Fastwel CPC307 User Manual

CPC307

PC/104-Plus
Vortex86DX Based
CPU Module

User Manual

Rev. 004 E
April 2014

Product Title: CPC307
Document name: CPC307 User Manual
Manual version: 003 E
Ref. doc. v.: 3.2 R (467444 038)

Copyright © 2014 Fastwel Co. Ltd. All rights reserved.

Revision Record

Rev. Index

Brief Description of Changes

Board Index

Date of Issue

001

Initial preliminary version

CPC307 v 2.0

July 2010

002

BIOS Setup description added.

CPC307 v 2.0

August 2010

003

Multiple changes caused by changes in the PCB design

CPC307 v 3.1

December 2012

Contact Information

Fastwel Co. Ltd

Fastwel Corporation US

Address:

108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation

45 Main Street, Suite 319
Brooklyn, New York 11201
USA

Tel.:

[phone]

[phone]

Fax:

[phone]

[phone]

Toll free:

[phone] (1-877-RURUGGED)

E-mail:

[e-mail]

Web:

http://www.fastwel.com/

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Table of Contents

Table of Contents ..................................................................................................................................................... 1

List of Tables ............................................................................................................................................................ 3

List of Figures .......................................................................................................................................................... 4

Notation Conventions ............................................................................................................................................... 5

General Safety Precautions ..................................................................................................................................... 6

Unpacking, Inspection and Handling ........................................................................................................................ 7

Three Year Warranty ............................................................................................................................................... 8

1 Introduction ............................................................................................................................................ 9

1.1 Module Introduction ...................................................................................................................................... 9

1.2 CPC307 Versions ....................................................................................................................................... 10

1.3 Delivery Checklist ....................................................................................................................................... 11

1.4 Additional Accessories ................................................................................................................................ 11

2 Technical Specifications .................................................................................................................... 13

2.1 General ....................................................................................................................................................... 13

2.2 Power Requirements .................................................................................................................................. 15

2.3 Environmental ............................................................................................................................................. 15

2.4 Mechanical.................................................................................................................................................. 15

2.5 Dimensions and Weight .............................................................................................................................. 16

2.6 MTBF .......................................................................................................................................................... 16

3 Functional Description ....................................................................................................................... 17

3.1 Structure and Layout .................................................................................................................................. 17

3.2 Functional Description ................................................................................................................................ 21

3.2.1 Vortex86DX SoC ....................................................................................................................... 21

3.2.2 SDRAM Memory ........................................................................................................................ 22

3.2.3 IDE Interface .............................................................................................................................. 22

3.2.4 MicroSD ..................................................................................................................................... 23

3.2.5 ATA Flash Disk .......................................................................................................................... 23

3.2.6 PS/2 Keyboard and Mouse Interface ......................................................................................... 24

3.2.7 Optoisolated Reset/IRQ Input .................................................................................................... 24

3.2.8 USB Interface ............................................................................................................................ 26

3.2.9 Fast Ethernet Interface .............................................................................................................. 27

3.2.10 Serial Ports ................................................................................................................................ 27

3.2.10.1 COM1 and COM2 ..................................................................................................... 27

3.2.10.2 COM3 and COM4 ..................................................................................................... 31

3.2.10.3 COM5 and COM6 ..................................................................................................... 31

3.2.11 Parallel Printer Port (LPT) .......................................................................................................... 33

3.2.12 Expansion Buses: ISA and PCI ................................................................................................. 34

3.2.12.1 PCI Header ............................................................................................................... 34

3.2.12.2 ISA Header ............................................................................................................... 36

3.2.13 Redundancy ............................................................................................................................... 38

3.2.14 CAN Ports .................................................................................................................................. 39

3.2.15 Watchdog Timers ....................................................................................................................... 40

3.2.16 RTC, CMOS, Serial FRAM and Reserved BIOS ........................................................................ 40

3.2.16.1 Reserved BIOS ......................................................................................................... 40

3.2.16.2 RTC, CMOS and Battery .......................................................................................... 41

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3.2.16.3 FRAM ........................................................................................................................ 41

3.2.16.4 BIOS Upgrade........................................................................................................... 41

3.2.17 Power Supply ............................................................................................................................. 41

3.2.18 Power Supply Supervisor ........................................................................................................... 42

3.2.19 GPIO Ports ................................................................................................................................ 43

3.2.20 Configuration Jumpers ............................................................................................................... 43

3.2.21 Diagnostic LEDs ........................................................................................................................ 43

3.2.22 Reset Button .............................................................................................................................. 44

3.3 Address Mapping ........................................................................................................................................ 44

3.3.1 Memory Addressing ................................................................................................................... 44

3.3.2 I/O Addressing ........................................................................................................................... 44

