Kb PSTN Hayes-type modem on a Type
1 ECOM (see Figure 2-24).
The ControlWave Micro Distributed I/O System then assigns the modem COM7 (if in slot #3) or COM11 (if in slot #4).
You can configure the MultiTech model MT9234SMI modem module for publicly switched telephone network (PSTN) operation. You can
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ControlWave Micro Distributed I/O System Instruction Manual
also clock DTE/DCE serial data into (transmit) or out of (receive) the modem at rates up to 115.2 kHz.
The factory supplies the modem pre-installed or in kit form with all required hardware. You install it on the ECOM1 module and then use the Ports page in the Flash Configuration utility (in NetView, LocalView, or TechView) to assign ports. Configure a profile for the modem using AT commands submitted using a terminal emulation program (such as HyperTerminal). Users typically use AT commands only when checking the modem’s active or stored profile or when reconfiguring a modem (to turn auto answer on or off, etc.).
Prior to shipment from the factory, the MultiTech modems are pre­configured using the following steps:
1. Connect pin Enable modem setup by setting jumper JP2 on the
ECOM to 2-3.
2. Connect via HyperTerminal (Parameters = 9600, 8, N, 1, None)
to ECOM port C1 using the null modem cable (see Figure 2-15).
3. Send Factory Default = AT&F0
PSTN
Connections
4. Disable Flow Control = AT&K0
5. Set baud rate using AT Command: AT$SB9600, or whatever
baud rate you require.
6. Write to Memory. = AT&W
7. Disable setup mode. Park JP2 (no connection)
Note: You can reconfigure the modem using AT commands and a
terminal program (like HyperTerminal). Connect pins 2 and 3 of JP2 with a suitcase jumper, and use a null modem cable (see
Figure 2-15) to connect the PC to the modem (COM4 or COM8).
Figure 2-25 shows a publicly switched telephone network (PSTN)
using a single master and three remote ControlWave Micro Distributed
I/O Systems (each equipped with a PSTN modem). This application
requires only one remote connection.
Use a cable with standard telephone connectors (RJ11s) on each end. Plug one end of the cable into the RJ11 connector jack on the ECOM and the end into a RJ11 wall jack. The telephone company provides the necessary subscriber loops at its central system along with the phone numbers for each destination.
Caution
Revised Aug-2015 Installation 2-33
Connect only one modem on each drop. If you attempt to parallel two or more modems across a single drop, an impedance mismatch occurs, adversely affecting the signal. Modems cannot provide reliable communications under these conditions.
ControlWave Micro Distributed I/O System Instruction Manual
Figure 2-25. PTSN Field Connections for ControlWave Micro Distributed I/O Systems
Figure 2-26. Phone Cord Wiring
The 56K PSTN modem is FCC-approved for use with public telephone lines. However, before you place a modem in operation, check the following items to make sure you meet all FCC requirements:
Connections to party line service are subject to state tariffs. Connections to telephone company-provided coin service (central
office implemented systems) are prohibited.
The equipment compliance information is summarized as follows:
o Complies with Part 68 FCC Rules.
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ControlWave Micro Distributed I/O System Instruction Manual
o Contains device with FCC Registration Number: AU7-USA-
25814-M5-E
o Ringer Equivalence Number (REN): 0.3B
Note: The sum of all the RENs on your telephone lines should
be less than five in order to assure proper service from the telephone company. In some cases, a sum of five may
not be usable on a given line.
Make any direct connections to PSTN lines through standard plugs
and jacks as specified in the FCC rules. The PSTN line connector plugs into J1 on the modem. Notify your telephone company that the
jack (connector) required for your device is one of the following:
o USOC: RJ11C or o USOC: RJ11W
Note: The jack provided on the Modem (J1) is a 6-pin TLECO RJ-
11. The connections to the modem are pin 3 PSTN-Tip, and
pin 4 PSTN-Ring.

2.6 Bezels

After the telephone company has installed the above jack, connect
the modem to your equipment by inserting the appropriate equipment interface RJ11 plug into the modem and wall connector.
Bezels are blue plastic covers (see Figure 2-27) that protect an adjacent
pair of I/O modules and provide an easy way for you to route wiring. The factory provides bezels with each order. Install bezels over I/O modules whenever the ControlWave Micro Distributed I/O System is operational; remove the bezels for maintenance procedures.
Bezels attach to the module covers of two adjacent I/O modules. Hooks
on the bezels (see Figure 2-27) attach to notches in the upper and lower
portions of the module covers. Align the hooks on the bezel with the notches on the I/O module covers and slide the bezel down. To remove the bezel, grasp its sides and gently squeeze them, and pull up and then away from the I/O modules.
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 2-27. Bezel Assembly

2.7 Optional Display/Keypads

The ControlWave Micro Distributed I/O System supports two optional display/keypads:
A 2-button keypad (shown in the left of Figure 2-28) A 25-button keypad (shown in the right Figure 2-28)
Figure 2-28. Optional 2-Button and 25-Button Keypads
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ControlWave Micro Distributed I/O System Instruction Manual
Both keypads use the same 4-line by 20-character LCD displays. You connect the keypad to the ControlWave Micro Distributed I/O System using a cable, one end of which has an RJ-45 jack (connected into the RJ-45 equipped with two plugs. This cable connects between the RJ-45 display jack (J1) on the PSSM Board and RJ-45 jack (J1) on the remote Display/Keypad assembly. A potentiometer, provided on the keypad, allows you to set the contrast of the LCD display.
Note: For further information on the installation and use of the
optional keypads, refer to the ControlWave Display/Keypad Manual (D5135).
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ControlWave Micro Distributed I/O System Instruction Manual
Chapter 3 – I/O Modules
This chapter discusses the placement and wiring for I/O modules for the ControlWave Micro Distributed I/O System. The chapter begins with some general instructions on module installation that are common to most I/O modules. The balance of the chapter includes specific details for configuring and wiring each type of I/O module.
In This Chapter
3.1Module Placement ........................................................................... 3-2
3.2Wiring ............................................................................................... 3-2
3.3Isolated Digital Input (DI) Module .................................................... 3-5
3.4Isolated Digital Output (DO) Module .............................................. 3-10
3.5Non-isolated Digital Input/Output (DI/O) Module ........................... 3-14
3.6Non-isolated Analog Input/Output & Analog Input Module ............ 3-17
3.7Non-isolated High Speed Counter (HSC) Input Module ................ 3-21
3.8Isolated Analog Input (AI) Module ................................................. 3-25
3.9Isolated Analog Output (AO) Module ............................................. 3-29
3.10Non-isolated Mixed I/O (MI/O) Module .......................................... 3-32
3.11Isolated Vac Digital Input Module .................................................. 3-38
3.12Relay Isolated Vac/Vdc Digital Output Module .............................. 3-40
3.13Isolated Digital Input/Output (DI/O) Module................................... 3-42
3.14Isolated Resistance Temperature Device (RTD) Input Module ..... 3-45
3.15Isolated Thermocouple Module ..................................................... 3-48
Installation
Installing any I/O module in the ControlWave Micro distributed I/O system involves the same basic steps:
1. Remove the I/O module and associated I/O module cover from the
shipping carton.
Note: Modules normally ship from the factory completely
assembled.
2. Align the I/O module with its intended slot on the base or expansion
housing and slide the module into the housing. Make sure the module snaps into the appropriate securing notches on the housing.
3. Wire and plug the local or remote cable assemblies into the
appropriate module connectors.
4. After installing and wiring two I/O modules into adjacent slots in
the housing, cover the modules with a protective bezel. The bezels snap on and off for maintenance.
5. Using a PC running the ControlWave Designer and OpenBSI
software, configure the ControlWave project that runs in the ControlWave Micro host controller to accept the new I/O modules in the distributed I/O system rack and download the revised ControlWave project into the host controller.
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ControlWave Micro Distributed I/O System Instruction Manual
Note: This step is beyond the scope of this manual. Refer to the
ControlWave Designer Programmer’s Handbook (D5125) for further instructions.
Caution
Power down the ControlWave Micro distributed I/O system before you install or remove any I/O module. Shut down any processes the distributed I/O system may be managing (or switch them over manually or handle with another controller). Perform any hardware configuration (wiring, jumper configuration, and installation) only when the ControlWave Micro distributed I/O system is powered down.
Before any I/O modules can become operational, you must use ControlWave Designer to configure and then download the application (project) into the ControlWave Micro host controller.
Do not install any modules in the housing until you have mounted and grounded the housing at the designated installation site.
To ensure safe use of this product, please review and follow the instructions in the following supplemental documentation:

3.1 Module Placement

You place I/O modules in the I/O slots of the housing:
Supplement Guide - ControlWave Site Considerations for
Equipment Installation, Grounding, and Wiring (S1400CW)
ESDS Manual – Care and Handling of PC Boards and ESD
Sensitive Components (S14006)

3.2 Wiring

3-slot base housing: supports one I/O module in slot 3. 4-slot base housing: supports up to two I/O modules in slots 3 and 4. 8-slot base housing: supports up to six I/O modules in slots 3
through 8.
Note: Some modules have placement restrictions. Note these in the
individual descriptions.
With a few exceptions (noted in the module descriptions), I/O modules support either “local termination” (field wiring connected directly to the module’s removable terminal blocks) or “remote termination” (field wiring connected to the remote headers under the module’s cover and routed to a DIN-rail mounted terminal assembly and then to field devices).
ControlWave Micro I/O modules use compression-type terminals that accommodate up to #14 AWG wire. Insert the wire’s bared end (approx. ¼” max) into the clamp beneath the screw and secure the wire. To prevent shorts, ensure that no bare wire is exposed. If using standard wire, tin the bare end with solder to prevent flattening and improve conductivity. Allow some slack in the wires when making terminal
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ControlWave Micro Distributed I/O System Instruction Manual
connections. Slack makes the wires more manageable and helps minimize mechanical strain on the terminal blocks.

3.2.1 Local Termination

For I/O modules equipped with local terminal blocks, install the field wiring between the I/O module’s removable terminal block connectors and field devices (see Figure 3-1). (consult with the field device manufacturer for recommendations). Leave some slack and plan for wire routing, identification, and maintenance. Route the bundled wires out through the bottom of the I/O module assembly between the terminal block and the terminal housing.
Use AWG 14 or smaller wire
Figure 3-1. Module Wiring: Local Termination

3.2.2 Remote Termination

For I/O modules that support remote terminations, install cables between the module’s remote headers and the remote DIN-rail mounted terminal block assemblies (see Figure 3-2). Install field wiring between the DIN-rail mounted terminal bock assembly and field devices (see the wiring diagrams associated with each I/O module description).
Use AWG 14 or smaller wire (consult with the field device manufacturer for recommendations) for remote terminations. Leave some slack and plan for wire routing, identification, and maintenance. Route the cables running between the I/O module and the DIN-rail
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ControlWave Micro Distributed I/O System Instruction Manual
mounted terminal blocks out through the bottom of the I/O module assembly via the bezel assembly.
Figure 3-2. Module Wiring: Remote Termination

3.2.3 Shielding and Grounding

Use twisted-pair, shielded and insulated cable for I/O signal wiring to minimize signal errors caused by electromagnetic interference (EMI), radio frequency interference (RFI), and transients. cable, ground all shields at only one point in the appropriate system. This prevents circulating ground current loops that can cause signal errors.
3-4 I/O Modules Revised Aug-2015
When using shielded
ControlWave Micro Distributed I/O System Instruction Manual

