Fastwel CPC1302 User Manual

-

CPC1302

CPU Module

User
Manual

IMES.467444.083 UM

August 2017
Version 1.01

Revision Record

Revision No
Brief description of changes

Board
index

Revision date

1:00

Initial version

CPC1302

November 2016

1.01

Graphics system characteristics were added. Adjustment
of the delivery checklist: added screw M2,5х16. The
subsection 1.3.3 has a clarification: recommended carrier­board Adlink Express-BASE6. Subsection 3.6 was added
with clarification on fastening the module to Adlink
Express-BASE6 board. Subsection 4.1 has an adjustment
of BIOS update text.

CPC1302

May 2017

Contact Information

Fastwel Co. Ltd

Fastwel Corporation US

Address:

108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation

6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011,

Tel.:

[phone] Tel.:

[phone]

Fax:

[phone]

E-mail:

[e-mail] Email:

[e-mail]

Web:

http://www.fastwel.com/

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Table of contents

Table of contents ……………………………………………………………………………………………………………. 3
List of tables …………………………………………………………………………………………………………………. 4
List of figures ………………………………………………………………………………………………………………… 4
Trademarks………………………………………………………………………………………………………………….. 5
Ownership Rights ………………………………………………………………………………………………………….. 5
Notation Conventions………………………………………………………………….…………………………………… 6

General safety requirements……………….. ............................................................................................................ 7

High Voltage Safe Handling Rules…………………………………………………………………………………. 7

Board Handling Regulations ......................................................................................................................... 7

General Board Operation Rules……………………………………………………………………………………………. 8
MANUFACTURER'S WARRANTIES………………………………………………………………………………………. 8

1

Description and operation of CPC1302 CPU Module ....................................................................... 10

1.1 Purpose .................................................................................................................................................. 10

1.2 Versions, ordering information ................................................................................................................ 10

1.2.1 Versions ..................................................................................................................................... 10

1.2.2 Description of the supplied configurations ................................................................................. 11

1.2.3 Available options for CPC1302 .................................................................................................. 11

1.3 Main and additional complete set ........................................................................................................... 12

1.3.1 Delivery checklist ....................................................................................................................... 12

1.3.2 Additional complete sets for heat removal ................................................................................. 12

1.3.3 Carrier-board for CPC1302 ........................................................................................................ 12

1.4 Technical features .................................................................................................................................. 13

1.5 Module power supply and current consumption ..................................................................................... 14

1.5.1 Power supply reset and monitoring ............................................................................................ 14

1.5.2 Power supply requirement ......................................................................................................... 14

1.5.3 Consumption currents of the modules ....................................................................................... 14

1.6 Resistance to climatic effects ................................................................................................................. 15

1.7 Resistance to mechanical effects ........................................................................................................... 15

1.8 Weight and dimensions characteristics (module and packaging) ........................................................... 15

1.8.1 Weight and dimensions of additional complete sets for heat removal ........................................ 16

1.9 MTBF ...................................................................................................................................................... 17

2

Description of operation of CPC1302 major components ............................................................... 18

2.1 Location of main components ................................................................................................................. 18

2.2 Functional structure of CPC1302 ............................................................................................................ 20

2.3 Connectors COM Express A-B, C-D ....................................................................................................... 23

2.4 Possible PCIe х16 Gen3 configuration options ....................................................................................... 23

2.5 Possible PCIe х8 Gen2 configuration options ......................................................................................... 24

2.6 Devices on SMBus ................................................................................................................................. 24

2.7 FRAM controller registers……………………………………………………………………………………….. 25

2.8 Watchdog timer ...................................................................................................................................... 26

2.8.1 Watchdog timer's registers ......................................................................................................... 27

2.8.2 Description of watchdog timer's registers ................................................................................... 28

2.9 I2C Controller/ I/O ports .......................................................................................................................... 29

2.9.1 Algorithm of I2C controller operation .......................................................................................... 30

2.9.2 Registers of I2C controller.......................................................................................................... 31

2.9.3 Description of I2C controller registers ........................................................................................ 31

3

Intended use of CPC1302 .................................................................................................................... 33

3.1 Reset of BIOS Setup settings ................................................................................................................. 33

3.2 Description of indicators ......................................................................................................................... 33

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3.2.1 Description of HL3 indicator operation ....................................................................................... 33

3.3 Possible heat removal options ................................................................................................................ 34

3.4 Heat removal requirements .................................................................................................................... 35

3.5 Installation of CPC1302 .......................................................................................................................... 37

3.5.1 Safety Requirements………………………………………………………………………………….. 37

3.6 Installation of CPC1302 to the carrier-board ........................................................................................... 38

3.7 Procedure of module removal ................................................................................................................. 38

3.8 Elimination of CPC1302 malfunctions .................................................................................................... 39

4

AMI® BIOS ............................................................................................................................................ 41

4.1 BIOS update ................................ ................................ ........................................................................... 41

5

Transportation, unpacking and storage 42

5.1 Transportation ........................................................................................................................................ 42

5.2 Unpacking ............................................................................................................................................... 42

5.3 Storage ................................................................................................................................................... 42

A Purpose of COM Express connector contacts ........................................................................................ 43

B Disclaimer …...............................................................................................................................................53

List of tables

Table 1-1: CPC1302 ordering information ............................................................................................................................................ 10

Table 1-2: CPC1302 ordering options .................................................................................................................................................. 11

Table 1-3: CPC1302 Delivery checklist .................................................................................................................................................. 12

Table 1-4: Installation kit IMES.467941.047 ........................................................................................................................................... 12

Table 1-5: Additional sets for CPC1302 .................................................................................................................................................. 12

Table 1-6: Consumption currents of CPC1302 ....................................................................................................................................... 14

Table 1-7: Consumption currents over input voltage +5V_STBY ............................................................................................................ 15

Table 1-8: Weight and dimensions of module and packaging ................................................................................................................. 15

Table 1-9: Weight and dimensions of additional complete sets for heat removal .................................................................................... 16

Table 1-10: Weight and dimensions of additional complete sets for heat removal................................................................................... 16

Table 1-11: MTBF .................................................................................................................................................................................. 17

Table 2-1: Possible PCIe х16 Gen3 configuration options ...................................................................................................................... 23

Table 2-2: Addresses of devices on SMBus ........................................................................................................................................... 24

Table 3-1: Reset of BIOS Setup settings of CPC1302 using XP1 switch ................................................................................................ 33

Table 3-2: Description of CPC1302 indicators ........................................................................................................................................ 33

Table 3-3: Description of HL3 indicator of CPC1302............................................................................................................................... 33

Table 3-4: Elimination of CPC1302 malfunctions .................................................................................................................................... 40

Table A-1: Purpose of COM Express connector contacts ....................................................................................................................... 43

List of figures

Fig. 1-1: Template for ordering CPC1302 ............................................................................................................................................. 11

Fig. 1-2: Overall and connecting dimensions of the module .................................................................................................................. 16

Fig. 2-1: Location of main components of CPC1302 (top view) ............................................................................................................... 18

Fig. 2-2: Location of COM Express connectors of CPC1302 (bottom view) ............................................................................................ 19

Fig. 2-3: Module block diagram .............................................................................................................................................................. 20

Fig. 2-4: Algorithm of I2C controller operation (example of writing 1 byte of data to EEPROM Atmel AT24C02) ..................................... 30

Fig. 3-1: Possible heat removal options .................................................................................................................................................. 34

Fig. 3-2: CPC1302 with the installed heat removal set ACS30076-02 ..................................................................................................... 35

Fig. 3-3: Point for temperature control on heat-spreading plate .............................................................................................................. 36

Fig. 3-4: Diagram of CPU temperature dependency on the temperature on plate (*) .............................................................................. 36

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All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose . This information has been thoroughly
checked and is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies,
omissions or their consequences, as well as liability arising from the use or application of any product or example described in this document.

Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice.
Software described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages
originated by the use of this software.

This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the
document or to convert it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially
authorized agents.

Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of Xerox
Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc. Microsoft is a trademark of the Microsoft
corporation. In addition, this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are
property of their respective owners.

Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.

Trademarks

"Fastwel" logotype is a trademark belonging to Fastwel Group Co. Ltd., Moscow, Russian

Federation.

Besides, this document may contain names, corporate logotypes and trademarks being
registered trademarks; consequently, property rights to them belong to their respective legitimate
owners.

Ownership Rights

This document contains information being the property of Fastwel Group Co. Ltd. It can
neither be copied nor transferred with the utilization of known media nor be stored in data storage
and search systems without the prior written authorization of Fastwel Group Co. Ltd. To our best
knowledge, the data in this document does not contain errors. However, Fastwel Group Co. Ltd
cannot take responsibility for any inaccuracies and their consequences, as well as responsibility
arising as a result of utilization or application of any diagram, product or example cited in this
document. Fastwel Group Co. Ltd reserves the right to alter and update both this document and
the product presented therein at its own discretion without additional notification.

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Notation
Conventions

Warning, high voltage!

This sign and inscription warn you about the dangers associated with
electric discharges (> 60 V) at the time you touch the device or its
parts. Noncompliance with the safety precautions, mentioned or
prescribed by the rules could endanger your life or health, or lead to
product damages. We also recommend you to familiarize with the
below subsection dedicated to the high voltage safe handling rules.

Warning!
ESD Sensitive Device!

This symbol draws your attention to the information related to electro
static sensitivity of your
product and its components. To keep product safety and operability it
is necessary to handle it with care and follow the ESD safety
directions.

Warning! Hot surface!
This sign marks warnings about hot surfaces. The surface of the

heatsink and some components can get very hot during operation.
Take due care when handling, avoid touching hot surfaces!

