Fastwel CPC309 User Manual

CPC309 Intel Atom D510-based SBC Specification

CPC309

CPC309 Intel Atom D510-based

SBC with StackPC expansion

connector

User Manual

Rev. 0.2

December 2015

The product described in this
manual is compliant
with all related CE standards.

CPC309 Intel Atom D510-based SBC Specification

Product Title: CPC309
Document name: CPC309 User Manual
Manual version: 0.2
Copyright © 2015 Fastwel Co. Ltd. All rights
reserved.

Revision Record

Revision No.

Brief description of

changes

Board index

Revision date

0.1

Initial version

CPC309

December 2013

0.2

Compliance assessment

CPC309

December 2015

Contact Information

Fastwel Co. Ltd

Fastwel Corporation US

Address:

108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation

6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011, USA

Tel.:

[phone] Tel.:

[phone]

Fax:

[phone]

E-mail:

[e-mail]

[e-mail]

Web:

http://www.fastwel.com/

CPC309 Intel Atom D510-based SBC Specification

TABLE OF CONTENTS

TRADEMARKS 7

OWNERSHIP RIGHTS 7

COPYRIGHT 7

TRANSPORTATION, UNPACKING AND STORAGE……………………………………………………………...…..8

Transportation………………………………………………………………………………………………………..…. 8
Unpacking………………………………………………………………………………………………………..……… 8
Storage……………………………………………………………………………………………………………..……. 8

MANUFACTURER’S WARRANTY………………………………………………………………………………………..9

Warranty Liability……………………………………………………………………………………………………..…9
Liability Limitation Right………………………………………………………………………………………………..9
Warranty Period…………………………………………………………………………………………………..….….9
Limitation of warranty liabilities…………………………………………………………………………….………….9
Returning a product for repair…………………………………………………………………………………….…...9

