TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
1 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
UNRESTRICTED
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1.0 OBJECTIVE
This specification defines the performance, test, quality, and reliability requirements of the MEG-Array™
.050” x.050” Grid High Density Connector System for Eutectic Sn Pb BGA as well as Lead Free BGA
product that meets the requirements of the European Union Directive of Restrictions for Hazardous
Substances (Directive 2002/95/EC).
2.0
SCOPE
This specification applies to the MEG-Array™ 0.50” x .050” Grid High Density Connector System which
provides for parallel interconnection of printed wiring boards in low power applications.
GENERAL
3.0
PARAGRAPH TITLE
1.0 Objective
2.0 Scope
3.0 General
4.0 Applicable Documents
5.0 Requirements
5.1 Qualification
5.2 Material
5.3 Finish
5.4 Design and Construction
6.0 Electrical Characteristics
7.0 Mechanical Characteristics
8.0 Environmental Conditions
9.0 Quality Assurance Provisions
9.1 Equipment Calibration
9.2 Inspection Conditions
9.3 Sample Quantities and Description
9.4 Qualification Testing
9.5 Requalification Testing
APPLICABLE DOCUMENTS
4.0
DRAWINGS & APPLICATION NOTE
4.1
4.1.3 81 Position 4.0mm mated height
55714 Plug
55715 Receptacle
4.1.4 100 Position 4.0mm mated height
84512 Plug
84513 Receptacle
4.1.5 200 Position 4.0mm mated height
84516 Plug
84517 Receptacle
4.1.6 200 Position 8.0mm mated height
84516 Plug
84535 Receptacle
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
Copyright FCI
Form E-3334
Rev E
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
4.1.7 200 Position 10.0mm mated height
4.1.8 200 Position 12.0mm mated height
4.1.9 240 Position 3.4mm mated height
4.1.10 240 Position 4.0mm mated height
4.1.11 240 Position 6.0mm mated height
4.1.12 300 Position 4.0mm mated height
4.1.13 300 Position 5.5mm mated height
4.1.14 300 Position 8.0mm mated height
4.1.15 300 Position 10.0mm mated height
4.1.16 300 Position 11.5mm mated height
4.1.17 300 Position 14.0mm mated height
4.1.18 400 Position 4.0mm mated height
4.1.19 400 Position 6.0mm mated height
4.1.20 400 Position 8.0mm mated height
4.1.21 400 Position 10.0mm mated height
84530 Plug
84517 Receptacle
84530 Plug
84535 Receptacle
74213 Plug
74215 Receptacle
74213 Plug
74217 Receptacle
74213 Plug
55755 Receptacle
84500 Plug
84501 Receptacle
84500 Plug
84502 Receptacle
84500 Plug
84553 Receptacle
84578 Plug
84501 Receptacle
84578 Plug
84502 Receptacle
84578 Plug
84553 Receptacle
84740 Plug
74221 Receptacle
84740 Plug
74388 Receptacle
84740 Plug
74390 Receptacle
84520 Plug
74221 Receptacle
NUMBER
GS-12-100
2 of 15 J
AUTHORIZED BY DATE
D. Harper
CLASSIFICATION
UNRESTRICTED
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Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
3 of 15 J
AUTHORIZED BY DATE
D. Harper
CLASSIFICATION
UNRESTRICTED
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4.1.22 400 Position 12.0mm mated height
84520 Plug
74388 Receptacle
4.1.23 400 Position 14.0mm mated height
84520 Plug
74390 Receptacle
4.1.24 528 Position 6.0mm mated height
10022671 Plug
10026846 Receptacle
4.1.25 Application Note GS-20-033
4.2 OTHER STANDARDS AND SPECIFICATIONS
4.2.1 UL-94: Flammability
4.2.2 EIA 364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
4.2.3 ASTM B122: Copper-Nickel-Tin Alloy
4.2.4 ASTM B194: Beryllium Copper Alloy
4.2.5 ASTM D5138: Std Specification for Liquid Crystal Polymers
4.2.6 ANSI/J-STD-005: Requirements for Soldering Pastes
4.2.7 ANSI/J-STD-004: Requirements for Soldering Fluxes
4.2.8 IEC 68-2-60 Ke: Flowing mixed gas Corrosion Test
4.2.9 ANSI-J-002: Solderability Tests for Component Leads, Terminations, Lugs, Terminals & Wires
(paragraph 3.4.2 Steam Aging)
4.2.10 EIA-638 - Surface Mount Solderability Test
4.3 FCI SPECIFICATIONS
4.3.1 BUS-15-002/M: Nickel Plating
4.3.2 BUS-15-005/H: Gold Plating
4.3.3 GES-14-455: Packaging of MEG-Array Product
4.3.4 BUS-19-124: Solderball to Terminal Tensile Test Procedure