3.3 Isolated Digital Input (DI) Module

Isolated DI modules provide 16 isolated digital inputs. For 24V DI modules you can individually configure inputs for either externally sourced inputs or internally powered (dry contact) applications.
Table 3-1. Isolated DI Module General Characteristics
Type Number
Supported
Digital Inputs (DI)
A DI module consists of an isolated digital input printed circuit board (PCB) with either two 10-point terminal block assemblies (for local termination) or two 14-pin mass termination headers (for remote termination). Each DI module also includes 19 configuration jumpers and a module cover. The DI PCB connects to the backplane using a 36­pin gold-plated card-edge connector.
16
Characteristics
Each DI supports/ includes:
Nominal input voltage of 12V or 24Vdc Nominal input current of 5 mA 30 ms input filtering
Dedicated LED on module turns ON
when DI is ON. (not available on all module versions)
Detailed Technical
Specifications
Configurations
Isolation
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Isolated Digital Input (DI) modules (general part number 396571-XX- X) come in different configurations. See Table 3-2 to see the variations.
Table 3-2. Isolated DI Module Configurations
Part Number Termination Connector Notes
396571-02-6 24V local Includes LED
daughterboard.
396571-04-2: 24V remote Includes LED
daughterboard.
396571-07-7 12V local
Does NOT support internal power source.
Includes LED daughterboard.
Figure 3-3, Figure 3-4, and Figure 3-5 show wiring for the DI module.
Surge suppressors and optocouplers electrically isolate the DI field circuitry from the module’s bus interface circuitry. 24V input modules configured for use in dry contact applications contain a +21 Vdc isolated power supply powered by the output of the +VIN power source originating on the Power Supply/Sequencer module (PSSM).
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ControlWave Micro Distributed I/O System Instruction Manual
Setting Jumpers
Set configuration jumpers W1 through W19 according to Table 3-3. Use jumper W19 (see Figure 3-3) to enable or disable the +21 Vdc field power supply.
Note:
Jumpers W1 through W12 and W15 through W19 only apply to 24V DI Modules.
Table 3-3. Jumper Assignments: Isolated DI Module
Jumper Purpose Description
WI Configures DI1 Pins 2-3 & 4-5 installed = External Power DI
Pins 1-2 & 3-4 installed = Internal Source DI
W2-W12 Configures DI2 through DI12
(respectively)
W13 Enables LEDs Pins 1-2 installed = allows hardware to enable LEDs
W14 Programs Serial EEPROM
W15 Configures DI13 Same as W1
W16 Configures DI14 Same as W1
W17 Configures DI15 Same as W1
W18 Configures DI16 Same as W1
W191
1 You must install a jumper on pins 1-2 of W19 to configure any DI for internally sourced operation.
Enables VIN Pins 1-2 enable VIN
Same as W1
Pins 2-3 installed = allows software to enable LEDs
Reserved for factory use only
Pins 2-3 disable VIN
Wiring the Module
Figure 3-3 shows field wiring assignments associated with locally terminated DI modules; Figure 3-4 shows field wiring assignments associated with remotely terminated DI modules. Figure 3-5 shows an optional remote termination module with built-in discrete relay module that supports input from 120 Vac DIs. The special remote termination module (with built-in discrete relay module) interfaces with an externally sourced DI module.
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-3. Isolated DI Module (Local Termination)
Figure 3-4 shows the wiring assignments associated with a DIN-rail
mounted terminal block assembly for a DI module associated with either internally sourced or externally powered operation. Figure 3-5 shows the wiring assignments associated with a DIN-rail mounted terminal block assembly for a DI module associated with relay isolated 120 Vac operation.
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-4. Isolated DI Module (Remote Termination, Internally Sourced or Externally Powered)
Note:
Fuses F0 to F7 are 1/8 A; F+ is a 2A fuse.
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-5. Isolated DI Module (Remote Termination, Internally Sourced or Externally Powered with
and without Fuses)
Software Configuration
To use data from an isolated DI module you must add an ERM_DI16 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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ControlWave Micro Distributed I/O System Instruction Manual

3.4 Isolated Digital Output (DO) Module

Isolated DO modules provide 16 DOs to control signaling functions. DO modules consist of a DO PCB with either two 10-point terminal
block assemblies (for local termination) or two 14-pin mass termination headers (for remote termination). DO modules also include two configuration jumpers, an LED board with 16 status LEDs (one for each point), and a cover assembly. The DO PCB connects with the backplane using a 36-pin gold-plated card-edge connector.
Table 3-4. Isolated DO Module General Characteristics
Type Number
Supported
Digital Outputs (DO)
16
Characteristics
Each DO supports/ includes: Optically isolated open source
MOSFET with surge suppression that is capable of handling 500mA at 30V.
Dedicated LED on module turns ON
when DO is ON.
Detailed Technical
Specifications
Configurations
Isolation
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
The isolated Digital Output (DO) module (general part number
396572-XX-X) comes in two possible configurations, see Table 3-5:
Table 3-5. Isolated DO Module Configurations
Part Number Termination Connector Notes
396572-02-2 local
396572-04-9 remote Includes LED
Includes LED daughterboard.
daughterboard.
Surge suppressors and optocouplers electrically isolate the DO field circuitry MOSFETs from the module’s bus interface circuitry.
DO modules provide a total of 16 DOs with surge protection. Each DO uses an open source MOSFET that is capable of driving up to 31Vdc at up to 500mA. A 500Vdc MOV to chassis and a 31Vdc MOV (across output) are provided to protect each DO. The maximum operating frequency is 20 Hz.
Outputs set OFF on
Power-up
An on-board DO load register stores output data. At power-up the load register clears and sets all outputs to “off.”
Setting Jumpers
3-10 I/O Modules Revised Aug-2015
DO modules contain two configuration jumpers (W1 and W2), which function as follows:
ControlWave Micro Distributed I/O System Instruction Manual
Table 3-6. Jumper Assignments: Isolated DO Module
Jumper Purpose Description
WI Configures DI1 Pins 1-2 installed = Manually enables status LEDs
Pins 2-3 installed = Software enables status LEDs
See Figure 3-6 for the location of this jumper.
W2 Programs serial EEPROM
Reserved for factory use only
Wiring the Module
Figure 3-6 shows field wiring assignments associated with a locally terminated DO module; Figure 3-7 shows field wiring assignments associated with remotely terminated DO modules. Figure 3-8 shows a remote termination module with built-in discrete relay modules.
Figure 3-6. Isolated DO Module (Local Termination)
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-7 shows the terminal block assignments for a remotely terminated DIN-rail mounted open source isolated DO module. Figure 3-8 shows the terminal block assignments for a remotely terminated DIN-rail mounted relay isolated 24 Vdc DO module.
Figure 3-7. Isolated DO Module (Remote Termination)
Note:
Fuses F0 to F7 are 1/8 A; F+ is a 2A fuse.
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-8. Isolated DO Module (Remote Termination with Relay Isolated with 24 Vdc)
Software Configuration
To use data from an isolated DO module you must add an ERM_DO16 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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ControlWave Micro Distributed I/O System Instruction Manual