Warning!

Information marked by this symbol is essential for human and
equipment safety.
Read this information attentively, be watchful.

Note
This symbol and title marks important information to be read attentively

for your own benefit.

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General safety requirements

This product is designed and tested for the purpose of ensuring compliance with the electric
safety requirements. Its design guarantees long-term failsafe operation. Life cycle of the device
can be sufficiently reduced due to improper handling during unpacking and installation. Therefore,
for your own safety and in order to ensure the proper operation of the device, you should observe
the below recommendations. It is also required to observe safety regulations outlined in subsection

3.5.1.

High Voltage Safe Handling Rules

Warning!

All the works that involve this device should be carried out by the
appropriately qualified personnel.

Warning, high voltage!
Before installing the board into the carrier-board, make sure that

the mains supply is switched off.
During installation, repairs and maintenance of the device there is a

real danger of exposure to electric shock, therefore you should
always disconnect the power supply feeding cable from the socket
at the time of works.

Board Handling Regulations

ESD Sensitive Device!

Electronic boards and their components are sensible to static
electricity. This is why you should give special attention to
handling
with these devices in order to ensure their integrity and working
efficiency.

 - Do not leave the board without protective packaging, when it is not operated.

 - When applicable, always operate the board at the workplace equipped with protection

against static electricity. If it is impossible, the user should remove a static discharge
before touching the device by hand or using tools. The best way to do it is touch a
metal part of system enclosure.

 You should observe safety precautions during operations for installation of jumpers

etc.. It is prohibited to remove/install jumpers when the power is on.

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General Board Operation Rules

 To keep the warranty, the product should not be altered or modified in any way. Any

alterations or improvements not authorized by Fastwel LLC, except for those specified
in this document or obtained from the technical support department of Fastwel LLC as
a set of instructions for their implementation, cancel the warranty.

 This device should be installed and connected only to the systems, meeting all the

necessary technical and climatic requirements. This above is also true to the operating
temperature range of a particular version of the board.

 While performing all the required operations for installation and adjustment, please

follow the instructions specified only in this document.

 Keep the original package for subsequent storage of the device and transportation in

the warranty event. If it is necessary to transport or store the board, please pack it
the same way as it was packed upon delivery.

 Exercise special care when unpacking and handling the device. Act in accordance with

the instructions given above and in the paragraph 5 Transportation, unpacking and
storage.

MANUFACTURER'S WARRANTIES

Warranty liabilities

The manufacturer guarantees that device's quality corresponds to the requirements of
technical specification TU 4013-022-72782511-08 provided that the Consumer meets operation,
storage, transportation and installation conditions and procedures, specified by accompanying
documents.

The Manufacturer hereby guarantees that the products supplied thereby are free from
defects in workmanship and materials, provided operation and maintenance norms were observed
during the currently established warranty period. The Manufacturer's obligation under this warranty
is to repair or replace free of charge any defective electronic component being a part of a returned
product.

Products that broke down through the Manufacturer's fault during the warranty period will be
repaired free of charge. Otherwise the Consumer will be invoiced as per the current labor
remuneration rates and expendable materials cost.

Liability limitation right

The Manufacturer shall not be liable for the damage inflicted to the Consumer's property
because of the product breakdown in the process of its utilization.

Warranty period

The warranty period for the products made by Fastwel LLC is 36 months since the sale date
(unless otherwise provided by the supply contract).

The warranty period for the custom-made products is 60 months since the sale date (unless
otherwise provided by the supply contract.

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Limitation of warranty obligations

The above warranty obligations shall not be applied:



To the products (including software), which were repaired or were amended by the
employees, that do not represent the manufacturer. Exceptions are the cases where the
customer has made repairs or made amendments to the devices in the strict compliance with
instructions, preliminary agreed and approved by the manufacturer in writing;



To the products, broken down due to unacceptable polarity reversal (to the opposite sign)
of the power supply, improper operation, transportation, storage, installation, mounting or
accident.

Procedure of device returning for repairs

Sequence of activities when returning the products for repairs:



Apply to Fastwel company or to any of the Fastwel's official representatives for the Product

Return Authorization;



Attach a failure inspection report with a product to be returned in the form, accepted by the
Manufacturer, with a description of the failure circumstances and symptoms;



Carefully package the product in the antistatic bag and carton box, in which the product
had been supplied. Then package the product in a safe container for shipping. Failure to
package in antistatic material will VOID all warranties.



The customer pays for shipping the product to Fastwel or to an official Fastwel

representative or dealer.

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Description and operation of CPC1302 CPU Module
CPC1302

1 Description and operation of CPC1302

CPU Module

1.1 Purpose

CPC1302 CPU Module is implemented in COM Express Type 6 (PICMG COM.0 r.2.1)
standard based on the 4th generation Intel Core i5 CPUs and 5th generation Core i7 CPU and
is designed for embedded applications requiring high performance, low power consumption and
high reliability.

1.2 Versions, ordering information

1.2.1 Versions

Module's versions and their designations at the time of the order (ordering information) are

given in the table below 1-1:

Table 1-1: CPC1302 ordering information

Versions

CPU

RAM

SSD

Temperature

1

CPC1302-01

Intel Core i7-5850EQ

2.7 GHz 4C 37 W

8 GB 1600

DDR3L

16 GB

-40…+85C

2

CPC1302-02

Intel Core i7-5850EQ

2.7 GHz 4C 37 W

8 GB 1600

DDR3L

-

-40…+85C

3

CPC1302-03

Intel Core i5-4422E

1.8 GHz 2C 25 W

4 GB 1600

DDR3L

16 GB

-40…+85C

4

CPC1302-04

Intel Core i5-4422E

1.8 GHz 2C 25 W

4 GB 1600

DDR3L

-

-40…+85C

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Description and operation of CPC1302 CPU Module
CPC1302

Fig. 1-1: Template for ordering CPC1302

1.2.2 Description of the supplied configurations

CPC1302-01: CPC1302 CPU Module, Intel Core i7-5850EQ 2.7 GHz 4 Core, 8GB DDR3L

SDRAM, embedded SSD 16GB, -40…+85C

CPC1302-02: CPC1302 CPU Module, Intel Core i7-5850EQ 2.7 GHz 4 Core, 8GB

DDR3L SDRAM, -40…+85C

CPC1302-03: CPC1302 CPU Module, Intel Core i5-4422E 1.8 GHz 2 Core, 4GB

DDR3L SDRAM, embedded SSD 16GB, -40…+85C

CPC1302-04: CPC1302 CPU Module, Intel Core i5-4422E 1.8 GHz 2 Core, 4GB

DDR3L SDRAM, -40…+85C

1.2.3 Available options for CPC1302

Table 1-2: CPC1302 ordering options

Pre-installed operating system (*)

\LNX

Linux 3.8.x

(*) OS pre-installation is possible only for the versions with SSD.

Coating

\COATED

Conformal coating

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Description and operation of CPC1302 CPU Module
CPC1302

1.3 Main and additional complete set

1.3.1 Delivery checklist

CPC1302 Module is delivered ready-assembled with the heat-spreading plate. Cooling
system is delivered as an option.

Table 1-3: CPC1302 Delivery checklist

Notation
Conventions

Name

Number

IMES.467941.047

Installation kit

1

IMES.421945.069

Packaging

1

Table 1-4: Installation kit IMES.467941.047

1

Screw DIN7985-M2,5х6-A2

5

2

Screw DIN7985-M2, 5x16-A2

5

For mounting to the
carrier-board Adlink
Express-BASE6

3

Washer DIN125-2,7-A2

5

4

Washer DIN6798А-2,7-A2

5

5

Rack WE p/n 971 080 154

5

L=8 mm

6

Jumper TE Connectivity
p/n 382575-2

1

Pitch 2 mm

1.3.2 Additional complete sets for heat removal

Additional accessories for heat-removal are specified in the table below:

Table 1-5: Additional sets for CPC1302

Heat-removal system (**)

ACS30076-01

Heatsink

ACS30076-02

Heatsink with a fan

(**) Module is delivered ready-assembled with the heat-spreading plate.

Additional complete-sets for heat-removal are supplied as an option. Weigh and
dimensions of the complete sets are given in the subsection 1.8.1.

1.3.3 Carrier-board for CPC1302

CPC1302 Module can be installed on the carrier-board compatible with the COM Express
Type 6 (r.2.1) standard. We recommend using Adlink Express-BASE6 board as the carrier-board
(to be purchased as an option). Procedure of module installation to the carrier-board is provided in
the subsection 3.6.

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Description and operation of CPC1302 CPU Module
CPC1302

1.4 Technical features

 Intel Core i7-5850EQ 2.7Ghz CPU 5

th

Gen 37W

▪ 4 cores Intel x64;
▪ 3 graphics engines;
▪ 6 MB of cash-memory.

 Intel Core i5-4422E 1.8Ghz CPU 4th Gen 25W

▪ 2 cores Intel x64;
▪ 2 graphics engines;
▪ 3 MB of cash-memory.

 RAM:

▪ DDR3L-1600 SDRAM up to 8 GB (depending on the version) with ECC support;
▪ 64-bit data bus.

 Graphics subsystem characteristics:

▪ 64 bit 25.6 GB/sec;
▪ Graphics in CPC1302-01 (-02):

▪ Intel Iris Pro Graphics 6200;
▪ Memory: up to 4GB;
▪ DirectX 12, OpenGL 4.4, OpenCL 2.0, H.264/MPEG-4 (AVC), VC1, MPEG-2, VP8;

▪ Graphics in CPC1302-03 (-04):

▪ Intel HD Graphics 4600;
▪ Memory: up to 2 GB;
▪ DirectX 11.1, OpenGL 4.0, OpenCL 1.2, H.264/MPEG-4(AVC), MPEG-2.