1. INTRODUCTION………………………………………………………………………………………………………. 10

1.1. Purpose……………………………………………………………………………………………….……..….…10

1.2. Versions, ordering information………………………………………………………………………………….10

1.2.1. Versions, ordering information………………………………………………………………………………10

1.2.2. Delivery checklist……………………………………………………………………………………………...12

1.3. Additional accessories…………..………………………………………………….…………………….………12

2. TECHNICAL CHARACTERISTICS…………………………………………………………………………………..13

2.1. Technical structure of the mdoule………………………………………………………………………...…….13

2.2. Module Power Supply………….....……………………………………………………………………………...14

2.3 Operating Conditions ……….……………………………………………….…………………………………..14

2.4 Mechanical Characteristics …….……………………………………………………………………………….15

2.5 Weight and Size Characteristics …………………………………………………………………………….…..15

2.6. MTBF……………………………………………………………………………………………….…………...…16

3. MODULE STRUCTURE AND FUNCTIONING.…………………………………………………….…………….…17

3.1 Block Diagram of the Module …...……………………………………………………………….…………..…17

3.2 Location of Module’s Principal Components ..…………………………………………………..…………... 18

3.3 Features of functional parts……………………………………………………………………………………...20

3.4 Interfaces and module connector…………………………………………………………………………….…21

3.4.1 StackPC-PCI connectors……………………………………………………………………………………...21

3.4.2 Graphics controller…………………………………………………………………………………………….25

3.4.3 Audio interface……………………………………………………………………………………………….…27

3.4.4 Serial interfaces………………………………………………………………………………………………...28

3.4.5 USB Interfaces………………………………………………………………………………………………….29

3.4.6 Gigabit Ethernet interface……………………………………………………………………………………..30

3.4.7 SerialATA Interface…………………………………………………………………………………………….30

3.4.8 CompactFlash Connector……………………………………………………………………………………..30

3.4.9 PS/2 keyboard/mouse interface………………………………………………………………………………32

3.4.10 Power supply connector………………………………………………………………………………………32

3.4.11 Digital I/O port………………………………………………………………………………………………….33

3.4.12 System reset connector………………………………………………………………………………………35

3.5 LEDs…………………………………………………………………………………………………………………35

CPC309 Intel Atom D510-based SBC Specification

3.6 Watchdog timers………………………………………………………………………………………………….35

3.7 Module address space…………………………………………………………………………………………...35

3.7.1 Distribution of memory address space……………………………………………………………………….35

3.7.2 Distribution of I/O address space of the module……………………………………………………………36

3.7.3 Distribution of interrupt lines…………………………………………………………………………………..37

4 INSTALLATION OF CPC309…………….……………………………………………………………………..…..…38

4.1 Safety requirements...…………………………………………………………………………………….……...38

4.2 Possible Heat Removal Methods……………………………………………………………………….……….39

4.3 Procedure of CPC309 Installation ……………………………………………………………..………….……39

4.4 Module removal procedure………………………………………………………………………………………41

4.5 Installing peripheral devices to CPC309…………………….………………………………...........................41

4.5.1 Installation of CompactFlash memory cards……………………………………………………………….41

4.5.2 Battery replacement…………………………………………………………………………………………..42

4.5.3 Installing StackPC extension modules……………………………………………………………………..42

5 CONFIGURATION OF CPC309………………………………………………………………………………….….43

5.1 Selection of Buffers Power Voltage on the PCI Bus of Extension Modules…………………………………..43

5.2 Selecting the Power Supplied to TFT Panel……………………………………………………………………..44

5.3 Restoring Factory CMOS Settings (Clear CMOS)……………………………………………………………….44

5.4 BIOS Update…………………………………………………………………………………………………………45

6 CPC309 PROGRAMMING………………………………………………………………………………………….…46

6.1 Work with WDT1 Watchdog Timer…………………………………………………………………………………46

6.2 Work with WDT2 Watchdog Timer…………………………………………………………………………………47

6.3 Discrete Input/Output Port Programming………………………………………………………………………….47

7 PHOENIX ® BIOS………………………………………………………………………………………………………49

7.1 Starting BIOS Setup Software…………………………………………………………………………………….…49

7.2 Main…………………………………………………………………………………………………………………….50

7.2.1 IDE Primary/Master………………………………………………………………………………………………..50

7.2.2 SATA Port 1 – Port 3………………………………………………………………………………………………52

7.2.3 Memory Cache……………………………………………………………………………………………………..52

7.2.4 Boot Features………………………………………………………………………………………………………53

7.3 Advanced……………………………………………………………………………………………………………...54

7.3.1 PnP Configuration…………………………………………………………………………………………………55

7.3.2 Console Redirection……………………………………………………………………………………………….56

7.3.3 I/O Device Configuration………………………………………………………………………………………….57

7.4 Intel……………………………………………………………………………………………………………………...58

7.4.1 CPU Control Sub-Menu……………………………………………………………………………………………59

7.4.2 Video (Intel IGD) Control Sub-Menu……………………………………………………………………………..60

7.4.3 ICH Control Sub-Menu…………………………………………………………………………………………….62

7.5 Security…………………………………………………………………………………………………………………65

7.6 Boot……………………………………………………………………………………………………………………...66

7.7 Custom…………………………………………………………………………………………………………………..67

7.8 Exit……………………………………………………………………………………………………………………….68

ANNEX A…………………………………………………………………………………………………………………….69
ANNEX B……………………………………………………………………………………………………………………70

CPC309 Intel Atom D510-based SBC Specification

List of tables

Table 1-1: Ordering information……………………………………………..……………………………………..…..11

Table 1-2: Delivery checklist………………………………………………………………………………………….....12

Table 1-3: Additional accessories………………………………………………………………………………………12

Table 2-1: Required Power Source Parameters.....…………………………………………………………….……..14

Table 2-2: Module Weight and Sizes……………………….…………………………………………………………...15
Table. 3-1: Purpose of StackPC connector contacts (XP7) ……..…………………………………………………….22
Table 3-2: Purpose of PCI-104 connector contacts (XS4).…………………………………………………………….24
Table 3-3: Purpose of VGA (XP1) connector contacts ...….…………………………………………………………...26
Table 3-4: Purpose of LVDS (XP8) connector’s contacts..…………………………………………………………….26

Table 3-5: Purpose of Audio connector contacts ……………………………………………………………………....28

Table. 3-6: Purpose of COM1/COM2 (XP3 и XP6) contacts .………………………………………………………....29

Table 3-7: Purpose of USB1-USB2 (XP5) connector contacts ..……………………………………………………...29
Table 3-8: Purpose of CompactFlash (XP12) connector contacts…...……………………………………………….31

Table 3-9: Purpose of PS/2 (XP15) connector contacts….…………………………………………………………....32