4.3.5 BUS-19-125; MEG Array Conn. 3 Point Bend Test Procedure
Copyright FCI
Form E-3334
Rev E
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
GS-01-001
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
4 of 15 J
AUTHORIZED BY DATE
D. Harper
CLASSIFICATION
UNRESTRICTED
28 Aug 06
4.3.6 BUS-03-108: Crosstalk Test Methods
4.3.7 BUS-03-109: Rise Time Degradation Measurement
4.3.8 BUS-03-110: Characteristic Impedance
4.3.9 BUS-03-111: Propagation Delay Measurements
4.3.10 BUS-03-113: Inductance Measurement
4.3.11 GS-18-015: Product Quality Plan
4.3.12 BUS-03-601: Current Rating
4.4
FCI LAB REPORTS - SUPPORTING DATA
4.4.1 EL-97-12-057: MEG Array Connector Qualification
4.4.2 EL-97-08-085: MEG Array Impedance, propagation delay, crosstalk
4.4.3 EL-98-03-007A: 400 Pos. MEG Array Recept. Development Testing
4.4.4 EL-98-02-072: 3.4mm 240 Pos Recept. Durability & Hi Temp Life
4.4.5 EL-98-02-102: 4.0mm 400 Pos Recept. 3-Point Bend
4.4.6 EL-98-04-031
4.4.7 EL-98-05-079: 240, 4.0mm Zipper Mating Forces
4.4.8 EL-98-12-069: 4.0mm, 400 Position Temp Cycling
4.4.9 SI-2002-03-001: Signal Integrity of 10mm, 12mm, & 14mm Stacked Height
4.4.10 EL-2003-10-09: Mating/Unmating Forces of 80, 81, 100 & 528 Positions
4.4.11 EL-2004-01-003C Lead Free BGA Temperature cycling
REQUIREMENTS
5.0
5.1 QUALIFICATION Connectors furnished under this specification shall be products that are
NOTE: 1) LLCR(Initial) for bulk resistance for 10mm, 12mm, and 14mm is in-progress.
5.2
Copyright FCI
Form E-3334
Rev E
CR
: 4.0mm 240 Pos Temp Cycle
capable of meeting the qualification test requirements specified herein.
2) Thermal cycling testing to include complete product line coverage with regards to
position, size, and mated height is in-progress.
3) Electrical Characteristics – Signal Integrity (Capacitance, Propagation Delay,
Characteristic Impedance, Crosstalk, Inductance)- Testing is in-progress for the
10mm, 12mm, and 14mm mated heights.
MATERIAL The material for each part shall be as specified herein, or equivalent. Substitute
material shall meet the performance requirements of this specification.
5.2.1 Receptacle Terminal. The base material shall be beryllium copper alloy strip.
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
5 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
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5.2.2 Plug Terminal. The base material shall be copper-nickel-tin alloy strip.
5.2.3
Plug and Receptacle Insulator Housing. The insulators shall be molded of liquid crystal
polymer that is rated 94V-0 or better in accordance with UL-94.
5.2.4
Solder Balls. Solder alloy 63 Tin/37 Lead or Lead Free 95.5Sn/4Ag/.5Cu
5.2.5
Solder Paste. Modified low resin content, no clean, with 63SN/37PB solder or Lead Free
95.5Sn/4Ag/.5Cu solder.
5.3 FINISH
5.3.1 The plug and receptacle terminals shall be plated in the contact area with 0.4
micrometers min. gold over 0.8 micrometers nickel.
5.4 DESIGN AND CONSTRUCTION. The connector shall be a multi-piece assembly having an array
of contacts with solder balls attached, for installation on surface mount printed wiring boards or
flexible circuits.
5.4.1 Mating. The connector shall be capable of mating and unmating manually without the
use of special tools.
6.0 Electrical Characteristics
Contact Resistance, Low Level (LLCR) - The initial low level contact resistance shall not exceed (See
6.1
Table)milliohms, with a max.10 milliohms change after environmental exposure, when measured in
accordance with EIA 364-23. The following details shall apply:
a) 3.4mm mated height 20 milliohms
4mm mated height 20 milliohms
5.5mm mated height 22 milliohms
6mm mated height 23 milliohms
8mm mated height 25 milliohms
10mm mated height In-progress
12mm mated height In-progress
14mm mated height In-progress
b) Method of Connection Attach current and voltage leads as shown in Figure 1.
c) Test Voltage 20 millivolts DC max open circuit
d) Test Current Not to exceed 100 milliamperes.