3.3.3 Integrated Address Decoder ...................................................................................................... 46

3.3.3.1 CAN Ports Addresses ............................................................................................... 46

3.3.3.2 COM5 and COM6 Ports Addresses .......................................................................... 46

3.3.4 Interrupt Settings ....................................................................................................................... 47

3.3.5 DMA Channels ........................................................................................................................... 48

3.4 Overall and Mounting Dimensions .............................................................................................................. 49

4 External Connections ......................................................................................................................... 50

4.1 Safety Regulations ...................................................................................................................................... 50

4.2 Connection of Peripheral Devices ............................................................................................................... 51

4.3 Software Installation ................................................................................................................................... 51

5 AMI BIOS .............................................................................................................................................. 52

5.1 BIOS Setup Program. Introduction ............................................................................................................. 52

5.2 Main Menu .................................................................................................................................................. 52

5.3 Advanced .................................................................................................................................................... 54

5.3.1 CPU Configuration ..................................................................................................................... 55

5.3.2 IDE Configuration ...................................................................................................................... 56

5.3.3 Remote Access Configuration ................................................................................................... 58

5.3.4 USB Configuration ..................................................................................................................... 60

5.4 PCI Plug and Play ....................................................................................................................................... 61

5.5 Boot Options ............................................................................................................................................... 63

5.5.1 Boot Settings Configuration ....................................................................................................... 64

5.6 Security Options ......................................................................................................................................... 65

5.7 Chipset Menu.............................................................................................................................................. 66

5.7.1 North Bridge Configuration ........................................................................................................ 67

5.7.2 South Bridge Configuration ........................................................................................................ 68

5.8 Exit Menu .................................................................................................................................................... 69

5.9 Functional Constraints of BIOS Versions .................................................................................................... 70

ANNEX A: BIOS Update…………….……………………………………………………………………………………...71

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List of Tables

Table 1.1: CPC307 Versions ............................................................................................................................ 10

Table 1.2: CPC307 Supplied Set...................................................................................................................... 11

Table 1.3: CPC307 Additional Accessories ...................................................................................................... 11

Table 2.1: Power Supply Requirements ................................................................ ................................ ........... 15

Table 3.1: IDE Channel: Devices Connection Variants .................................................................................... 22

Table 3.2: XP13 Connector Pinout (IDE) .......................................................................................................... 22

Table 3.3: XS3 and XS4 MicroSD Sockets Pinout ........................................................................................... 23

Table 3.4: XP23 Contacts Designation ............................................................................................................. 24

Table 3.5: XP12 Connector Pinout (USB) ........................................................................................................ 26

Table 3.6: XP9 Ethernet Header Pinout ........................................................................................................... 27

Table 3.7: XP18 Pinpad Jumpers ..................................................................................................................... 28

Table 3.8: XP10 and XP16 Pin Assignments ................................................................................................... 29

Table 3.9: XP6 and XP7 Pin Assignments ....................................................................................................... 31

Table 3.10: COM5 and COM6 Controllers Resources ....................................................................................... 31

Table 3.11: XP15 and XP20 Pinpads Jumpers .................................................................................................. 32

Table 3.12: XP17 Pin Assignments (COM5 and COM6) .................................................................................... 33

Table 3.13: XP12 (LPT) Connector Pinout ......................................................................................................... 33

Table 3.14: XS1 Connector Contacts Designation (Rows A, B) ......................................................................... 34

Table 3.15: XS1 Connector Contacts Designation (Rows C, D) ......................................................................... 35

Table 3.16: ISA XS2 Connector (Rows A and B) Contacts Designation ............................................................ 36

Table 3.17: ISA XS2 (Rows C and D) Contacts Designation ............................................................................. 37

Table 3.18: XP11 Pinout (CPC307-01) .............................................................................................................. 39

Table 3.19: CAN Controllers Addresses ............................................................................................................. 39

Table 3.20: XP4 and XP8 Pinpads Jumpers ...................................................................................................... 39

Table 3.21: XP5 Connector Pinout (CAN) .......................................................................................................... 40

Table 3.22: XP22 Power Connector Pinout ........................................................................................................ 42

Table 3.23: CPC307 Diagnostic LEDs Function ................................................................................................. 43

Table 3.24: XP3 Contacts Function .................................................................................................................... 43

Table 3.25: Memory Address Mapping ............................................................................................................... 44

Table 3.26: I/O Address Space .......................................................................................................................... 44

Table 3.27: Interrupt Settings ............................................................................................................................. 47

Table 3.28: DMA Channels ................................................................................................................................ 48

Table 5.1: Main Menu Items ............................................................................................................................. 53

Table 5.2: Advanced Menu Items ..................................................................................................................... 54

Table 5.3: CPU Configuration Menu Items ....................................................................................................... 55