Table 3-10: Purpose of XP25 connector contacts.……………………………………………………………………...33
Table 3-11: Parameters of the line of digital I/O port in the output mode.…..……………………………………….33
Table 3-12: Parameters of the line of digital I/O port in the input mode.……………………………………………..34
Table 3-13: Purpose of XP24 digital I/O port connector contacts……………………………………………………..34
Table 3-14: Purpose of LED indicators .…………………………………………………………………………………35
Table 3-15: Distribution of memory address space……………………………………………………………………36
Table 3-16: Distribution of I/O address space …………………………………………………………………………36
Table 3-17: Distribution of interrupt lines…………………………….………………………………………………….37

Table 6-1: WDT1 Watchdog Timer Control Registers.……...................................................................................46

Table 6-2: WDT2 Watchdog Timer Control Registers ………............................................................................. 47

CPC309 Intel Atom D510-based SBC Specification

List of figures

Fig. 1-1: Template for ordering CPC309 CPU Module ......................................................................................... 11

Fig. 2-1: Dimensions and fitting dimensions of the module (top view) ….............................................................. 15

Fig. 2-2: Module dimensions (side view) ……....................................................................................................... 16

Fig. 3-1: Module block diagram …............................................................................................................................17

Fig. 3-2: Location of connectors and major components on the TOP side.. .......................................................... 19

Fig. 3-3: Location of connectors and major components on the BOTTOM side..................................................... 19

Fig. 3-4: StackPC (XP7) connector.......................................................................................................................... 22

Fig. 3-5: PCI-104 (XS4) connector’s contacts......................................................................................................... 25

Fig. 3-6: VGA CRT (XP1) connector........................................................................................................................ 25

Fig. 3-7: LVDS (XP8) connector............................................................................................................................... 26

Fig. 3-8: XP19 Audio connector............................................................................................................................... 27

Fig. 3-9: XP 20 Audio connector.............................................................................................................................. 27

Fig. 3-10: COM1/COM2 (XP3 и XP6) connectors.................................................................................................... 29

Fig. 3-11: USB1-USB2 (XP5) connector.................................................................................................................. 29

Fig. 3-12: CompactFlash XP12 connector............................................................................................................... 30

Fig. 3-13: PS/2 (XP15) connector............................................................................................................................ 32

Fig. 3-14: XP25 power supply connector................................................................................................................. 33

Fig. 3-15: Connector of XP24 digital I/O port……………......................................................................................... 34

Fig.3-16: Reset XP16 connector.............................................................................................................................. 35

Fig. 4-1: Heat removal methods ................................................................................................................................39

Fig. 5-1: Status of the PCI VIO Selector (XP13) Switch Contacts …...................................................................... 43

Fig. 5-2: TFT (XP2) Digital Panel Power Switch ..……………................................................................................. 44

Fig. 7-1: Screen during module loading (POST)…………….................................................................................... 49

Fig. 7-2: "Main" Tab Menu Screen…………............................................................................................................. 50

Fig. 7-3: “IDE Primary/Master” submenu screen ……………................................................................................... 51

Fig. 7-4: "Memory Cache" submenu screen………….............................................................................................. 52

Fig. 7-5: "Boot Features" submenu screen…………................................................................................................ 53

Fig. 7-6: Advanced tab menu screen……………........................................................................................................54

Fig. 7-7: "PnP Configuration" submenu screen…………......................................................................................... 55

Fig. 7-8: " Console Redirection " submenu screen………….................................................................................... 56

Fig. 7-9: "I/O Device Configuration" submenu screen……………............................................................................ 57

Fig. 7-10: "Intel" Tab Menu Screen…………............................................................................................................ 58

Fig. 7-11: "CPU Control Sub-Menu" submenu screen…………............................................................................... 59

Fig. 7-12: "Video (Intel IGD) Control Sub-Menu" submenu screen…………............................................................ 60

Fig. 7-13: “IGD – LCD Control Sub-Menu” submenu screen.................................................................................... 61

Fig. 7-14: "ICH Control SUB-Menu" submenu screen ….......................................................................................... 62

Fig. 7- 15: “PCI Express Control SUB-Menu” submenu screen ............................................................................... 63

Fig. 7-16: ICH USB Control Sub-Menu screen……………. ….................................................................................. 64

Fig. 7-17: Security tab menu screen……………........................................................................................................ 65

Fig. 7-18: "Boot" Tab Menu Screen ………..……........................................................................................................66

Fig. 7-19: "Custom" Tab Menu Screen………........................................................................................................... 67

Fig. 7-20: "Exit" Tab Menu Screen………................................................................................................................. 68

Fig. A-1: Heat-sink temperature dependency from the ambient temperature when using a radiator (ACS00035-01

kit)….……………………………………………………………………………………...................................................... 69

All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information
has been thoroughly checked and is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no
responsibility for inaccuracies, omissions or their consequences, as well as liability arising from the use or application of any product or example
described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further
notice. Software described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or
incidental damages originated by the use of this software.