6.2 Insulation Resistance - The insulation resistance of mated connectors shall not be less than 1000
megohms (1000 megohms after environmental exposure) when measured in accordance with EIA
364-21. The following details shall apply:
a) Test Voltage - 200 volts DC.
b) Electrification Time - 2 minutes, unless otherwise specified.
c) Points of Measurement - Between adjacent and opposing contacts.
6.3 Dielectric Withstanding Voltage - There shall be no evidence of arc-over, insulation breakdown, or
excessive leakage current (> 1 milliampere) when mated connectors are tested in accordance with
EIA 364-20. The following details shall apply:
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
6 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
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a) Test Voltage - 200 volts (DC RMS or AC, 60Hz).
b) Test Duration - 60 seconds.
c) Test Condition - 1 (760 Torr - sea level).
d) Points of Measurement - Between adjacent and opposing contacts.
6.4
Current Rating - The temperature rise above ambient shall not exceed 30 °C at any point in the
system when all contacts are powered at 0.45 ampere(s) or one contact is powered at 2.0
amperes. The following details shall apply:
a) Ambient Conditions - Still air at 25 °C.
b) Reference - BUS-03-601.
c) A plug and receptacle were soldered to 38mm x 82 mm single sided board with solid layer of 3
oz. Copper. Power applied to connectors through wires screwed to corner of boards.
Thermocouple located in center of connectors. See Figure 2.
6.5
Capacitance - The capacitance between adjacent and opposing contacts in a mated connector shall
not exceed 1.0 picofarads when measured in accordance with EIA-364-30. The following details
shall apply:
a) Test frequency: 100 khz
b) Preparation: The connectors shall be mated but not soldered to a P.C. board.
c) Measurement points: The capacitance shall be measured across a minimum of 10 adjacent
contacts.
6.6
Propagation Delay - The specification requirement shall be satisfied when evaluated in accordance
with FCI Test Specification BUS-03-111 and the following details:
a) Specification requirement 35ps. max.(3.4 & 4mm mated height)
5.5mm-mated height 60ps. Max estimated 6mm-mated height 60ps.max. 8mm-mated height 60ps.max. 10mm mated height 60ps.max. 12mm mated height 60ps.max. 14mm mated height 63ps.max.
6.7 Characteristic Impedance - The specification requirement shall be satisfied when evaluated in
accordance with FCI Test Specification BUS-03-110 and the following details:
a) Input Rise Time (10% to 90%) = 100ps
b) Specification requirement 50 ± 5 for 3.4 & 4.0mm mated height
Specification requirement 55 ± 5 for 5.5, 6 & 8mm mated height
In-progress- Specification requirement 55 ± 5 for 10, 12, 14mm mated height
c) All signal contacts terminated with 50 ohm resistors.
d) Connector terminated in a 4:1 signal to ground ratio
6.8
Crosstalk - The specification requirement shall be satisfied when evaluated in accordance with FCI
Test Specification BUS-03-108 and the following details:
a) Input Rise Time (10% to 90%) = 100ps
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
7 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
UNRESTRICTED
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b) Near End Crosstalk: 5% max.(4mm)
5.5mm- 7.5% max estimated
6mm- 7.5% max.
8mm- 9% max.
10mm 9% max.
12mm 10% max.
14mm 10% max.
c) All signal contacts terminated with 50 ohm resistors.
d) 4:1 Signal to Ground Ratio
6.9 Inductance - The specification requirement shall be satisfied by simulation:
a) Specification requirement.
Product Mated Height Partial Loop Inductance
4.0mm 1.48nH
5.5mm 2.48nH
6mm 2.88nH.
8mm 4.39nH
10mm 5.80nH
12mm 7.88nH
14mm 9.60nH
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
8 of 15 J
AUTHORIZED BY DATE
D. Harper
CLASSIFICATION
UNRESTRICTED
28 Aug 06
FIGURE 1
Termination Resistance Measurement Points
Note: If ambient temperature varies by more than 4º between measurements, all values shall be corrected to a
standard ambient temperature.
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
9 of 15 J
AUTHORIZED BY DATE
D. Harper
CLASSIFICATION
UNRESTRICTED
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FIGURE 2
Maximum Current Set-up
7.0 MECHANICAL CHARACTERISTICS
7.1 Mating/Unmating Force
- Both plug and receptacle shall be soldered onto boards and the boards held in place
by adequate fixturing to prevent cocking or misalignment, and shall be fully mated. Measurements are
recorded for 3 mate/unmate cycles. Connectors are mated first on one end then the other end(zippered).