Table 5.4: IDE Configuration Menu Items ........................................................................................................ 56

Table 5.5: Primary IDE Master Menu Items ..................................................................................................... 57

Table 5.6: Remote Access Configuration Menu Items ..................................................................................... 59

Table 5.7: Name ............................................................................................................................................... 60

Table 5.8: PCI Plug and Play Menu Items ........................................................................................................ 61

Table 5.9: Boot Menu Items ............................................................................................................................. 63

Table 5.10: Boot Settings Configuration Menu Items ......................................................................................... 64

Table 5.11: Security Menu Items ........................................................................................................................ 65

Table 5.12: Chipset Menu Items......................................................................................................................... 66

Table 5.13: North Bridge Configuration Menu Items .......................................................................................... 67

Table 5.14: South Bridge Configuration Menu Items .......................................................................................... 68

Table 5.15: Exit Menu Items ............................................................................................................................... 69

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List of Figures

Figure 3.1: CPC307 Block Diagram ................................................................................................................... 17

Figure 3.2: Top Side: Connectors and Main Components Layout ..................................................................... 19

Figure 3.3: Bottom Side: Connectors and Main Components Layout (CPC30704) ........................................... 20

Figure 3.4: Vortex86DX SoC Block Diagram ..................................................................................................... 21

Figure 3.5: XP13 IDC44 Pins Numbering .......................................................................................................... 22

Figure 3.6: MicroSD Cards Contacts Numbering............................................................................................... 23

Figure 3.7: XP23 Connector Contacts Numbering............................................................................................. 24

Figure 3.8: XP19 Connector .............................................................................................................................. 24

Figure 3.9: Discrete Input Optoisolation and Reset or IRQ Source Selection .................................................... 24

Figure 3.10: XP12Connector ............................................................................................................................... 26

Figure 3.11: XP9 Connector ................................................................................................................................ 27

Figure 3.12: IDC10 Pins Numbering .................................................................................................................... 27

Figure 3.13: XP18 Pinpad ................................................................................................................................... 28

Figure 3.14: RS485/422 Transmitter with Bias Elements and Terminating Resistors.......................................... 29

Figure 3.15: Connection of Several Devices in RS422 Mode .............................................................................. 30

Figure 3.16: Connection of Several Devices in RS485 Mode .............................................................................. 30

Figure 3.17: XP15 and XP20 Pinpads ................................................................................................................. 32

Figure 3.18: Transmitter with Protective Bias Elements and Terminating Resistors............................................ 32

Figure 3.19: XP12 Connector .............................................................................................................................. 33

Figure 3.20: XS1 Connector Contacts Layout ..................................................................................................... 34

Figure 3.21: ISA Header Contacts Layout ................................................................................................ ........... 36

Figure 3.22: Redundancy Pinpads Connection ................................................................................................... 38

Figure 3.23: XP11 Pinpad ................................................................................................................................... 38

Figure 3.24: XP4 and XP8 Pinpads ..................................................................................................................... 39

Figure 3.25: XP5 Pins Numbering (CAN) ............................................................................................................ 39

Figure 3.26: XP22 Power Supply Connector ....................................................................................................... 41

Figure 3.27: Power Supply Supervisor Diagram .................................................................................................. 42

Figure 3.28: External LEDs Connection (XP3) .................................................................................................... 44

Figure 3.29: CPC307: Overall and Mounting Dimensions ................................................................................... 49

Figure 4.1: External Devices Connection .......................................................................................................... 51

Figure 5.1: Main Menu Screen Image ............................................................................................................... 53

Figure 5.2: Advanced Screen Image ................................................................................................................. 54

Figure 5.3: CPU Configuration Menu Screen .................................................................................................... 55

Figure 5.4: IDE Configuration Menu Screen ...................................................................................................... 56

Figure 5.5: Primary IDE Master Menu Screen ................................................................................................... 57

Figure 5.6: Remote Access Configuration Menu Screen ................................................................................... 58

Figure 5.7: USB Configuration Menu Screen .................................................................................................... 60

Figure 5.8: PCI Plug and Play Menu Screen ..................................................................................................... 61

Figure 5.9: Boot Menu Screen ........................................................................................................................... 63

Figure 5.10: Boot Settings Configuration Menu Screen ....................................................................................... 64

Figure 5.11: Security Menu Screen ..................................................................................................................... 65

Figure 5.12: Chipset Menu Screen Image ................................................................................................ ........... 66

Figure 5.13: North Bridge Configuration Menu Screen ........................................................................................ 67

Figure 5.14: South Bridge Configuration Menu Screen ....................................................................................... 68

Figure 5.15: Exit Menu Screen Image ................................................................................................................. 69

All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly checked and
is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies, omissions or their
consequences, as well as liability arising from the use or application of any product or example described in this document.

Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice. Software
described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages originated by the use of
this software.

This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the document or to convert
it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially authorized agents.

Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of Xerox Corporation. IEEE is a
registered trademark of the Institute of Electrical and Electronics Engineers Inc. Intel is a trademark of Intel Corporation. Microsoft is a trademark of the Microsoft
corporation. In addition, this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their
respective owners.

Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.

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Notation Conventions

Warning, ESD Sensitive Device!

This symbol draws your attention to the information related to electro static sensitivity of your
product and its components. To keep product safety and operability it is necessary to handle
it with care and follow the ESD safety directions.

Warning!

This sign marks warnings about hot surfaces. The surface of the heatsink and some
components can get very hot during operation. Take due care when handling, avoid
touching hot surfaces!

Caution: Electric Shock!

This symbol warns about danger of electrical shock (> 60 V) when touching products or
parts of them. Failure to observe the indicated precautions and directions may expose your
life to danger and may lead to damage to your product.

Warning!

Information marked by this symbol is essential for human and equipment safety.
Read this information attentively, be watchful.

Note...

This symbol and title marks important information to be read attentively for your own benefit.

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General Safety Precautions

This product was developed for fault-free operation. Its design provides conformance to all related
safety requirements. However, the life of this product can be seriously shortened by improper
handling and incorrect operation. That is why it is necessary to follow general safety and
operational instructions below.

Warning!

All operations on this device must be carried out by sufficiently
skilled personnel only.

Warning!

When handling this product, special care must be taken not to hit
the heatsink (if installed) against another rigid object. Also, be
careful not to drop the product, since this may cause damage
to the heatsink, CPU or other sensitive components as well.

Please, keep in mind that any physical damage to this product
is not covered under warranty.

Note:

This product is guaranteed to operate within the published
temperature ranges and relevant conditions. However, prolonged
operation near the maximum temperature is not recommended by
Fastwel or by electronic chip manufacturers due to thermal stress
related failure mechanisms. These mechanisms are common to all
silicon devices, they can reduce the MTBF of the product by
increasing the failure probability. Prolonged operation at the lower
limits of the temperature ranges has no limitations.

Caution, Electric Shock!

Before installing this product into a system and before installing
other devices on it, always ensure that your mains power is switched
off.

Always disconnect external power supply cables during all handling
and maintenance operations with this module to avoid serious
danger of electrical shock.

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Unpacking, Inspection and Handling

Please read the manual carefully before unpacking the module or mounting the device into your
system. Keep in mind the following:

ESD Sensitive Device!

Electronic modules and their components are sensitive to static
electricity. Even a non-perceptible by human being static discharge
can be sufficient to destroy or degrade a component's operation!
Therefore, all handling operations and inspections of this product
must be performed with due care, in order to keep product integrity
and operability:

 Preferably, unpack or pack this product only at EOS/ESD safe workplaces. Otherwise, it is

important to be electrically discharged before touching the product. This can be done by
touching a metal part of your system case with your hand or tool. It is particularly important
to observe anti-static precautions when setting jumpers or replacing components.

 If the product contains batteries for RTC or memory back-up, ensure that the module is not

placed on conductive surfaces, including anti-static mats or sponges. This can cause short­circuit and result in damage to the battery and other components.

 Store this product in its protective packaging while it is not used for operational purposes.

Unpacking

The product is carefully packed in an antistatic bag and in a carton box to protect it against
possible damage and harmful influence during shipping. Unpack the product indoors only at a

temperature not less than +15°C and relative humidity not more than 70%. Please note, that if the

product was exposed to the temperatures below 0°С for a long time, it is necessary to keep it at

normal conditions for at least 24 hours before unpacking. Do not keep the product close to a heat
source.

Following ESD precautions, carefully take the product out of the shipping carton box. Proper
handling of the product is critical to ensure correct operation and long-term reliability. When
unpacking the product, and whenever handling it thereafter, be sure to hold the module preferably
by the front panel, card edges or ejector handles. Avoid touching the components and connectors.

Retain all original packaging at least until the warranty period is over. You may need it for
shipments or for storage of the product.

Initial Inspection

Although the product is carefully packaged, it is still possible that shipping damages may occur.
Careful inspection of the shipping carton can reveal evidence of damage or rough handling. Should
you notice that the package is damaged, please notify the shipping service and the manufacturer
as soon as possible. Retain the damaged packing material for inspection.

After unpacking the product, you should inspect it for visible damage that could have occurred
during shipping or unpacking. If damage is observed (usually in the form of bent component leads
or loose socketed components), contact Fastwel's official distributor from which you have
purchased the product for additional instructions. Depending on the severity of the damage, the
product may even need to be returned to the factory for repair. DO NOT apply power to the product
if it has visible damage. Doing so may cause further, possibly irreparable damage, as well as result
in a fire or electric shock hazard.