This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to
translate the document or to convert it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its
officially authorized agents.

Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of
Xerox Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc. Intel is a trademark of Intel Corporation.
Pentium M and Celeron M are trademarks of Intel Corporation. Microsoft is a trademark of the Microsoft corporation. In addition, this document may
include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their respective owners.

Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.

CPC309 Intel Atom D510-based SBC Specification

Trademarks

"Fastwel" logotype is a trademark belonging to Fastwel Group Co. Ltd., Moscow, Russian

Federation.

Besides, this document may contain names, corporate logotypes and trademarks being
registered trademarks; consequently, property rights to them belong to their respective
legitimate owners.

Ownership Rights

This document contains information being the property of Fastwel Group Co. Ltd. It can neither
be copied nor transferred with the utilization of known media nor be stored in data storage and
search systems without the prior written authorization of Fastwel Group Co. Ltd. To our best
knowledge, the data in this document does not contain errors. However, Fastwel Group Co. Ltd
cannot take responsibility for any inaccuracies and their consequences, as well as responsibility
arising as a result of utilization or application of any diagram, product or example cited in this
document. Fastwel Group Co. Ltd reserves the right to alter and update both this document and

the product presented therein at its own discretion without additional notification.

Copyright

This document cannot be copied, reproduced, transferred or converted to any electronic or
machine-readable form without prior written permission of Fastwel Co. Ltd

CPC309 Intel Atom D510-based SBC Specification

TRANSPORTATION, UNPACKING AND STORAGE

Transportation

The device should be transported in original manufacturer’s separate packaging
(transport packaging), which contains an individual antistatic bag and a cardboard box, in the
closed transport (automobile, railway, air transportation in heated and pressurized
compartments) in storage conditions 5 defined in the IEC 721-2-1 standard (GOST standard

15150-69) or in storage conditions 3 during sea transportation.

The packaged modules should be transported in accordance with the shipping rules,
specified for this particular type of transport.

During handling and transportation operations, the packaged modules should not
undergo sharp pounding, falls, shocks and exposure to atmospheric precipitation. The goods
should be stored in a carrier vehicle in such a manner which will prevent their moving.

Unpacking

Prior to unpacking, after transportation at subzero temperature of ambient air the
module(s) should be kept within 6 hours under storage conditions 1 defined in the IEC 721-2-1
standard (GOST standard 15150-69).

It is prohibited to place the packaged module close to the heat source, prior to
unpacking.

Retain all original packaging at least until the warranty period is over. You may need it for
shipments or for storage of the product.

After unpacking the product, you should inspect it for visible damage that could have occurred
during shipping or unpacking. If damage is observed (usually in the form of bent component leads or
loose socketed components), contact Fastwel's official distributor from which you have purchased the
product for additional instructions.

Storage

Module storage conditions for group 1 are defined in the IEC 721-2-1 standard (GOST standard

15150-69).

CPC309 Intel Atom D510-based SBC Specification

MANUFACTURER’S WARRANTY

Warranty Liabilities

The Manufacturer hereby guarantees the product conformity with the requirements of the 4013-

025-72782511-09 technical conditions provided that the Consumer complies with the operating,

storage, transportation and installation conditions and procedures, specified by the
accompanying documents.
The Manufacturer hereby guarantees that the products supplied thereby are free from defects in
workmanship and materials, provided operation and maintenance norms were observed during
the currently established warranty period. The Manufacturer's obligation under this warranty is
to repair or replace free of charge any defective electronic component being a part of a returned
product.
Products that broke down through the Manufacturer's fault during the warranty period will be
repaired free of charge. Otherwise the Consumer will be invoiced as per the current labor
remuneration rates and expendable materials cost

Liability Limitation Right

The Manufacturer shall not be liable for the damage inflicted to the Consumer's property
because of the product breakdown in the process of its utilization.

Warranty Period

The warranty period for the products made by Fastwel Group is 24 months since the sale date
(unless otherwise provided by the supply contract).
The warranty period for the custom-made products is 36 months since the sale date (unless
otherwise provided by the supply contract.