3.5 Non-isolated Digital Input/Output (DI/O) Module

Non-isolated DI/O modules consist of a digital input/output PCB with either two 10-point terminal block assemblies (for local termination) or two 14-pin mass termination headers (for remote termination). The DI/O module also includes 14 configuration jumpers, an LED board with 16 status LEDs (one for each point), and a cover assembly. The DI/O module connects with the backplane using a 36-pin gold-plated card-edge connector.
Non-isolated DI/O modules contain field interface circuitry for up to 12 digital inputs and four digital outputs.
Table 3-7. Non-Isolated DI/DO Module General Characteristics
Type Number
Digital Inputs (DI)
Digital Outputs (DO)
Supported
12
4
Characteristics
Each DI supports/ includes: Internally sourced DI operation for dry
contacts pulled internally to 3.3Vdc when field input is open.
Surge suppressor
Signal conditioning
Filter time of 15 ms
Jumper to configure source current for
either 2 mA or 60 uA
Dedicated LED on module turns ON
when DI is ON.
Each DO supports/ includes: Open drain MOSFET provides 100mA
at 30Vdc to an externally powered device.
Surge suppressor Current sink to ground of DI/DO
module
Dedicated LED on module turns ON
when DO is ON.
Detailed Technical
Specifications
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Configurations
The non-isolated DI/O module (general part number 396567-XX-X) comes in several different configurations. See Table 3-8.
Table 3-8. Non-Isolated DI/O Module Configurations
Part Number Termination Connector Notes
396567-02-9
3-14 I/O Modules Revised Aug-2015
local Includes LED
daughterboard.
ControlWave Micro Distributed I/O System Instruction Manual
Part Number Termination Connector Notes
396567-04-5:
remote Includes LED
daughterboard.
Setting Jumpers
DI/O modules provide 12 individually field configurable DIs and 4 non-configurable externally powered DOs.
Using configuration jumpers W1 through W12, you can set each DI individually to provide either a 2 mA or 60 uA source current. Table 3-9 details jumper settings.
Table 3-9. Jumper Assignments: Non-isolated DI/O Module
Jumper Purpose Description
W1-W12 Configures DI1 through DI12
(respectively)
W13 Enables LEDs Pins 1-2 installed = allows manual enabling of LEDs
W14 Programs Serial EEPROM
Pins 1-2 installed = 2mA Source Current Pins 2-3 installed = 60uA Source Current
Pins 2-3 installed = allows software enabling of LEDs
Reserved for factory use only
Wiring the Module
Figure 3-9 shows the terminal block assignments for a locally terminated DI/O module. Figure 3-10 shows the terminal block assignments for a DIN-rail mounted remotely terminated DI/O module.
Figure 3-9. Non-isolated DI/O Module (Local Termination)
Revised Aug-2015 I/O Modules 3-15
ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-10. Non-isolated DI/O Module (Remote Termination)
Software Configuration
To use data from a non-isolated DI/O module you must add an ERM_MD board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
3-16 I/O Modules Revised Aug-2015
ControlWave Micro Distributed I/O System Instruction Manual

3.6 Non-isolated Analog Input/Output & Analog Input Module

Non-isolated Analog Input/Output (AI/O) modules support six externally sourced 4–20mA or 1–5 Vdc single-ended analog inputs and optionally, two independently configurable 4–20 mA or 1–5 Vdc analog outputs. Non-isolated Analog Input (AI) modules are identical to
AI/O modules but have a depopulated AO section.
AI/O modules consist of an AI/O PCB with two 10-point terminal block assemblies (for local termination) or two 14-pin mass termination headers (for remote termination), 12 configuration jumpers, and a cover assembly. The AI/O module connects with the backplane using a 36-pin gold-plated card-edge connector.
Table 3-10. Non-Isolated AI/O and AI Module General Characteristics
Type Number
Analog Inputs (AI)
Analog Outputs (AO)
Supported
6 on AI/O
Module
6 on AI
Module
2 on AI/O
Module
None on AI
Module
Characteristics
Each AI supports/includes:
Jumper to configure input for either 4–
20mA or 1–5 Vdc
Signal conditioning that provides 2 Hz
low pass filter
Transorb for surge suppression
Analog to Digital converter
Each AO supports/includes:
Jumper to configure output for either 4–
20mA or 1–5 Vdc
maximum external load to the 4–20mA
output of either 250 ohms with an external 11V power source or 650 ohms with an external 24V power source.
maximum external load current to the
1–5 Vdc output is 5 mA with an external 11-30 V power source.
AO operation requires an 11–30Vdc
power source connected to the VEXT terminal of the AI/O module.
Detailed Technical
Specifications
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Configurations
Each non-isolated AI/O module (general part number 396568-XX-X) consists of a PCB with six AIs, 2 AOs, and comes with a module cover. There are two configurations:
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ControlWave Micro Distributed I/O System Instruction Manual
Table 3-11. Non-Isolated AI/O Module Configurations
Part Number Termination
Connector 396568-01-7: 396568-02-5:
local
remote
Each non-isolated AI module (general part number 396569-XX-X) consists of a PCB with six AIs and comes with a module cover. There are two configurations:
Table 3-12. Non-Isolated AI Module Configurations
Part Number Termination Connector Notes 396569-01-3: 396569-02-1:
local
remote
Notes
Cable Shields
Connect cable shields associated with AI wiring to the ControlWave Micro’s housing ground. Multiple shield terminations require that you supply a copper ground bus (up to a #4 AWG wire size) and connect it to the housing’s ground lug.
This ground bus must accommodate a connection to a known good earth ground (in lieu of a direct connection from the ground lug) and to all AI cable shields. Shield wires should use an appropriate terminal lug. Secure them to the copper bus using industry rugged hardware
Setting Jumpers
(screw/bolt, lock washer, and nuts).
AI/O and AI modules have jumpers you can use to configure each of the six AIs. You can individually configure AIs for 1–5 Vdc or 4–20 mA operation. See Table 3-13.
Table 3-13. Jumper Assignments: Non-isolated AI/O and AI Module
Jumper Purpose Description
JP1-JP6 Configures AI1 through AI6
(respectively)
JP71
JP81
JP91
JP101
JP1 Configures ISP Connector
W1 Programs Serial EEPROM
1 Configuration for JP7 and JP9 must match (that is, both 1-5 V or 4-20mA)
Configuration for JP8 and JP10 must match (that is, both -5 V or 4-20mA)
AO1 Field Output Pins 1-2 installed = 4-20 mA AO
AO2 Field Output Pins 1-2 installed = 4-20 mA AO
AO1 Calibration Test Pins 1-2 installed = 1-5 V AO
AO2 Calibration Test Pins 1-2 installed = 1-5 V AO
Pins 1-2 installed = 4-20 mA AI Pins 2-3 installed = 1-5 V AI
Pins 2-3 installed = 1-5 V AO
Pins 2-3 installed = 1-5 V AO
Pins 2-3 installed = 4-20 mA AO
Pins 2-3 installed = 4-20 mA AO
Reserved for factory use only Reserved for factory use only
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ControlWave Micro Distributed I/O System Instruction Manual
Wiring the Module
Figure 3-11 shows field wiring assignments associated with the locally terminated AI/O and AI modules. Figure 3-12 shows field wiring assignments associated with remotely terminated AI/O and AI modules.
Figure 3-11. Non-isolated AI/O and AI Module Configuration (Local Termination)
Revised Aug-2015 I/O Modules 3-19
ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-12. Non-isolated AI/O and AI Modules (Remote Termination)
Software Configuration
To use data from a non-isolated AI/O module you must add an ERM_MA board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. To use data from a non-isolated AI module you must add an ERM_AI6 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for these modules.
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ControlWave Micro Distributed I/O System Instruction Manual