See Figure 4
a) Cross Head Speed - 5mm per minute.
b) Lubrication - None
7.1.1 Total Mating Force
The max total mating force shall be:
240 Pos. 300 Pos. 400 Pos. 528 Pos.
8 Kgms 10.5Kgms (est.) 14Kgms 20.5Kgms
81 Pos. 100 Pos. 200 Pos.
7 Kgms* 14.5Kgms * 9Kgms*
7.1.2 Withdrawal Force
The max. withdrawal force shall be:
240 Pos. 300 Pos. 400 Pos. 528 Pos.
8 Kgms 8Kgms (est.) 8Kgms 9Kgms
*Due to size of connector system, the zipper method was not used. All pins were mated and unmated at the same
time.
81 Pos.
100 Pos. 200 Pos.
3.5 Kgms* 7.3Kgms* 6Kgms*
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
10 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
UNRESTRICTED
28 Aug 06
7.2 Solderball Pull Strength – The solderball pull strength in “Z” axis shall not be less than 1000gms per
contact when tested in accordance with BUS-19-124. Connectors are not soldered onto board. The
housing is held in a fixture while each terminal is gripped in a vise and pulled vertically out of the housing.
The terminal is stripped out of the ball, leaving the ball on the housing bottom.
8.0 3-Point Bend – The connectors are soldered onto FR-4 bd. With pad geometry and footprint per FCI
Customer drawing and Application Note 950554-002. The board is fixtured and bowed 20 mils/inch of
board support distance (see Figure 3). Dye penetrant is applied to solder joints and
off board and solder joints are visually inspected for cracks that occurred during bending.
BUS-19-125 3-Point Bend Procedure.
dried. Conn. Is pried
Per
FIGURE 3 – 3-Point Bend Test
Copyright FCI
Form E-3334
Rev E
FIGURE 4
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
11 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
UNRESTRICTED
28 Aug 06
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
12 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
UNRESTRICTED
28 Aug 06
8.0 ENVIRONMENTAL CONDITIONS
After exposure to the following environmental conditions in accordance with the specified test procedure and/or
details, the product shall show no physical damage and shall meet the electrical and mechanical requirements per
sections 6.0 and 7.0 as specified in the Table 1 test sequences. Unless specified otherwise, assemblies shall be
mated during exposure.
8.1. Temperature Cycling – At increments of 300 temp. cycles, contact resistance shall pass the requirements
of Paragraph 6.1. Optionally, samples may be wired in series, with less than 100% increase in total
resistance from initial value (recorded at hot temperature).
a) Number of Cycles – 1000
b) Temperature Range – Between -40 and 85 °C
c) Time for Each Cycle – 30 minutes (approx. 24 days to total)
8.2 Humidity – EIA 364-31, Method II.
Connectors shall be tested at accelerated humidity. Upon completion of exposure period, they shall be
conditioned at room ambient for a period of four hours.
a) Relative Humidity 95%
b) Temperature 40°C
c) Test Condition A (96 hours)
8.0 High Temperature Life – EIA 364-17.
a) Test Temperature – 85 °C ± 5 °C
b) Test Duration – 500 hours
8.0 Durability – EIA 364-09
The connector halves shall be mated/unmated 50 times. After cycling, the contacts shall meet the
requirements of paragraphs 6.1, 7.1 & 8.5 of this specification. The test shall be performed with plug &
receptacle soldered to board.
8.0 Corrosive Atmosphere – IEC 68-2-60 Ke
Connectors shall be mated when exposed to the environment. Upon completion of the exposure, the
contacts shall pass the requirements of paragraph 6.1 of this specification. The mated connectors shall
not be disturbed during this test.
Using connectors mounted to the appropriate printed wiring board, they shall be exposed to a mixed gas
atmosphere, to be placed in the test chamber of a sufficient volume to result in saturation of the test
chamber.
a) Relative humidity: 75%
b) Exposure time: 96 hours
c) Temperature: 40 ° ± 5 °C
d) H2S: 3 ± 1 ppm
e) S02: 10 ± 3 ppm
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
13 of 15 J
AUTHORIZED BY DATE
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CLASSIFICATION
UNRESTRICTED
28 Aug 06
8.0 Solderability – EIA-638
Solder paste is deposited on a ceramic plate via stencil in the pattern per customer drawing. The
connectors are steam aged and placed onto the solder paste print. The substrate is processed
through a forced hot air convection oven with nitrogen blanket. The connectors are removed from
the ceramic and solder balls inspected for bridging and wetting.
a) Steam age 1 hour per ANSI-J-STD-002 (paragraph 3.4.2)
b) Solder paste Alpha LR735 no clean
c) Ceramic plate .9mm thick
d) Temperature profile;
Eutectic
: 230 ° C max., over 183 ° C, 45 -90 seconds, 60 – 120 ° C/min ramp until 110 ° to 130
° C soak, soak 1.5 to 2.0 min.