If the product contains socketed components, they should be inspected to make sure they are
seated fully in their sockets.

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Handling

In performing all necessary installation and application operations, please follow only the
instructions supplied by the present manual.

In order to keep Fastwel’s warranty, you must not change or modify this product in any way, other

than specifically approved by Fastwel or described in this manual.
Technical characteristics of the systems in which this product is installed, such as operating

temperature ranges and power supply parameters, should conform to the requirements stated by
this document.

Retain all the original packaging, you will need it to pack the product for shipping in warranty cases
or for safe storage. Please, pack the product for transportation in the way it was packed by the
supplier.

When handling the product, please, remember that the module, its components and connectors
require delicate care. Always keep in mind the ESD sensitivity of the product.

Three Year Warranty

Fastwel Co. Ltd. (Fastwel), warrants that its standard hardware products will be free from defects
in materials and workmanship under normal use and service for the currently established warranty
period. Fastwel’s only responsibility under this warranty is, at its option, to replace or repair any
defective component part of such products free of charge.

Fastwel neither assumes nor authorizes any other liability in connection with the sale, installation
or use of its products. Fastwel shall have no liability for direct or consequential damages of any
kind arising out of sale, delay in delivery, installation, or use of its products.

If a product should fail through Fastwel's fault during the warranty period, it will be repaired free of
charge. For out of warranty repairs, the customer will be invoiced for repair charges at current
standard labor and materials rates.

Warranty period for Fastwel products is 36 months since the date of purchase.

The warranty set forth above does not extend to and shall not apply to:

1. Products, including software, which have been repaired or altered by other than
Fastwel personnel, unless Buyer has properly altered or repaired the products in
accordance with procedures previously approved in writing by Fastwel.

2. Products, which have been subject to power supply reversal, misuse, neglect,
accident, or improper installation.

Returning a product for repair

1. Apply to Fastwel company or to any of the Fastwel's official representatives for the
Product Return Authorization.

2. Attach a failure inspection report with a product to be returned in the form, accepted by
customer, with a description of the failure circumstances and symptoms.

3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then
package the product in a safe container for shipping.

4. The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

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1 Introduction

This document presents general information on CPC307 CPU module, the details of its proper and
safe installation, configuration and operation. The issues of PC/104 modules and external devices
connection are also considered. This document applies to the module version 3.1.

1.1 Module Introduction

Fastwel CPC307 is designed for applications requiring high-performance low-power industrial
controller with CAN interface. Fastwel СРС307 conforms to PC/104-Plus specification (except
CPC307-01) and is compatible with a large number of peripheral and power supply modules
delivered by a wide range of manufacturers.

Based on x86-compatible 32-bit Vortex86DX System-on-Chip (SoC) operating at 600 MHz, the
module bears 256 MB soldered DDR2 memory and wide range of input/output interfaces. CPC307
allows system designers simple programming and provides portability of previously developed
libraries for x86 architecture with DOS, Linux, Windows CE, and QNX support. Having two isolated
CAN ports onboard along with a wide set of popular industrial interfaces, such as RS232, RS485,
RS422, USB, and Fast Ethernet, CPC307 offers integrated functionality which is usually achieved
by using several products from different manufacturers.

The module is designed for operation at temperatures from -40C to +85C.
CPC307 is supplied with the preinstalled FDOS 6.22 operating system and supports

MS DOS 6.22, QNX 6.4, and Linux 2.6 operating systems.

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1.2 CPC307 Versions

At the present time the CPC307 module is manufactured in several versions differing in interface
capabilities.

Table 1.1: CPC307 Versions

Name

CPC307-01

CPC307-02

CPC307-03

CPC307-04

CPC307-05

Processor

Vortex86DX (600 MHz)

RAM

256 MB

Flash Disk

1 GB

1 GB

1 GB

–

1 GB

IDE + + + +

+

2xRS-232/485/422

+ + + + +

2xRS-232 + + + +

+

2xRS-422/485

+ + – + +

2xCAN + + – +

+

LPT + + + +

+

4xUSB 2.0 + + + +

+

PCI-104 Connector

– + + + +

LAN 10/100

– + + + +

8xGPIO – + + +

+

2xI2C – + + +

+

2xMicroSD – – – +

–

Coated – – – –

+

-50C…+90C

– – – – +

Other options:

\COATED – Protective coating option for CPC307-01, -02, -03, -04;
\WCE5 – Preinstalled Windows CE 5.0 for CPC307-01, -02, -03, -05;
\LNX – Preinstalled Linux for CPC307-01, -02, -03, -05;
*For QNX 6.4, BSP can be provided.