3.7 Non-isolated High Speed Counter (HSC) Input Module

Non-isolated High Speed Counter (HSC) Input modules provide up to four inputs. You can individually configure HSC module inputs for either a 10 KHz (high speed) or 300 Hz (low speed) input, and as a 16­bit high speed counter
HSC modules consist of a HSC PCB with two 10-point terminal block assemblies (for local termination) or two 14-pin mass termination headers (for remote termination), 14 configuration jumpers, an LED daughter board with four status LEDs (one for each point), and a cover assembly. The HSC PCM connects with the backplane using a 36-pin gold-plated card-edge connector.
Table 3-14. High Speed Counter Module General Characteristics
Type Number
High Speed Counter Inputs (HSC)
Supported
4
Characteristics
Each HSC supports/includes:
Jumper to configure point as either a
low speed input (300 Hz) or a high speed input (10 KHz).
Jumper to configure HSC current.
Bandwidth limiting
Surge suppression
Field inputs can be driven by signals or
relay contacts.
LED status indicator
Detailed Technical
Specifications
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Configurations
The non-isolated HSC module (general part number 396570-XX-X) has the following configurations:
Table 3-15. High Speed Counter Module Configurations
Part Number Termination Connector Notes 396570-05-4: 396570-06-2:
local
remote
Setting Jumpers
HSC modules support up to four HSC inputs. Configure the HSC jumpers (W1 through W14) according to Table 3-16.
Table 3-16. Jumper Assignments: Non-isolated HSC Module
Jumper Purpose Description
W1 – W4 Configures HSC1 through
HSC4 (respectively)
Pins 1-2 installed = Enables 300 Hz (low speed input) Pins 2-3 installed = Enables 10 KHz (high speed input)
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ControlWave Micro Distributed I/O System Instruction Manual
Jumper Purpose Description
W5 Programs Serial EEPROM
W6 Enables LEDs Pins 1-2 installed = Enables LEDs manually
W7 & W8 Controls HSC1 Current Pins 1-2 installed = Enables additional 2 mA load
W9 & W10 Controls HSC2 Current Pins 1-2 installed = Enables additional 2 mA load
W11 & W12 Control HSC3 Current Pins 1-2 installed = Enables additional 2 mA load
W13 & W14 Controls HSC4 Current Pins 1-2 installed = Enables additional 2 mA load
Reserved for factory use only
Pins 2-3 installed = Enables LEDs via software
Pins 2-3 installed = Enables 200 uA source; no 2 mA load
Pins 2-3 installed = Enables 200 uA source; no 2 mA load
Pins 2-3 installed = Enables 200 uA source; no 2 mA load
Pins 2-3 installed = Enables 200 uA source; no 2 mA load
Wiring the Module
Figure 3-13 shows field wiring assignments for the locally terminated HSC module; Figure 3-14 shows field wiring assignments for the remotely terminated HSC module.
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-13. Non-isolated HSC Module (Local Termination)
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ControlWave Micro Distributed I/O System Instruction Manual
Note: Fuses F0, F2, F4, and F6 are 1/8 A.
Figure 3-14. Non-isolated HSC Module (Remote Termination)
Software Configuration
To use data from a high speed counter module you must add an ERM_HSC4 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
3-24 I/O Modules Revised Aug-2015
ControlWave Micro Distributed I/O System Instruction Manual

3.8 Isolated Analog Input (AI) Module

Isolated AI modules support eight 4–20 mA, 1–5 Vdc, or 0–10 Vdc differential analog inputs.
AI modules consist of an AI PCB with two 10-point terminal block assemblies (for local termination) or two 14-pin mass termination headers (for remote termination), eight configuration jumpers, and a module cover assembly. The AI PCB connects with the backplane using a 36-pin gold-plated card-edge connector.
Table 3-17. Isolated Analog Input (AI) Module General Characteristics
Type Number
Supported
Analog Inputs (AI)
8
Characteristics
Each AI supports/includes:
Jumpers to configure input for either
isolated 4–20mA, isolated 1–5 Vdc, isolated 0–10 Vdc, or non-isolated internally powered 4-20mA current loop operation.
AIs configured as isolated inputs have
a common mode range of 180V
Analog input circuitry isolated from bus
interface
Cable Shields
Detailed Technical
Specifications
Configurations
Connect cable shields associated with AI wiring to the ControlWave Micro’s housing ground. Multiple shield terminations require that you supply a copper ground bus (up to a #4 AWG wire size) and connect it to the housing’s ground lug.
This ground bus must accommodate a connection to a known good earth ground (in lieu of a direct connection from the ground lug) and to all AI cable shields. Shield wires should use an appropriate terminal lug. Secure them to the copper bus using industry rugged hardware (screw/bolt, lock washer, and nuts).
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
The isolated Analog Input (AI) module (general part number 396604- XX-X) has the following configurations:
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ControlWave Micro Distributed I/O System Instruction Manual
Table 3-18. Isolated Analog Input Module Configurations
Part Number Termination Connector Notes 396604-03-0 396604-04-8
local
remote
Setting Jumpers
AI modules have jumpers you can use to configure each of the eight AIs. You can individually configure AI for 4–20 mA, 1–5 Vdc, or 0– 10 Vdc isolated operation or internally sourced 4–20 mA non-isolated operation. See Table 3-19 for settings.
Table 3-19. Jumper Assignments: Isolated AI Module
Jumper Purpose Description
W1 – W8 Configures AI1 through AI8
(respectively)
W9 Programs Serial EEPROM
Voltage Input AIs use two dual-pin jumpers Isolated Current AIs use three dual-pin connectors Internally sourced AIs use four dual-pin jumpers
See Figure 3-15 and Figure 3-16 for examples of how to
use these jumpers.
Reserved for factory use only
Wiring the Module
Figure 3-15 shows terminal assignments for a locally terminated AI module; Figure 3-16 shows terminal assignments for a remotely terminated AI.
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ControlWave Micro Distributed I/O System Instruction Manual
2
2
TB1
TB2
P3
P4
+AI
-AI
Shield
Internally Sourced
Chassis Ground
Field
TB2
1
2
AI#1 (Example)
4-20mA AI
Wiring Diagram
P1
FIELD
CIRCUIT RY
P3
P4
+AI1
-AI1
+AI2
-AI2
+AI3
-AI3
+AI4
-AI4
ISOGND
ISOGND
+AI5
-AI5
+AI6
-AI6
+AI7
-AI7
+AI8
-AI8 ISOGND ISOGND
Chassis Gro und
1
2 3
4 5 6 7 8
9 10
1
2
3
4 5 6
7
8
9 10
Field
TB
+AI
-AI
Shield
AI #1 ( Exampl e)
Externally
Powered
0-10Vdc AI
Wiring Diagram
TB1
}
TB2
}
1
FIEL D
CIRCUITRY
_
+
+AI
-AI
Shield
Chassis Ground
Field
TB
1
2
AI #1 (Exam p le)
Externally
Powered
4-20mA AI
Wiring Diagram
FIEL D
CIRCUIT RY
Figure 3-15. Isolated AI Module (Local Termination)
Chassis Ground
-AI
Shield
Field
TB
+AI
AI #1 (Exam p le)
Externally
Powered 1-5Vdc AI
Wiring Diagram
1
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ControlWave Micro Distributed I/O System Instruction Manual
Note: Fuses F0, F2, F4, and F6 are 1/8 A.
Figure 3-16. Isolated AI Module (Remote Termination)
Software Configuration
To use data from an isolated analog input module you must add a ERM_AI8 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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ControlWave Micro Distributed I/O System Instruction Manual

