Filtronic FMA411 User Manual

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PRELIMINARY

LOW-NOISE X-BAND MMIC

FMA411

• PERFORMANCE

♦ 8.5 – 14.0 GHz Operating Bandwidth
♦ 2.6 dB Noise Figure
♦ 18 dB Small-Signal Gain
♦ 17.5 dm Output Power
♦ +6V Single Bias Supply
♦ Adjustable Operating Current
♦ DC De-coupled Input and Output Ports

• DESCRIPTION AND APPLICATIONS

The FMA411 is a 2-stage, reactively matched pHEMT low-noise MMIC amplifier designed for use
over the 8.5 to 14.0 GHz bandwidth. The amplifier requires a single +6V supply and one off-chip
component for supply de-coupling; the supply voltage can be varied from +3V to +6V if needed.
Both the input and output ports are DC de-coupled. Grounding of the amplifier is provided by plated
thru-vias to the bottom of the die, no additional ground is required. Operating current can be
adjusted using the Source resistor ladders located along the bottom edge, by bonding a particular pad
to ground, in order to optimize noise or power performance.

Typical applications include low-noise front end amplifiers, and general gain block utilizations in X­band. The amplifier is unconditionally stable over all load states (-45 to +85°C), and conditionally
stable if the input port is open-circuited.

• ELECTRICAL SPECIFICATIONS AT 22°C

Parameter Symbol Test Conditions Min Typ Max Units

Operating Frequency Bandwidth BW 8.5 14 GHz

Small Signal Gain S21 V

Saturated Drain Current

I

V

DSS

(see Note)

Operating Current IDQ V

Small Signal Gain Flatness

∆S

21

Noise Figure NF V

3rd-Order Intermodulation Distortion IMD V

Power at 1dB Compression P

V

1dB

Input Return Loss S11 V

Output Return Loss S22 V

Reverse Isolation S

12

DD

V

DD

DD

DD

DD

DD

DD

V

DD

= +6 V I

= +3V 210 230 270 mA

DD

= +6V 125 140 165 mA

DD

= +6 V I

= +6 V I

= +6 V I

P

= +6 dBm SCL

OUT

= +6 V I

= +6 V I

= +6 V I

= +6 V I

≈ 60% I

DD

≈ 60% I

DD

≈ 60% I

DD

≈ 60% I

DD

≈ 60% I

DD

≈ 60% I

DD

≈ 60% I

DD

≈ 60% I

DD

16.5 18 21 dB

DSS

DSS

DSS

DSS

2.6 3.5 dB

± 0.8 ± 1.2

-46

16 17.5 dBm

DSS

DSS

-16 -10 dB

DSS

-40 -35 dB

DSS

-10 -6 dB

dB

dBc

• NOTE: Continuous operation at I

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is not recommended

DSS

PRELIMINARY

FMA411

LOW-NOISE X-BAND MMIC

ABSOLUTE MAXIMUM RATINGS1

Parameter Symbol Test Conditions Min Max Units

Supply Voltage V

Supply Current I

RF Input Power P

Storage Temperature T

Total Power Dissipation P

DD

DD

IN

STG

TOT

Gain Compression Comp. Under any bias conditions 5 dB

Simultaneous Combination of Limits2

1

T

= 22°C unless otherwise noted

Ambient

2

Users should avoid exceeding 80% of 2 or more Limits simultaneously

Notes:

• Operating conditions that exceed the Absolute Maximum Ratings will result in permanent damage to the device.

• Total Power Dissipation defined as: P

P

DC

P

IN

P

OUT

≡ (PDC + PIN) – P

TOT

: DC Bias Power

: RF Input Power

: RF Output Power

• Total Power Dissipation to be de-rated as follows above 22°C:
P

= 0.6 - (0.004W/°C) x T

TOT

where T

= carrier or heatsink temperature above 22°C

CARRIER

(coefficient of de-rating formula is the Thermal Conductivity)

Example: For a 55°C carrier temperature: P

= 0.6 - (0.004 x (55 – 22)) = 0.47W

TOT

• For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with

some degradation in thermal de-rating performance (P

• Note on Thermal Resistivity: The nominal value of 250°C/W is stated for the input stage, which will reach

temperature limits before the output stage. The aggregate MMIC thermal resistivity is approximately 175°C/W.

For any operating current 8 V

For VDD < 7V 75% I

mA

DSS

For standard bias conditions 0 dBm

Non-Operating Storage -40 150 ºC

See De-Rating Note below 980 mW

2 or more Max. Limits 80 %

, where:

OUT

CARRIER

= 550mW)

TOT

• HANDLING PRECAUTIONS

To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model.
Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.

Phone: [phone] www.filcs.com Revised: 7/19/04

Fax: [phone] Email: [e-mail]