Limitation of warranty liabilities

The above warranty liabilities shall not be applied:
To the products (including software), which were repaired or were amended by the employees,
that do not represent the manufacturer. Exceptions are the cases where the customer has
made repairs or made amendments to the devices in the strict compliance with instructions,
preliminary agreed and approved by the manufacturer in writing;
To the products, broken down due to unacceptable polarity reversal (to the opposite sign) of the
power supply, improper operation, transportation, storage, installation, mounting or accident.

Returning a product for repair

1. Apply to Fastwel company or to any of the Fastwel's official representatives for the Product
Return Authorization.

2. Attach a failure inspection report with a product to be returned in the form, accepted by the
Manufacturer, with a description of the failure circumstances and symptoms.

3. Place the product in the consumer packaging (antistatic bag) and cardboard box, in which the
product had been supplied. Failure to package in antistatic material will VOID all warranties of
the Customer on a unilateral basis.

4. The customer pays for shipping the product to Fastwel or to an official Fastwel representative or

dealer

CPC309 Intel Atom D510-based SBC Specification

1. Introduction

1.1. Purpose

This User Manual (hereinafter referred to as the “Manual”) contains essential information on the
device and its operation principle, which is required for commissioning, intended use and
maintenance of CPС309 CPU Module (hereinafter referred to as the “Module”).

Note: This document represents the current version of 0.1 version of the Manual1).

The Module is a single-board computer of StackPC-PCI format and is designed for embedded
applications requiring high performance and low power consumption.
The Module contains Compact Flash connector, 2x Ethernet channels, 8x USB ports, 2x Serial ATA
ports, 2 x serial ports, 1x NAND Flash drive.

Module’s functionalities can be extended by connecting additional modules in StackPC, StackPC-PCI,
PCI-104, PCIe/104, PCI/104-Express formats.
The module is supplied with pre-installed operating system (hereinafter referred to as the “OS”)
FreeDOS

2

) and is compatible with the following OS: QNX 6.5, Windows XP (embedded), Linux 2.6.

The Manual contains instructions on proper and safe installation, start-up and configuration of the
module, connection and interaction with extension modules or external devices.
The Manual also provides solutions to problems related to start-up, debugging and use of basic and utility
software (hereinafter referred to as the Software).

For safe and correct use of the Module within the specified service life, it is required to previously read
and understand this Manual.

Warning: Non-compliance with the safety requirements, application notes and operation guidelines, is
prohibited!

3

)

Attention: Module contains components are sensitive to electrostatic discharge! 4)

Forbidden: Persons lacking adequate qualification and the required level of proficiency training CAN NOT

operate, maintain and repair the modules! 5

_________________________________________________________________________________________

1) This graphics symbol (sign) will be used together with an explanatory word “Note” and text.

2) If the preinstalled operating system option is not ordered, please see Table 1-1 below.

3) The graphics symbol (safety sign according to the ISO 3864:1984) is used along with the warning word “WARNING” and
warning text (according to the GOST 2.601-2006).

4) The graphics symbol (safety sign according to the ISO 3461-88, ISO 3864-84) will be used here along with the WARNING
word and warning text (according to the GOST 2.601-2006).

5) The graphics symbol (safety sign according to the ISO 3461-88, ISO 3864-84) will be used here along with the WARNING
word and warning text (according to the GOST 2.601-2006).

CPC309 Intel Atom D510-based SBC Specification

1.2 Versions, delivery checklist, ordering information

1.2.1 Versions, ordering information

Module’s versions and their part numbers (ordering information) are given in the table below:

Table. 1-1: Ordering information

Name

Условное обозначение

Ordering name

Note

CPC309 CPU Module

CPС309

CPC309-01

Intel Atom D510/2GB
DDR2 RAM/ 4GB NAND
Flash/ Compact Flash/
2xSATA/ Digital IO/ 2x
Ethernet/ 8x USB 2.0/ 2x
RS232/ 2x TTL UART/
VGA/ LVDS.

CPC309-xx\ LNX1)

Module’s option with
preinstalled Linux 2.6.

CPC309-xx\ WXPe

Module’s option with

preinstalled Windows XP
Embedded.

CPC309-xx\ yy\ Coated2)

Module’s option with

conformal coating

1) Where xx – use of the module (01).

2) Where yy –OS (LNX, XPE) optionally preinstalled.

Fig. 1-1: Template for ordering of CPC309 CPU Module

CPC309 Intel Atom D510-based SBC Specification

1.2.2 Delivery checklist

Delivery checklist for all module versions is specified in the table below::

Table 1-2: Delivery checklist

Ordering name

Description

CPС309-01

CPC309 CPU Module

ACS00023-04

Adaptor cable (DB9M – IDC10) for the XP3, XP6 (СОМ1, COM2)
connectors.