 FLASH BIOS:

▪ 128 Mb SPI-Flash;
▪ modifiable within the system;

 FRAM 32 Kbyte (SPI port) for storing user data
 COM-Express Type 6 connector:

▪ 1 port PCIe x16 GEN3, 8 GT/s;
▪ 7(8) ports PCIe x1 GEN2, 5 GT/s;
▪ 8x ports USB 2.0;
▪ 4x ports USB 3.0;
▪ 4x ports SATA III 6Gbps;
▪ Port "LAN 0": Gbit Ethernet Intel 210;
▪ Port SPI (External Boot);
▪ Port "LVDS Channel ": LVDS Dual Channel 24bit 1920x1200@60Hz or port eDP

3840x2160@60H;

▪ 3 x ports DDI 4096x2304@60Hz;

▪ 1x port VGA CRT 1920x2000@60Hz;
▪ Port LPC (Specification Rev. 1.1);
▪ Port SMBus;
▪ Port I2C;
▪ Port HD Audio;
▪ Speaker Out;
▪ 4x ports GPIO;
▪ 2x ports RS-232 (TTL, 128-byte FIFO, up to 3Mbps).

 Real-Time Clock (with power fed from "RTC battery" port)
 SSD 16GB on SATA interface
 Watchdog timer:
 Monitor of 7 power supply voltages, monitor of PCB temperature

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Description and operation of CPC1302 CPU Module
CPC1302

 Console I/O via serial ports (COM1 / COM2)
 Software compatibility:

▪ Linux 3.8.x;
▪ QNX 6.5;
▪ Microsoft Windows Embedded Standard 7.

1.5 Module power supply and current consumption

1.5.1 Power supply reset and monitoring

CPU reset signal is generated from the following sources:

▪ from supervisor at power on;
▪ from Reset button;
▪ from watchdog timer;
▪ from external reset signal.

Forbidden!
To restart the Module less than in5 seconds after shutdown.

1.5.2 Power supply requirements

As the main power supply voltage, the board uses the voltage of +12 V from COM-Express
connector. In order to support the sleep modes, the standby voltage is used.
+5V_STBY from COM-Express connector (optional).

At 12 V input, protection against over-voltage and pulse interference is provided.

Acceptable range of the main supply voltage: 8-14 V.

Acceptable range of the standby supply voltage: 4.75-5.25 V.

1.5.3 Consumption currents of the modules

Table 1-6: Consumption currents of CPC1302

CPU Module

Module input voltage

(Vin)

Average current A) at

TDP load

Starting current

(A) (*)

Peak current (А)

during OS

CPC1302-01
47 W

8V

~[8.9], 7.6

~3

~12

12V

~[6.3], 5.2

~2.3

~7.5

14V

~[5.3], 4.4A

~2.3

~6.2

CPC1302-01
37 W

8V

~[7.5], 6.1

~3

~11.4

12V

~[5.1], 4.2

~2.2

~8

14V

~[4.3], 3.5

~2.3

~6.2

CPC1302-03

8V

~[5.5], 4.6

~2.5

~6.7

12V

~[3.68], 3.1

~2

~4.8

14V

~[3.2], 2.7

~1.9

~3.6

Note:
Average current under load by synthetic benchmarks. (*)
Peak current within the range up to 100 ms.

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Description and operation of CPC1302 CPU Module
CPC1302

Table 1-7: Consumption currents over input voltage +5V_STBY

CPU Module

Average

current

during

Peak current

during module's
start

Average

current in S3
mode (mA)

Peak current

when switching

to S3 mode (mA)

CPC1302-01 (-03)

66

~340

200

280

1.6 Resistance to climatic effects

CPC1302 modules of industrial temperature range are resistant to the changes of ambient
temperature within the range from - 40 to + 85°С with relative humidity of up to 80 %, no
condensation, in accordance with the GOST 28209. Description of heat-removal features is given
in subsections 3.3 and 3.4.

CPC1302 Modules are resistant to cyclic damp heat at ambient temperatures of + (55
2)°С, relative humidity (93 3) % (for modules with conformal coating) in accordance with the
GOST 28216.

1.7 Resistance to mechanical effects

The modules complying with the GOST standard 28203 are resistant to sinusoidal vibrations
for frequencies from 10 to 500 Hz with acceleration of 2 g.

The modules complying with the GOST standard 28213 are resistant to single shocks with
the peak acceleration of 50 g.

The modules complying with the GOST standard 28215 are resistant to multiple shocks (with
1000 shocks) with the peak acceleration of 25 g.

1.8 Weight and dimensions characteristics (module and packaging)

Values of weight and overall dimensions of modules and packaging are given in the table

below:

Table 1-8: Weight and dimensions of module and packaging

CPU Module

Weight in

kg, no
more than:

Packaged
weight, in
kg

Overall dimensions with

head-spreading plate and

racks, in mm

Overall dimensions of

the packaging, in
mm

CPC1302

0.4

0.5

125 х 95 × 18

140 × 150 × 45

Overall and connection dimensions of the module are shown in figure below.

CPC1302 User Manual

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Description and operation of CPC1302 CPU Module
CPC1302

Fig. 1-2: Overall and connecting dimensions of the module

1.8.1 Weight and dimensions of additional complete sets for heat removal

Table 1-9: Weight and dimensions of additional complete sets for heat removal

Additional complete set

Overall dimensions, no more than:

ACS30076-01

125,5х95,5х25,0

ACS30076-02

125,5х95,5х40,0

Table 1-10: Weight and dimensions of additional complete sets for heat removal

Additional complete set

Weight in kg, no

ACS30076-01

280

ACS30076-02

380

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Description and operation of CPC1302 CPU Module
CPC1302

1.9 MTBF

Mean time between failure (MTBF) for ambient temperature of +30С corresponds to the
values given in the table.

Table 1-11: MTBF

CPU Module

MTBF in hours, not less than:

CPC1302

150,000

Note – MTBF values are calculated according to the Telcordia Issue 1 computational model (calculation

method - Method I Case 3) for continuous operation in case of the on-ground placement,
under conditions corresponding to the Moderately Cold Climate 4 climatic category, in
accordance with the GOST 15150-69, at the ambient temperature of + 30 С.

CPC1302 User Manual

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Description of operation of CPC1302 major components

CPC1302

2 Description of operation of CPC1302 major

components

2.1 Location of main components

Location of main components and connectors is given in Figure 2-1 and Figure 2-2.
Purpose of indicators and XP1 switch is given in subsections 3.1 and 3.2.

CPU

HL1
HL2
HL3

XP1

PCH

Fig. 2-1: Location of main components of CPC1302 (top view)

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Description of operation of CPC1302 major components

CPC1302

Connector

COM Express
C-D

Connector
COM Express
A-B

Fig. 2-2: Location of COM Express connectors of CPC1302 (bottom view)

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Description of operation of CPC1302 major components

CPC1302

2.2 Functional structure of CPC1302

Block diagram of CPC1302 is shown in Figure 2-3:

Fig. 2-3: Module block diagram

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Description of operation of CPC1302 major components

CPC1302

 CPU Intel Core i7-5850EQ 2.7 GHz
64-bit Intel microprocessor manufactured using 14 nm process, with 37 W TDP (switching to the

47 W TDP mode is available in BIOS Setup with a plate temperature limitation up to +70C).
Includes 4 improved cores 5th generation Intel Core i7, two-channel 64-bit DDR3L SDRAM

memory controller with ECC support, modern graphics subsystem with 2D/3D acceleration GT3e,
input-output subsystem PCI-Ex16 Gen3. The modern high-speed DDI graphics interfaces.

The processor is implemented in BGA enclosure, 37.5 x 32 mm.
 CPU Intel Core i5-4422E 1.8 GHz

64-bit Intel microprocessor, manufactured using 22 nm processor, with maximum TDP of 25W.
Includes 2 cores 4th generation Intel Core i5, two-channel 64-bit DDR3L SDRAM memory

controller with ECC support, modern graphics subsystem with 2D/3D acceleration GT2, input­output subsystem PCI-Ex16 Gen3. The modern high-speed DDI graphics interfaces.

The processor is implemented in BGA enclosure, 37.5 x 32 mm.
 PCH Intel QM87

Highly integrated controller of interfaces, including standard peripherals of IBM PC AT platform
and modern high-speed interfaces PCI-E Gen2, SATA 6 Gps, USB 2.0/3.0. Implemented in BGA

enclosure 20х20mm, has a heat dissipation, which is by 20% lower as compared to the one of the

previous controller QM77.
 DDR3L SDRAM

The board can be equipped with 18 (soldered) microchips DDR3L 1600 SDRAM with a total
volume of up to 8GB. (18x4Gbx8). Operating mode - two-channel with ECC support.

 BIOS
For storing the main (working) copy of BIOS, two microchips SPI-Flash 64 Mb are used.
Booting from an external carrier (SPI interface on COM-Express connector) is supported. By

default, the booting is carried out from SPI Flash soldered on the module. Switching to the
booting from an external SPI Flash (COM-Express) or LPC bus is possible.

 RTC, CMOS
The Real-Time Clock is integrated in PCH QM87. Operability of the clock when the power is off is

ensured via the port "RTC battery" of COM-Express connector from the carrier-board. CMOS
settings are stored in the FRAM non-volatile memory.

 SPI FRAM
The non-volatile memory 32 Kbyte (Ramtron, FM25L256, SPI), required for storage of user data

(used as a replacement for a standard non-volatile RAM).

