Fairchild Semiconductor SFS2955 Datasheet

Advanced Power MOSFET
SFS2955
FEATURES
! Avalanche Rugged Technology ! Rugged Gate Oxide Technology ! Lower Input Capacitance ! Improved Gate Charge ! 175oC Operating Temperature ! Extended Safe Operating Area ! Lower Leakage Current : 10 µA(Max.) @ VDS= -60V ! Low R
: 0.22 Ω (Typ.)
DS(ON)
Absolute Maximum Ratings
Characteristic Value UnitsSymbol
Drain-to-Source Voltage Continuous Drain Current (T Continuous Drain Current (T
=25oC)
C
=100oC)
C
Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (T
=25oC)
C
Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8” from case for 5-seconds
O
O O O O
1
2
1 1
3
T
V
DSS
I
I
DM
V E
I
AR
E
dv/dt
P
, T
J
T
D
GS AS
AR
D
STG
L
BV
DSS
R
DS(on)
ID= -7.3 A
TO-220F
1
2
3
1.Gate 2. Drain 3. Source
-60
-7.3
-5.1
-30
+
_
20
137
-7.3
2.4
-5.5 24
0.19
- 55 to +175
300
= -60 V
= 0.3
W/
V A A
V
mJ
A
mJ
V/ns
W
o
o
C
C
Thermal Resistance
Symbol Typ.
R
θJC
R
θJA
Characteristic Max.
Junction-to-Case
Junction-to-Ambient
Units
--
--
5.2
62.5
o
C/W
Rev. A
SFS2955
CHANNEL
P-
POWER MOSFET
Electrical Characteristics
CharacteristicSymbol
BV
BV/T
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
C
C
C
t
d(on)
t
d(off)
Q Q Q
Drain-Source Breakdown Voltage
DSS
Breakdown Voltage Temp. Coeff.
J
Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse
Drain-to-Source Leakage Current
Static Drain-Source On-State Resistance Forward Transconductance
fs
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer Capacitance
rss
Turn-On Delay Time
t
Rise Time
r
Turn-Off Delay Time
t
Fall Time
f
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain(“Miller”) Charge
gd
(TC=25oC unless otherwise specified)
Max. UnitsTyp.Min. Test Condition
V
-60
--
-2.0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
-0.04
--
--
--
--
--
--
3.5 465 140
40 11 21 29 20 15
2.9
6.0
--
--
-4.0
-100 100
-10
-100
0.3
-­600 215
60 30 50 65 50 19
--
--
V
V/oC
V
nA
µA
S
pF
ns
nC
=0V,ID=-250µA
GS
I
=-250µA See Fig 7
D
=-5V,ID=-250µA
V
DS
V
=-20V
GS
V
=20V
GS
VDS=-60V V
=-48V,TC=150oC
DS
=-10V,ID=-3.7A
V
GS
VDS=-30V,ID=-3.7A VGS=0V,VDS=-25V,f =1MHz
=-30V,ID=-9.4A,
V
DD
R
=18
G
V
=-48V,VGS=-10V,
DS
I
=-9.4A
D
See Fig 6 & Fig 12
See Fig 5
See Fig 13
O
4
O
4
O
4
5
O
4
O5O
Source-Drain Diode Ratings and Characteristics
CharacteristicSymbol Max. UnitsTyp.Min. Test Condition
I
I
SM
V
t
Q
Notes ;
1
Repetitive Rating : Pulse Wi dt h Limi t ed by Maximum Junction Temperature
O
2
L=3.0mH, I
O
3
I
O
SD
4
Pulse Test : Pulse Width = 250µs, Duty Cycle 2%
O
5
Essentially Independent of Operating Temperature
O
Continuous Source Current
S
Pulsed-Source Current Diode Forward Voltage
SD
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
=-7.3A, VDD=-25V, RG=27Ω*, Starting TJ =25oC
AS
_
<
-9.4A, di/dt 250A/µs, V
_
<
_
<
DD BVDSS
--
1
--
O
4
--
O
--
0.22
--
, Starting TJ =25oC
_
<
--
--
--
80
-7.3
-30
-3.8
--
--
A
V ns µC
Integral reverse pn-diode in the MOSFET T
=25oC,IS=-7.3A,VGS=0V
J
T
=25oC,IF=-9.4A
J
di
/dt=100A/µs
F
O
4
P-CHANNEL
POWER MOSFET
Fig 1. Output Characteristics Fig 2. Transfer Characteristics
V
GS
Top : - 1 5 V
- 10 V
- 8.0 V
1
10
- 7.0 V
- 6.0 V
- 5.5 V
- 5.0 V Bott om : - 4.5 V
0
10
, Drain Current [A]
D
-I
-1
10
-1
10
-VDS , Drain-Source Voltage [V]
@ Notes :
1. 250 µs Pulse Test
2. TC = 25 oC
0
10
SFS2955
1
10
175 oC
0
10
25 oC
, Drain Current [A ]
D
-I
-1
1
10
10
246810
- 55 oC
-VGS , Gate-Source Vo ltage [V]
@ Notes :
1. V
2. V
3. 250
= 0 V
GS
= -30 V
DS
s Pulse Test
µ
0.45
0.40
]
0.35
, [
0.30
DS(on)
R
0.25
0.20
Drain-Source On-Resistance
0.15
0.10 0 5 10 15 20 25 30 35 40
VGS = -10 V
VGS = -20 V
-ID , Drain Current [A]
800
C
600
iss
C
oss
400
Capacitance [pF]
C
200
rss
0
0
10
C
= Cgs+ Cgd ( Cds= shorted )
iss
= Cds+ C
C
oss
gd
C
= C
rss
gd
1
10
-VDS , Drain-Source Voltage [V]
@ Note : TJ = 25 oC
@ Notes :
1. V
= 0 V
GS
2. f = 1 MHz
Fig 4. Source-Drain Diode Forward VoltageFig 3. On-Resistance vs. Drain Current
1
10
0
10
175 oC
, Reverse Drain C urrent [A]
DR
-I
-1
10
25 oC
0.5 1.0 1.5 2.0 2.5 3.0 3.5
@ Notes :
1. V
2. 250
= 0 V
GS
s Pulse Test
µ
-VSD , Source-Drain Voltage [V]
Fig 6. Gate Charge vs. Gate-Source VoltageFig 5. Capacitance vs. Drain-Source Voltage
10
5
, Gate-Source Vo ltage [V]
GS
-V
0
0481216
VDS = -12 V
VDS = -30 V
VDS = -48 V
@ Notes : ID =-9.4 A
QG , Total Gate Char ge [nC]
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