3.9 Isolated Analog Output (AO) Module

AO modules support four independently configurable 4–20 mA or 1–5 Vdc isolated analog outputs. Analog output circuitry is electrically isolated from the CPU power system.
AO modules consist of an AO PCB with two 10-point terminal block assemblies (TB1 and TB2 for local termination) or two 14-pin mass termination headers (P2 and P3 for remote termination), four configuration jumpers, and a module cover. The AO PCB connects to the backplane using a 36-pin gold-plated card-edge connector.
Detailed Technical
Specifications
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Configurations
The isolated Analog Output module (general part number 396603-XX­X) has the following configurations:
Table 3-20. Isolated Analog Output Module Configurations
Part Number Termination Connector Notes 396603-01-7 396603-02-5
local
remote
Setting Jumpers
AO modules have jumpers you can use to configure each of the four AOs. You can individually configure each AO for 4–20 mA or 1–5 Vdc isolated operation. See Table 3-21.
Table 3-21. Jumper Assignments: Isolated AO Module
Jumper Purpose Description
JP1 Configures AO1 Pins 1-2 installed = Voltage output
Pins 2-3 installed = Current output
JP2 Configures AO2 Pins 1-2 installed = Voltage output
Pins 2-3 installed = Current output
JP3 Configures AO3 Pins 1-2 installed = Voltage output
Pins 2-3 installed = Current output
JP4 Configures AO4 Pins 1-2 installed = Voltage output
Pins 2-3 installed = Current output
Wiring the Module
Figure 3-17 shows field wiring assignments for a locally terminated AO module. Figure 3-18 shows field wiring assignments for a remotely terminated AO module.
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-17. Isolated AO Module (Local Termination)
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ControlWave Micro Distributed I/O System Instruction Manual
Note: Fuses F0, F2, F4, and F6 are 1/8 A.
Figure 3-18. Isolated AO Module (Remotely Terminated)
Software Configuration
To use data from an isolated analog output module you must add an ERM_AO4 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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ControlWave Micro Distributed I/O System Instruction Manual

3.10 Non-isolated Mixed I/O (MI/O) Module

Non-isolated Mixed I/O (MI/O) modules provide up to six individually field configurable DI/Os, four AIs, two HSC Inputs and, optionally, one AO.
MI/O modules consist of an MI/O PCB with two 10-point terminal block assemblies (TB1 and TB2 for local termination) or two 14-pin mass termination headers (P2 and P3 for remote termination), 28 configuration jumpers, and a module cover. The MI/O PCB connects to the backplane using a 36-pin gold-plated card-edge connector.
Note: I/O circuitry is identical to circuitry used on other I/O modules.
HSC inputs have surge suppression, bandwidth limiting and 20 microsecond (50kHz) filtering. You can individually field-configure HSC inputs for 2mA or 200uA (low power) operation. Each input of the HSCI Module is configured as a 16-bit high-speed counter.
Detailed Technical
Specifications
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Optional AO
Optionally, certain configurations of MI/O modules can also support one externally powered (VEXT = 11–30 Vdc) analog output.
AO circuitry consists of a 12-bit resolution Digital-to-Analog Converter (DAC).
Configurations
The non-isolated Mixed I/O (MI/O) module (general part number 396630-XX-X) has the following configurations:
Table 3-22. Mixed I/O Module Configurations
Part Number I/O Included Termination
Connector 396897-01-0 396897-02-9
396897-03-7 396897-04-5
4AI, 2HSC, 6DI/DO local includes LED daughterboard
4AI, 2HSC, 6DI/DO
& 1AO (on daughterboard)
4AI, 2HSC, 6DI/DO remote includes LED daughterboard
4AI, 2HSC, 6DI/DO
& 1AO (on daughterboard)
local includes LED daughterboard
remote includes LED daughterboard
Notes
Setting Jumpers
MI/O modules have 28 jumpers you can use to configure each input or output. See Table 3-23.
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ControlWave Micro Distributed I/O System Instruction Manual
Table 3-23. Jumper Assignments: Non-isolated MI/O Module
Jumper Purpose Description
1
W1
W2 Configures optional AO for
W3 Enables DI/DO status LEDs Pins 1-2 installed = Enables LEDs manually
W4 Enables HSC status LEDs Pins 1-2 installed = Enables LEDs manually
W5 & W6 Controls HSC1 Current Pins 1-2 installed = Permits additional 2 mA load
W7 & W8 Controls HSC2 Current Pins 1-2 installed = Permits additional 2 mA load
W9 & W10 Configures HSC1 and HSC2
W11-W16 Configures DI1 through DI6
W17-W22 Select DI/O1 through DI/O6
W23-W26 Configures AI1 through AI4
W272
W28 Enables HSC Circuitry Pins 1-2 installed = Enable (power) HSC circuit
1 W1 jumper located on optional AO daughterboard. 2 Set W27 always to pins 2-3.
Configures optional AO for voltage or current output
voltage or current output
debounce (respectively)
current (respectively)
points (respectively)
(respectively)
Selects AO Voltage Pins 1-2 installed = N/A
Pins 1-2 installed = Sets AO for current output Pins 2-3 installed = Sets AO for voltage output
Pins 1-2 installed = Sets AO for voltage output Pins 2-3 installed = Sets AO for current output
Pins 2-3 installed = Enables LEDs via software
Pins 2-3 installed = Enables LEDs via software
Pins 2-3 installed = Permits 200 uA source; no 2 ma load
Pins 2-3 installed = Permits 200 uA source; no 2 ma load
Pins 1-2 installed = Enables HSC debounce Pins 2-3 installed = Disabled HSC debounce
Pins 1-2 installed = Sets 2 mA source current Pins 2-3 installed = Sets 60 uA source current
Pins 1-2 installed = Sets digital input operation Pins 2-3 installed = Sets digital output operation
Pins 1-2 installed = 4–20 mA AI (250 resistor in) Pins 2-3 installed = 1–5 Vdc AI
Pins 2-3 installed = External Field Voltage (TB2-9)
Pins 2-3 installed = Disable HSC circuit
Wiring the Module
Figure 3-19 shows field wiring assignments for a locally terminated MI/O module. Figure 3-20 shows field wiring assignments for a remotely terminated MI/O module.
Revised Aug-2015 I/O Modules 3-33
ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-19. Non-isolated MI/O Module (Local Termination)
Figure 3-20. Non-isolated MI/O Module (Remote Termination)
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-21 shows terminal block assignments for remote termination. Figure 3-22 shows a wiring diagram for mixed I/O for local
termination. Figure 3-23 shows a wiring diagram for mixed I/O for remote termination.
Note: Fuses F1 to F6 are ¼ A; fused F7 to F15 are 1/8 A.
Figure 3-21. MI/O Module (Remote Termination)
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-22. MI/O Module Wiring (Local Termination)
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ControlWave Micro Distributed I/O System Instruction Manual
Figure 3-23. MI/O Module Wiring (Remote Termination)
Software Configuration
To use data from a mixed I/O module you must add an ERM_MIX board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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ControlWave Micro Distributed I/O System Instruction Manual

