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A
B
C
D
E
F
Heatsinks for SMD
– particularly suitable for SMD components
– low profile
– reduced weight
– effective heat dissipation
– can be glued directly onto the component
– solderable versions
– customer specific versions on request
– special packaging like tape and real, bar magazin, tray etc. on request
G
H
K
L
1
4,8
6,3
Rth[K/W][mm]art. no.Rth[K/W][mm]art. no.
6313ICK SMD A 13 ...1235ICK SMD A 5 ...
878ICK SMD A 8 ... 5117ICK SMD A 17 ...
3422ICK SMD A 22 ...7510ICK SMD A 10 ...
1
4,8
19
I
477ICK SMD B 7 SA 2219ICK SMD B 19 ...
3510ICK SMD B 10 SA
30
2,8
7,5
17
2610ICK SMD C 10 SA
... surfaceplease indicate:
black anodised=SA
solderable surface=MI
Rth[K/W][mm]art. no.Rth[K/W][mm]art. no.
2913ICK SMD B 13 SA565ICK SMD B 5 ...
Rth[K/W][mm]art. no.Rth[K/W][mm]art. no.
1717ICK SMD C 17 ...337ICK SMD C 7 SA
M
N
B45
E5–13Thermally conductive foilA22–83Extruded heatsinks
E19–20Thermal conductive pasteB21–27Pin heatsinks for IC
A21Hole patternE43Insulting clamping parts
A2–7Technical introductionE21–22Thermal conductive glue
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