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Description of operation of CPC1302 major components

CPC1302

 PCI-E 3.0 ports
Port PCI-E Gen3 x16 with a bandwidth capacity of up to 128 GT/sec is routed to COM-Express

connector. Possible port configurations: 1x16, 2x8, 1x8 + 2x4.
 PCI-E 2.0 ports

The COM-Express connector is equipped with 8 routed ports PCI-E Gen2 x1 with bandwidth

capacity of up to 5 GT/sec. Possible port configurations: 8x1, 2x4, 4х2, 2х2+4х1, (while

switching off the integrated LAN). When LAN is on there are 7 ports with configurations 7x1, 1x4
+ 3x1, 3x2 + 1x1 available at the connector.

 SATA ports
COM-Express is equipped with 4 routed SATA ports. SATA III specification (up to 6Gbit/s) is

supported.
 SATA Flash Disk

As an option, the board can be equipped with SSD Flash Disk with a total volume of 16 GB
RC03GW1AAB manufactured by RunCore. Distinguishing features: Memory SLC, support of
ECC, extended temperature range (-40°C + 85°C). Enclosure FBGA 16x20 mm. SATA port is
used.

 USB 2.0 port
The COM-Express connector is equipped with 8 USB 2.0 ports with protection and short circuits.

 USB 3.0 port
The COM-Express connector is equipped with 4 routed USB 3.0 ports (Super Speed).

 Gbit Ethernet port
The board is equipped with 1 Gbit Ethernet channel. External controller Gigabit Ethernet I210,

connected to the 8-th port PCI-E, is used. Controller can be switched off in BIOS, in this case, the
COM-Express connector will have 8 ports available.

 COM1/COM2 ports
The ports are implemented on EXAR XR28V382 controller, connected to the LPC bus. Software-

compatible with 16550UART and are supported by standard drivers of COM-ports. Size of FIFO –
128 bytes.

COM1, COM2 – 2-wire interface RS-232 (TTL), with a speed up to 3 Mb/sec. May be used as
console I/O port. Routed to COM-Express connector.

 Video ports
For connection of LCD (TFT)-panels DDI interfaces routed to the COM-Express connector, are

used. Maximum resolution: 4096x2304@60 Hz (for CPU Core i5 – 3200x2000@60 Hz).
Independent operation of three displays is supported. Support of LVDS two-channel interface is

implemented in microchip NXP PTN3460. Maximum resolution 1920х1200@60 Hz, 18/24 bpp.

Routing eDP port instead of LVDS is possible – maximum resolution 3840x2160@60 Hz (for
CPU Core i5 – 3200x2000@60 Hz).

 Audio port
For connection of audio-devices, COM-Express connector is equipped with the routed High

Definition Audio interface.

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CPC1302

 GPIO port (8 I/O channels)
GPIO port is used in FPGA. Is designed for input of 4 and output of 4 logical signals.

 Sensors
Digital temperature sensor of CPU (integrated in СPU), dual-zone temperature sensor LM95235

is connected to SMBUS. Monitor of 7 power supply voltages (12V, 5V, 3.3V, 1.5V, 1.05V, 1.34V,
VCPU) AMC80AIPW is connected to SMBUS.

 FGA Xilinx Spartan-6
Used for implementation of SPI, I2C interfaces, GPIO ports, Watchdog-timer, diagnostics

LED\start and control of power supply modes.
 WDT

The module uses one hardware watchdog timer with modifiable actuation interval from
1 µsec up to 10 minutes, is implemented in FPGA.

2.3 Connectors COM Express A-B, C-D

CPC1302 is equipped with the standard COM Express connectors (see Fig. 2-2), using which
CPC1302 is connecting with the carrier-board. Purpose of the contacts is specified in the Table A­1: Purpose of COM Express connector contacts.

2.4 Possible PCIe х16 Gen3 configuration options

Table 2-1: PCIe х16 Gen3 configurations

The configuration is set in BIOS Setup. Switching to the Reverse mode – over the signal
PEG_LANE_RV# from COM Express connector.

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CPC1302

2.5 Possible configurations of PCIe х8 Gen2

Number of available PCIe ports at COM Express connector depends on the fact whether
the integrated Gigabit Ethernet is used. If it is integrated into BIOS Setup, then PCIe [0:6] ports are
available on the connector, if it is off – all the 8 ports will be available. The possible configuration
options depend on whether the Gigabit Ethernet used and they are not used and are available only
when the custom version of BIOS is applied. The groups of [0:3] and [4:7] ports can be configured
regardless of each other.

During the standard supply, the ports are configured as 7x1 when Ethernet is activated and
8x1 when Ethernet is deactivated.

Port0

Port1

Port2

Port3

X4

X2

X2

X2

X1

X1

X1

X1

X1

X1

Gbe is off:

Port4

Port5

Port6

Port7

X4

X2

X2

X2

X1

X1

X1

X1

X1

X1

Gbe is on:

Port4

Port5

Port6

Port7

X2

X1

N/A

X1

X1

X1

N/A

2.6 Devices on SMBus

SMBus (System Management Bus) ensures monitoring and system configuration functions.

This bus uses a two-wire interface I2C™.

Device addresses on SMBus are given in the table below.

Table 2-2: Addresses of devices on SMBus

Name

Address

SPD1 EEPROM

A0h

SPD2 EEPROM

A2h

LM95235DIMM

4Ch

PTN3460BS/F

40h

AMC80A

50h

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Description of operation of CPC1302 major components

CPC1302

2.7 FRAM controller registers

FRAM controller is implemented in FPGA as a device on LPC bus. Controller is activated in
BIOS Setup. The device is operated via registers in the field of input-output (I/O) ports. Base
register address (BASE), set in BIOS, is specified in "Help" section of BIOS Setup, to the right side
of the item dedicated to activation/deactivation of FRAM controller.

INDEX

Input/output

address

Type

HARD RESET

Configuration register

Base+0

R/W

00h

FRAM address value [7:0]

Base+1

R/W

00h

FRAM address value [14:8]

Base+2

R/W

00h

SPI data value [7:0]

Base+3

R/W

00h

SPI Control/Status register
[7] – busy status
[6] – last 1K FRAM lock
status [5:1] – Reserved

[0] – BURST mode

The controller automatically generates the sequence of access to FRAM on SPI bus

(address from registers BASE+0, BASE+1, write/ read mode and data – register BASE+2).

The las kilobyte from 32 Kbyte is backed up for storing the BIOS Setup settings. Bit <0> in
the control register (Base+3) includes the mode of automatic increase of address during
reading/writing of data register (base+2), upon completion of the packet exchange it should be
reset.

Programming SPI devices
Work with FRAM is carried out in the field of I/O at the addresses, specified in BIOS Setup. The
example shows base address 310H.

▪ Writing data byte (32h) to FRAM at the address (144h)

MOV DX, 310H

MOV AL, 44H

OUT DX, AL

MOV DX, 311H

MOV AL, 01H

OUT DX, AL

MOV

DX,
312h MOV AL,
32h OUT DX,AL

▪ Reading data byte from FRAM at the address (101h)

MOV DX, 310H
MOV AL, 01H
OUT DX, AL
MOV DX, 311H
MOV AL, 10H
OUT DX, AL
MOV

DX,
312h IN

AL,DX

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CPC1302

▪ Reading data packet containing three FRAM data bytes starting from the 208h address

MOV DX, 310H
MOV AL, 08H
OUT DX, AL
MOV DX, 311H
MOV AL, 20H
OUT DX, AL
MOV DX,313h
MOV AL, 01H

OUT DX, AL ; activation of batch mode

MOV DX, 312h

IN AL,DX ; reading data byte at the address 208h

…

IN AL,DX ;reading data byte at the address 209h

…

IN AL,DX ;reading data byte at the address 20Ah

…

MOV DX,313h
MOV AL, 00H

OUT DX, AL ; deactivation of batch mode

2.8 Watchdog timer

The watchdog is implemented in FPGA as a device on LPC bus. Deactivation of the
watchdog timer and selection of hardware interrupt (IRQ) is carried out in BIOS Setup. Work with
timer is carried out via the registers in the field of input-output (I/O) ports. Base register address
(BASE), set in BIOS, is specified in "Help" section of BIOS Setup, to the right side of the item
dedicated to activation/deactivation of watchdog timer.

The watchdog timer contains 24-bit counter register [Timer Current Value Register],
decremented with the frequency of 32768 kHz and initial value register [Timer Initial Value
Register]. When the counter register is zeroed, it could lead to either interrupt or board automatic
reset (in case of counter double zeroing). Actuation time can be set from 0 though 512 seconds
with a pitch of 30,52 µs.

The watchdog timer is inactive by default. Below is the formula for calculation of duration of
TWD actuation delay (µs) depending on the decimal value in the register [Timer Initial Value
Register] (KWD):

T

WD

[s] = K

WD

* 106 / 2

15

E.g. the decimal value KWD = 1 (000001h) corresponds to actuation delay time of 30.52
µs, and the value KWD = 16777215 (FFFFFFh) – to the delay time of 512 seconds.

Reset of the counter to the initial value can be performed by recording of any number to the
counter register [Timer Current Value Register].

During the first zeroing of the counter register, TMF flag is set, during the second one –
theSTF flag, the counter is set and the board reboot will be performed (if allowed).

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Description of operation of CPC1302 major components

CPC1302

Operation algorithm with watchdog timer via I/O registers:

1) The counter decrement is stopped.

2) Timeout value is recorded to the initial value registers.

3) Counter register is initiated by recording any number to the counter register. In this case, the
timeout value from the initial value register is overwritten to the counter register.

4) Start the counter for decrement and, if required, allow the board automatic reset.