3.11 Isolated Vac Digital Input Module

Isolated Vac DI modules provide eight isolated DIs, which can interface to field-powered devices providing 110 Vac or 220 Vac.
Table 3-24. Isolated Vac DI Module General Characteristics
Type Number
Supported
Isolated Digital Inputs (DI)
Vac DI modules consists of a DI PCB with two 10-point terminal block assemblies (for local termination), one configuration jumper, an LED daughterboard with eight status LEDs (one for each point), and a module cover. The Vac DI PCB connects with the backplane using a 36­pin gold-plated card-edge connector.
8
Characteristics
Each DI supports/includes:
Nominal field powered input voltage of
110Vac or 220Vac
Nominal input current of 12mA @
120Vac
30 ms input filtering
LED that turns ON when DI is ON.
Detailed Technical
Specifications
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Configuration
The isolated Vac DI module is available in a single configuration (part number 396686-01-0):
Isolation
Optocouplers electrically isolate the module’s DI field circuitry from the module’s bus interface circuitry.
Setting Jumpers
Vac DI module has one jumper which enables the DI status LEDs. See
Table 3-25.
Table 3-25. Jumper Assignments: Isolated Vac DI Module
Jumper Purpose Description
W1 Enables DI status LED Pins 1-2 installed = Enables LEDs manually
Pins 2-3 installed = Enables LEDs via software
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ControlWave Micro Distributed I/O System Instruction Manual
Wiring the Module
Figure 3-24 shows field wiring assignments for a locally terminated Vac DI module.
Figure 3-24. Isolated Vac DI Module Wiring (Local Termination)
Software Configuration
To use data from an isolated Vac Digital Input module you must add an ERM_DI16 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
Revised Aug-2015 I/O Modules 3-39
ControlWave Micro Distributed I/O System Instruction Manual

3.12 Relay Isolated Vac/Vdc Digital Output Module

Caution
You cannot install a relay isolated Vac/Vdc DO module in slot #1 of the housing.
Relay isolated Vac/Vdc DO modules provide a total of eight isolated DOs to control signaling functions. The DOs do not have surge protection (this is a customer-provided feature, if necessary).
Table 3-26. Relay Isolated Vac/Vdc DO Module Characteristics
Type Number
Relay Isolated Digital Outputs (DO)
Supported
8
Characteristics
Each DO supports/includes:
A pair of Normally Open (NO) relay
contacts capable of handling a maximum operating load of 6A at 240 Vac or 5A at 30Vdc.
Output relay provides 500 Vdc
electrical isolation for the DO.
Maximum operating frequency of 360
operations per hour (under rated load).
LED that turns ON when DO is ON.
Detailed Technical
Specifications
Isolation
Configuration
Setting Jumpers
Isolated Vac/Vdc DO modules consist of a DO PCB with two 10-point terminal block assemblies (for local termination), one configuration jumper, an LED daughterboard with eight status LEDs (one for each point), and a module cover. The DO PCB connects with the backplane using a 36-pin gold-plated card-edge connector.
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
Relays electrically isolate the Vac/Vdc DO field circuitry from the module’s bus interface circuitry. An onboard DO load register stores output data. At power up the DO load register clears and sets all outputs to “off.”
The relay isolated Vac/Vdc DO module is available in a single configuration (part number 396687-01-6).
The Vac/Vdc DO module has one jumper which enables the DI status LEDs. See Table 3-27.
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ControlWave Micro Distributed I/O System Instruction Manual
A
A
2
Table 3-27. Jumper Assignments: Isolated Vac DI Module
Jumper Purpose Description
W1 Enables DO status LED Pins 1-2 installed = Enables LEDs manually
Pins 2-3 installed = Enables LEDs via software
Wiring the Module
Figure 3-25 shows field wiring assignments for a locally terminated relay isolated Vac/Vdc DO module.
LED Board Connector
TB1
TB2
1
39
A Relay Isolated Vac/Vdc DO Module
cannot be installed into Sl ot #1 of a
2
P2
W1 LED Enable 1-2 = Enable LEDs Manually 2-3 = Enable LEDs via Software
NOTE:
Wave
Control MICRO
I/O Expansion Chassis!
1
FIELD
CIRCUITRY
NO_IN1
NO_OUT1
DO3
DO1 DO2
DO4
DO5 DO6 DO7 DO8
P1
NO_IN1
NO_OUT1
NO_IN2 NO_OUT2 N/C N/C
NO_IN3
NO_OUT3 NO_IN4 NO_OUT4
NO_IN5 NO_OUT5 NO_IN6 NO_OUT6
NO_IN7 NO_OUT7 NO_IN8 NO_OUT8
AC/DC DO MODULE
1
2
Field
TB
C/DC
DO Module
LED
ssignments
N/C N/C
DO1
DO5
DO2
DO6
DO3
DO4
DO8
DO7
1 2
3 4 5
TB1
6 7 8 9 10
1 2 3 4 5
TB
6 7 8 9 10
Figure 3-25. Relay Isolated Vac/Vdc DO Module Wiring (Local Termination)
Software Configuration
To use data from a Relay Isolated Vac/Vdc Digital Output module you must add an ERM_DO16 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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3.13 Isolated Digital Input/Output (DI/O) Module