Lead Free
; 260 ° C max., over 218 ° C, 40 -70 seconds, 60 – 120 ° C/min ramp until 140 ° to
160 ° C soak, soak 1.5 to 2.0 min.
9.0 QUALITY ASSURANCE PROVISIONS
9.1 Equipment Calibration
All test equipment and inspection facilities used in the performance of any test shall be maintained
in a calibration system in accordance with ANSI/NCSL Z-540-1
8.0 Inspection Conditions
Unless otherwise specified herein, all inspections shall be performed under the following ambient
conditions:
a) Temperature: 25 ± 5° C.
b) Barometric pressure: Local ambient
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
14 of 15 J
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TABLE 1 – QUALIFICATION TESTING
TEST GROUP
1 2 3 4 5 6 7 8 9 10
TEST PA TEST SEQUENCE
Examination of
5.4 1 1
Product
Contact Resistance
Low Level
Insulation
6.1
3
5
8
6.2 2 6
Resistance
Dielectric
6.3 3 7
Withstanding
Voltage
Current Rating 6.4 2
Capacitance 6.5 4 8
Propagation Delay 6.6 2
Characteristic
6.7 3
Impedance
Crosstalk 6.8 4
Inductance 6.9 5
Rise Time
6.1 6
Degradation
Mating/Unmating
7.1 2 6 3 6
Force
Solderball Pull
7.2 2
Strength
3-Point Bend 7.3 2
Temperature
8.1 2
Cycling
Humidity 8.2 3 5
Hi Temperature Life 8.3 4
Durability 8.4 4
Corrosive
85 7
Atmosphere
Solderability 8.6 2
Qty. Conns./Group 3 3 3 1 3 30 3 3 3
8. - Refer to EIA-540B000 for Sample Quantities
2
4
1
1
2
5
1
1
1
1
3
1
1
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
TYPE
PRODUCT SPECIFICATION
TITLE PAGE REVISION
MEG-Array™ 81, 100, 200, 240, 300,
400 & 528 Positions
NUMBER
GS-12-100
15 of 15 J
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REVISION RECORD
REV PAGE DESCRIPTION EC # DATE
1 All Preliminary
V70712 04/21/97
2 ALL Add dwg. Numbers, ref. Berg specs., add cleanliness,
V71445 10/06/97
add Figures 2 & 3, and 7.2 & 7.3 and renumber
3 1-12 Update 4.1.1,4.1.2 & 4.1.3. Change
V80007 01/06/98
4.3.7,4.3.9,6.1,6.4,
7.1.1,7.1.2,7.3,8.1,8.5,8.6,9.1& 9.2
4 All Delete 4.1.1,4.5.1. Change 4.1.2,4.1.3,4.5.2,&4.5.3. V80262 03/17/98
5 3,5,6,8,9 Pg. 3, 6.1 a change 12 to 20, 16 to 25. Pg. 5 change
V81012 07/09/98
6.8.b ,change 75% to 7.5. Pg. 8 , 8.3 b change 240 to
500 hours. 6.9 add test in process. Add (d) to 8.1.
6 9 8.0 change b) from -25 and 100 to -40 and 85. V81066 09/22/98
A All New Release V90413 03/31/99
B ALL Revised format to be consistent with GS-01-001, and
V01949 08/16/00
change BERG, Dupont, etc. references to FCI.
Change document number prefix from GES to GS.
C ALL Add Products V10218 3/12//01
D ALL Add Products V21506 4/02/03
E ALL Add Products V03-1179 10/27/03
F 3 Add Inductance Simulation Values V03-1244 11/19/03
G All Add Lead Free BGA information V04-0883 9/17/04
H All Change logo V06-0539 6/2/06
J All Removed 80 Position information and add 200 position
V06-0858 8/28/06
mating and un-mating force information
Copyright FCI
Form E-3334
Rev E
GS-01-001
PDM: Rev:J Released .STATUS: Printed: Apr 13, 2007
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