5) After that, with a period of the lesser or equal timeout value we regularly perform counter reset
(using any of the methods described above). If the counter is not reset during the first timeout
interval – TMF flag is set and interrupt will appear (if allowed), If the counter is not reset during the
second timeout interval – STF flag is set and the board will reboot, if the reset was allowed.

2.8.1 Watchdog timer's registers

Input/output address
Type

HARD RESET

Configuration register

Base+0

R/W Timer current value [7:0]

Base+1

R/W Timer current value [15:8]

Base+2

R/W Timer current value [23:16]

Base+3

R/W

00h

Timer initial value [7:0]

Base+4

R/W

40h

Timer initial value [15:8]

Base+5

R/W

00h

Timer initial value [23:16]

Base+6

R/W

00h

Status register

Base+7

R/W

00h

Control register

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CPC1302

2.8.2 Description of watchdog timer's registers

Timer Current Value Register [23:0]

Base+0h

Bit

Name

Description

7:0 Timer_Current_Value[7:0]

Write/Read:
Bits 7:0 of the current counter value

Base+1h

Bit

Name

Description

7:0 Timer_Current_Value[15:8]

Write/Read:
Bits 15:8 of the current counter value

Base+2h

Bit

Name

Description

7:0 Timer_Current_Value[23:16]

Write/Read:
Bits 23:16 of the current counter value

Timer Initial Value Register [23:0]

Base+3h

Bit

Name

Description

7:0 Timer_Initial_Value[7:0]

Write/Read:
Bits 7:0 of initial counter value

Base+4h

Bit

Name

Description

7:0 Timer_Initial_Value[15:8]

Write/Read:
Bits 15:8 of initial counter value

Base+5h

Bit

Name

Description

7:0 Timer_Initial_Value[23:16]

Write/Read:
Bits 23:16 of initial counter value

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Description of operation of CPC1302 major components

CPC1302

Status Register

Base+6h

Bit

Name

Description

7:3 - Reserved

2

STF

Write/Read:
Second timeout flag Is set to "1" provided that the timer's

counter was reset to zero for the second time, the counter
stops. In case the board reset RSTE=1 is allowed, the
hardware reset will be carried out. The reset is carried out
by writing any number to the registers of the current value.

1 - Reserved

0

TMF

Write/Read:

Timeout flag. Installed into "1" when resetting the timer
counter. An interrupt is generated over this flag. The reset
is carried out by writing any number to the registers of the
current value.

Control Register

Base+7h

Bit

Name

Description

7:3 - Reserved

2

INTM

Write/Read
1 – interrupt is on
0 – interrupt is off

1

CNTE

Write/Read: Counter
1 decrement is ON
0 – switched off

0

RSTE

Write/Read:

Board reset on timeout 1 –
Reset is permitted
0 – Reset is prohibited

2.9 I2C Controllers/ input-output ports

Controller I2C supports the "Master" mode and transfer frequency of 100 KHz. Base address
in the field of I/O, installed by BIOS is specified in the section "help", to the right of the item
dedicated to I2C controller activation/ deactivation.

Register GPIO (BASE+3) enables to read and set input-output signals GPI[3:0], GPO[3:0],
routed to the COM Express connector.

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Description of operation of CPC1302 major components

CPC1302

2.9.1 Algorithm of I2C controller operation

Operation of I2C controller is shown in Fig. 2-4 as exemplified by recording 1 data byte.

Beginning

Start of controller

(MEN=1)

Is the bus busy?

Ye

(MBB=1)

No

No

Confirmation is

received?
(RXAK=0)

Yes

Recording of header

I2C to the data register

(address of EEPROM

microchip [7:1] + Write

[0])

Recording of the

EEPROM data byte to

the data register and

continuing writing

transaction (MCF=0)

Transfer mode selection

and transaction start

(MTX=1, MSTA=1)

Transaction

is over?

(MCF=1)

No

Transaction

is over?

(MCF=1)

Yes

No

Yes

Confirmation is

received?
(RXAK=0)

Yes

Writing of the EEPROM

data byte to the data

register and continuing

writing transaction

(MCF=0)

No

Continuing transaction

(automatic generation

STOP- condition)

(MCF=0)

No

Confirmation is

received?
(RXAK=0)

Yes

Generation of

STOP- condition

(MSTA=0) and continuing

transaction (MCF=0)

Transaction

is over?

(MCF=1)

No

Transaction

is over?

(MCF=1)

Yes

No

Yes

End

Fig. 2-4: Algorithm of I2C controller operation (example of writing 1 byte of data to EEPROM Atmel AT24C02)

Yes

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Description of operation of CPC1302 major components

CPC1302

2.9.2 Registers of I2C controller

Input/output address
Type

HARD RESET

Configuration register

Base+0

R/W

00h

Status Register

Base+1

R/W

00h

Control Register

Base+2

R/W

00h

Data Register

Base+3

R/W

0xh

GPIO Register

2.9.3 Description of I2C controller registers

Status Register (Base+0)

Bit

number

Name

Type

Descriptio

n

7

MCF

R/W

Flag of transaction ending / continuation.
Is set to "1" after acknowledgement (ACK) condition and STOP Condition of the

transaction.
For start of the next transaction it should be reset by writing "1" to this bit.

6

- Reserved

5

MBB

R

Bus busy flag. Is set to "1" if the START condition was recorded and is
reset to "0" if the STOP condition was recorded.

4

MAL

R/W

Flag of the bus arbitration loss. Is set to "1" at bus arbitration loss (in
START/STOP/Transmit conditions). Should be reset by writing "1" to this bit.

3

- Reserved

2

- Reserved

1

MIF

R/W

Interrupt flag. Is installed in the "1" under condition of MCF="1" or MAL="1".
Interrupt occurs when MIEN bit is set in the Control Register should be reset by
writing "1" to this bit.

0

RXAK

R

Flag of transaction acknowledgement (ACK). This will be reset to "0" if ACK was
obtained, and will be set to "1" if ACK wasn't obtained. Where there is no
acknowledgement of (RXAK=1) of the transmit transaction, MSTA bit will be
automatically reset to "0" and the Stop Condition will be initiated.

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Description of operation of CPC1302 major components

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Control Register (Base+1)

Bit

number

Name

Type

Descriptio

n

7

MEN

R/W

Start/reset of controller. Writing "1" to this bit switches on the I2C controller.
Writing "0" to this bit resets and switches off the I2C controller.

6

MIEN

R/W

Interrupt activation Writing "1" to this bit enables interrupt. Interrupt occurs when
MIF bit is set in the Status Register.

5

MSTA

R/W

Start of the transaction. Writing "1" to this bit calls the Start condition and
transmit\receive condition, depending on the MTX bit setting. Writing "0" to this
bit calls the Stop condition. Where there is no acknowledgement of (RXAK=1) of
the transmit transaction, the bit will automatically reset to "0" and the Stop
Condition will be initiated.

4

MTX

R/W

Selection of transaction mode. Writing "1" to this bit sets the transmission
mode, writing "0" – to receipt mode.

3

TXAK

R/W

Reception transaction acknowledgement bit. Writing "0" to this bit performs
acknowledgement (ACK), writing "1" – no acknowledgement is performed.

2

RSTA

R/W

Restart. Writing "1" to this bit calls the Repeated Start Condition. The bit is
automatically reset to "0" upon completion of the Repeated Start Condition.

1

- Reserved

0

- Reserved

Data Register (Base+2)

Bit

number

Name

Type

Descriptio

n

7-0

R/W

Data for transfer mode during recording or data of receipt mode during
reading.

GPIO Register (Base+3)

Bit

number

Name

Type

Descriptio

n

7-4

GPO

R/W

Values of output signals GPO[3:0].

3-0

GPI R Values of input signals GPO[3:0].

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Intended use of CPC1302

CPC1302

3 Intended use of CPC1302

3.1 Reset of BIOS Setup settings

In order to reset BIOS Setup settings (Table. 3-1), it i necessary to set the jumper XP1 (see
Fig. 2-1), switch on the module, wait for the BIOS information to appear on the screen, switch off
the module and remove the jumper XP1.

It is prohibited:
to remove/install the jumper when the power is on.

Table 3-1: Reset of BIOS Setup settings of CPC1302 using XP1 switch

Connector

name

Purpose

XP1

Contacts 1-2 are closed

CMOS Reset (factory reset)

3.2 Description of indicators

Table 3-2: Description of CPC1302 indicators

Indicator

names

Purpose

HL1

Indication of power supply +5V_STBY

HL2

Activity LED of SATA

HL3

Indicator of module's diagnostics\start

3.2.1 Description of HL3 LED operation

Table 3-3: Description of HL3 indicator of CPC1302

State of HL3

indicator

Function

Off

Module's primary supply is off

Flashing at ~8 Hz
CPU is started for BIOS operation

Flashing at ~1 Hz
CPU performs POST procedures

Flashing
constantly

POST is completed, OS booting is performed

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Intended use of CPC1302

CPC1302

3.3 Possible heat removal options

Subsection 3.4 contains technical specifications, which the user should consider during
development of the proprietary cooling system. Heat-removal options are shown in the figure
below.

The side of the CPU of CPC1302 module is
equipped with the heat-spreading plate, to which
the heat from the CPU and PCH microchip is
withdrawn. With such a configuration, it is possible
to ensure heat dissipation by installing the module
immediately on the enclosure or chassis (the
enclosure fulfills a function of a large heatsink).

The module 1302 can be additionally equipped
with a heatsink from the set ACS30076-01 (to be
purchased as an option) or a user-made heatsink.
The heatsink is installed to the heatspreading
plate (using a thermal conductive paste) and is
fixed with the screws from the heatsink delivery
checklist.

CPC1302 can also be equipped with a heatsink
with a fan (set ACS30076-02, to be purchased as
an option).