ACS00027-02

Adaptor cable (DB15F – IDC10) for connection of the VGA display to XP1
connector.

ACS00043

Adaptor cable for connection of the PS/2 keyboard and mouse to XP15
connector.

ACS00059

Power supply outlet with contacts, for XP25 power supply connector.

-

Jumper 2mm for XP9 and XP26 connectors (2 pcs).

- - -

Package

1.2.3 Additional accessories

Additional accessories for connection to the module are specified in the table below.

Table 1-3: Additional accessories

Ordering name

Description

ACS00031-01

ACS00031-01 Installation kit. The kit includes JST PHR-5 outlet and a set of
SPH-002T-P0.5S contacts for the XP19 (Audio) connector of the module.

ACS00031-02

ACS00031-02 Installation kit. The kit includes JST PHR-6 outlet and a set of
SPH-002T-P0.5S contacts for XP15 (KB/Mouse) connector of the module.

ACS00031-03

ACS00031-03 Installation kit. The kit includes JST PHR-2 outlet and a set of
SPH-002T-P0.5S contacts for XP20 (Mic In) connector of the module.

ACS00037

ACS00037 Installation kit. The kit includes Hirose DF13-20DS-1.25C outlet
and a set of DF13-2630SCF contacts for the XP8 (LVDS) connector of the
module.

ACS00051

IDC2-10 cable – 2 x USBA for XP5 (USB) connector.

ACS00035-01

A set of heat-sink and mounting screws.

NOTE: ADDITIONAL ACCESSORIES FOR MODULE ARE NOT INCLUDED IN THE DELIVERY
CHECKLIST AND COME AS AN OPTION.

CPC309 Intel Atom D510-based SBC Specification

2 TECHNICAL SPECIFICATION

2.1 Functional Structure of the Module

The module includes the following basic functional elements:

▪ Intel Atom D510 CPU:
– Two 32-x/64-x bit x86 core,

– SSE2, SSE3, SSSE3 support,
– Hyperthreading support,
– 64-bit memory bus,
– Level I cache - 32 Kbytes programs area, 24 Kbytes data area),
– Level II cache - 1 MB;
– Intel SpeedStep technology support (for N450);

▪ DDR2 SDRAM 667 MHz random access memory (soldered) - 2 GB;
▪ Flash BIOS:

–16 Mbit,
– In-system modification possible;

▪ Two SATA storage interfaces: routed to Stack PC connector;
▪·NAND Flash storage (soldered and connected to the SATA interface) - 4 GB;
▪ CompactFlash connector:

– Type I / Type II devices support,
– UDMA mode support;

▪·Video controller:

– 2D/3D accelerator,
– video memory size (allocated from system memory) maximum 256 MB,
– Connectivity for LCD panels (LVDS 18-bit) with resolution not exceeding 1366 x 768 (60 Hz)

and VGA interface monitors with resolution not exceeding 2048 x 1536 (60 Hz),

▪ Two 10/100/1000 Mb Ethernet controllers;
▪ USB ports:

– Up to eight devices,
– USB 1.1 and USB 2.0 specifications support
– Support of OS loading from USB media;

▪ Serial ports:

– СОМ1, COM2: RS 232, 9-wire (full) console input/output enabled, maximum data exchange
rate of 115.2 Kbit/s,
▪ HD Audio controller;

– Linear stereo input/output,
– Microphone input;

▪ PS/2 keyboard and mouse port;
▪·Digital input/output port:

– 8 separately programmable input/output lines;

▪ Real time clock (RTC);
▪ CMOS+Serial FRAM (for system configuration storage);
▪·Two watchdog timers (WDTs):

– WDT1 - with a fixed timeout period - 1.6 s,
– WDT2 - with a programmable timeout period - from 1 to 255 minutes;

The module is software compatible with the following OS: FreeDOS, QNX 6.5, Windows XP
(embedded), Linux 2.6.

CPC309 Intel Atom D510-based SBC Specification

2.2 Module Power Supply

Electric power supply of the module must meet the requirements cited in the table below. The
module may be powered via the both power connector (XP25) and PC/104 bus connector. The
module's maximum current consumption value is 2.9 A without considering the connected
external devices.

Table 2-1: Required Power Source Parameters

Output voltage, V

Rated load current, A

Output buildup time to the +4.75
V level, ms

From +4.75 to +5.25

6

No more than 10

2.3 Operating Conditions

The module should be used under the following operating conditions:

– Operating temperature range – from -40 to + 85 °С1),
– The modules are resistant to ambient temperature changes within the specified temperature

range, at the relative humidity up to 85%, without moisture condensation.