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1.3 Delivery Checklist

Table 1.2: CPC307 Supplied Set

Name

Description

CPC30701
CPC30702
CPC30703
CPC30704
CPC30705

CPC307 processor module

ACS00023

DB9F to IDC2-10 2 mm adapter cable for connection to COM port (685611.082)

–

Mounting standoffs kit

–

Jumpers set

–

Antistatic bag and consumer carton box

Note:

Keep the antistatic bag and the original package at least until the warranty period
is over. It can be used for future storage or warranty shipments.

1.4 Additional Accessories

Peripheral devices are attached to the module directly or via additional accessories and cables
listed in the following table. Additional accessories are not supplied with the CPU module, are
ordered separately.

Table 1.3: CPC307 Additional Accessories

Name

Description

CDM02

Adapter module for connection of 3.5" HDD or CD-ROM drive (469535.023)

ACS00010

FC44 cable for 2.5" HDD connection to 44-contact header

ACS00031-03
ACS0054

PHR-2 connector set. Includes JST PHR-2 socket and a set of contacts
SPH-002T-P0.5S or connector with 0.5 m wires.
Recommended counterpart connector for XP19 header (optoisolated Reset/IRQ)
of the module (467941.016-02)

ACS00038
ACS00038-01
ACS00038-02

Connector set for connection of a power supply unit to the module.
Includes AMP 4-171822-4 socket and a set of contacts 170262-1 (ACS00038) or
a connector with 1.0 m wires (ACS00038-01, -02).
Recommended counterpart connector for XP22 header (additional power
connector)

ACS00040-01

Leotronics 2040-3102 socket (IDC2-10 2 mm).
Recommended counterpart for XP5 (CAN), XP6 (COM3), XP7 (COM4), XP9
(LAN), XP10 (COM1), XP14 (GPIO), XP16 (COM2), XP17 (COM5,6) headers of
the module

ACS00048,
ACS00049,
ACS00049-02

Leotronics socket, 10 positions, 2 mm pitch and contacts set (ACS00049) or
contacts with 1 m wires (ACS00049-02)
Recommended counterpart for XP5 (CAN), XP6 (COM3), XP7 (COM4), XP9
(LAN), XP10 (COM1), XP14 (GPIO), XP16 (COM2), XP17 (COM5,6) headers of
the module

ACS00040-05

Leotronics IDC2-44 2 mm socket. Recommended counterpart for
XP12 (LPT, USB), XP13 (IDE) headers of the module

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Name

Description

ACS00048-04,
ACS00049,
ACS00049-02

Leotronics socket, 44 positions, 2 mm pitch and contacts set (ACS00049) or
contacts with 1 m wires (ACS00049-02). Recommended counterpart for XP12
(LPT, USB), XP13 (IDE) headers of the module

ACS00042

Null modem cable

ACS00043-01

PS/2 cable. Recommended counterpart for XP23 header of the module

ACS00051

Cable for connection of two standard USB devices to XP12 (LPT/USB) connector

Technical Specifications CPC307

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2 Technical Specifications

2.1 General

 Form-factor:

 PC/104-Plus

 CPU: Integrated in DM&P Vortex86DX SoC

 600 MHz
 32-bit x86 compatible core
 16-bit memory bus
 Math coprocessor
 32 KB L1, 256 KB L2 cache
 6-stage pipeline

 System memory:

 256 MB soldered DDR2 SDRAM
 DDR333

 IDE port:

 One IDE channel (Primary)
 For CPC307-04: support for up to two UltraDMA-100 IDE devices if the microSD

sockets are not populated

 For all other versions one IDE device can be connected

 Solid State Disk (except for CPC30704)

 Soldered
 1 GB NAND flash
 IDE interface
 Can be used as bootable device
 MS DOS-compatible Fastwel file system

 SD controller (for CPC30704 only):

 Up to two microSD cards (bottom side sockets)
 Up to 4 GB each card

 PS/2:

 PS/2 keyboard and mouse interface

 Remote Reset/IRQ:

 Discrete remote reset/interrupt input
 500V optoisolation

 USB:

 Four USB 2.0 channels
 One device can be connected to each channel

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 LAN:

 One Fast Ethernet port 10/100 Mbit/s (except for CPC30701)
 500 V isolation

 Serial ports:

 Six serial ports (four for CPC30703)
 High speed NS16C550 compatible
 COM1, COM2: RS232/422/485, complete, up to 115.2 Kbaud
 COM3, COM4: RS232, complete, up to 115.2 Kbaud
 COM5, COM6: RS422/485, up to 3.6 Mbaud, 500 V isolation

(except for CPC307-03)

 Console operation via COM1 ... COM4

 CAN:

 2xCAN 2.0b (except for CPC307-03)
 SJA1000T controller
 Up to 1 Mbit/s
 500 V isolation