Fig. 3-1: Possible heat removal options

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Intended use of CPC1302

CPC1302

CPC1302 with the installed heat-removal set ACS30076-02 is shown in Fig. 3-2.

Fig. 3-2: CPC1302 with the installed heat removal set ACS30076-02

3.4 Heat removal requirements

Operation of CPC1302 is possible only with additional cooler, which ensures temperature of
CPU cores no higher than the maximum temperature allowed by CPU manufacturer. For
CPC1302-01 (-02) the maximum allowed temperature of the core is 105°C, for CPC1302-03 (-04)
– 100°C. Possibility to control the temperature of CPU cores is ensured by the internal digital
temperature sensor (DTS). Description of DTS registers is provided in documentation of CPU
manufacturer.

Reduction of CPU performance is permitted at the board temperature above 85°С,

temperature control is performed in accordance with Fig. 3-3.

For versions CPC1302-01 (-02) it is possible to increase CPU performance by setting in
BIOS Setup of an item "Configurable TDP" to the value "Nominal", in this case CPU performance
is increased up to 47W and decrease of performance is permitted at the board temperature above
+70°C.

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Intended use of CPC1302

CPC1302

Plate temperature T'C

Fig. 3-3: Point for temperature control on heat-spreading plate

95

85

75

65

CPC1302-01

47W

55

CPC1302-01

37W

45

CPC1302-03

25W

35

25

45 55 65 75 85 95 105

Processor temperature T'C

Fig. 3-4: Diagram of CPU temperature dependency on the temperature on plate (*)

CPC1302-01 (-02) modules with heat-removal sets ACS30076-02 can be operated at

ambient temperatures of up to +70°C without reduction in performance. (When using the mode

"47W" – up to +55°C). (*)

CPC1302-03 (-04) modules equipped with the heat-removal sets ACS30076-01 can be

operated at ambient temperatures of up to +30°C, without reduction in performance under

conditions of natural convection. (*)

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Intended use of CPC1302

CPC1302

CPC1302-03 (-04) modules with heat-removal sets ACS30076-02 can be operated at
ambient temperatures of up to +75°C without reduction in performance. (*)

(*) It specifies operating modes under the load of processor cores and graphics engine with
synthetic benchmarks, ensuring maximum Thermal Design Power (TDP).

3.5 Installation of CPC1302

CPC1302 Module can be installed on the carrier-board compatible with the COM

Express Type 6 r.2.1 standard.

3.5.1 Safety requirements

For proper installation of CPC1302 it is required to strictly follow the below rules and safety
requirements in order to avoid damages to the device and not to injure the health of people.
Manufacturer shall not be liable for any damages, arising out as a result of non-observance of such
requirements.

Warning!
Be careful when handling the module, since the heat-spreading plate

(and heatsink, if installed) can become too hot. Moreover, the module
should not be placed on any surface or put in any container until both
module and heatsink will have the room temperature.

Warning!
Switch off the power supply prior to installation of the module to the

carrier- board. Non-compliance with this rule could pose threat to your
health, as well as could lead to the failures of operation of the module
and the entire system.

CPC1302 User Manual

0-38

Intended use of CPC1302

CPC1302

ESD Sensitive Device!

CPC1302 contains components sensible to static
electricity. In order to prevent module damages, the following
precaution measures should be observed:

▪ Before touching the module, discharge the static electricity from

your clothes, as well as from the tools before using them.

▪ Do not touch electronic components and connector contacts.
▪ If you have a professional workplace equipped with antistatic

protection, don't forget to use it.

Be especially careful in could and dry weather.

Forbidden!
To restart the Module less than in 5 sec. after shutdown

3.6 Installation of CPC1302 to the carrier-board

In order to install CPC1302 to the carrier-board, follow the below procedure:

1. Make sure that the safety requirements, listed in section 3.5.1 have been met.
Warning!

Noncompliance with the following directions could lead module damages and
improper operation of the system.

2. Prior to installation, make sure that the carrier -board is compatible with the standard COM

Express Type 6 r.2.1 and that the height of the COM Express connectors on the carrier­board corresponds to the height of racks on CPC1302. (The module is supplied with the
installed 5 mm racks, 8 mm height racks are supplied in the delivery checklist.) If the
carrier-board Adlink Express-BASE6 is used, the 5 mm racks installed on the module
should be removed (since the board Adlink Express-BASE6 is already equipped with the
fasteners similar to the racks). If heatsink ACS30076 from the delivery checklist or user­made heatsink are used, then you will have to preliminary install the heatsink, see
subsection 3.3.

3. Connectors XS2 of CPC1302 module (see Figure 2-2) should be inserted into the relevant

connectors of the carrier-board. Fix the module on the carrier-board using fastening screws
and washers from the installation kit (supplied to the customer with the module, see
subsection 1.3.1).

3.7 Procedure of module removal

In order to remove the module, the following operations should be performed:

CPC1302 User Manual

0-39

Intended use of CPC1302

CPC1302

1. Make sure that the safety requirements, listed in section 3.5.1.have been met. Pay

special attention to the warning related to heatsink temperature!

2. Before starting operations, make sure that system power supply is switched off.

3. Unscrew the fastening screws and remove the module from connectors of the carrier -

board. Do not touch the heatsink since it could get too hot during operation.

4. Do not place the module in the box or packaging, till the module and cooling heatsinks cool

down to the ambient temperature.

3.8 Elimination of CPC1302 malfunctions

The Table 3-4 contains possible malfunctions of CPC1302 and the ways of their

elimination.

CPC1302 User Manual

0-40

Intended use of CPC1302

CPC1302

Table 3-4: Elimination of CPC1302 malfunctions

Malfunction

Cause

Solution

The board fails to start,
HL1 LED is off.

No triggered voltage
+5 V on the board.

Check the availability of the triggered
voltage at COM_Express connector (B84­B87 contacts) (if used).

Or check the availability of the feeding
voltage +12V and PWR_OK signal (contact
B24) at COM_Express connector.

The board fails to start,
HL1 LED is on, HL3 is off.

No feeding power
supply of +12 V.

Check the availability of the feeding voltage
+12 V, supplied from the carrier of the board
and PWR_OK signal (B24) at
COM_Express connector.

Feeding power supply
sources on the board are
not functioning properly.

FPGA firmware is absent or
damaged.

Signal PCIRST# is active.

Contact the service center.

The board fails to start,
HL1 LED is on, HL3 is
flashing fast (~8 Hz).

BIOS is absent or
damaged/

Check the accuracy of BIOS selection on
the carrier-board (if the selection is
available). Check the accuracy of
BIOS_DIS0# (A34) signals and
BIOS_DIS#1 (B88) signals at
COM_Express connector. Boot the board
from BIOS backup, if such is stipulated for
the carrier-board, and restore BIOS on the
board.

The board is

Contact the service center.

The board fails to start,
HL1 LED is on, HL3 LED
is flashing slowly (~1 Hz),
the board makes sounds.

The BIOS implementation
has failed to reach the call
of OS boot INT19H.

Run the diagnostics of the BIOS
implementation over the POST codes and
sound signals. If it is impossible to carry out
diagnostics/eliminate the reason, please
contact the service center.

BIOS is damaged.

Boot the board from BIOS backup, if such
is stipulated for the carrier-board, and
restore BIOS on the board.

CPC1302 User Manual

0-41

Transportation, unpacking and storage

CPC1302

4 AMI® BIOS

Your module has an installed adapted version of AMI® BIOS, which is a standard system for

IBM PC AT-compatible computers. It supports Intel®x86 and Intel®x86-compatible CPUs, ensures
low-level support for CPU, memory and I/O subsystems.

Using BIOS Setup program you can change BIOS parameters and control special computer

operation modes. It enables to change basic parameters of system configuration.

4.1 BIOS update

BIOS update is carried out using the Flash Programming Tool utility (is available on network

file-servers of the manufacturer and official distributor).

Actions for updating BIOS
There is a BIOS version for CPC1302 available on FTP: 1302_Vxxx.bin.

Example of BIOS update via an integrated UEFI SHELL:

1. Copy EFI utility to USB drive root directory.

2. Copy with the new BIOS to the EFI catalog.

3. Connect USB drive to the CPC1302 module.

4. In BIOS SETUP select the menu "Save & Exit -> Launch EFI Shell from filesystem

device".

5. Type in the command line:
fs0:

cd efi64
fpt64.efi -f <file name>

6. Wait for update completion and message "FPT Operation Passed" to appear on the screen.

7. Restart the system

Transportation, unpacking and storage

CPC1302

CPC1302 User Manual

0-42

5 Transportation, unpacking and storage

5.1 Transportation

The module should be transported in a separate packaging box (transport packaging) of the
manufacturing facility, which consists of an individual antistatic bag and a cardboard box, in the
closed transport (automobile, railway, air transportation in heated and pressurized compartments)
in storage conditions 5 defined in the GOST standard 15150-69 (IEC 721-2-1 standard) or in
storage conditions 3 during sea transportation.

It is possible to transport modules, packaged in individual antistatic packages, in multiple
packaging (transport packaging) of the manufacturing facility.

The packaged modules should be transported in accordance with the shipping rules,
operating with this particular type of transport.

During handling and transportation operations, the packaged modules should not undergo
sharp pounding, falls, shocks and exposure to atmospheric precipitation. The packaged modules
should be stored in a carrier vehicle in such a manner which will prevent their moving.

5.2 Unpacking

Prior to unpacking, before transportation at subzero temperature of ambient air the modules
should be kept within 6 hours under storage conditions 1 defined in the GOST standard 15150-69.
(IEC 721-2-1 standard).

It is prohibited to place the packaged module close to the heat source, prior to unpacking.