Isolated Digital I/O modules provide four isolated DOs that are externally powered and twelve isolated DIs.
Table 3-28. Isolated (DI/O) Module Characteristics
Type Number
Isolated Digital Outputs (DO)
Isolated Digital Inputs (DI)
Supported
4
12
Characteristics
Each isolated DO supports/includes:
Externally powered. Supports 500mA
maximum load (nominally powered from a 10Vdc supply [30Vdc max]_
Surge protection.
Open source MOSFET drives up to
31Vdc at up to 500mA.
500Vdc MOV to chassis and 31Vdc
MOV (across output) protect each DO.
Maximum operating frequency of 20
Hz.
Each isolated DI supports/includes:
Jumper allows externally powered
single end inputs or internally sourced dry contact operation.
Nominal input voltage of 24Vdc.
Nominal input current of 5mA.
30 ms filtering.
Detailed Technical
Specifications
Configuration
Isolation
Isolated DI/O modules consist of a DI/O PCB with two 10-point terminal block assemblies (for local termination), 14 configuration jumpers, an LED daughterboard with 16 status LEDs (one for each point), and a module cover. The isolated DI/O PCB connects with the backplane using a 36-pin gold-plated card-edge connector.
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
The isolated DI/O module is available in a single configuration (part number 396804-01-2).
Surge suppressors and optocouplers electrically isolate the DI field circuitry from the module’s bus interface circuitry.
When configured for use in dry contact applications, all DIs use a built­in +21Vdc field power supply. This is an isolated supply powered by the output of the +VIN power source originating on the PSSM. Use jumper W15 to enable or disable the +21Vdc field power supply.
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Each of the four DO circuits contain an optically isolated open source MOSFET with surge suppressor and are capable of handling 500mA @ 30V.
Use jumper W15 to enable power for DIs that are configured for internal power. The nominal input voltage is 24Vdc at 5mA.
Setting Jumpers
The isolated DI/O module has 15 jumpers you can use to configure inputs and outputs. See Table 3-29.
Table 3-29. Jumper Assignments: Isolated Vac DI Module
Jumper Purpose Description
W1 Configures DI1 Pins 2-3 & 4-5 installed = Permit external power DI
Pins 1-2 & 3-4 installed = Permit internal source DI
W2-W12 Configures DI2 through DI12
(respectively)
W13 Enables DI/O status LED Pins 1-2 installed = Enables LEDs manually
W14 Programs serial EEPROM
W151
1 Place configuration jumper on pins 1-2 if you configure any DI for internally sourced operation.
Enables VIN Pins 1-2 installed = Enable VIN
Pins 2-3 & 4-5 installed = Permit external power DI Pins 1-2 & 3-4 installed = Permit internal source DI
Pins 2-3 installed = Enables LEDs via software
Reserved for factory use only
Pins 2-3 installed = Disable VIN
Wiring the Module
Figure 3-26 shows field wiring assignments for a locally terminated isolated DI/O module.
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Figure 3-26. Isolated DI/O Module Wiring (Local Termination)
Software Configuration
To use data from an isolated digital input/output module you must add an ERM_MD board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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3.14 Isolated Resistance Temperature Device (RTD) Input Module

RTD Input modules provide a total of four inputs. Firmware detects the RTD type (2-, 3- or 4 platinum wire) via the installation of jumper wires on the terminal block for 2-wire and 3-wire RTDs (see Figure 3-27).
Table 3-30. Isolated RTD Input Module General Characteristics
Type Number
Isolated RTD Input
Supported
4
Characteristics
Each isolated RTD input supports/includes:
Signal conditioning circuitry
Surge protection with a 12V transorb
that meets IEEE standard 472-1978
Over voltage protection
24-bit analog to digital converter (ADC)
Common mode range of 500V with
respect to chassis
Electrical isolation of 500Vdc (channel
to channel/system bus)
Source current to RTD limited to 330
uA
Detailed Technical
Specifications
Configuration
Wiring the Module
RTD Input Modules consists of an Isolated RTD Input Board with two 10-point Terminal Block Assemblies (for local termination) or two 14­pin Mass Termination Header Block Assembly (for remote termination), and a Cover Assembly. Each Isolated RTD Board is connected to the unit’s Backplane via a 36-pin card edge connector.
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
The isolated RTD module (general part number 396876-XX-X) has the following configurations:
Table 3-31. Isolated RTD Input Module Configurations
Part Number Termination Connector Notes 396876-01-3 396876-02-1
local
remote
Figure 3-27 shows field wiring assignments for locally terminated isolated RTD modules. Figure 3-28 shows field wiring assignments for remotely terminated isolated RTD modules.
Figure 3-28 also provides wiring diagrams for 2-wire, 3-wire, and 4­wire RTDs to the Local RTD Module Terminal Blocks; wiring assignments, i.e., +RTD#_3/4W, -RTD#_4W, +RTD# and –RTD# are
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ControlWave Micro Distributed I/O System Instruction Manual
similar to those assigned to the Remote DIN-Rail Mountable Terminal Blocks.
Note: To maintain specified accuracy with a 3-wire RTD, you must
match the two field wires that source and sink the RTD current within 0.01 ohms (matched in length and matched in wire type) and the ambient temperature on these wires must be the same.
Figure 3-27. Isolated RTD Module Wiring (Local Termination)
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Figure 3-28. Isolated RTD Module Wiring (Remote Termination)
Software Configuration
To use data from an isolated RTD input module you must add an ERM_RTD4 board in ControlWave Designer’s I/O Configurator into the ControlWave project that runs in the host ControlWave Micro, and then configure it. See the ControlWave Designer Programmer's Handbook (D5125) for more information. That same manual includes an I/O Mapping section that describes, for advanced users, the I/O map for this module.
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3.15 Isolated Thermocouple Module

Thermocouple (TC) modules (sometimes known as Low Level Analog Input modules) provide six individually isolated differential inputs for thermocouples or 10mV inputs plus one cold junction compensation (CJC) input for temperature compensation at the terminal block.
Table 3-32. Isolated Thermocouple Module Characteristics
Type Number
Supported
Isolated Thermocouple
6
Characteristics
Each isolated TC supports/includes:
Signal conditioning circuitry including a
2.5V reference
Surge suppression with a 188V
Transorb that meets IEEE standard 472-1978.
Over voltage protection
Opto-isolation circuitry.
provided electrical isolation of 500Vdc (channel to channel/system bus).
24-bit analog to digital converter (ADC)
Each input is
Detailed Technical
Specifications
Configuration
Wiring the Module
The CJC with a built-in RTD provides thermocouple temperature compensation at the terminal block and is electrically isolated. Pins 8, 9 and 10 of the local terminal block (TB1) source and sink the CJC’s RTD.
For detailed technical specifications, please see our website http://www.emersonprocess.com/remote.
The isolated TC module (general part number 396875-XX-X) has the following configurations:
Table 3-33. Isolated TC Module Configurations
Part Number Termination Connector Notes 396875-01-7 396875-02-5
local
remote
Figure 3-29 shows field wiring for locally terminated isolated TC modules. Figure 3-30 shows field wiring for remotely terminated isolated TC modules.
Figure 3-29 also provides diagrams showing the wiring for thermocouples and the 3-wire cold junction compensation (CJC) PCB to a locally terminated TC module (that is, +AI#, -AI#, +CJC (Reference),
-CJC (Return) & +CJC (Sense) are similar to those assigned to the remote DIN-rail mountable terminal blocks. A small CJC PCB is factory-installed to the terminal block.
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