 Parallel port:

 SPP/ECP/EPP compatible

 Expansion buses:

 PCI and ISA

 Redundancy support
 GPIO:

 8 discrete I/O lines

 I2C:

 2 ports, via GPIO port

 Three watchdog timers:

 One with fixed timeout period of 1.6 s
 Two integrated in Vortex86DX with programmable timeout period

 Flash BIOS:

 Main BIOS: 512 KB, soldered
 Reserve: 256 KB, integrated in the controller
 In-system modification
 Automatic switching

 RTC:

 On-board real time clock with Li battery backup

 Safety:

 System configuration settings stored in CMOS + Serial FRAM (256 Kb)
 Possibility of batteryless operation

 Software support:

 AMI BIOS
 Support for MS DOS 6.22, FreeDOS, Windows CE 5.0, Linux 2.6, QNX 6.4

operating systems

Technical Specifications CPC307

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2.2 Power Requirements

The module can be powered via PC/104-Plus connectors. Additionally, power can be supplied via
XP22 (4-contact AMP 4-171826-4) power connector by an external DC power source. Power
supply unit should provide starting current, which is 2.1 A for CPC307-02 version. It is allowed to
use power supply units with current limiting not less than 1.2 A. Selecting a power supply unit, the
starting current should be considered as well as the consumption current of expansion modules.

Consumption current typical valuation is 0.6 A.

Table 2.1: Power Supply Requirements

Connectors

Power Voltage

Voltage Limits

Consumption current

Starting current

PC/104 and PCI-104

+5 V

From +4.75V to +5.25V

1 A

1.5 A (0.5 ms)

XP22

+5 V

From +4.8V to +5.3V

1 A

1.5 A (0.5 ms)

Important:

Please, find important notes on power supply in subsection 3.2.17
of this document.

2.3 Environmental

 Operating temperature range: –40C to +85C (-50C to +90C for CPC30705)
 Storage temperature: –55C to +90C
 Relative humidity: up to 80% at 25°С, noncondensing

Note:

Protective coating of CPC307 versions makes them resistant to
damp heat cyclic exposure at temperatures up to +552C and
relative humidity of up to 933%.

2.4 Mechanical

 Vibration (5 ... 2000 Hz) – 10g;
 Single shock, peak acceleration – 150 g;
 Multiple shock, peak acceleration – 50 g.

If the module is operated in harsh environment, it is recommended to additionally fix counterpart
connectors and cables.

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2.5 Dimensions and Weight

 Dimensions, not more: 101.5 × 90.6 × 23.7 mm (4” × 3.57” × 0.93”)

(see also Overall and Mounting Dimensions for details)

 Weight:

Version

Net Weight, kg

Gross Weight, kg

CPC307-01

0.120

0.260

CPC307-02

0.125

0.265

CPC307-03

0.120

0.260

CPC307-04

0.125

0.265

CPC307-05

0.135

0.275

2.6 MTBF

 MTBF for CPC307 is 200000 hours.

The value is calculated according to: Telcordia Issue 1 model, Method I Case 3, for continuous operation
at a surface location, at normal environmental conditions and at ambient temperature 30С.

Functional Description CPC307

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3 Functional Description

3.1 Structure and Layout

Functional diagram of the CPC307 module is shown in Figure 3.1.

Figure 3.1: CPC307 Block Diagram

MicroSD

Socket

SJA1000

SJA1000

ADM213E

PC/104 Connector (ISA)

COM3

USB

1 GB

NAND Flash

Power

Connector

GLS

55LD040M

(ATA Flash

Disk)

Vortex86DX

(SoC)

IDE

(44 pin)

COM4

LPT

MAX3057

DC/DC

TSM0505S

ISA

MAX1486

MAX1486

IDE 1, 2

ADM213E

ADM213E

SPI

4x USB 2.0

Opto

Isolation

Opto

Reset/IRQ

LPT

ADM706T

Supervisory

Circuit

Watchdog

External
Interrupt

Reset#

FRAM

256 Kb

BIOS

EEPROM

256KB

DDRII

SDRAM

256 MB

MAX3057

ADuM

1201

CAN 1,2

DC/DC

TSM0505S

ADuM

1201

Reserved BIOS

(Soldered)

RS-232

RS-232

COM 1, 2

DC/DC

UART

16C752

ADuM

1201

ADuM

1201

MAX1486

MAX1486

PCI-104 Connector (PCI)

MicroSD

Sockets

Ethernet

Redundancy

Connector

8xGPIO/

2xI2C

2 User LEDs

2 Switches with

State Read Option

ADM213E

Isolated

500V

Isolated

500V

Isolated

500V

Isolated

500V

+1.0V
+1.8V
+3.3V

Power Good

DC/DC

TSM0505S

DC/DC

TSM0505S

COM 5,6

Addressing and

Control Logic

CR2032

Battery

Functional Description CPC307

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CPC307 includes the following main functional units:

 SoC Vortex86DX
 256 MB soldered DDR2 SDRAM system memory;
 IDE port with support for up to two UltraDMA/100 devices;
 SD controller (IDE, for CPC307-04 only);
 Onboard NAND flash-disk, 1 GB (IDE; except for CPC307-04);
 PS/2 keyboard/mouse port;
 Optoisolated (500V) remote Reset/interrupt input;
 Four USB 2.0 channels;
 Fast Ethernet port, 10/100 Mbit/s, 500V isolation (except for CPC307-01);
 Serial ports:

 COM1, COM2: RS232/422/485, up to 115.2 Kbaud, complete;
 COM3, СОМ4: RS232, up to 115.2 Kbaud, complete;
 COM5, COM6: RS422/485, up to 3.6 Mbaud, 500V isolation

(except for CPC307-03)

 Console operation via COM1 ... COM4

 CAN:

 Two CAN 2.0b ports (except for CPC307-03), SJA1000T controller;

Up to 1 Mbit/s; 500 V isolation

 Parallel port, SPP/ECP/EPP compatible
 PCI and ISA expansion buses
 Redundancy support
 GPIO: 8 discrete I/O lines
 I2C: 2 ports, via GPIO port
 Three watchdog timers:

 One with fixed timeout period of 1.6 s
 Two integrated in Vortex86DX with programmable timeout period

 Flash memory based reserved BIOS, in-system modification;
 Real time clock with Li battery backup;
 CMOS+SFRAM (32 KB) for BIOS configuration storage;

Layouts of main CPC307 components and connectors on top and bottom sides are presented in
Figures 3.2 and 3.3 respectively.

External connections are illustrated in Chapter 4.

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Figure 3.2: Top Side: Connectors and Main Components Layout

A1

B1

C1

D1

XP1 XP2 XP3 HL1 HL2

HL3 XP23 XP24 XP25 XP21 XP27

SW1

XP20

XP15

XP11

XP8

XP4

XP5

XP9

XP14

XP17

XS1

X1

XP18

XP16

XP10

XP13

XP7

XP6

XP12

XP19

XP22

1 1 1 1 1 1

1

1

1

1

11

11

1 1 1

1

1

1

1

1

1

1

1

1

Optional

Power

Connector

LPT,
USB

IDE

COM2

COM1

COM3 COM4

CAN 1,2

LAN

GPIO

COM 5,6

B1
A1

C0
D0

XS2

XP26

PS/2 ResetWatchdog

Control

The layout may slightly differ for various versions of the module.

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Figure 3.3: Bottom Side: Connectors and Main Components Layout (CPC30704)

XS3

XS4

SA1

1

2

ON

XS1

microSD 0

microSD 1

XS2

The layout may slightly differ for various versions of the board.

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3.2 Functional Description

3.2.1 Vortex86DX SoC

DM&P Vortex86DX includes the following main functional units:

 32-bit х86 compatible core operating at 600 MHz;
 32 KB L1, 256 KB L2 cache;
 Math coprocessor;
 16-bit DDR2 SDRAM memory bus;
 IDE/SD controller;
 Five RS-232 serial ports;
 Universal parallel port;
 Four USB 2.0 ports;
 PS/2 keyboard/mouse port;
 PCI, ISA, LPC, and SPI bus controllers;
 Two I2C interfaces;
 Built-in Ethernet 10/100 controller;
 RTC;
 CMOS memory for configuration storage;
 Integrated flash-memory for BIOS storage;
 Integrated redundancy system;
 Two programmable watchdog timers.

Figure 3.4: Vortex86DX SoC Block Diagram

FPU

Vortex86 CPU

16KB

DATA

Cache

16KB
CODE
Cache

SPI Flash BIOS

256KB

10/100Mbit LAN

USB 2.0

Primary IDE/

SD controller

Internal SPI BUS

DDR2 SDRAM Controller

GPIO

REDUNDANCY + COM9

WATCHDOG

COM 1,2 (RS-232/422 Mode)

LPC BUS

LPT

COM 3,4 (RS-232 Mode)

Vortex86DX CPU North Bridge South Bridge

PCI BUSIDE/SD BUS SPI BUS

DDR2 SDRAM BUSLAN LPT

LPC BUS

GPIO

COM 9
(Rx/Tx)

COM 1,2
(RS-232/422
Mode)

COM 3,4
(RS-232 Mode)

JTAG Debug Port 32.768KHz

RTC

Battery

Speaker

Vcore
Vio
Vmem

SoC

USB 2.0

External SPI

BUS

2x I2C BUS

I2C BUS

256 KB

L2 Cache