While unpacking, it is required to comply with all safety precautions, which ensure its safety,
as well as marketable condition of consumer packaging of the manufacturing company.

At the time of unpacking it is required to check the module that it has no external mechanical
damages after transportation.

5.3 Storage

Module storage conditions for group 1 are defined in the GOST standard 151-50-69 (IEC 721-

2-1 standard).

CPC1302 User Manual

0-43

Annex A

CPC1302

Annex A

A Purpose of COM Express connector

contacts

Table A-1: Purpose of COM Express connector contacts

Contact

Description

Note

A1

GND

A2

GBE0_MDI3-

A3

GBE0_MDI3+

A4

GBE0_LINK100#

OD, 330oHm

A5

GBE0_LINK1000#

OD, 330oHm

A6

GBE0_MDI2-

A7

GBE0_MDI2+

A8

GBE0_LINK#

OD, 330oHm

A9

GBE0_MDI1-

A10

GBE0_MDI1+

A11

GND

A12

GBE0_MDI0-

A13

GBE0_MDI0+

A14

NC

A15

SUS_S3#

PP 3.3V_STBY,PD 10K

A16

SATA0_TX+

A17

SATA0_TX-

A18

SUS_S4#

PP 3.3V_STBY,PD 10K

A19

SATA0_RX+

A20

SATA0_RX-

A21

GND

A22

SATA2_TX+

A23

SATA2_TX-

A24

SUS_S5#

PP 3.3V_STBY,PD 10K

A25

SATA2_RX+

A26

SATA2_RX-

A27

BATLOW#

PU 10K 3.3V_STBY

A28

(S)ATA_ACT#

OD, 3.3V_STBY

A29

AC/HDA_SYNC

PP 3.3V

A30

AC/HDA_RST#

PP 3.3V

A31

GND

A32

AC/HDA_BITCLK

PP 3.3V

A33

AC/HDA_SDOUT

PP 3.3V

A34

BIOS_DIS0#

PU 10K 3.3V_STBY

A35

THRMTRIP#

PU 10K 3.3V_STBY

A36

USB6-

A37

USB6+

A38

USB_6_7_OC#

PU 10K 3.3V_STBY

Annex A

CPC1302

CPC1302 User Manual

0-44

A39

USB4-

A40

USB4+

A41

GND

A42

USB2-

A43

USB2+

A44

USB_2_3_OC#

PU 10K 3.3V_STBY

A45

USB0-

A46

USB0+

A47

VCC_RTC

A48

EXCD0_PERST#

PP 3.3V_STBY

A49

EXCD0_CPPE#

PP 3.3V_STBY

A50

LPC_SERIRQ

OD 3.3V,PU 3.3V

A51

GND

A52

PCIE_TX5+

A53

PCIE_TX5-

A54

GPI0

CM 3.3V_STBY

A55

PCIE_TX4+

A56

PCIE_TX4-

A57

GND

A58

PCIE_TX3+

A59

PCIE_TX3-

A60

GND

A61

PCIE_TX2+

A62

PCIE_TX2-

A63

GPI1

CM 3.3V_STBY

A64

PCIE_TX1+

A65

PCIE_TX1-

A66

GND

A67

GPI2

CM 3.3V_STBY

A68

PCIE_TX0+

A69

PCIE_TX0-

A70

GND

A71

LVDS_A0+

A72

LVDS_A0-

A73

LVDS_A1+

A74

LVDS_A1-

A75

LVDS_A2+

A76

LVDS_A2-

A77

LVDS_VDD_EN

PP 3.3V

A78

LVDS_A3+

A79

LVDS_A3-

A80

GND

A81

LVDS_A_CK+

A82

LVDS_A_CK-

A83

LVDS_I2C_CK

2.2K PU 3.3V

A84

LVDS_I2C_DAT

2.2K PU 3.3V

Annex A

CPC1302

CPC1302 User Manual

0-45

A85

GPI3

CM 3.3V_STBY

A86

NC

A87

NC

A88

PCIE0_CK_REF+

A89

PCIE0_CK_REF-

A90

GND

A91

SPI_POWER

PP +3.3V_STBY, 0.16A

A92

SPI_MISO

CM/PP +3.3V_STBY

A93

GPO0

PP 3.3V_STBY

A94

SPI_CLK

PP 3.3V_STBY

A95

SPI_MOSI

CM/PP +3.3V_STBY

A96

PP_TPM

CM 3.3V

A97

NC

A98

SER0_TX

OD 3.3V

A99

SER0_RX

CM 3.3V

A100

GND

A101

SER1_TX

OD 3.3V

A102

SER1_RX

CM 3.3V

A103

LID#

A104

VCC_12V

A105

VCC_12V

A106

VCC_12V

A107

VCC_12V

A108

VCC_12V

A109

VCC_12V

A110

GND

B1

GND

B2

GBE0_ACT#

OD, 330oHm

B3

LPC_FRAME#

PP 3.3V

B4

LPC_AD0

PP 3.3V

B5

LPC_AD1

PP 3.3V

B6

LPC_AD2

PP 3.3V

B7

LPC_AD3

PP 3.3V

B8

LPC_DRQ0#

PP 3.3V

B9

LPC_DRQ1#

PP 3.3V

B10

LPC_CLK

PP 3.3V

B11

GND

B12

PWRBTN#

PU 10K, +3.3V_STBY

B13

SMB_CK

2.2K PU 3.3V_STBY

B14

SMB_DAT

2.2K PU 3.3V_STBY

B15

SMB_ALERT#

10K PU 3.3V_STBY

B16

SATA1_TX+

B17

SATA1_TX-

B18

SUS_STAT#

PP 3.3V_STBY

B19

SATA1_RX+

B20

SATA1_RX-

Annex A

CPC1302

CPC1302 User Manual

0-46

B21

GND

B22

SATA3_TX+

B23

SATA3_TX-

B24

PWR_OK

100K PD

B25

SATA3_RX+

B26

SATA3_RX-

B27

WDT

PP 3.3V_STBY

B28

AC/HDA_SDIN2

B29

AC/HDA_SDIN1

B30

AC/HDA_SDIN0

B31

GND

B32

SPKR

PP 3.3V

B33

I2C_CK

2.2K PU 3.3V

B34

I2C_DAT

2.2K PU 3.3V

B35

THRM#

10K PU 3.3V

B36

USB7-

B37

USB7+

B38

USB_4_5_OC#

10K PU 3.3V_STBY

B39

USB5-

B40

USB5+

B41

GND

B42

USB3-

B43

USB3+

B44

USB_0_1_OC#

10K PU 3.3V_STBY

B45

USB1-

B46

USB1+

B47

EXCD1_PERST#

PP 3.3V_STBY

B48

EXCD1_CPPE#

PP 3.3V_STBY

B49

SYS_RESET

10K PU 3.3V

B50

CB_RESET#

PP 3.3V_STBY, 10K PD

B51

GND

B52

PCIE_RX5+

B53

PCIE_RX5-

B54

GPO1

PP 3.3V_STBY

B55

PCIE_RX4+

B56

PCIE_RX4-

B57

GPO2

PP 3.3V_STBY

B58

PCIE_RX3+

B59

PCIE_RX3-

B60

GND

B61

PCIE_RX2+

B62

PCIE_RX2-

B63

GPO3

PP 3.3V_STBY

B64

PCIE_RX1+

B65

PCIE_RX1-

B66

WAKE0#

PU 1K, +3.3V_STBY

Annex A

CPC1302

CPC1302 User Manual

0-47

B67

WAKE1#

PU 10K, +3.3V_STBY

B68

PCIE_RX0+

B69

PCIE_RX0-

B70

GND

B71

LVDS_B0+

B72

LVDS_B0-

B73

LVDS_B1+

B74

LVDS_B1-

B75

LVDS_B2+

B76

LVDS_B2-

B77

LVDS_B3+

B78

LVDS_B3-

B79

LVDS_BKLT_EN

PP 3.3V

B80

GND

B81

LVDS_B_CK+

B82

LVDS_B_CK-

B83

LVDS_BKLT_CTRL

PP 3.3V

B84

VCC_5V_SBY

B85

VCC_5V_SBY

B86

VCC_5V_SBY

B87

VCC_5V_SBY

B88

BIOS_DIS1#

PU 10K, +3.3V_STBY

B89

VGA_RED

PD 150ohm

B90

GND

B91

VGA_GRN

PD 150ohm

B92

VGA_BLU

PD 150ohm

B93

VGA_HSYNC

22.6 ohm series

B94

VGA_VSYNC

22.6 ohm series

B95

VGA_I2C_CK

PU 2.2K, 3.3V

B96

VGA_I2C_DAT

PU 2.2K, 3.3V

B97

SPI_CS#

PU 100K, +3.3V_STBY

B98

NC

B99

NC

B100

GND

B101

FAN_PWMOUT

B102

FAN_TACHIN

B103

SLEEP#

B104

VCC_12V

B105

VCC_12V

B106

VCC_12V

B107

VCC_12V

B108

VCC_12V

B109

VCC_12V

B110

GND

C1

GND

C2

GND

Annex A

CPC1302

CPC1302 User Manual

0-48

C3

USB_SSRX0-

C4

USB_SSRX0+

C5

GND

C6

USB_SSRX1-

C7

USB_SSRX1+

C8

GND

C9

USB_SSRX2-

C10

USB_SSRX2+

C11

GND

C12

USB_SSRX3-

C13

USB_SSRX3+

C14

GND

C15

NC C16

NC C17

NC C18

NC C19

PCIE_RX6+

C20

PCIE_RX6-

C21

GND

C22

PCIE_RX7+

C23

PCIE_RX7-

C24

DDI1_HPD

100K PD

C25

NC

C26

NC

C27

NC C28

NC C29

NC C30

NC C31

GND

C32

DDI2_CTRLCLK_AUX+

PU 2.2K, 3.3V / PD 100K

C33

DDI2_CTRLDATA_AUX-

PU 2.2K, 3.3V / PU
100K 3.3V

C34

DDI2_AUXSEL

PD 1M

C35

NC C36

DDI3_CTRLCLK_AUX+

PU 2.2K, 3.3V / PD 100K

C37

DDI3_CTRLDATA_AUX-

PU 2.2K, 3.3V / PD 100K

C38

DDI3_AUXSEL

PD 1M

C39

DDI3_PAIR0+

C40

DDI3_PAIR0-

C41

GND

C42

DDI3_PAIR1+

C43

DDI3_PAIR1-

C44

DDI1_HPD

100K PD

C45

NC

C46

DDI3_PAIR2+

C47

DDI3_PAIR2-

Annex A

CPC1302

CPC1302 User Manual

0-49

C48

NC

C49

DDI3_PAIR3+

C50

DDI3_PAIR3-

C51

GND

C52

PEG_RX0+

C53

PEG_RX0-

C54

NC

C55

PEG_RX1+

C56

PEG_RX1-

C57

NC C58

PEG_RX2+

C59

PEG_RX2-

C60

GND

C61

PEG_RX3+

C62

PEG_RX3-

C63

NC C64

NC

C65

PEG_RX4+

C66

PEG_RX4-

C67

NC C68

PEG_RX5+

C69

PEG_RX5-

C70

GND

C71

PEG_RX6+

C72

PEG_RX6-

C73

GND

C74

PEG_RX7+

C75

PEG_RX7-

C76

GND

C77

NC

C78

PEG_RX8+

C79

PEG_RX8-

C80

GND

C81

PEG_RX9+

C82

PEG_RX9-

C83

NC C84

GND

C85

PEG_RX10+

C86

PEG_RX10-

C87

GND

C88

PEG_RX11+

C89

PEG_RX11-

C90

GND

C91

PEG_RX12+

C92

PEG_RX12-

C93

GND

Annex A

CPC1302

CPC1302 User Manual

0-50

C94

PEG_RX13+

C95

PEG_RX13-

C96

GND

C97

NC C98

PEG_RX14+

C99

PEG_RX14-

C100

GND

C101

PEG_RX15+

C102

PEG_RX15-

C103

GND

C104

VCC12

C105

VCC12