FORBIDDEN: TO USE THE MODULE AT AMBIENT TEMPERATURES EXCEEDING
70°С WITHOUT ACS00035-01 ACCESSORY OR ANOTHER HEAT REMOVAL DEVICE
(SHOULD BE MADE IN ACCORDANCE WITH THE SECTION A) ATTACHED TO THE HEAT­SPREADING PLATA (ANOTHER RADIATOR, DEVICE ECNLOSURE, ETC.).

1) Value of the upper temperature limit (+ 85°С) is valid when using the module with ACS00035-01 accessory, or
when using it as a part of the enclosure device with heat-removal from the heat-removal plate to the device’s
enclosure.

CPC309 Intel Atom D510-based SBC Specification

2.4 Mechanical Characteristics

The module has the following mechanical characteristics:

– Vibration resistance, acceleration amplitude - 5g max.
– Single shock resistance, peak acceleration - 100 g max.
– Multiple shock resistance, peak acceleration - 50 g max.

2.5 Weight and Size Characteristics

The weight and sizes values for various hardware versions of the module are shown in the table
below:

Table 2-2: Module Weight and Sizes

Module

Weight, kg, max.

Packaged weight,
in kg

Overall
dimensions, mm,
max.

Overall
dimensions, box,
mm.

CPC309

0,26 ¹)

-

96,5 x 96,0 x 29,0

230x155x45

¹) Without consideration of the weight of Compact Flash device

The general sizes and interface dimensions of the module are shown on figures below.

Fig. 2-1: Sizes and interface dimensions of the module (top view)

CPC309 Intel Atom D510-based SBC Specification

Fig. 2-2: Module overall dimensions (side view)

NOTE:

THE OVERALL DIMENSIONS ARE SHOWN IN VIEW OF THE PARTS PROTRUDING OVER
THE STACK PC BOARD.

2.6 Mean Time Between Failures (MTBF)

The MTBF value for the module is 175 000 h.

NOTE:
THIS MTBF VALUE HAS BEEN CALCULATED ACCORDING TO THE TELCORDIA ISSUE 1
CALCULATION MODEL, METHOD I CASE 3 CALCULATION PROCEDURE, FOR
CONTINUOUS OPERATION ON EARTH UNDER THE CONDITIONS MEETING UKHL4
UNDER GOST 15150-69, AT THE AMBIENT TEMPERATURE OF + 30 °С.

CPC309 Intel Atom D510-based SBC Specification

3 MODULE STRUCTURE AND FUNCTIONING

3.1 Block Diagram of the Module

Block diagram of the module is shown below:

Fig. 3-1: Block diagram of the module

Block diagram of the module shows principal functional parts:

- Intel Atom D510 CPU;

-

- DDR2 SDRAM (2GB)

-

- Flash BIOS (16 Mb);

CPC309 Intel Atom D510-based SBC Specification

– NAND Flash data storage (4 GB);
– VGA monitor port (XP1);
– LVDS interface connector for TFT panel connecting (XP8);
– 2x SATA channels (XP7);
– Compact Flash connector (XP12);
– Two 10/100/1000 Mb Ethernet channels (XP7);
– 8x USB 2.0 ports (XP4 and XP5);
– СОМ1 (RS232) (XP3), COM2 (RS 232) (XP6) serial ports;
– PS/2 keyboard and mouse port (XP15);
– Digital input/output port (XP24);
– HD sound controller with linear input/output and microphone connectors (XP19 and XP20);
– 32x bit, 33 MHz PCI bus(XS4);

– 4x channels of PCI Express X1 interface (XS7);

- Serial FRAM (for system configuration storage);

– 2x watchdog timers (WDTs).
Technical features of the module's principal functional parts are described in the Manual

2.1 subsection.

3.2 Location of Module’s Principal Components

The layout of the principal components, their respective connectors, as well as commutator bars
for the component side (TOP) and the conductor side (BOTTOM) is shown on Fig. 3-2 and Fig.
3-3. accordingly.

The default positions of jumpers in the module commutator bars are also shown on Fig. 3-2, and
jumpers installation into the module’s commutator bars by functions are shown in Section 5
CPC309 Configuration.