C106

VCC12

C107

VCC12

C108

VCC12

C109

VCC12

C110

GND

D1

GND

D2

GND

D3

USB_SSTX0+

D4

USB_SSTX0-

D5

GND

D6

USB_SSTX1-

D7

USB_SSTX1+

D8

GND

D9

USB_SSTX2-

D10

USB_SSTX2+

D11

GND

D12

USB_SSTX3-

D13

USB_SSTX3+

D14

GND

D15

DDI1_CTRLCLK_AUX+

PU 2.2K, 3.3V / PD 100K

D16

DDI1_CTRLDATA_AUX-

PU 2.2K, 3.3V / PU
100K 3.3V

D17

NC D18

NC D19

PCIE_TX6+

D20

PCIE_TX6-

D21

GND

D22

PCIE_TX7+

D23

PCIE_TX7-

D24↔

NC

D25

NC

D26

DDI1_PAIR0+

D27

DDI1_PAIR0-

D28

NC

Annex A

CPC1302

CPC1302 User Manual

0-51

D29

DDI1_PAIR1+

D30

DDI1_PAIR1-

D31

NC

D32

DDI1_PAIR2+

D33

DDI1_PAIR2-

D34

DDI1_AUXSEL

PD 1M

D35

NC

D36

DDI1_PAIR3+

D37

DDI1_PAIR3-

D38

NC D39

DDI2_PAIR0+

D40

DDI2_PAIR0-

D41

GND

D42

DDI2_PAIR1+

D43

DDI2_PAIR1-

D44

DDI2_HPD

100K PD

D45

NC

D46

DDI2_PAIR2+

D47

DDI2_PAIR2-

D48

NC D49

DDI2_PAIR3+

D50

DDI2_PAIR3-

D51

GND

D52

PEG_TX0+

D53

PEG_TX0-

D54

PEG_LANE_RV#

PU 10K 3.3V

D55

PEG_TX1+

D56

PEG_TX1-

D57

GND

D58

PEG_TX2+

D59

PEG_TX2-

D60

GND

D61

PEG_TX3+

D62

PEG_TX3-

D63

NC D64

NC D65

PEG_TX4+

D66

PEG_TX4-

D67

GND

D68

PEG_TX5+

D69

PEG_TX5-

D70

GND

D71

PEG_TX6+

D72

PEG_TX6-

D73

GND

D74

PEG_TX7+

Annex A

CPC1302

CPC1302 User Manual

0-52

D75

PEG_TX7-

D76

GND

D77

NC

D78

PEG_TX8+

D79

PEG_TX8-

D80

GND

D81

PEG_TX9+

D82

PEG_TX9-

D83

NC

D84

GND

D85

PEG_TX10+

D86

PEG_TX10-

D87

GND

D88

PEG_TX11+

D89

PEG_TX11-

D90

GND

D91

PEG_TX12+

D92

PEG_TX12-

D93

GND

D94

PEG_TX13+

D95

PEG_TX13-

D96

GND

D97

NC

D98

PEG_TX14+

D99

PEG_TX14-

D100

GND

D101

PEG_TX15+

D102

PEG_TX15-

D103

GND

D104

VCC12

D105

VCC12

D106

VCC12

D107

VCC12

D108

VCC12

D109

VCC12

D110

GND

Interpretation:
OD - open drain PP PD - pull down
PU - pull up CM – CMOS input
PP -push-pull output of СMOS

Annex A

CPC1302

CPC1302 User Manual

0-53

DISCLAIMER

This Disclaimer contains special operating conditions of Fastwel in the following areas: intellectual property, warranty policy,
conditions of the order and delivery.

1 INTELLECTUAL PRORETY

1.1 If any infraction, interference, improper use, illegitimate exploitation and/or violation of the industrial and/or intellectual
property rights of any third party and/or property, exploitation during the use of Fastwel Embedded Module will take place –
Fastwel does not guarantee to replace the materials, computer programs, procedures or equipment affected by the
complaint and under no circumstances doesn't bear responsibility in any form for possible refusal in case of such a
replacement.

1.2 Use of the Fastwel products as well as the objects of intellectual property containing in them, in the ways and for the
purposes, not provided by the present user manual and datasheet isn't allowed without preliminary written approval of
Fastwel.

1.3 Fastwel is not responsible for possible incidents and losses, related to the operation of end devices, in which the original
Fastwel equipment is used.

2 WARRANTY POLICY

2.1 When the detected flaws in an element can be corrected without decreasing the foreseen technical features and
functionality for it, User may demand Fastwel the urgent correction of the failures in additionally agreed period and an
increasing of the period of the guarantee of the element equal as the time elapsed from the formal request to repair the
failures, until the receipt of the repaired element. All costs associated to the correction of failures, included those of
assembly, dismantle, transport, tests, etc, if they exist, shall be prosecuted according the Warranty Policy of Fastwel.

3 ORDER AND DELIVERY CONDITIONS

3.1 The general rule is that all Fastwel equipment prices are determined with due consideration of delivery under the EXW
terms and conditions (Incoterms 2010). Delivery of the products under other terms and conditions should be preliminary
agreed and stated in writing between the parties.

3.2 Unless otherwise expressly agreed with Fastwel, all the deliveries of Fastwel equipment will be carried out only after the
official purchase order is obtained and provided that the ordered products have been prepaid in full. Other terms and
conditions of cooperation should be made in writing.

3.3 Any delivery of Fastwel electronics is submitted with the right package in accordance with the current rules and
standards in the Member States of the European Economic Area. The purchaser independently bears all risks regarding the
compliance of package and marking of Fastwel products with legislation requirements being in effect at the place of
purchased products destination (in the buyer’s country). The specified condition excludes unequivocally any liability of
Fastwel for possible non-compliance of package and marking of products with the requirements of legislation of the country
of products destination.

3.4 In general, all components of the supply are properly protected with respect to freight, in order to avoid any damage to
the supply, third parties, environmental damages or unrelated goods, as consequence of wrong packaging.

3.5 Each package unit is labeled on the exterior area with the indications of product’s Part Number and Serial Number.

3.6 The support documents for the order should be made either in English or in Russian unless otherwise agreed between
parties in writing.

3.7 Fastwel does not pay penalties and does not cover costs associated with delay in the delivery of the products caused by
actions of the third parties, force-majeure etc. - Fastwel doesn't bear any responsibility for non-execution or inadequate
execution of the obligations in a case when it is caused by actions of the third parties (for example producers or suppliers of
accessories), force majeure etc.

3.8 Fastwel declares that independently and at any time without damage, it has an exclusive right to define and change
functionality architecture, bill of materials of its products without any preliminary coordination and approvals of the third
parties.

4 OTHER CONDITIONS

4.1 Fastwel has the obligation to respect the current Russian legislation (including, but not limited to environmental, labor,
social laws) in each moment and to apply it to its embedded electronics considering all and each execution phase, that is to
say, from the design until the commissioning and subsequent maintenance. In this regard Fastwel is not liable to the user or
other persons in connection with possible changes of the company’s rules (including, but not limited to warranty, ordering
policy) caused by changes of the Russian legislation.

4.2 Unless otherwise expressly agreed in writing, Fastwel provides no training for assembly\installation\adjustment\operation
of its equipment.