CPC309 Intel Atom D510-based SBC Specification

Fig. 3-2: Location of connectors and principal components on the top side

Fig. 3-3: Location of connectors and principal components on the bottom side

CPC309 Intel Atom D510-based SBC Specification

3.3 Features of functional parts

- Intel Atom D510

32-bit Intel Atom CPU with low power consumption (~10 W). The CPU represents a highly­integrated solution that combines the CPU core itself, as well as SDRAM/DDR2 controller and
graphics card with 3D/2D acceleration.

- ICH-8M

High-Integrity interface controller, including standard periphery of IBM PC AT platform.

- MEMORY

The board is equipped with the soldered 2GB DDR2-667 RAM, not extendable.

- BIOS

BIOS uses Flash 16 Mb microchip based on SPI bus.

- RTC, CMOS

Real Time Clock integrated into ICH8. When power is off, RTC operation is provided by lithium
battery, which is to be installed into the board. BIOS Setup settings are stored in FRAM.

- FRAM

Nonvolatile memory 64 Kb, may be used for storing user data and BIOS SETUP settings.

- NAND Flash

The board is equipped with the soldered NAND Flash microchips with a total volume of 4 GB.
Placement of NAND Flash on SATA bus (SATA Flash Disk Controller is used) enables to
increase operation speed and ensure compatibility with various OS. 2-channel NAND Flash
operating mode.

- Compact Flash

The board makes it possible to use Compact Flash drive (type I / type II), for this purpose, the
board has a relevant connector on the reverse side.

- Ethernet

2x PCIe Ethernet 10/100/1000 Mb controllers based on Intel i82574 microchip are used, the
both channels are routed to the StackPC connector.

- USB 2.0

The board has 8x USB 2.0 channels: 2 channels are routed to IDC10 type connector with a
pitch of 2 mm contact, 6 – to the StackPC connector.

- COM1/COM2

COM1/COM2 – 9- wire interface RS232. Each port is routed to IDC10 type connector with a
contact pitch of 2 mm on the board.

- PS/2 Keyboard & Mouse

Designed for connection of PS/2 keyboard and mouse to the display, single-row direct 6-contact
connector – 2mm pitch.

- SATA

Two interfaces for connection of SATA drives: the both channels are routed to the StackPC
connector.

- VGA, LVDS

The ports are designed for the connection of VGA analog display and/or matrix with LVDS
interface. 2-diplays configurations support is provided: clone/extended desktop.

CPC309 Intel Atom D510-based SBC Specification

- Audio

Support is implemented via Audio Codec HD Audio. The board is equipped with connectors,
which have: line input signals, line output signals (5 contact connector with a pitch of 2mm), as
well as microphone input (2-contact connector with a pitch of 2 mm).

- Indication

The board has a LED indicating module operating mode (module is switched on, StackPC
error).
External LEDs can be connected via StackPC connector on the board, according to the
specification.
Using StackPC extension module it is possible to connect the following LEDs: drive activities
(CF_SATA_ACT), indication of connection and activity of LAN1 and LAN2 ports
(LAN1_LINK_ACT, LAN2_LINK_ACT).

- Watchdog

The module has two watchdog timers, one (WDT1) is integrated into supervisor’s microchip and

has a fixed actuating range (1.6 sec), another one – into SIO microchip and has a
programmable actuating range (up to 255 min).

- Power reset and monitoring

Microprocessor reset signal is generated from the following sources:

- from supervisor, at startup;

- from system reset connector;

- from watchdog timers.

- Switches (jumpers)

- The board is equipped with the switches having the following functionalities:

- Switch “LVDS Panel Power Selector” (XP2);

- Switch “PCI VIO Selector” (XP13);

- Switch CMOS Reset (XP9);

- Switch BIOS Select (XP26).

3.4 Interfaces and module connector

3.4.1 StackPC-PCI connectors

The module is equipped with the installed standard connectors in StackPC-PCI format, which enable
connection of CPC309 to such devices as analog-to-digital converters, digital I/O modules etc. According
to the StackPC specification (for a detailed description, please visit the website at:

http://www.stackpc.org/), the module of such a forma includes StackPC and PCI-104 connectors,

described below.

3.4.1.1 StackPC interface

Availability of StackPC makes it possible to connect CPC309 with additional extension modules
(interfaces: 4x1 PCI-E, 6xUSB, 2xSATA, 2xEthernet, SMBUS, SPI, LPC).
Location of StackPC connector contacts is shown on Fig. 3-4. Purpose of the connector contacts is
specified in Table. 3-1.

Fig. 3-4: StackPC connector (XP7)